WO2005008837A1 - Electrical contact assembly with insulative carrier, stapled contact attachment and fusible element - Google Patents

Electrical contact assembly with insulative carrier, stapled contact attachment and fusible element Download PDF

Info

Publication number
WO2005008837A1
WO2005008837A1 PCT/US2004/020712 US2004020712W WO2005008837A1 WO 2005008837 A1 WO2005008837 A1 WO 2005008837A1 US 2004020712 W US2004020712 W US 2004020712W WO 2005008837 A1 WO2005008837 A1 WO 2005008837A1
Authority
WO
WIPO (PCT)
Prior art keywords
contact
base
carrier
electrical
fusible element
Prior art date
Application number
PCT/US2004/020712
Other languages
French (fr)
Inventor
Donald K. Harper Jr.
Original Assignee
Fci Americas Technology, Inc.
Fci
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fci Americas Technology, Inc., Fci filed Critical Fci Americas Technology, Inc.
Publication of WO2005008837A1 publication Critical patent/WO2005008837A1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/52Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components
    • H05K3/3426Leaded components characterised by the leads

Definitions

  • the present invention relates to an electrical connector and, more particularly, to an electrical connector with deflectable contacts and fusible elements.
  • U.S. Patent No. 6,193,523 discloses a contact for an electrical connector with a mounting portion for a solder ball.
  • U.S. Patent No. 6,217,348 discloses an electrical connector with an upwardly extending contact section and a solder ball.
  • Various other patents disclose land grid array connectors which use solder balls and deflectable spring arms, such as U.S. Patent Nos. 6,179,624 and 5,772,451 for example.
  • Manufacturing of small electrical contacts by use of a forming operation can results in contacts being manufactured with inconsistent dimensions because of variations in thickness of the stock material.
  • the problem due to stock material thickness can be multiplied in contacts which comprise multiple bends to be formed during the forming operation. This can result in the manufacture of contacts which do not meet predetermined specifications. This can be especially detrimental in small size contacts, such as contacts used in land grid array connectors having 800 or more contacts in a 1 mm x 1 mm grid which are mounted in a housing which is only about 42 mm square .
  • an electrical contact assembly including a contact terminal and a fusible element .
  • the contact terminal has a base and two cantilevered deflectable contact arms extending from at least one lateral side of the base. A first one of the contact arms extends in a downward direction and a second one of the contact arms extends in an upward direction.
  • the fusible element is fixedly attached to an end of the first contact arm.
  • the fusible element is adapted to be fused to a first pad on a first electronic component.
  • the second contact arm comprises a surface contact area for contacting a second pad on a second electronic component.
  • the first and second contact arms are adapted to deflect when the fusible element is fused to the first electronic component and when the contact area of the second contact arm is contacted by the second pad of the second electronic component .
  • an electrical connector subassembly comprising a carrier comprising electrically insulative material; and a plurality of electrical contact terminals connected to the carrier.
  • Each terminal comprises a base and at least two deflectable contact arms extending from at least one lateral side of the base.
  • the carrier comprises apertures. At least one of the contact arms of each terminal extends through a respective one of the apertures.
  • the base of each terminal comprises tabs which are deformed to form a stapled connection of the base with the carrier.
  • a method of assembling an electrical contact assembly comprising steps of providing a contact terminal comprising a base and two cantilevered deflectable contact arms extending from a same lateral side of the base, a first one of the contact arms extending in an upward direction and a second one of the contact arms extending in a downward direction; and attaching a fusible element to an end of the second contact arm.
  • FIG. 1 is a exploded perspective review of an electrical connector incorporating features of the present invention shown attached to a portion of a printed circuit board and adapted to receive an electronic component;
  • FIG. 2 is a partial cross sectional view of the electrical connector shown in Fig. 1 ;
  • Fig. 3 is a perspective view of the contact and fusible element shown in Fig. 2 shown attached to a carry strip before attachment to the carrier;
  • Fig. 4 is a partial cross sectional view of the electrical connector as shown in Fig. 2 shown attached to two electronic components;
  • FIG. 5 is a partial perspective view of the carrier shown in Fig. 2;
  • FIG. 6 is a partial enlarged perspective view of the carrier shown in Fig. 5;
  • Fig 7 is a partial perspective view similar to Fig. 3 of an alternate embodiment of the attachment of the fusible element to an electrical contact. ' DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • FIG. 1 there is shown a perspective view of an electrical connector 10 incorporating features of the present invention shown attached to a first electronic component 12, such as a printed circuit board (PCB) , and adapted to receive a second electronic component 14, such as a processor chip.
  • the connector 10 is adapted to electrically attach the electronic component 14 to the printed circuit board 12.
  • the present invention can address the need for an electrical connection between two pads, such as in the case of connecting a land grid array (LGA) package to a pad on a PCB.
  • LGA land grid array
  • the present invention can provide an optimized design to be configured into an array for high- density and high I/O counts. This optimized design can provide superior electrical performance from a short electrical path provided by the contact geometry.
  • the short contact geometry also provides a low mated height.
  • the contact can consist of a spring having two spring beams, one formed up and the other formed down, and a carrier that provides a support for positioning the contacts.
  • the contacts can be attached to the carrier by a feature on the contact, similar to a staple, that protrudes through the carrier and is then formed against the carrier to secure the contact to the carrier.
  • One spring beam can have a solder ball attached to its tip.
  • the spring beams can be designed to accommodate a torsional deflection and additional wipe of the upper beam contact created by the offset position of the spring beam relative to each other.
  • the contacts can be held in place by the contact staple feature attached to the insulating carrier with apertures in the carrier allowing the spring beams to protrude through one side of the carrier to make contact with the associated mating components when positioned and compressed. Assembly of multiple contacts allows for various array configurations determined by the mating component and assembly patterns . This design leads itself to rapidly producing multiple different contact configurations. A frame could be added to the carrier to provide mechanical stiffness to the contact pattern for ball grid array (BGA) placement and attachment.
  • BGA ball grid array
  • the electrical connector 10 comprises a housing 16 and at least one electrical connector subassembly 17.
  • the electrical connector subassembly 17 generally comprises electrical contacts 18, a carrier 19, and fusible elements 20.
  • Fig. 2 shows the electrical connector 10 before the electrical connector is attached to the PCB 12 and before the second electronic component 14 is attached to the connector.
  • Fig. 4 shows the electrical connector 10 after the electronic component 14 is attached thereto by a compression means (not shown) .
  • the electrical connector 10 generally comprises a first side 90 which is adapted to function as a land grid array (LGA) connection and a second side 92 which is adapted to function as a ball grid array (BGA) connection.
  • LGA land grid array
  • BGA ball grid array
  • the first electronic component 12, in the embodiment shown, comprises contact pads 23 on a top side thereof.
  • the contact pads 23 comprise solder pads.
  • the contact pads 23 are adapted to have the fusible materials, such as solder balls 20, fused thereonto .
  • the second electronic component 14, in the embodiment shown, comprises contact pads 22 on a bottom side thereof.
  • the contact pads 22 are adapted to contact the electrical contacts 18 in a general land grid array type of connection.
  • portions of the electrical contacts 18 extend above and below the housing 16.
  • the portions of the electrical contacts 18 can be deflected or moved towards the housing 16 by the second electronic component 14 when the second electronic component is attached to the electrical connector 10.
  • the housing 16 is comprised of electrically insulating material.
  • the housing 16 generally comprises a first member 26 and a second member 28.
  • the first and second members 26, 28 form a plurality of electrical contact receiving areas 24.
  • the electrical contact receiving areas 24 are arranged in an array of parallel columns and parallel rows.
  • the array has a general square ring shape.
  • any suitable type of array could be provided.
  • the receiving areas 24 each comprise a first section 30, a second section 32 and a middle section 36.
  • the first section 30 is located in the first member 26.
  • the second section 32 is located in the second member 28.
  • the middle section 36 is located in both the first and second members 26, 28 or may be located entirely within one of the members 26, 28.
  • the middle section 36 is located at a junction between the first members 26, 28 and connects the first section 30 to the second section 32.
  • the first and second sections 30, 32 are at least partially offset from each other as seen in Fig. 2.
  • the subassembly 17 is also located at the junction between the first and second members 26, 28.
  • the subassembly 17 generally comprises the electrical contacts 18, the carrier 19, and the fusible elements 20.
  • the carrier 19 preferably comprises a sheet of electrically insulative material.
  • the sheet 19 comprises a plurality of main apertures 38 and a plurality of staple slots 40.
  • Each main aperture 38 comprises a pair of the staple slots 40 at one end thereof.
  • the carrier 19 can be comprised of any suitable type of electrically insulative film material, such as KAPTONTM.
  • the carrier 19 is about 0.003 - 0.005 inches thick.
  • the carrier 19 is preferably flexible. The carrier 19 adds stiffness to the contact 18.
  • the electrical contacts 18 are substantially identical to each other.
  • the electrical connector 10 could comprise different types of electrical contacts.
  • the electrical contact 18 is preferably comprised of flat sheet metal material, such as a copper alloy for example, which has been stamped and/or formed into the shape shown.
  • the contact 18 can be plated with additional material, such as nickel and gold for example.
  • the thickness or width 34 of the contact 18 is about 0.15 mm. However, in alternate embodiments, any suitable type of thickness or width could be provided.
  • the electrical contact 18 generally comprises a base 44 and two cantilevered, resiliently deflectable, contact arms 46, 48 extending from a same lateral side 50 of the base 44.
  • the first contact arm 46 extends in a downward direction.
  • the second contact arm 48 extends in an upward direction.
  • An end 52 of the first contact arm 46 forms a fusible element attachment section.
  • the end 52 comprises a concave shaped bottom side 54 which forms a recess or pocket for receiving a portion of the solder ball 20.
  • the recess in the bottom side 54 might not be provided and, the recess might not be preferred.
  • An end 56 of the second contact arm 48 comprises a top surface 58 which forms a contact surface.
  • the top surface 58 is stamped to form a curved surface.
  • the curved top surface 58 comprises a compound curvature.
  • the top surface 58 could comprise any suitable type of contact surface shape .
  • the first contact arm 46 extends downward and the second contact arm 48 extends upward generally parallel to each other as shown by centerlines 62 and 64 in Fig. 2.
  • the two centerlines 62, 64 are offset from each other.
  • the base 44 of the contact 18 includes an aperture 45 which is provided to increase the flexibility of the contact arms 46, 48 without increasing the length of the contact arms. However, the aperture 45 decreases the stiffness or rigidity of the base 44. By attaching the base 44 to the carrier 19, the carrier 19 is able to add stiffness to the base 44.
  • the base 44 also includes two cantilevered side tabs 60.
  • the side tabs 60 are used as mounting means for attaching the contact 18 to the carrier 19. More particularly, the tabs 60 are deformed to extend through the staple slots 40 in the carrier 19 and back towards the main section of the base 44 as shown in Fig. 2 in a stapled mounting configuration. Thus, the base 44 captures a portion of the carrier 19 thereto by a staple mounting procedure.
  • the second contact arm 48 is able to extend through one of the apertures 39.
  • the apertures 39 thus, provide a clearance hole for the second contact arm 48.
  • the slots 40 might not be provided before the staple mounts are attached, such as when the staple mounts pierce through the carrier 19.
  • the staple mounts comprise the tabs 60 being bent towards each other and then inward towards the base 44 to capture portions of the carrier between outer ends of the tabs 60 and the base 44.
  • other forms of staple mounting could be provided.
  • any other suitable form of attaching the contacts to the carrier could be provided.
  • the fusible elements 20, generally comprise solder balls. A top side of each solder ball 20 is fused to the concave bottom side 54 of the first contact arm 46, by reflow techniques using solder paste or solder flux. The fusible elements 20 are preferably attached to the contacts 18 before the contacts are attached to the carrier 19.
  • the subassembly 17 With the subassembly 17 assembled, the subassembly is then assembled with the housing 16.
  • the subassembly 17 is located such that the carrier 19 is located at the junction between the first and second members 26, 28.
  • the base 44 is also located at the junction between the first and second members 26, 28 in the middle section 36 of the contact receiving area 24.
  • the first and second members 26, 28 can be fixedly attached to each other by any suitable means.
  • adhesive layers between the first and second members and the carrier 19 hold the elements of the housing together.
  • the members 19, 26, 28 could be ultrasonically welded to each other.
  • the first contact arm 46 extends from the middle section 36 through the first section 30 of the contact receiving area 24 and past the bottom of the housing 16.
  • the first contact arm 46 is deflectably movable in the first section 30.
  • the second contact arm 48 extends from the middle section 36 through the second section 32 of the contact receiving areas 24 and past the top of the housing 16.
  • the second contact arm 48 is deflectably movable in the second section 32.
  • the electrical connector 10 would be attached to the first electronic component 12 before the second electronic component 14 is secured onto the component 12.
  • the fusible element 20 is placed against the pad 23.
  • the fusible element 20 is then melted, such as in a solder reflow heating process, to allow the fusible element 22 to fuse with the pad 23 and form a fixed stationery electrical and mechanical connection therebetween.
  • the contact arms 48 of the many contacts 18 will deflect outward different amounts due to different sizes of the solder balls 20 before melting, such as due to tolerance variations of the solder balls, and different sizes and shapes of the contact arms 48 due to tolerance variations.
  • the second electronic component 14 can be removably connected to the connector 10.
  • the contact pads 22 press against the contact surfaces 58 on the second contact arms 48.
  • the centerline axis 64 of the second contact arm 48 is offset by a distance 66 from the center line axis 62 of the first contact arm 46, there is provided a torsional bending of at least the second contact arm 48, and perhaps the base 44 and/or first contact arm 46, during deflection by contact with the pads 22 against the contact surfaces 58. This torsional deflection provides an additional wipe of the contact surface 58 against the pads 22 to be created by the offset position of the spring beams 46, 48 relative to each other.
  • the clamping structure which presses the second component 14 towards the first component 12 causes both the arms 46, 48 to deflect in generally opposite directions towards the base 44.
  • This structure increases the height of available deflection by using area both above and below the base 44 and, increases the normal force against the pads 22 because of the use of both arms 46, 48 to deflect.
  • the staple slots 40 might not be provided in the carrier 19 before the contacts 18 are attached to the carrier. Instead, the staple slots could be formed during connection of the contacts 18 to the carrier 19.
  • the carrier 19 could comprise any suitable thickness.
  • the carrier 19 could be rigid or semi-rigid.
  • the carrier could comprise a laminated structure with multiple layers, such as a layer of stainless steel laminated with an electrically insulative isolator, such as comprised of KAPTONTM.
  • any suitable type of method for attaching the contact to the carrier could be provided. Any suitable connection of the fusible element to one of the contact arms could be provided.
  • Both of the contact arms could comprise fusible elements attached thereto, such as for a nonremovable connection.
  • the fusible elements could also be attached to the contacts after the contacts are attached to the carrier.
  • the fusible elements 20 could be attached to the contacts 18 after the carrier 19 and contacts 18 are assembled with the housing 16.
  • the subassembly 70 generally comprises an electrical contact 72 and a fusible element 74.
  • the electrical contact 72 is substantially identical to the electrical contact 18 shown in Fig. 3.
  • the end 76 of the first contact arm 78 does not comprise an inverted bowl shape as the end 52 shown in Fig. 3.
  • the end 52 extends into the fusible element.
  • the fusible element 74 is located on the end 76 with the end 76 being located inside the fusible element 74.
  • this embodiment illustrates that the fusible element 74 can be fused to the end 76 before attachment of the fusible element 74 to the contact pad on the printed circuit board.
  • the subassembly 70 can be subsequently attached to a carrier, such as the carrier 19.
  • the present invention can provide a BGA to LGA or compressive beam connection that has an array with a high contact density, low inductance, high speed, and low cost manufacture. Because of the small size of the contacts, the use of the carrier helps to eliminate contact positioning problems in the housing during connector assembly. The use of the carrier in the present invention also helps to eliminate the small contact transporting problems found in assembly of conventional connectors having small contacts. The present invention provides greater manufacturing configuration flexibility by allowing the contacts to be connected to the carrier in any selected type of array design while still using the same contacts and carrier. The small height of the contacts help to reduce the height of the connector. The contact design also helps to reduce induction and impedance. Torsional bending can be provided to enhance contact wipe.

Abstract

An electrical contact assembly including a contact terminal and a fusible element. The contact terminal has a base and two cantilevered deflectable contact arms extending from at least one lateral side of the base. A first one of the contact arms extends in a downward direction and a second one of the contact arms extends in an upward direction. The fusible element is fixedly attached to an end of the first contact arm. The fusible element is adapted to be fused to a first pad on a first electronic component. The second contact arm comprises a surface contact area for contacting a second pad on a second electronic component. The first and second contact arms are adapted to deflect when the contact area of the second contact arm is contacted by the second pad of the second electronic component.

Description

Electrical Contact Assembly With Insulative Carrier, Stapled Contact Attachment And Fusible Element
BACKGROUND OF THE INVENTION
1. Field of the Invention
[0001] The present invention relates to an electrical connector and, more particularly, to an electrical connector with deflectable contacts and fusible elements.
2. Brief Description of Prior Developments
[0002] U.S. Patent No. 6,193,523 discloses a contact for an electrical connector with a mounting portion for a solder ball. U.S. Patent No. 6,217,348 discloses an electrical connector with an upwardly extending contact section and a solder ball. Various other patents disclose land grid array connectors which use solder balls and deflectable spring arms, such as U.S. Patent Nos. 6,179,624 and 5,772,451 for example.
[0003] There is a continuing desire in the area of land grid array connectors to reduce the footprint size of the connectors, or increase contact density for a predetermined footprint size. Furthermore, the length of a spring feature in a contact in a land grid array connector still needs to be long enough and the spring powerful enough to provide certain predetermined contact force requirements. The contact also preferably provides a wiping feature when making contact with another electrical component .
[0004] Manufacturing of small electrical contacts by use of a forming operation can results in contacts being manufactured with inconsistent dimensions because of variations in thickness of the stock material. The problem due to stock material thickness can be multiplied in contacts which comprise multiple bends to be formed during the forming operation. This can result in the manufacture of contacts which do not meet predetermined specifications. This can be especially detrimental in small size contacts, such as contacts used in land grid array connectors having 800 or more contacts in a 1 mm x 1 mm grid which are mounted in a housing which is only about 42 mm square .
[0005] There is a desire to provide a land grid array connector which can use ball grid array technology and which also comprises a greater density of electrical contacts than previously available. However, electrical contacts of the connector still need to provide sufficient contact force, contact wiping, and stability to be commercially marketable as a dependable product with a reasonably long working life. Such a connector also needs to be manufacturable at a reasonable, marketable cost in order to be commercially acceptable to customers .
SUMMARY OF THE INVENTION
[0006] In accordance with one aspect of the present invention, an electrical contact assembly is provided including a contact terminal and a fusible element . The contact terminal has a base and two cantilevered deflectable contact arms extending from at least one lateral side of the base. A first one of the contact arms extends in a downward direction and a second one of the contact arms extends in an upward direction. The fusible element is fixedly attached to an end of the first contact arm. The fusible element is adapted to be fused to a first pad on a first electronic component. The second contact arm comprises a surface contact area for contacting a second pad on a second electronic component. The first and second contact arms are adapted to deflect when the fusible element is fused to the first electronic component and when the contact area of the second contact arm is contacted by the second pad of the second electronic component .
[0007] In accordance with another aspect of the present invention, an electrical connector subassembly is provided comprising a carrier comprising electrically insulative material; and a plurality of electrical contact terminals connected to the carrier. Each terminal comprises a base and at least two deflectable contact arms extending from at least one lateral side of the base. The carrier comprises apertures. At least one of the contact arms of each terminal extends through a respective one of the apertures. The base of each terminal comprises tabs which are deformed to form a stapled connection of the base with the carrier.
[0008] In accordance with one method of the present invention, a method of assembling an electrical contact assembly is provided comprising steps of providing a contact terminal comprising a base and two cantilevered deflectable contact arms extending from a same lateral side of the base, a first one of the contact arms extending in an upward direction and a second one of the contact arms extending in a downward direction; and attaching a fusible element to an end of the second contact arm. BRIEF DESCRIPTION OF THE DRAWINGS
[0009] The foregoing aspects and other features of the present invention are explained in the following description, taken in connection with the accompanying drawings, wherein:
[0010] Fig. 1 is a exploded perspective review of an electrical connector incorporating features of the present invention shown attached to a portion of a printed circuit board and adapted to receive an electronic component;
[0011] Fig. 2 is a partial cross sectional view of the electrical connector shown in Fig. 1 ;
[0012] Fig. 3 is a perspective view of the contact and fusible element shown in Fig. 2 shown attached to a carry strip before attachment to the carrier;
[0013] Fig. 4 is a partial cross sectional view of the electrical connector as shown in Fig. 2 shown attached to two electronic components;
[0014] Fig. 5 is a partial perspective view of the carrier shown in Fig. 2;
[0015] Fig. 6 is a partial enlarged perspective view of the carrier shown in Fig. 5; and
[0016] Fig 7 is a partial perspective view similar to Fig. 3 of an alternate embodiment of the attachment of the fusible element to an electrical contact. ' DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0017] Referring to Fig. 1, there is shown a perspective view of an electrical connector 10 incorporating features of the present invention shown attached to a first electronic component 12, such as a printed circuit board (PCB) , and adapted to receive a second electronic component 14, such as a processor chip. The connector 10 is adapted to electrically attach the electronic component 14 to the printed circuit board 12. Although the present invention will be described with reference to the exemplary embodiments shown in the drawings, it should be understood that the present invention can be embodied in many alternate forms of embodiments. In addition, any suitable size, shape or type of elements or materials could be used.
[0018] The present invention can address the need for an electrical connection between two pads, such as in the case of connecting a land grid array (LGA) package to a pad on a PCB. The present invention can provide an optimized design to be configured into an array for high- density and high I/O counts. This optimized design can provide superior electrical performance from a short electrical path provided by the contact geometry. The short contact geometry also provides a low mated height.
[0019] The contact can consist of a spring having two spring beams, one formed up and the other formed down, and a carrier that provides a support for positioning the contacts. The contacts can be attached to the carrier by a feature on the contact, similar to a staple, that protrudes through the carrier and is then formed against the carrier to secure the contact to the carrier. One spring beam can have a solder ball attached to its tip. The spring beams can be designed to accommodate a torsional deflection and additional wipe of the upper beam contact created by the offset position of the spring beam relative to each other.
[0020] The contacts can be held in place by the contact staple feature attached to the insulating carrier with apertures in the carrier allowing the spring beams to protrude through one side of the carrier to make contact with the associated mating components when positioned and compressed. Assembly of multiple contacts allows for various array configurations determined by the mating component and assembly patterns . This design leads itself to rapidly producing multiple different contact configurations. A frame could be added to the carrier to provide mechanical stiffness to the contact pattern for ball grid array (BGA) placement and attachment.
[0021] Referring also to Figs. 2 and 3, the electrical connector 10 comprises a housing 16 and at least one electrical connector subassembly 17. The electrical connector subassembly 17 generally comprises electrical contacts 18, a carrier 19, and fusible elements 20. Fig. 2 shows the electrical connector 10 before the electrical connector is attached to the PCB 12 and before the second electronic component 14 is attached to the connector. Fig. 4 shows the electrical connector 10 after the electronic component 14 is attached thereto by a compression means (not shown) . The electrical connector 10 generally comprises a first side 90 which is adapted to function as a land grid array (LGA) connection and a second side 92 which is adapted to function as a ball grid array (BGA) connection. [0022] The first electronic component 12, in the embodiment shown, comprises contact pads 23 on a top side thereof. In the embodiment shown, the contact pads 23 comprise solder pads. The contact pads 23 are adapted to have the fusible materials, such as solder balls 20, fused thereonto . The second electronic component 14, in the embodiment shown, comprises contact pads 22 on a bottom side thereof. The contact pads 22 are adapted to contact the electrical contacts 18 in a general land grid array type of connection.
[0023] As seen most clearly in Figs. 2 and 4, portions of the electrical contacts 18 extend above and below the housing 16. The portions of the electrical contacts 18 can be deflected or moved towards the housing 16 by the second electronic component 14 when the second electronic component is attached to the electrical connector 10.
[0024] The housing 16 is comprised of electrically insulating material. In the embodiment shown, the housing 16 generally comprises a first member 26 and a second member 28. The first and second members 26, 28 form a plurality of electrical contact receiving areas 24. As seen in Fig. 1, the electrical contact receiving areas 24 are arranged in an array of parallel columns and parallel rows. In this embodiment, the array has a general square ring shape. However, in alternate embodiments, any suitable type of array could be provided.
[0025] The receiving areas 24 each comprise a first section 30, a second section 32 and a middle section 36. The first section 30 is located in the first member 26. The second section 32 is located in the second member 28. The middle section 36 is located in both the first and second members 26, 28 or may be located entirely within one of the members 26, 28. The middle section 36 is located at a junction between the first members 26, 28 and connects the first section 30 to the second section 32. The first and second sections 30, 32 are at least partially offset from each other as seen in Fig. 2.
[0026] The subassembly 17 is also located at the junction between the first and second members 26, 28. As noted above, the subassembly 17 generally comprises the electrical contacts 18, the carrier 19, and the fusible elements 20. Referring also to Figs. 5 and 6, the carrier 19 preferably comprises a sheet of electrically insulative material. In this embodiment, the sheet 19 comprises a plurality of main apertures 38 and a plurality of staple slots 40. Each main aperture 38 comprises a pair of the staple slots 40 at one end thereof. The carrier 19 can be comprised of any suitable type of electrically insulative film material, such as KAPTON™. In a preferred embodiment, the carrier 19 is about 0.003 - 0.005 inches thick. The carrier 19 is preferably flexible. The carrier 19 adds stiffness to the contact 18.
[0027] Referring particularly to Fig. 3, one of the electrical contacts 18 is shown. The electrical contact 18 is shown still attached to its carry strip 42. The carry strip 42 would be removed before, during or after connection of the contact 18 to the carrier 19. In the embodiment shown, the electrical contacts 18 are substantially identical to each other. However, in alternate embodiments, the electrical connector 10 could comprise different types of electrical contacts. The electrical contact 18 is preferably comprised of flat sheet metal material, such as a copper alloy for example, which has been stamped and/or formed into the shape shown. The contact 18 can be plated with additional material, such as nickel and gold for example. In a preferred embodiment, the thickness or width 34 of the contact 18 is about 0.15 mm. However, in alternate embodiments, any suitable type of thickness or width could be provided.
[0028] The electrical contact 18 generally comprises a base 44 and two cantilevered, resiliently deflectable, contact arms 46, 48 extending from a same lateral side 50 of the base 44. The first contact arm 46 extends in a downward direction. The second contact arm 48 extends in an upward direction. An end 52 of the first contact arm 46 forms a fusible element attachment section. In the embodiment shown, the end 52 comprises a concave shaped bottom side 54 which forms a recess or pocket for receiving a portion of the solder ball 20. However, in an alternate embodiment, the recess in the bottom side 54 might not be provided and, the recess might not be preferred. An end 56 of the second contact arm 48 comprises a top surface 58 which forms a contact surface. In a preferred embodiment, the top surface 58 is stamped to form a curved surface. Preferably, the curved top surface 58 comprises a compound curvature. However, in alternate embodiments, the top surface 58 could comprise any suitable type of contact surface shape . The first contact arm 46 extends downward and the second contact arm 48 extends upward generally parallel to each other as shown by centerlines 62 and 64 in Fig. 2. The two centerlines 62, 64 are offset from each other. [0029] The base 44 of the contact 18 includes an aperture 45 which is provided to increase the flexibility of the contact arms 46, 48 without increasing the length of the contact arms. However, the aperture 45 decreases the stiffness or rigidity of the base 44. By attaching the base 44 to the carrier 19, the carrier 19 is able to add stiffness to the base 44.
[0030] The base 44 also includes two cantilevered side tabs 60. The side tabs 60 are used as mounting means for attaching the contact 18 to the carrier 19. More particularly, the tabs 60 are deformed to extend through the staple slots 40 in the carrier 19 and back towards the main section of the base 44 as shown in Fig. 2 in a stapled mounting configuration. Thus, the base 44 captures a portion of the carrier 19 thereto by a staple mounting procedure. When the contact 18 is attached to the carrier 19 the second contact arm 48 is able to extend through one of the apertures 39. The apertures 39, thus, provide a clearance hole for the second contact arm 48. The slots 40 might not be provided before the staple mounts are attached, such as when the staple mounts pierce through the carrier 19. The staple mounts comprise the tabs 60 being bent towards each other and then inward towards the base 44 to capture portions of the carrier between outer ends of the tabs 60 and the base 44. In alternate embodiments, other forms of staple mounting could be provided. Alternatively or additionally, any other suitable form of attaching the contacts to the carrier could be provided.
[0031] The fusible elements 20, generally comprise solder balls. A top side of each solder ball 20 is fused to the concave bottom side 54 of the first contact arm 46, by reflow techniques using solder paste or solder flux. The fusible elements 20 are preferably attached to the contacts 18 before the contacts are attached to the carrier 19.
[0032] With the subassembly 17 assembled, the subassembly is then assembled with the housing 16. The subassembly 17 is located such that the carrier 19 is located at the junction between the first and second members 26, 28. The base 44 is also located at the junction between the first and second members 26, 28 in the middle section 36 of the contact receiving area 24. The first and second members 26, 28 can be fixedly attached to each other by any suitable means. In one type of embodiment, adhesive layers between the first and second members and the carrier 19 hold the elements of the housing together. In another type of embodiment, the members 19, 26, 28 could be ultrasonically welded to each other.
[0033] The first contact arm 46 extends from the middle section 36 through the first section 30 of the contact receiving area 24 and past the bottom of the housing 16. The first contact arm 46 is deflectably movable in the first section 30. The second contact arm 48 extends from the middle section 36 through the second section 32 of the contact receiving areas 24 and past the top of the housing 16. The second contact arm 48 is deflectably movable in the second section 32.
[0034] Referring particularly to Fig. 4, the electrical connector 10 would be attached to the first electronic component 12 before the second electronic component 14 is secured onto the component 12. When the connector 10 is attached to the first electronic component 12 the fusible element 20 is placed against the pad 23. The fusible element 20 is then melted, such as in a solder reflow heating process, to allow the fusible element 22 to fuse with the pad 23 and form a fixed stationery electrical and mechanical connection therebetween. The contact arms 48 of the many contacts 18 will deflect outward different amounts due to different sizes of the solder balls 20 before melting, such as due to tolerance variations of the solder balls, and different sizes and shapes of the contact arms 48 due to tolerance variations.
[0035] Once the electrical connector 10 is attached to the first electronic component 12, the second electronic component 14 can be removably connected to the connector 10. When the second electronic component 14 is attached to the connector 10, the contact pads 22 press against the contact surfaces 58 on the second contact arms 48. Because the centerline axis 64 of the second contact arm 48 is offset by a distance 66 from the center line axis 62 of the first contact arm 46, there is provided a torsional bending of at least the second contact arm 48, and perhaps the base 44 and/or first contact arm 46, during deflection by contact with the pads 22 against the contact surfaces 58. This torsional deflection provides an additional wipe of the contact surface 58 against the pads 22 to be created by the offset position of the spring beams 46, 48 relative to each other. The clamping structure which presses the second component 14 towards the first component 12 causes both the arms 46, 48 to deflect in generally opposite directions towards the base 44. This structure increases the height of available deflection by using area both above and below the base 44 and, increases the normal force against the pads 22 because of the use of both arms 46, 48 to deflect.
[0036] In an alternate embodiment, the staple slots 40 might not be provided in the carrier 19 before the contacts 18 are attached to the carrier. Instead, the staple slots could be formed during connection of the contacts 18 to the carrier 19. In an alternate embodiment, the carrier 19 could comprise any suitable thickness. The carrier 19 could be rigid or semi-rigid. In another alternate embodiment, the carrier could comprise a laminated structure with multiple layers, such as a layer of stainless steel laminated with an electrically insulative isolator, such as comprised of KAPTON™. In another alternate embodiment, any suitable type of method for attaching the contact to the carrier could be provided. Any suitable connection of the fusible element to one of the contact arms could be provided. Both of the contact arms could comprise fusible elements attached thereto, such as for a nonremovable connection. The fusible elements could also be attached to the contacts after the contacts are attached to the carrier. In another alternate embodiment, the fusible elements 20 could be attached to the contacts 18 after the carrier 19 and contacts 18 are assembled with the housing 16.
[0037] Referring now to Fig. 7, a partial perspective view of an alternate embodiment of the present invention is shown. In this embodiment the subassembly 70 generally comprises an electrical contact 72 and a fusible element 74. The electrical contact 72 is substantially identical to the electrical contact 18 shown in Fig. 3. However, the end 76 of the first contact arm 78 does not comprise an inverted bowl shape as the end 52 shown in Fig. 3. In this embodiment, the end 52 extends into the fusible element. The fusible element 74 is located on the end 76 with the end 76 being located inside the fusible element 74. Thus, this embodiment illustrates that the fusible element 74 can be fused to the end 76 before attachment of the fusible element 74 to the contact pad on the printed circuit board. The subassembly 70 can be subsequently attached to a carrier, such as the carrier 19.
[0038] The present invention can provide a BGA to LGA or compressive beam connection that has an array with a high contact density, low inductance, high speed, and low cost manufacture. Because of the small size of the contacts, the use of the carrier helps to eliminate contact positioning problems in the housing during connector assembly. The use of the carrier in the present invention also helps to eliminate the small contact transporting problems found in assembly of conventional connectors having small contacts. The present invention provides greater manufacturing configuration flexibility by allowing the contacts to be connected to the carrier in any selected type of array design while still using the same contacts and carrier. The small height of the contacts help to reduce the height of the connector. The contact design also helps to reduce induction and impedance. Torsional bending can be provided to enhance contact wipe.
[0039] It should be understood that the foregoing description is only illustrative of the invention. Various alternatives and modifications can be devised by those skilled in the art without departing from the invention. Accordingly, the present invention is 'intended to embrace all such alternatives, modifications and variances which fall within the scope of the appended claims .

Claims

CLAIMS/ What is claimed is :
1. An electrical contact assembly comprising: a contact terminal comprising a base and two cantilevered deflectable' contact arms extending from at least one lateral side of the base, a first one of the contact arms extending in a downward direction and a second one of the contact arms extending in an upward direction; and a fusible element fixedly attached to an end of the first contact arm, wherein the fusible element is adapted to be fused to a first pad on a first electronic component, wherein the second contact arm comprises a surface contact area for contacting a second pad on a second electronic component, and wherein the first and second contact arms are adapted to deflect when the contact area of the second contact arm is contacted by the second pad of the second electronic component .
2. An electrical contact assembly as in claim 1 wherein the contact terminal comprises stamped sheet metal.
3. An electrical contact assembly as in claim 1 wherein the surface contact area on the second contact arm comprises a compound curvature.
4. An electrical contact assembly as in claim 1 wherein the first and second contact arms extend from a same lateral side of the base.
5. An electrical contact assembly as in claim 4 wherein the first and second contact arms extend in opposite directions generally parallel to each other.
6. An electrical contact assembly as in claim 1 wherein the end of the first contact arm comprises a concave bottom surface, and wherein a top surface of the fusible element is attached to the end of the first contact arm against the bottom concave surface.
7. An electrical contact assembly as in claim 1 wherein a top surface of the fusible element is attached to a bottom surface of the end of the first contact arm.
8. An electrical contact assembly as in claim 1 wherein the end of the first contact arm extends into the fusible element .
9. An electrical connector subassembly comprising: a carrier comprising electrically insulative material ; an electrical contact assembly as in claim 1 connected to the carrier, wherein the carrier comprises an aperture, wherein at least a portion of one of the contact arms extends through the aperture, and wherein the base comprises tabs which are deformed to form a stapled connection of the base with the carrier.
10. An electrical connector subassembly as in claim 9 wherein the carrier comprises a sheet of electrically insulative material, wherein the sheet comprises a plurality of the apertures, and wherein the subassembly comprises a plurality of the electrical contacts connected to the sheet in an array of multiple rows and columns .
11. An electrical connector subassembly as in claim 9 wherein the carrier comprises a film having a general sheet shape .
12. An electrical connector subassembly as in claim 11 wherein the film is flexible.
13. An electrical connector subassembly comprising: a carrier comprising electrically insulative material; and a plurality of electrical contact terminals connected to the carrier, each terminal comprising a base and at least two deflectable contact arms extending from at least one lateral side of the base, wherein the carrier comprises apertures, wherein at least one of the contact arms of each terminal extends through a respective one of the apertures, and wherein the base of each terminal comprises tabs which are deformed to form a stapled connection of the base with the carrier.
14. An electrical connector subassembly as in claim 13 wherein the contact terminals comprise stamped sheet metal .
15. An electrical connector subassembly as in claim 13 wherein a first one of the contact arms extending in a downward direction and a second one of the contact arms extending in an upward direction, and wherein a surface contact area on the second contact arm comprises a compound curvature .
16. An electrical connector subassembly as in claim 13 wherein the contact arms extend from a same lateral side of the base .
17. An electrical connector subassembly as in claim 16 wherein the contact arms extend in opposite directions generally parallel to each other.
18. An electrical connector subassembly as in claim 13 further comprising a fusible element fixedly attached to an end of a first one of the contact arms, wherein the end of the first contact arm comprises a concave bottom surface, and wherein a top surface of the fusible element is attached to the end of the first contact arm against the bottom concave surface .
19. An electrical connector subassembly as in claim 13 further comprising a fusible element fixedly attached to an end of a first one of the contact arms, wherein a top surface of the fusible element is attached to a bottom surface of the end of the first contact arm.
20. An electrical connector subassembly as in claim 13 further comprising a fusible element fixedly attached to an end of a first one of the contact arms, wherein the end of the first contact arm extends into the fusible element .
21. A method of assembling an electrical contact assembly comprising steps of: providing a contact terminal comprising a base and two cantilevered deflectable contact arms extending from a same lateral side of the base, a first one of the contact arms extending in an upward direction and a second one of the contact arms extending in a downward direction; and attaching a fusible element to an end of the second contact arm, wherein the first and second contact arms are adapted to deflect in opposite directions towards the base when the contact assembly is compressed between two electronic components.
22. A method as in claim 21 further comprising attaching the base of the contact terminal and to a carrier comprised of insulative material, the step of attaching comprising deforming tabs on the base of the contact terminal to form a stapled connection of the base to the carrier.
PCT/US2004/020712 2003-07-14 2004-06-28 Electrical contact assembly with insulative carrier, stapled contact attachment and fusible element WO2005008837A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/619,647 2003-07-14
US10/619,647 US6994565B2 (en) 2003-07-14 2003-07-14 Electrical contact assembly with insulative carrier, stapled contact attachment and fusible element

Publications (1)

Publication Number Publication Date
WO2005008837A1 true WO2005008837A1 (en) 2005-01-27

Family

ID=34062608

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/020712 WO2005008837A1 (en) 2003-07-14 2004-06-28 Electrical contact assembly with insulative carrier, stapled contact attachment and fusible element

Country Status (2)

Country Link
US (1) US6994565B2 (en)
WO (1) WO2005008837A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7104838B1 (en) 2005-03-07 2006-09-12 Fci Americas Technology, Inc. Electrical connector attachment
US7410384B2 (en) 2006-05-16 2008-08-12 Fci Americas Technology, Inc. Electrical contact with stapled connection

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005013430A1 (en) * 2003-08-01 2005-02-10 Fci Asia Technology Pte Ltd Connector
EP1753100A4 (en) * 2004-06-03 2008-05-07 Nihon Micronics Kk Contactor and electrical connector
US7238031B2 (en) * 2005-02-14 2007-07-03 Alps Electric Co., Ltd. Contact structure and manufacturing method thereof, and electronic member to which the contact structure is attached and manufacturing method thereof
CN100399637C (en) * 2005-05-16 2008-07-02 富士康(昆山)电脑接插件有限公司 Electric connector
US20070117268A1 (en) * 2005-11-23 2007-05-24 Baker Hughes, Inc. Ball grid attachment
JP2007165149A (en) * 2005-12-14 2007-06-28 Fujitsu Ltd Lga connector, and package mounting structure
US20100153836A1 (en) * 2008-12-16 2010-06-17 Rich Media Club, Llc Content rendering control system and method
US7473102B2 (en) * 2006-03-31 2009-01-06 International Business Machines Corporation Space transforming land grid array interposers
CN200941518Y (en) * 2006-08-01 2007-08-29 富士康(昆山)电脑接插件有限公司 Electrical connector
US20080160841A1 (en) * 2006-12-28 2008-07-03 Hon Hai Precision Ind. Co., Ltd. Electrical contact used in an electrical socket
US8206160B2 (en) * 2007-05-25 2012-06-26 Georgia Tech Research Corporation Compliant off-chip interconnects for use in electronic packages
US7568917B1 (en) * 2008-01-10 2009-08-04 Tyco Electronics Corporation Laminated electrical contact strip
US7654828B1 (en) * 2008-09-19 2010-02-02 Hon Hai Precision Ind. Co., Ltd. Socket with contact for being soldered to printed circuit board
JP5561470B2 (en) * 2010-02-19 2014-07-30 新光電気工業株式会社 Socket, connection structure between socket and electronic device, and semiconductor device
CN102740664A (en) * 2011-04-01 2012-10-17 鸿富锦精密工业(深圳)有限公司 Electronic device
US8974236B2 (en) * 2012-07-26 2015-03-10 Hon Hai Precision Industry Co., Ltd. Low profile electrical connector
CN204216286U (en) * 2014-11-11 2015-03-18 番禺得意精密电子工业有限公司 Electric connector
US9407015B1 (en) * 2014-12-29 2016-08-02 Western Digital Technologies, Inc. Automatic power disconnect device
US10062666B2 (en) 2015-10-30 2018-08-28 Advanced Research Corporation Catch flexure systems, devices and methods
CN108306138A (en) * 2018-01-09 2018-07-20 番禺得意精密电子工业有限公司 Electric connector
US10980135B2 (en) * 2019-02-18 2021-04-13 John O. Tate Insulated socket body and terminals for a land grid array socket assembly

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5228861A (en) * 1992-06-12 1993-07-20 Amp Incorporated High density electrical connector system
US6217348B1 (en) * 1999-08-09 2001-04-17 Hon Hai Precision Ind. Co., Ltd. Electrical connector
US6375474B1 (en) * 1999-08-09 2002-04-23 Berg Technology, Inc. Mezzanine style electrical connector

Family Cites Families (94)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2922948A (en) 1957-03-19 1960-01-26 George H Washburn Storage battery cell tester
US3107319A (en) 1962-05-28 1963-10-15 Brown Engineering Company Inc Modular component printed circuit connector
US3432801A (en) 1966-10-31 1969-03-11 Dynamics Corp America Patchboard programming system
US3654592A (en) 1970-09-21 1972-04-04 Berg Electronics Inc Electrical connector and block
GB1430114A (en) 1972-07-03 1976-03-31 Ibm Electrical connector
US3951495A (en) 1974-09-23 1976-04-20 Advanced Memory Systems, Inc. Leadless package receptacle
US4199209A (en) 1978-08-18 1980-04-22 Amp Incorporated Electrical interconnecting device
US4161346A (en) 1978-08-22 1979-07-17 Amp Incorporated Connecting element for surface to surface connectors
US4341433A (en) 1979-05-14 1982-07-27 Amp Incorporated Active device substrate connector
US4307928A (en) 1979-08-17 1981-12-29 Petlock Jr William Bellows-type electrical test contact
US4315663A (en) 1980-03-10 1982-02-16 Amp, Inc. Multiple position brush connector
US4805885A (en) 1982-12-21 1989-02-21 Amp Incorporated Sinuous spring
US4553192A (en) 1983-08-25 1985-11-12 International Business Machines Corporation High density planar interconnected integrated circuit package
US4533203A (en) 1983-12-07 1985-08-06 Amp Incorporated Connector for printed circuit boards
US4778404A (en) 1983-12-27 1988-10-18 Amp Incorporated Spring terminal
DE3507464A1 (en) 1984-03-08 1985-09-12 Feinmetall Gmbh, 7033 Herrenberg Spring contact pin
US4620761A (en) 1985-01-30 1986-11-04 Texas Instruments Incorporated High density chip socket
DE3507646C1 (en) 1985-03-05 1986-07-17 Anton Piller GmbH & Co KG, 3360 Osterode Internal-taper measuring device
US4647126A (en) 1985-06-17 1987-03-03 Sperry Corporation Compliant lead clip
US5476211A (en) 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US4699593A (en) 1986-01-14 1987-10-13 Amp Incorporated Connector having contact modules for a substrate such as an IC chip carrier
US5597313A (en) 1986-06-19 1997-01-28 Labinal Components And Systems, Inc. Electrical connectors
EP0256541A3 (en) 1986-08-19 1990-03-14 Feinmetall Gesellschaft mit beschrÀ¤nkter Haftung Contacting device
US4830623A (en) 1988-02-10 1989-05-16 Rogers Corporation Connector arrangement for electrically interconnecting first and second arrays of pad-type contacts
US4954087A (en) 1988-04-27 1990-09-04 I-Stat Corporation Static-free interrogating connector for electric components
JPH073582Y2 (en) 1989-01-18 1995-01-30 Contact terminal and low insertion force connector
USRE34084E (en) 1989-02-13 1992-09-29 Burndy Corporation Vertical action contact spring
US4927369A (en) 1989-02-22 1990-05-22 Amp Incorporated Electrical connector for high density usage
US4891019A (en) 1989-03-03 1990-01-02 Amp Incorporated Electrical connector for interconnecting a printed circuit board to a ribbon cable
US4906194A (en) 1989-04-13 1990-03-06 Amp Incorporated High density connector for an IC chip carrier
US5366380A (en) 1989-06-13 1994-11-22 General Datacomm, Inc. Spring biased tapered contact elements for electrical connectors and integrated circuit packages
US4998886A (en) 1989-07-07 1991-03-12 Teledyne Kinetics High density stacking connector
US4990107A (en) 1989-11-17 1991-02-05 Amp Incorporated Integrated circuit module connector assembly
US4969826A (en) 1989-12-06 1990-11-13 Amp Incorporated High density connector for an IC chip carrier
US4978308A (en) 1989-12-18 1990-12-18 Amp Incorporated Surface mount pin header
US5055054A (en) 1990-06-05 1991-10-08 E. I. Du Pont De Nemours And Company High density connector
JP2542958B2 (en) 1990-08-20 1996-10-09 三洋電機株式会社 High frequency heating equipment
JPH0638382Y2 (en) 1990-09-10 1994-10-05 モレックス インコーポレーテッド Surface mount connector for connecting boards
AU650212B2 (en) 1990-10-29 1994-06-09 General Datacomm Inc. Electrical connectors having tapered spring contact element
US5337202A (en) 1990-11-09 1994-08-09 Seagate Technology, Inc. Actuator arm assembly printed circuit cable to external printed circuit board interface apparatus
US5061192A (en) 1990-12-17 1991-10-29 International Business Machines Corporation High density connector
JPH0713191Y2 (en) 1991-02-20 1995-03-29 日本航空電子工業株式会社 connector
US5161982A (en) 1991-03-29 1992-11-10 Teledyne Kinetics Reactive base for cantilevered connector
US5167512A (en) 1991-07-05 1992-12-01 Walkup William B Multi-chip module connector element and system
US5173055A (en) 1991-08-08 1992-12-22 Amp Incorporated Area array connector
US5152695A (en) 1991-10-10 1992-10-06 Amp Incorporated Surface mount electrical connector
US5137456A (en) 1991-11-04 1992-08-11 International Business Machines Corporation High density, separable connector and contact for use therein
US5199889A (en) 1991-11-12 1993-04-06 Jem Tech Leadless grid array socket
US5158468A (en) 1991-12-06 1992-10-27 Motorola, Inc. Self-retaining contact assembly
US5263880A (en) 1992-07-17 1993-11-23 Delco Electronics Corporation Wirebond pin-plastic header combination and methods of making and using the same
US5259769A (en) 1992-09-29 1993-11-09 Molex Incorporated Electrical connector with preloaded spring-like terminal with improved wiping action
WO1994011925A1 (en) 1992-11-11 1994-05-26 Elco Europe Limited Electrical connector
US5357386A (en) 1992-11-13 1994-10-18 Seagate Technology, Inc. Disc drive with head/disc assembly having sealed connectors
GB2273830B (en) 1992-12-24 1997-04-16 Whitaker Corp Electrical contact elements for interposer structures
US5358411A (en) 1993-08-09 1994-10-25 The Whitaker Corporation Duplex plated epsilon compliant beam contact and interposer
US5308252A (en) 1992-12-24 1994-05-03 The Whitaker Corporation Interposer connector and contact element therefore
JPH06325810A (en) 1993-03-08 1994-11-25 Whitaker Corp:The Contact module and pin grid array based thereon
US5324205A (en) 1993-03-22 1994-06-28 International Business Machines Corporation Array of pinless connectors and a carrier therefor
FR2703839B1 (en) 1993-04-09 1995-07-07 Framatome Connectors France Intermediate connector between printed circuit board and electronic circuit substrate.
US5378160A (en) 1993-10-01 1995-01-03 Bourns, Inc. Compliant stacking connector for printed circuit boards
US5772451A (en) 1993-11-16 1998-06-30 Form Factor, Inc. Sockets for electronic components and methods of connecting to electronic components
US5464355A (en) 1994-01-19 1995-11-07 Rothenberger; Richard E. Sealed land grid array connector
US5800184A (en) 1994-03-08 1998-09-01 International Business Machines Corporation High density electrical interconnect apparatus and method
US5462440A (en) 1994-03-11 1995-10-31 Rothenberger; Richard E. Micro-power connector
US5484295A (en) 1994-04-01 1996-01-16 Teledyne Electronic Technologies Low profile compression electrical connector
US5802699A (en) 1994-06-07 1998-09-08 Tessera, Inc. Methods of assembling microelectronic assembly with socket for engaging bump leads
US5632631A (en) 1994-06-07 1997-05-27 Tessera, Inc. Microelectronic contacts with asperities and methods of making same
US5498166A (en) 1994-06-30 1996-03-12 The Whitaker Corporation Interconnect system
DE9414307U1 (en) * 1994-08-23 1994-12-08 Thomas & Betts Corp Flat / round cable connection device
US5810609A (en) 1995-08-28 1998-09-22 Tessera, Inc. Socket for engaging bump leads on a microelectronic device and methods therefor
US5573435A (en) 1995-08-31 1996-11-12 The Whitaker Corporation Tandem loop contact for an electrical connector
US5653598A (en) 1995-08-31 1997-08-05 The Whitaker Corporation Electrical contact with reduced self-inductance
GB9519204D0 (en) 1995-09-20 1995-11-22 Amp Gmbh Electrical installataion bus connector
US5746626A (en) 1996-10-11 1998-05-05 Bourns, Inc. Electrical connector assembly
EP0849842A3 (en) 1996-12-17 1999-06-09 The Whitaker Corporation Smart card connector module
GB9703923D0 (en) 1997-02-25 1997-04-16 Breckenridge David Folding landing net
US5938451A (en) 1997-05-06 1999-08-17 Gryphics, Inc. Electrical connector with multiple modes of compliance
US5913687A (en) 1997-05-06 1999-06-22 Gryphics, Inc. Replacement chip module
US6045367A (en) 1997-09-24 2000-04-04 Teledyne Industries, Inc. Multi-pin connector
US6217342B1 (en) 1997-10-30 2001-04-17 Intercon Systems, Inc. Interposer assembly
US6019611A (en) 1998-02-12 2000-02-01 Hon Hai Precision Ind. Co., Ltd. Land grid array assembly and related contact
JP3284342B2 (en) 1998-04-17 2002-05-20 日本航空電子工業株式会社 connector
US6042412A (en) 1998-08-28 2000-03-28 The Whitaker Corporation Land grid array connector assembly
TW392975U (en) 1998-09-29 2000-06-01 Hon Hai Prec Ind Co Ltd Electrical connector
US5984693A (en) 1998-12-17 1999-11-16 Hon Hai Precision Ind. Co., Ltd. Contact of an LGA socket
TW389436U (en) 1998-12-28 2000-05-01 Hon Hai Prec Ind Co Ltd Electrical connector
US6155845A (en) 1998-12-28 2000-12-05 Hon Hai Precision Ind. Co., Ltd. Electrical contact for ball grid array socket
US6193523B1 (en) 1999-04-29 2001-02-27 Berg Technology, Inc. Contact for electrical connector
US6203331B1 (en) 1999-11-05 2001-03-20 Hon Hai Precision Ind. Co., Ltd. Land grid array connector having a floating housing
US6296495B1 (en) 1999-11-05 2001-10-02 Hon Hai Precision Ind. Co., Ltd. Land grid package connector
US6179624B1 (en) 1999-11-05 2001-01-30 Hon Hai Precision Ind. Co., Ltd. Land grid array connector
US6210176B1 (en) 1999-11-18 2001-04-03 Hon Hai Precision Ind. Co., Ltd. Land grid array connector
US6758702B2 (en) 2000-02-24 2004-07-06 Fci Americas Technology, Inc. Electrical connector with compression contacts
US6257899B1 (en) 2000-07-26 2001-07-10 Hon Hai Precision Ind. Co., Ltd. Soft internal touch contact for IC socket

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5228861A (en) * 1992-06-12 1993-07-20 Amp Incorporated High density electrical connector system
US6217348B1 (en) * 1999-08-09 2001-04-17 Hon Hai Precision Ind. Co., Ltd. Electrical connector
US6375474B1 (en) * 1999-08-09 2002-04-23 Berg Technology, Inc. Mezzanine style electrical connector

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7104838B1 (en) 2005-03-07 2006-09-12 Fci Americas Technology, Inc. Electrical connector attachment
US7410384B2 (en) 2006-05-16 2008-08-12 Fci Americas Technology, Inc. Electrical contact with stapled connection
US7422468B2 (en) 2006-05-16 2008-09-09 Fci Americas Technology, Inc. Electrical contact with stapled connection

Also Published As

Publication number Publication date
US20050014396A1 (en) 2005-01-20
US6994565B2 (en) 2006-02-07

Similar Documents

Publication Publication Date Title
US6994565B2 (en) Electrical contact assembly with insulative carrier, stapled contact attachment and fusible element
KR100537870B1 (en) Contact sheet, method of manufacturing the same, and socket including the same
US5210939A (en) Lead grid array integrated circuit
KR940002662Y1 (en) Soldering support terminals
US6293806B1 (en) Electrical connector with improved terminals for electrically connecting to a circuit board
US5938451A (en) Electrical connector with multiple modes of compliance
JP2819179B2 (en) Multi-contact electrical connector
US4827611A (en) Compliant S-leads for chip carriers
US4593463A (en) Method of making a contact assembly
US7285026B1 (en) Compressed contact electrical connector
WO1998028818A1 (en) Miniature card edge clip
CN110034430B (en) Electric connector and assembling method thereof
US7927159B2 (en) Contact carrier having contact terminals arranged alternatively along sides
US7654828B1 (en) Socket with contact for being soldered to printed circuit board
US20100317232A1 (en) Low profile socket connector and method for making the same
WO2020014010A1 (en) Electrical connector with hermaphroditic terminal and housing
CN112151986A (en) Electrical connector
EP1094566B1 (en) Clip for coupling component to connector contacts
JP3442349B2 (en) Terminal fitting
US7439625B2 (en) Circuit board
US7029292B2 (en) Electrical connector and contact
US9004959B2 (en) Electrical connecting device
US20030114028A1 (en) Solder-bearing lead
US20040102066A1 (en) Electrical connector with deflectable contacts and fusible elements
JP2529985B2 (en) Connector manufacturing method and contact

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 69(1) EPC (EPO FORM 1205A DATED 11-05-2006)

122 Ep: pct application non-entry in european phase