WO2005010936A3 - Edge bead control method and apparatus - Google Patents

Edge bead control method and apparatus Download PDF

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Publication number
WO2005010936A3
WO2005010936A3 PCT/US2004/022039 US2004022039W WO2005010936A3 WO 2005010936 A3 WO2005010936 A3 WO 2005010936A3 US 2004022039 W US2004022039 W US 2004022039W WO 2005010936 A3 WO2005010936 A3 WO 2005010936A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
control method
methods
edge bead
bead control
Prior art date
Application number
PCT/US2004/022039
Other languages
French (fr)
Other versions
WO2005010936A2 (en
Inventor
Bernard O Li
Original Assignee
Finisar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Finisar Corp filed Critical Finisar Corp
Publication of WO2005010936A2 publication Critical patent/WO2005010936A2/en
Publication of WO2005010936A3 publication Critical patent/WO2005010936A3/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Abstract

Methods and devices for handling wafers during wafer processing are provided. One embodiment includes an apparatus for holding a wafer. The holding apparatus includes a pocket for receiving a wafer, and may include a mechanism allowing for the wafer to be secured within the pocket. Methods are also included for preparing a wafer for fabrication processes by the use of a wafer holding apparatus. These methods may include applying a layer of photoresist to the surface of a wafer.
PCT/US2004/022039 2003-07-18 2004-07-08 Edge bead control method and apparatus WO2005010936A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/623,351 US6887801B2 (en) 2003-07-18 2003-07-18 Edge bead control method and apparatus
US10/623,351 2003-07-18

Publications (2)

Publication Number Publication Date
WO2005010936A2 WO2005010936A2 (en) 2005-02-03
WO2005010936A3 true WO2005010936A3 (en) 2005-07-21

Family

ID=34063363

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/022039 WO2005010936A2 (en) 2003-07-18 2004-07-08 Edge bead control method and apparatus

Country Status (4)

Country Link
US (1) US6887801B2 (en)
CN (1) CN1826185A (en)
TW (1) TW200515525A (en)
WO (1) WO2005010936A2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100518788B1 (en) * 2003-03-11 2005-10-05 삼성전자주식회사 Spin coating apparatus for coating photoresist
US8619072B2 (en) * 2009-03-04 2013-12-31 Triangle Software Llc Controlling a three-dimensional virtual broadcast presentation
CN102862396A (en) * 2012-08-04 2013-01-09 江苏吉星新材料有限公司 Chip marking positioning die
US10978332B2 (en) * 2016-10-05 2021-04-13 Prilit Optronics, Inc. Vacuum suction apparatus
CN117497435A (en) * 2022-07-21 2024-02-02 长鑫存储技术有限公司 Semiconductor structure processing method, processing device and processing system

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Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
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Also Published As

Publication number Publication date
WO2005010936A2 (en) 2005-02-03
US20050014390A1 (en) 2005-01-20
TW200515525A (en) 2005-05-01
CN1826185A (en) 2006-08-30
US6887801B2 (en) 2005-05-03

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