WO2005010956A3 - Endeffectors for handling semiconductor wafers - Google Patents

Endeffectors for handling semiconductor wafers Download PDF

Info

Publication number
WO2005010956A3
WO2005010956A3 PCT/US2004/008767 US2004008767W WO2005010956A3 WO 2005010956 A3 WO2005010956 A3 WO 2005010956A3 US 2004008767 W US2004008767 W US 2004008767W WO 2005010956 A3 WO2005010956 A3 WO 2005010956A3
Authority
WO
WIPO (PCT)
Prior art keywords
endeffector
endeffectors
wafer
handling
wafers
Prior art date
Application number
PCT/US2004/008767
Other languages
French (fr)
Other versions
WO2005010956A2 (en
Inventor
Paul Mantz
Original Assignee
Mattson Tech Inc
Paul Mantz
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mattson Tech Inc, Paul Mantz filed Critical Mattson Tech Inc
Priority to DE112004001162.0T priority Critical patent/DE112004001162B4/en
Priority to JP2006517080A priority patent/JP4755088B2/en
Priority to KR1020057024890A priority patent/KR101135216B1/en
Publication of WO2005010956A2 publication Critical patent/WO2005010956A2/en
Publication of WO2005010956A3 publication Critical patent/WO2005010956A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Manipulator (AREA)

Abstract

Various endeffector designs are disclosed for handling semiconductor wafers. For instance, an endeffector for handling wafers at a relatively low temperature is disclosed along with an endeffector for handling wafers at a relatively high temperature. Both endeffectors include uniquely designed support members that are configured to only contact a wafer at the wafer's edge. The endeffectors may also include a wafer detection system. The endeffector for handling wafers at relatively low temperatures may also include a pushing device that is used not only to position a wafer but to hold a wafer on the endeffector during acceleration or deceleration of the endeffector caused by a robot arm attached to the endeffector. As designed, the endeffectors may have a very slim profile making the endeffectors easily maneuverable.
PCT/US2004/008767 2003-06-27 2004-03-23 Endeffectors for handling semiconductor wafers WO2005010956A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE112004001162.0T DE112004001162B4 (en) 2003-06-27 2004-03-23 End effector for handling semiconductor wafers
JP2006517080A JP4755088B2 (en) 2003-06-27 2004-03-23 End effector handling semiconductor wafers
KR1020057024890A KR101135216B1 (en) 2003-06-27 2004-03-23 Endeffectors for handling semiconductor wafers

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US48342503P 2003-06-27 2003-06-27
US60/483,425 2003-06-27
US10/781,323 2004-02-18
US10/781,323 US7654596B2 (en) 2003-06-27 2004-02-18 Endeffectors for handling semiconductor wafers

Publications (2)

Publication Number Publication Date
WO2005010956A2 WO2005010956A2 (en) 2005-02-03
WO2005010956A3 true WO2005010956A3 (en) 2005-09-15

Family

ID=33567692

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/008767 WO2005010956A2 (en) 2003-06-27 2004-03-23 Endeffectors for handling semiconductor wafers

Country Status (6)

Country Link
US (3) US7654596B2 (en)
JP (1) JP4755088B2 (en)
KR (1) KR101135216B1 (en)
CN (1) CN101908498A (en)
DE (1) DE112004001162B4 (en)
WO (1) WO2005010956A2 (en)

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JP2007525001A (en) 2007-08-30
US7654596B2 (en) 2010-02-02
WO2005010956A2 (en) 2005-02-03
US20100096869A1 (en) 2010-04-22
US8109549B2 (en) 2012-02-07
DE112004001162T5 (en) 2006-07-27
US20120126555A1 (en) 2012-05-24
CN101908498A (en) 2010-12-08
KR101135216B1 (en) 2012-04-12
DE112004001162B4 (en) 2018-10-04
US20050006916A1 (en) 2005-01-13
US8622451B2 (en) 2014-01-07
KR20060026444A (en) 2006-03-23

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