WO2005015104A2 - Tower heat sink with sintered grooved wick - Google Patents
Tower heat sink with sintered grooved wick Download PDFInfo
- Publication number
- WO2005015104A2 WO2005015104A2 PCT/US2004/018039 US2004018039W WO2005015104A2 WO 2005015104 A2 WO2005015104 A2 WO 2005015104A2 US 2004018039 W US2004018039 W US 2004018039W WO 2005015104 A2 WO2005015104 A2 WO 2005015104A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat pipe
- wick
- lands
- average particle
- disposed
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention generally relates to the management of thermal energy generated by electronic systems, and more particularly to a heat pipe-related tower heat sink for efficiently and cost effectively routing and controlling the thermal energy generated by various components of an electronic system.
- Heat pipes are known in the art for both transferring and spreading heat that is generated by electronic devices.
- Heat pipes use successive evaporation and condensation of a working fluid to transport thermal energy from a heat source to a heat sink. Heat pipes can transport very large amounts of thermal energy in a vaporized working fluid, because most working fluids have a high heat of vaporization. Further, the thermal energy can be transported over relatively small temperature differences between the heat source and the heat sink.
- Heat pipes generally use capillary forces created by a porous wick to return condensed working fluid, from a heat pipe condenser section (where transported thermal energy is given up at the heat sink) to an evaporator section (where the thermal energy to be transported is absorbed from the heat source).
- Heat pipe wicks are typically made by wrapping metal screening of felt metal around a cylindrically shaped mandrel, inserting the mandrel and wrapped wick inside a heat pipe container and then removing the mandrel. Wicks have also been formed by depositing a metal powder onto the interior surfaces of the heat pipe and then sintering the powder to create a very large number of intersticial capillaries.
- Typical heat pipe wicks are particularly susceptible to developing hot spots where the liquid condensate being wicked back to the evaporator section boils away and impedes or blocks liquid movement.
- Heat spreader heat pipes can help improve heat rejection from integrated circuits.
- a heat spreader is a thin substrate that absorbs the thermal energy generated by, e.g., a semiconductor device, and spreads the energy over a large surface of a heat sink.
- a wick structure should be thin enough that the conduction delta-T is sufficiently small to prevent boiling from initiating. Thin wicks, however, have not been thought to have sufficient cross-sectional area to transport the large amounts of liquid required to dissipate any significant amount of power.
- Eastman, U.S. Patent No.4,274,479 concerns a heat pipe capillary wick structure that is fabricated from sintered metal, and formed with longitudinal grooves on its interior surface.
- the Eastman wick grooves provide longitudinal capillary pumping while the sintered wick provides a high capillary pressure to fill the grooves and assure effective circumferential distribution of the heat transfer liquid.
- Eastman describes grooved structures generally as having "lands" and "grooves or channels".
- the lands are the material between the grooves or channels.
- the sides of the lands define the width of the grooves. Thus, the land height is also the groove depth.
- Eastman also states that the prior art consists of grooved structures in which the lands are solid material, integral with the casing wall, and the grooves are made by various machining, chemical milling or extrusion processes.
- the lands and grooves must be sufficient in size to maintain a continuous layer of fluid within a relatively thick band of sintered powder connecting the lands and grooves such that a reservoir of working fluid exists at the bottom of each groove.
- Eastman requires his grooves to be blocked at their respective ends to assure that the capillary pumping pressure within the groove is determined by its narrowest width at the vapor liquid interface.
- Eastman suggests that these wicks do not have sufficient cross-sectional area to transport the relatively large amounts of working fluid that is required to dissipate a significant amount of thermal energy.
- the present invention provides a tower heat pipe comprising a tubular enclosure having an internal surface at least partially covered with a wick, a working fluid disposed within the enclosure, and at least one fin projecting radially outwardly from an outer surface of the tubular enclosure.
- the tubular enclosure is sealed at one end by a base having a grooved sintered wick disposed on at least a portion of its internal surface.
- the grooved, sintered wick comprises a plurality of individual particles having an average diameter.
- the grooved wick includes at least two lands that are in fluid communication with one another through a particle layer disposed between the at least two lands that comprises less than about six average particle diameters.
- Fig. 1 is a front elevational view of a tower heat pipe formed in accordance with the present invention
- Fig. 2 is a cross-sectional perspective view of the tower heat pipe shown in Fig. 1
- Fig. 3 is an elevational cross-sectional view of the tower heat pipe shown in Figs.
- Fig.4 is a broken-way, enlarged view of a portion of a base-wick shown in Figs. 2 and 3;
- Fig. 5 is a significantly enlarged view of a portion of a groove-wick disposed at the bottom of the heat pipe of Figs. 1-3, showing an extremely thin wick structure disposed between individual lands of the wick;
- Fig. 6 is a broken-away end portion of a base-wick and base formed in accordance with the present invention;
- Fig. 7 is a perspective view of a typical mandrel used to form a base- wick in accordance with the present invention.
- the present invention comprises a tower heat pipe heat 2 that is sized and shaped to transfer thermal energy generated by at least one thermal energy source, e.g., a semiconductor device 4 that is thermally engaged with a portion of tower heat pipe 2.
- Heat pipe 2 includes a body 6, a body-wick 8, a base 10, a base-wick 12, and fins 16. More particularly, body 6 comprises a cylindrical tube formed from a highly thermally conductive metal, e.g., copper or its alloys, nickel or its alloys (such as monel an alloy of nickel and copper) could be incorporated into the structure with no significant changes in design or fabrication method.
- a vapor space is defined by a central passageway 18 extending along the longitudinal axis of body 6.
- Body 6 includes a bottom end 22 and a top end 25.
- Bottom end 22 is hermetically sealed to an inner surface 23 of base 10.
- Top end 25 is pinched off or otherwise sealed at a fill tube 26 during construction.
- Fins 16 project radially outwardly from outer surface 27 of body 6.
- Fins 16 may be formed from any thermally conductive material, such as copper, aluminum, or their alloys.
- body-wick 8 is preferably formed from a sintered copper powder or the like, that is distributed throughout the inner surface of body 6 that defines central passageway 18.
- body-wick 8 may also comprise adjacent layers of screening or a sintered powder structure with interstices between the particles of powder, having an average thickness of about 0.1mm to 1.0mm.
- central passageway 18 may be devoid of some or all of body-wick 8, particularly in gravity-aided embodiments of the invention.
- base-wick 12 is located on inner surface 23 of base 10, and is often formed from a metal powder 30 that is sintered in place around a shaped mandrel 32 (Fig. 7) to form a sintered groove structure.
- Lands 35 of mandrel 32 form grooves 37 of finished base-wick 12, and grooves 40 of mandrel 32 form lands 42 of base-wick 12.
- Each land 42 is formed as an inverted, substantially "V'-shaped or pyramidal protrusion having sloped side walls 44a, 44b, and is spaced-apart from adjacent lands.
- Grooves 37 separate lands 42 and are arranged in substantially parallel rows that extend through a portion of inner surface 23.
- the terminal portions 43 of grooves 37 may be disposed adjacent to the inner surface of bottom end 22 of body 6, or may be spaced away from body 6.
- a relatively thin layer of sintered powder 30 is deposited upon inner surface 23 of base 10 so as to form a groove-wick 45 at the bottom of each groove 37, and between spaced-apart lands 42.
- base-wick 12 is arranged in spaced-away relation to the inner surface of bottom end 22 of body 6, groove-wick 45 extends between terminal portions 43 of grooves 37 and the inner surface of body 6.
- Sintered powder 30 may be selected from any of the materials having high thermal conductivity and that are suitable for fabrication into porous structures, e.g., carbon, tungsten, copper, aluminum, magnesium, nickel, gold, silver, aluminum oxide, beryllium oxide, or the like, and may comprise either substantially spherical, arbitrary or regular polygonal, or filament-shaped particles of varying cross-sectional shape.
- sintered copper powder 30 is deposited between lands 42 (and on the portion of base 10 that surrounds base- wick 12) such that groove-wick 45 comprises an average thickness of about one to six average copper particle diameters (approximately .005 millimeters to .5 millimeters, preferably, in the range from about .05 millimeters to about .25 millimeters) when deposited over substantially all of inner surface 23 of base 10, and in the space between sloped side walls 44a, 44b at the bottom of lands 42.
- other wick materials such as, aluminum-silicon-carbide or copper-silicon- carbide may be used with similar effect.
- groove-wick 45 is formed so as to be thin enough that the conduction delta-T is small enough to prevent boiling from initiating at the interface between inner surface 23 and the sintered powder forming the wick.
- Groove-wick 45 is an extremely thin wick structure that is fed by spaced lands 42 which provide the required cross-sectional area to maintain effective working fluid flow.
- groove-wick 45 comprises an optimum design when it comprises the largest possible (limited by capillary limitations) flat area between lands 42. This area should have a thickness of, e.g., only one to six copper powder particles.
- the thinner groove-wick 45 is, the better performance within realistic fabrication constraints, as long as the surface area of inner surface 23 has at least one layer of copper particles.
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04754606A EP1645174A4 (en) | 2003-07-14 | 2004-06-04 | Tower heat sink with sintered grooved wick |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/618,965 US6938680B2 (en) | 2003-07-14 | 2003-07-14 | Tower heat sink with sintered grooved wick |
US10/618,965 | 2003-07-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005015104A2 true WO2005015104A2 (en) | 2005-02-17 |
WO2005015104A3 WO2005015104A3 (en) | 2005-05-12 |
Family
ID=34062487
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/018039 WO2005015104A2 (en) | 2003-07-14 | 2004-06-04 | Tower heat sink with sintered grooved wick |
Country Status (4)
Country | Link |
---|---|
US (1) | US6938680B2 (en) |
EP (1) | EP1645174A4 (en) |
CN (1) | CN1820560A (en) |
WO (1) | WO2005015104A2 (en) |
Cited By (1)
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2003
- 2003-07-14 US US10/618,965 patent/US6938680B2/en not_active Expired - Fee Related
-
2004
- 2004-06-04 WO PCT/US2004/018039 patent/WO2005015104A2/en active Application Filing
- 2004-06-04 EP EP04754606A patent/EP1645174A4/en active Pending
- 2004-06-04 CN CNA2004800195447A patent/CN1820560A/en active Pending
Non-Patent Citations (1)
Title |
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See references of EP1645174A4 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103925576A (en) * | 2014-04-25 | 2014-07-16 | 上海柏宜照明电子有限公司 | LED heat radiator based on heat pipe technology |
Also Published As
Publication number | Publication date |
---|---|
EP1645174A2 (en) | 2006-04-12 |
US20050011633A1 (en) | 2005-01-20 |
CN1820560A (en) | 2006-08-16 |
EP1645174A4 (en) | 2008-07-16 |
US6938680B2 (en) | 2005-09-06 |
WO2005015104A3 (en) | 2005-05-12 |
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