WO2005019785A3 - Capacitive sensor - Google Patents
Capacitive sensor Download PDFInfo
- Publication number
- WO2005019785A3 WO2005019785A3 PCT/US2004/025825 US2004025825W WO2005019785A3 WO 2005019785 A3 WO2005019785 A3 WO 2005019785A3 US 2004025825 W US2004025825 W US 2004025825W WO 2005019785 A3 WO2005019785 A3 WO 2005019785A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- plate
- capacitive sensor
- cavity
- diaphragm
- conductive layer
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L13/00—Devices or apparatus for measuring differences of two or more fluid pressure values
- G01L13/02—Devices or apparatus for measuring differences of two or more fluid pressure values using elastically-deformable members or pistons as sensing elements
- G01L13/025—Devices or apparatus for measuring differences of two or more fluid pressure values using elastically-deformable members or pistons as sensing elements using diaphragms
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0069—Electrical connection means from the sensor to its support
- G01L19/0076—Electrical connection means from the sensor to its support using buried connections
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
- G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
- G01L9/0075—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a ceramic diaphragm, e.g. alumina, fused quartz, glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04780631A EP1682859A4 (en) | 2003-08-11 | 2004-08-10 | Capacitive sensor |
CN2004800247808A CN1864054B (en) | 2003-08-11 | 2004-08-10 | Capacitive sensor |
JP2006523296A JP2007502416A (en) | 2003-08-11 | 2004-08-10 | Capacitive sensor |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US49414703P | 2003-08-11 | 2003-08-11 | |
US60/494,147 | 2003-08-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005019785A2 WO2005019785A2 (en) | 2005-03-03 |
WO2005019785A3 true WO2005019785A3 (en) | 2006-08-03 |
Family
ID=34215855
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/025825 WO2005019785A2 (en) | 2003-08-11 | 2004-08-10 | Capacitive sensor |
Country Status (5)
Country | Link |
---|---|
US (1) | US7353711B2 (en) |
EP (1) | EP1682859A4 (en) |
JP (1) | JP2007502416A (en) |
CN (1) | CN1864054B (en) |
WO (1) | WO2005019785A2 (en) |
Families Citing this family (104)
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2004
- 2004-08-10 WO PCT/US2004/025825 patent/WO2005019785A2/en active Application Filing
- 2004-08-10 JP JP2006523296A patent/JP2007502416A/en active Pending
- 2004-08-10 EP EP04780631A patent/EP1682859A4/en not_active Withdrawn
- 2004-08-10 CN CN2004800247808A patent/CN1864054B/en active Active
- 2004-08-10 US US10/914,909 patent/US7353711B2/en active Active
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US5241864A (en) * | 1992-06-17 | 1993-09-07 | Motorola, Inc. | Double pinned sensor utilizing a tensile film |
US5663496A (en) * | 1993-08-03 | 1997-09-02 | The Mclaughlin Group | Tire monitoring via an electromagnetic path including the ground plan of a vehicle |
US5436795A (en) * | 1994-03-28 | 1995-07-25 | Texas Instruments Incorporated | Pressure transducer apparatus and method for making same |
US6431005B1 (en) * | 1997-04-17 | 2002-08-13 | Commissariat A L'energie Atomique | Microsystem with a flexible membrane pressure sensor |
US6278379B1 (en) * | 1998-04-02 | 2001-08-21 | Georgia Tech Research Corporation | System, method, and sensors for sensing physical properties |
US6520014B1 (en) * | 1999-06-02 | 2003-02-18 | Austria Mikro Systeme International Aktiengesellschaft | Microsensor having a sensor device connected to an integrated circuit by a solder joint |
US6550337B1 (en) * | 2000-01-19 | 2003-04-22 | Measurement Specialties, Inc. | Isolation technique for pressure sensing structure |
US20050030724A1 (en) * | 2003-01-22 | 2005-02-10 | Tapani Ryhanen | Sensing arrangement |
Also Published As
Publication number | Publication date |
---|---|
US20050229710A1 (en) | 2005-10-20 |
WO2005019785A2 (en) | 2005-03-03 |
EP1682859A2 (en) | 2006-07-26 |
EP1682859A4 (en) | 2007-08-22 |
CN1864054B (en) | 2012-08-22 |
US7353711B2 (en) | 2008-04-08 |
CN1864054A (en) | 2006-11-15 |
JP2007502416A (en) | 2007-02-08 |
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