WO2005019785A3 - Capacitive sensor - Google Patents

Capacitive sensor Download PDF

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Publication number
WO2005019785A3
WO2005019785A3 PCT/US2004/025825 US2004025825W WO2005019785A3 WO 2005019785 A3 WO2005019785 A3 WO 2005019785A3 US 2004025825 W US2004025825 W US 2004025825W WO 2005019785 A3 WO2005019785 A3 WO 2005019785A3
Authority
WO
WIPO (PCT)
Prior art keywords
plate
capacitive sensor
cavity
diaphragm
conductive layer
Prior art date
Application number
PCT/US2004/025825
Other languages
French (fr)
Other versions
WO2005019785A2 (en
Inventor
John O'dowd
Damien Joseph Mccartney
William Hunt
Eamon Hynes
John M Wynne
Patrick Crowley
John R Martin
Original Assignee
Analog Devices Inc
John O'dowd
Damien Joseph Mccartney
William Hunt
Eamon Hynes
John M Wynne
Patrick Crowley
John R Martin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Analog Devices Inc, John O'dowd, Damien Joseph Mccartney, William Hunt, Eamon Hynes, John M Wynne, Patrick Crowley, John R Martin filed Critical Analog Devices Inc
Priority to EP04780631A priority Critical patent/EP1682859A4/en
Priority to CN2004800247808A priority patent/CN1864054B/en
Priority to JP2006523296A priority patent/JP2007502416A/en
Publication of WO2005019785A2 publication Critical patent/WO2005019785A2/en
Publication of WO2005019785A3 publication Critical patent/WO2005019785A3/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L13/00Devices or apparatus for measuring differences of two or more fluid pressure values
    • G01L13/02Devices or apparatus for measuring differences of two or more fluid pressure values using elastically-deformable members or pistons as sensing elements
    • G01L13/025Devices or apparatus for measuring differences of two or more fluid pressure values using elastically-deformable members or pistons as sensing elements using diaphragms
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061Electrical connection means
    • G01L19/0069Electrical connection means from the sensor to its support
    • G01L19/0076Electrical connection means from the sensor to its support using buried connections
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0075Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a ceramic diaphragm, e.g. alumina, fused quartz, glass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3025Electromagnetic shielding

Abstract

A capacitive sensor including a housing having a hermetically sealed cavity, a plate in the cavity, a diaphragm forming a part of the cavity and spaced from the plate, a conductive layer on the first diaphragm, and a second conductive layer on the plate, the first and second conductive layers being the electrodes of a capacitor whose capacitance varies with the position of the diaphragm relative to the plate.
PCT/US2004/025825 2003-08-11 2004-08-10 Capacitive sensor WO2005019785A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP04780631A EP1682859A4 (en) 2003-08-11 2004-08-10 Capacitive sensor
CN2004800247808A CN1864054B (en) 2003-08-11 2004-08-10 Capacitive sensor
JP2006523296A JP2007502416A (en) 2003-08-11 2004-08-10 Capacitive sensor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US49414703P 2003-08-11 2003-08-11
US60/494,147 2003-08-11

Publications (2)

Publication Number Publication Date
WO2005019785A2 WO2005019785A2 (en) 2005-03-03
WO2005019785A3 true WO2005019785A3 (en) 2006-08-03

Family

ID=34215855

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/025825 WO2005019785A2 (en) 2003-08-11 2004-08-10 Capacitive sensor

Country Status (5)

Country Link
US (1) US7353711B2 (en)
EP (1) EP1682859A4 (en)
JP (1) JP2007502416A (en)
CN (1) CN1864054B (en)
WO (1) WO2005019785A2 (en)

Families Citing this family (104)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7570065B2 (en) * 2006-03-01 2009-08-04 Loadstar Sensors Inc Cylindrical capacitive force sensing device and method
WO2005027998A2 (en) 2003-09-16 2005-03-31 Cardiomems, Inc. Implantable wireless sensor
US8026729B2 (en) 2003-09-16 2011-09-27 Cardiomems, Inc. System and apparatus for in-vivo assessment of relative position of an implant
WO2005078458A1 (en) * 2004-02-05 2005-08-25 Analog Devices, Inc. Capped sensor
FR2873849A1 (en) * 2004-07-27 2006-02-03 St Microelectronics Sa PROCESS FOR OBTAINING SOFT MAGNETIC THIN FILM, WITH HIGH MAGNET, INSULATION, INTEGRATED FILM AND INTEGRATED CIRCUIT
US20060055499A1 (en) * 2004-09-16 2006-03-16 Bolle Cristian A Fuse arrangement
US7240560B2 (en) * 2004-10-18 2007-07-10 Silverbrook Research Pty Ltd Pressure sensor with remote power source
US7121145B2 (en) * 2004-10-18 2006-10-17 Silverbrook Research Pty Ltd Capacitative pressure sensor
US7159467B2 (en) * 2004-10-18 2007-01-09 Silverbrook Research Pty Ltd Pressure sensor with conductive ceramic membrane
US7234357B2 (en) * 2004-10-18 2007-06-26 Silverbrook Research Pty Ltd Wafer bonded pressure sensor
US6968744B1 (en) * 2004-10-18 2005-11-29 Silverbrook Research Pty Ltd Capacitative pressure sensor with close electrodes
US7093494B2 (en) * 2004-10-18 2006-08-22 Silverbrook Research Pty Ltd Micro-electromechanical pressure sensor
US7089798B2 (en) * 2004-10-18 2006-08-15 Silverbrook Research Pty Ltd Pressure sensor with thin membrane
US7143652B2 (en) * 2004-10-18 2006-12-05 Silverbrook Research Pty Ltd Pressure sensor for high acceleration environment
US7194901B2 (en) * 2004-10-18 2007-03-27 Silverbrook Research Pty Ltd Pressure sensor with apertured membrane guard
US7089790B2 (en) * 2004-10-18 2006-08-15 Silverbrook Research Pty Ltd Pressure sensor with laminated membrane
US7089797B2 (en) 2004-10-18 2006-08-15 Silverbrook Research Pty Ltd Temperature insensitive pressure sensor
US7290454B2 (en) * 2004-12-02 2007-11-06 Honeywell International Inc. Pressure flow sensor systems and pressure flow sensors for use therein
US20060158484A1 (en) * 2005-01-14 2006-07-20 Greywall Dennis S Thermal actuator for a MEMS device
US7662653B2 (en) 2005-02-10 2010-02-16 Cardiomems, Inc. Method of manufacturing a hermetic chamber with electrical feedthroughs
US7647836B2 (en) 2005-02-10 2010-01-19 Cardiomems, Inc. Hermetic chamber with electrical feedthroughs
US20060191351A1 (en) * 2005-02-25 2006-08-31 Meehan Peter G Sealed capacitive sensor
US7401523B2 (en) * 2005-02-25 2008-07-22 Analog Devices, Inc. Capacitive sensor and method of fabricating
WO2007002185A2 (en) 2005-06-21 2007-01-04 Cardiomems, Inc. Method of manufacturing implantable wireless sensor for in vivo pressure measurement
FR2890438B1 (en) * 2005-09-08 2007-11-30 Peugeot Citroen Automobiles Sa SENSOR STRUCTURE, IN PARTICULAR FOR A SEVERE ENVIRONMENT IN A MOTOR VEHICLE AND PREHEATING PLUG COMPRISING SUCH A SENSOR
US20070158769A1 (en) * 2005-10-14 2007-07-12 Cardiomems, Inc. Integrated CMOS-MEMS technology for wired implantable sensors
WO2007061841A2 (en) * 2005-11-18 2007-05-31 Cardiomems, Inc. Capacitor electrode formed on surface of integrated circuit chip
DE602007013745D1 (en) * 2006-05-17 2011-05-19 Cardiomems Inc HERMETIC CHAMBER WITH ELECTRIC IMPLEMENTS
JP5092462B2 (en) * 2006-06-13 2012-12-05 株式会社デンソー Mechanical quantity sensor
WO2008021178A2 (en) * 2006-08-09 2008-02-21 Mks Instruments, Inc. Constant power dissipation in capacitance pressure transducers
EP2786701B1 (en) * 2006-08-29 2015-12-23 California Institute of Technology Microfabricated implantable wireless pressure sensor for use in biomedical applications and pressure measurement and sensor implantation methods
JP2008160352A (en) * 2006-12-22 2008-07-10 Yamaha Corp Electrostatic capacity sensor
US20080237823A1 (en) * 2007-01-11 2008-10-02 Analog Devices, Inc. Aluminum Based Bonding of Semiconductor Wafers
US7605593B2 (en) * 2007-01-16 2009-10-20 The Boeing Company Method and apparatus for detecting inconsistencies in cured resin structures
US20080202251A1 (en) * 2007-02-27 2008-08-28 Iee International Electronics & Engineering S.A. Capacitive pressure sensor
US7851759B2 (en) * 2007-06-21 2010-12-14 Alcatel-Lucent Usa Inc. Infrared imaging apparatus
US7580175B2 (en) * 2007-06-21 2009-08-25 Alcatel-Lucent Usa Inc. Detector of infrared radiation having a bi-material transducer
US8360984B2 (en) * 2008-01-28 2013-01-29 Cardiomems, Inc. Hypertension system and method
US7842923B2 (en) * 2008-07-28 2010-11-30 Alcatel-Lucent Usa Inc. Thermal actuator for an infrared sensor
WO2010067580A1 (en) * 2008-12-09 2010-06-17 株式会社ブリヂストン Device for acquiring information regarding the inside of a tire
JP5281385B2 (en) * 2008-12-19 2013-09-04 株式会社ブリヂストン Sensor module and tire / wheel assembly provided with sensor module
DE102009000056A1 (en) * 2009-01-07 2010-07-08 Robert Bosch Gmbh Sensor element for capacitive differential pressure detection
DE102009007917A1 (en) * 2009-02-06 2010-08-12 Preh Gmbh Capacitive touch sensor
US9063016B2 (en) 2009-05-04 2015-06-23 R.W. Beckett Corporation Fail safe multi-sensor component
US20100280788A1 (en) * 2009-05-04 2010-11-04 R. W. Becketi Corporation Integrated multi-sensor component
FR2947629B1 (en) * 2009-07-06 2012-03-30 Tronic S Microsystems PRESSURE MEASURING DEVICE AND METHOD FOR MANUFACTURING THE SAME
JP5639176B2 (en) * 2009-09-18 2014-12-10 スマート チップ マイクロエレクトロニック シーオー.リミテッド Electronic smoke
US10420374B2 (en) 2009-09-18 2019-09-24 Altria Client Services Llc Electronic smoke apparatus
US8723944B1 (en) * 2009-09-28 2014-05-13 EDTM, Inc. System for detecting conductive coatings on non-conductive medium surfaces
US8171800B1 (en) * 2011-01-25 2012-05-08 Continental Automotive Systems, Inc. Differential pressure sensor using dual backside absolute pressure sensing
DE102011004722A1 (en) * 2011-02-25 2012-08-30 Endress + Hauser Gmbh + Co. Kg Ceramic pressure cell
US10226218B2 (en) 2011-06-30 2019-03-12 Endotronix, Inc. Pressure sensing implant
US10638955B2 (en) 2011-06-30 2020-05-05 Endotronix, Inc. Pressure sensing implant
US11896365B2 (en) 2011-06-30 2024-02-13 Endotronix, Inc. MEMS device for an implant assembly
EP2739951A4 (en) * 2011-08-04 2015-07-29 Fontem Holdings 1 Bv A capacitor sensor, devices employing the capacitor sensor and methods for their use
DE102011081887A1 (en) * 2011-08-31 2013-02-28 Robert Bosch Gmbh Polymer layer system pressure sensor device and polymer layer system pressure sensor method
JP5867821B2 (en) * 2012-03-08 2016-02-24 セイコーインスツル株式会社 Pressure sensor
JP5806164B2 (en) * 2012-04-16 2015-11-10 京セラ株式会社 Sensor device parts and sensor device
FR2990757B1 (en) * 2012-05-15 2014-10-31 Commissariat Energie Atomique CAPACITIVE CAPACITOR WITH POROUS MATERIAL HAVING AN IMPROVED ARRANGEMENT
US9733142B2 (en) * 2012-10-17 2017-08-15 Kabushiki Kaisha Saginomiya Seisakusho Pressure sensor, and sensor unit provided with same
CN102922961A (en) * 2012-11-12 2013-02-13 西安交通大学 Capacitive miniature tire pressure sensor
US20140157892A1 (en) * 2012-12-11 2014-06-12 Seiko Epson Corporation Mems element, electronic device, altimeter, electronic apparatus, and moving object
JP2014115208A (en) * 2012-12-11 2014-06-26 Seiko Epson Corp Mems element, electronic device, altimeter, electronic apparatus and moving body
JP2014115210A (en) * 2012-12-11 2014-06-26 Seiko Epson Corp Mems element, electronic device, altimeter, electronic apparatus and moving body
JP2014115209A (en) * 2012-12-11 2014-06-26 Seiko Epson Corp Mems element, electronic device, altimeter, electronic apparatus and moving body
US9861524B2 (en) * 2013-03-14 2018-01-09 New Jersey Institute Of Technology Smart shunt devices and methods
JP2014211405A (en) * 2013-04-22 2014-11-13 セイコーエプソン株式会社 Mems pressure sensor, electronic device, altimeter, electronic apparatus and movable body
ITUD20130068A1 (en) * 2013-05-22 2014-11-23 Eliwell Controls S R L Con Unico S Ocio DIGITAL PRESSURE SENSOR, ASSEMBLY AND ELECTRO-HOUSING PROCEDURE PROVIDED WITH THIS DIGITAL PRESSURE SENSOR
WO2014188374A1 (en) * 2013-05-22 2014-11-27 Eliwell Controls S.R.L. Con Unico Socio Pressure sensor, assembly method and domestic appliance provided with said pressure sensor
JP6122354B2 (en) * 2013-06-25 2017-04-26 京セラ株式会社 Base for pressure detection device and pressure detection device
CN103698060B (en) * 2013-12-25 2015-08-12 中北大学 Wireless and passive high-temp pressure sensor with temperature compensation and temperature compensation algorithm thereof
US9383283B2 (en) * 2014-01-16 2016-07-05 Sensata Technologies, Inc. Pressure transducer with capacitively coupled source electrode
JP6445768B2 (en) * 2014-02-25 2018-12-26 株式会社ブリヂストン Tire condition detection device
US9309105B2 (en) * 2014-03-06 2016-04-12 Infineon Technologies Ag Sensor structure for sensing pressure waves and ambient pressure
US9599637B2 (en) * 2014-04-03 2017-03-21 United Technologies Corporation Apparatus and method for facilitating transmission of a wireless signal from embedded sensors
US9939331B2 (en) 2014-05-21 2018-04-10 Infineon Technologies Ag System and method for a capacitive thermometer
EP3032229B1 (en) * 2014-12-09 2020-11-25 VEGA Grieshaber KG Limit state measurement assembly
GB2534222B (en) * 2015-01-19 2017-11-15 Frequency Prec Ltd Pressure sensor and device comprising the same
JP5980463B1 (en) * 2015-01-23 2016-08-31 三菱電機株式会社 Ceramic substrate, joined body, module, and method for manufacturing ceramic substrate
DE102015110259A1 (en) * 2015-06-25 2016-12-29 Endress + Hauser Gmbh + Co. Kg Pressure sensor module Measuring arrangement with a pressure sensor module
GB2542332A (en) * 2015-06-29 2017-03-22 Continental automotive systems inc Pressure sensor device with a MEMS piezoresistive element attached to an in-circuit ceramic board
FR3043202B1 (en) * 2015-11-03 2018-11-16 Safran Electronics & Defense PRESSURE MEASURING DEVICE
CN105333938B (en) * 2015-11-30 2018-12-14 蚌埠大洋传感系统工程有限公司 A kind of hydraulic weighing sensor of condenser type
WO2018091644A1 (en) * 2016-11-18 2018-05-24 Robert Bosch Gmbh System of non-acoustic sensor combined with mems microphone
CA3044266A1 (en) * 2016-11-21 2018-05-24 Simon Fraser University Accelerometer sensor
DE102016124485A1 (en) * 2016-12-15 2018-06-21 Valeo Schalter Und Sensoren Gmbh Operating device with a first and a second capacitive measuring unit, motor vehicle, and method for operating an operating device
US11615257B2 (en) 2017-02-24 2023-03-28 Endotronix, Inc. Method for communicating with implant devices
WO2018156930A1 (en) 2017-02-24 2018-08-30 Endotronix, Inc. Wireless sensor reader assembly
CN107315114B (en) * 2017-07-03 2019-08-30 京东方科技集团股份有限公司 A kind of capacity measurement unit and capacitance test method
EP3654835A1 (en) 2017-07-19 2020-05-27 Endotronix, Inc. Physiological monitoring system
CN107478359B (en) * 2017-07-28 2019-07-19 佛山市川东磁电股份有限公司 A kind of double membrane capacitance formula pressure sensors and production method
DE102017213277B4 (en) 2017-08-01 2019-08-14 Infineon Technologies Ag MEMS SENSORS, METHOD FOR PROVIDING THE SAME, AND METHOD FOR OPERATING A MEMS SENSOR
US10712360B2 (en) 2017-09-27 2020-07-14 Azoteq (Pty) Ltd Differential charge transfer based accelerometer
JP6786469B2 (en) * 2017-11-30 2020-11-18 株式会社鷺宮製作所 Shield structure of pressure sensor and pressure sensor equipped with it
DE102018211330A1 (en) * 2018-07-10 2020-01-16 Robert Bosch Gmbh Micromechanical pressure sensor device and corresponding manufacturing method
USD970457S1 (en) * 2018-08-21 2022-11-22 Mitsubishi Electric Corporation Capacitive sensor
TWI693382B (en) * 2019-01-24 2020-05-11 中光電智能感測股份有限公司 Force sensor
DE102019104841A1 (en) * 2019-02-26 2020-08-27 Endress+Hauser SE+Co. KG Measuring device with a sensor element and a measuring and operating circuit
JP7401248B2 (en) * 2019-10-09 2023-12-19 アズビル株式会社 pressure sensor
US11206495B2 (en) * 2019-11-07 2021-12-21 Solid State System Co., Ltd. Structure of micro-electro-mechanical-system microphone
FR3105415B1 (en) * 2019-12-23 2021-12-24 Commissariat Energie Atomique Autonomous membrane sensor
CN112683427B (en) * 2020-11-26 2022-04-29 南京高华科技股份有限公司 LC composite MEMS pressure sensor and preparation method thereof
US11725995B2 (en) * 2021-02-01 2023-08-15 Medtronic, Inc. Pressure sensor assembly for use in implantable medical device including a substrate having via that extends through substrate along via axis between first major surface and second major surface of substrate
EP4052643B1 (en) 2021-03-04 2023-10-04 Universitat Pompeu Fabra Implantable sensor for measuring and monitoring intravascular pressure, system comprising said sensor and method for operating thereof

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5241864A (en) * 1992-06-17 1993-09-07 Motorola, Inc. Double pinned sensor utilizing a tensile film
US5436795A (en) * 1994-03-28 1995-07-25 Texas Instruments Incorporated Pressure transducer apparatus and method for making same
US5663496A (en) * 1993-08-03 1997-09-02 The Mclaughlin Group Tire monitoring via an electromagnetic path including the ground plan of a vehicle
US6278379B1 (en) * 1998-04-02 2001-08-21 Georgia Tech Research Corporation System, method, and sensors for sensing physical properties
US6431005B1 (en) * 1997-04-17 2002-08-13 Commissariat A L'energie Atomique Microsystem with a flexible membrane pressure sensor
US6520014B1 (en) * 1999-06-02 2003-02-18 Austria Mikro Systeme International Aktiengesellschaft Microsensor having a sensor device connected to an integrated circuit by a solder joint
US6550337B1 (en) * 2000-01-19 2003-04-22 Measurement Specialties, Inc. Isolation technique for pressure sensing structure
US20050030724A1 (en) * 2003-01-22 2005-02-10 Tapani Ryhanen Sensing arrangement

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58731A (en) * 1981-06-25 1983-01-05 Matsushita Electric Ind Co Ltd Electrostatic capacity type pressure sensor
US4555952A (en) * 1984-06-08 1985-12-03 Borg-Warner Corporation Differential pressure sensor
JPS62115110U (en) * 1985-11-29 1987-07-22
EP0456873A1 (en) * 1990-05-18 1991-11-21 Hottinger Baldwin Messtechnik Gmbh Capacitive pressure transducer
US5164328A (en) * 1990-06-25 1992-11-17 Motorola, Inc. Method of bump bonding and sealing an accelerometer chip onto an integrated circuit chip
JPH04204339A (en) * 1990-11-30 1992-07-24 Sumitomo Electric Ind Ltd Electrostatic capacity type pressure detector
US5150275A (en) * 1991-07-01 1992-09-22 Setra Systems, Inc. Capacitive pressure sensor
JP3203788B2 (en) * 1992-07-24 2001-08-27 オムロン株式会社 Physical quantity sensor and method of manufacturing the same
JP2578148Y2 (en) * 1992-10-13 1998-08-06 株式会社トーキン Capacitive pressure sensor
US5571970A (en) * 1993-03-30 1996-11-05 Honda Motor Co., Ltd. Pressure sensor
US5561247A (en) * 1993-03-30 1996-10-01 Honda Motor Co., Ltd. Pressure sensor
JPH09257833A (en) * 1996-03-26 1997-10-03 Matsushita Electric Works Ltd Electret applied device and manufacture thereof
CN2288431Y (en) * 1996-09-28 1998-08-19 上海无线电二十三厂 Capacitive baroceptor
JPH10239193A (en) * 1997-02-25 1998-09-11 Nitta Ind Corp Pressure sensor
WO2000002028A1 (en) * 1998-07-07 2000-01-13 The Goodyear Tire & Rubber Company Method of fabricating silicon capacitive sensor
JP3567089B2 (en) * 1998-10-12 2004-09-15 株式会社日立製作所 Capacitive pressure sensor
EP1039284A1 (en) * 1999-03-24 2000-09-27 ENVEC Mess- und Regeltechnik GmbH + Co. Capacitive sensor of pressure or differential pressure
DE59911611D1 (en) * 1999-12-10 2005-03-17 Endress & Hauser Gmbh & Co Kg pressure monitor
JP3716165B2 (en) 2000-07-25 2005-11-16 京セラ株式会社 Pressure detection device package and pressure detection device
DE10135568A1 (en) * 2001-07-20 2003-02-06 Endress & Hauser Gmbh & Co Kg Differential or absolute pressure sensor has a hermetically sealed cap to protect measurement electronics from the external environment and prevent moisture ingress
JP2003050173A (en) * 2001-08-07 2003-02-21 Fujikura Ltd Pressure sensor and manufacturing method therefor

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5241864A (en) * 1992-06-17 1993-09-07 Motorola, Inc. Double pinned sensor utilizing a tensile film
US5663496A (en) * 1993-08-03 1997-09-02 The Mclaughlin Group Tire monitoring via an electromagnetic path including the ground plan of a vehicle
US5436795A (en) * 1994-03-28 1995-07-25 Texas Instruments Incorporated Pressure transducer apparatus and method for making same
US6431005B1 (en) * 1997-04-17 2002-08-13 Commissariat A L'energie Atomique Microsystem with a flexible membrane pressure sensor
US6278379B1 (en) * 1998-04-02 2001-08-21 Georgia Tech Research Corporation System, method, and sensors for sensing physical properties
US6520014B1 (en) * 1999-06-02 2003-02-18 Austria Mikro Systeme International Aktiengesellschaft Microsensor having a sensor device connected to an integrated circuit by a solder joint
US6550337B1 (en) * 2000-01-19 2003-04-22 Measurement Specialties, Inc. Isolation technique for pressure sensing structure
US20050030724A1 (en) * 2003-01-22 2005-02-10 Tapani Ryhanen Sensing arrangement

Also Published As

Publication number Publication date
US20050229710A1 (en) 2005-10-20
WO2005019785A2 (en) 2005-03-03
EP1682859A2 (en) 2006-07-26
EP1682859A4 (en) 2007-08-22
CN1864054B (en) 2012-08-22
US7353711B2 (en) 2008-04-08
CN1864054A (en) 2006-11-15
JP2007502416A (en) 2007-02-08

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