WO2005022176A3 - Temperature control system which sprays liquid coolant droplets against an ic-module at a sub-atmospheric pressure - Google Patents
Temperature control system which sprays liquid coolant droplets against an ic-module at a sub-atmospheric pressure Download PDFInfo
- Publication number
- WO2005022176A3 WO2005022176A3 PCT/US2004/027023 US2004027023W WO2005022176A3 WO 2005022176 A3 WO2005022176 A3 WO 2005022176A3 US 2004027023 W US2004027023 W US 2004027023W WO 2005022176 A3 WO2005022176 A3 WO 2005022176A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- module
- liquid coolant
- sub
- atmospheric pressure
- control system
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
Abstract
A system for maintaining an IC-chip (10a) near a set-point temperature while electrical power dissipation in the IC-chip is varied includes a container (20) having an open end with a seal ring (21). Located in the container is at least one nozzle (30) for spraying liquid coolant droplets on a portion of an IC-module (10) which holds the IC-chip. This spraying of the liquid coolant occurs while the seal ring is pressed against the IC-module. Also, a pressure reducing means (24) is coupled to the container for producing a sub-atmospheric pressure in the space between the container and the IC-module while the seal ring is pressed against the IC-module.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/647,090 | 2003-08-21 | ||
US10/647,090 US7310230B2 (en) | 2003-08-21 | 2003-08-21 | Temperature control system which sprays liquid coolant droplets against an IC-module at a sub-atmospheric pressure |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005022176A2 WO2005022176A2 (en) | 2005-03-10 |
WO2005022176A3 true WO2005022176A3 (en) | 2005-04-14 |
Family
ID=34194642
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/027023 WO2005022176A2 (en) | 2003-08-21 | 2004-08-20 | Temperature control system which sprays liquid coolant droplets against an ic-module at a sub-atmospheric pressure |
Country Status (2)
Country | Link |
---|---|
US (2) | US7310230B2 (en) |
WO (1) | WO2005022176A2 (en) |
Families Citing this family (26)
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US8464781B2 (en) | 2002-11-01 | 2013-06-18 | Cooligy Inc. | Cooling systems incorporating heat exchangers and thermoelectric layers |
JP3814598B2 (en) * | 2003-10-02 | 2006-08-30 | キヤノン株式会社 | Temperature adjustment apparatus, exposure apparatus, and device manufacturing method |
US6952346B2 (en) * | 2004-02-24 | 2005-10-04 | Isothermal Systems Research, Inc | Etched open microchannel spray cooling |
JP4512815B2 (en) * | 2004-07-30 | 2010-07-28 | エスペック株式会社 | Burn-in equipment |
JP4426396B2 (en) * | 2004-07-30 | 2010-03-03 | エスペック株式会社 | Cooling system |
TWM284950U (en) * | 2005-09-21 | 2006-01-01 | Yen Sun Technology Corp | Heat dissipating device for an electronic device |
WO2007120530A2 (en) * | 2006-03-30 | 2007-10-25 | Cooligy, Inc. | Integrated liquid to air conduction module |
US20070256825A1 (en) * | 2006-05-04 | 2007-11-08 | Conway Bruce R | Methodology for the liquid cooling of heat generating components mounted on a daughter card/expansion card in a personal computer through the use of a remote drive bay heat exchanger with a flexible fluid interconnect |
US20070290702A1 (en) * | 2006-06-19 | 2007-12-20 | Credence Systems Corporation | System and method for thermal management and gradient reduction |
US7457117B2 (en) * | 2006-08-16 | 2008-11-25 | Rambus Inc. | System for controlling the temperature of electronic devices |
US20090225514A1 (en) | 2008-03-10 | 2009-09-10 | Adrian Correa | Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door |
US8302419B2 (en) * | 2008-05-02 | 2012-11-06 | Thermal Take Technology Co., Ltd. | Computer cooling apparatus |
WO2010017321A1 (en) | 2008-08-05 | 2010-02-11 | Cooligy Inc. | Bonded metal and ceramic plates for thermal management of optical and electronic devices |
US9010141B2 (en) | 2010-04-19 | 2015-04-21 | Chilldyne, Inc. | Computer cooling system and method of use |
US20110253347A1 (en) | 2010-04-19 | 2011-10-20 | Steve Harrington | Vacuum Pumped Liquid Cooling System for Computers |
JP5948995B2 (en) * | 2012-03-14 | 2016-07-06 | 横浜ゴム株式会社 | Pneumatic tire |
US8643173B1 (en) * | 2013-01-04 | 2014-02-04 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling apparatuses and power electronics modules with single-phase and two-phase surface enhancement features |
US8820351B1 (en) | 2013-06-25 | 2014-09-02 | Chilldyne, Inc. | No drip hot swap connector and method of use |
US9131631B2 (en) | 2013-08-08 | 2015-09-08 | Toyota Motor Engineering & Manufacturing North America, Inc. | Jet impingement cooling apparatuses having enhanced heat transfer assemblies |
US9997434B2 (en) | 2014-05-19 | 2018-06-12 | Hewlett Packard Enterprise Development Lp | Substrate sprayer |
US10634397B2 (en) | 2015-09-17 | 2020-04-28 | Purdue Research Foundation | Devices, systems, and methods for the rapid transient cooling of pulsed heat sources |
JP6515003B2 (en) * | 2015-09-24 | 2019-05-15 | 東京エレクトロン株式会社 | Interface device, interface unit, probe device and connection method |
KR102411068B1 (en) * | 2020-08-14 | 2022-06-22 | 주식회사 아이에스시 | Temperature adjustment apparatus for adjusting temperature of device under test |
TWI775566B (en) * | 2021-08-13 | 2022-08-21 | 美商第一檢測有限公司 | Chip testing equipment |
TWI764808B (en) * | 2021-08-13 | 2022-05-11 | 美商第一檢測有限公司 | Temperature adjusting device |
CN116853508B (en) * | 2023-09-04 | 2023-11-14 | 中国航空工业集团公司金城南京机电液压工程研究中心 | Aircraft spray cooling control method and device |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4897762A (en) * | 1987-07-22 | 1990-01-30 | Hitachi, Ltd. | Cooling system and method for electronic circuit devices |
EP0480750A2 (en) * | 1990-10-11 | 1992-04-15 | Nec Corporation | Liquid cooling system for LSI packages |
US5515910A (en) * | 1993-05-03 | 1996-05-14 | Micro Control System | Apparatus for burn-in of high power semiconductor devices |
US20020050144A1 (en) * | 1999-09-13 | 2002-05-02 | Patel Chandrakant D. | Spray cooling system |
US20020113142A1 (en) * | 2001-02-22 | 2002-08-22 | Patel Chandrakant D. | Spray cooling system for a device |
US20020112498A1 (en) * | 2001-02-22 | 2002-08-22 | Bash Cullen E. | Modular sprayjet cooling system |
US20020163782A1 (en) * | 2001-05-01 | 2002-11-07 | Mainstream Engineering Corporation | Method and two-phase spray cooling apparatus |
US20030098692A1 (en) * | 2001-11-28 | 2003-05-29 | Cotton Daniel Murdoch | Time resolved non-invasive diagnostics system |
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US3710251A (en) * | 1971-04-07 | 1973-01-09 | Collins Radio Co | Microelectric heat exchanger pedestal |
US4698728A (en) | 1986-10-14 | 1987-10-06 | Unisys Corporation | Leak tolerant liquid cooling system |
US5048599A (en) | 1990-10-11 | 1991-09-17 | Unisys Corporation | Leak tolerant liquid cooling system employing an improved air purging mechanism |
US5831824A (en) * | 1996-01-31 | 1998-11-03 | Motorola, Inc. | Apparatus for spray-cooling multiple electronic modules |
US5731542A (en) * | 1996-05-23 | 1998-03-24 | Motorola, Inc. | Apparatus and method for mounting an electronic component to a substrate and method for spray-cooling an electronic component mounted to a substrate |
US5821505A (en) * | 1997-04-04 | 1998-10-13 | Unisys Corporation | Temperature control system for an electronic device which achieves a quick response by interposing a heater between the device and a heat sink |
US6583638B2 (en) * | 1999-01-26 | 2003-06-24 | Trio-Tech International | Temperature-controlled semiconductor wafer chuck system |
US6484521B2 (en) * | 2001-02-22 | 2002-11-26 | Hewlett-Packard Company | Spray cooling with local control of nozzles |
US6861861B2 (en) * | 2002-07-24 | 2005-03-01 | Lg Electronics Inc. | Device for compensating for a test temperature deviation in a semiconductor device handler |
US7102374B2 (en) * | 2002-08-16 | 2006-09-05 | Credence Systems Corporation | Spray cooling thermal management system and method for semiconductor probing, diagnostics, and failure analysis |
US6889509B1 (en) * | 2002-09-13 | 2005-05-10 | Isothermal Systems Research Inc. | Coolant recovery system |
US6857283B2 (en) * | 2002-09-13 | 2005-02-22 | Isothermal Systems Research, Inc. | Semiconductor burn-in thermal management system |
US6880350B2 (en) * | 2002-09-13 | 2005-04-19 | Isothermal Systems Research, Inc. | Dynamic spray system |
US6827135B1 (en) * | 2003-06-12 | 2004-12-07 | Gary W. Kramer | High flux heat removal system using jet impingement of water at subatmospheric pressure |
-
2003
- 2003-08-21 US US10/647,090 patent/US7310230B2/en not_active Expired - Fee Related
-
2004
- 2004-08-20 WO PCT/US2004/027023 patent/WO2005022176A2/en active Application Filing
-
2006
- 2006-01-20 US US11/335,976 patent/US7224586B2/en not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4897762A (en) * | 1987-07-22 | 1990-01-30 | Hitachi, Ltd. | Cooling system and method for electronic circuit devices |
EP0480750A2 (en) * | 1990-10-11 | 1992-04-15 | Nec Corporation | Liquid cooling system for LSI packages |
US5515910A (en) * | 1993-05-03 | 1996-05-14 | Micro Control System | Apparatus for burn-in of high power semiconductor devices |
US20020050144A1 (en) * | 1999-09-13 | 2002-05-02 | Patel Chandrakant D. | Spray cooling system |
US20020113142A1 (en) * | 2001-02-22 | 2002-08-22 | Patel Chandrakant D. | Spray cooling system for a device |
US20020112498A1 (en) * | 2001-02-22 | 2002-08-22 | Bash Cullen E. | Modular sprayjet cooling system |
US20020163782A1 (en) * | 2001-05-01 | 2002-11-07 | Mainstream Engineering Corporation | Method and two-phase spray cooling apparatus |
US20030098692A1 (en) * | 2001-11-28 | 2003-05-29 | Cotton Daniel Murdoch | Time resolved non-invasive diagnostics system |
Also Published As
Publication number | Publication date |
---|---|
US7310230B2 (en) | 2007-12-18 |
US20060120049A1 (en) | 2006-06-08 |
US7224586B2 (en) | 2007-05-29 |
US20050041393A1 (en) | 2005-02-24 |
WO2005022176A2 (en) | 2005-03-10 |
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