WO2005022639A3 - Gallium nitride material devices and methods of forming the same - Google Patents

Gallium nitride material devices and methods of forming the same Download PDF

Info

Publication number
WO2005022639A3
WO2005022639A3 PCT/US2004/027657 US2004027657W WO2005022639A3 WO 2005022639 A3 WO2005022639 A3 WO 2005022639A3 US 2004027657 W US2004027657 W US 2004027657W WO 2005022639 A3 WO2005022639 A3 WO 2005022639A3
Authority
WO
WIPO (PCT)
Prior art keywords
gallium nitride
nitride material
methods
forming
same
Prior art date
Application number
PCT/US2004/027657
Other languages
French (fr)
Other versions
WO2005022639A2 (en
Inventor
T Warren Weeks
Kevin J Linthicum
Original Assignee
Nitronex Corp
T Warren Weeks
Kevin J Linthicum
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34273355&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2005022639(A3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nitronex Corp, T Warren Weeks, Kevin J Linthicum filed Critical Nitronex Corp
Publication of WO2005022639A2 publication Critical patent/WO2005022639A2/en
Publication of WO2005022639A3 publication Critical patent/WO2005022639A3/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26Materials of the light emitting region
    • H01L33/30Materials of the light emitting region containing only elements of group III and group V of the periodic system
    • H01L33/32Materials of the light emitting region containing only elements of group III and group V of the periodic system containing nitrogen
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/417Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66083Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
    • H01L29/66196Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices with an active layer made of a group 13/15 material
    • H01L29/66204Diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66446Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
    • H01L29/66462Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/778Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
    • H01L29/7786Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/80Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier
    • H01L29/802Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier with heterojunction gate, e.g. transistors with semiconductor layer acting as gate insulating layer, MIS-like transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/861Diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/0256Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
    • H01L31/0264Inorganic materials
    • H01L31/0304Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds
    • H01L31/03044Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds comprising a nitride compounds, e.g. GaN
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/0256Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
    • H01L31/0264Inorganic materials
    • H01L31/0304Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds
    • H01L31/03046Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds including ternary or quaternary compounds, e.g. GaAlAs, InGaAs, InGaAsP
    • H01L31/03048Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds including ternary or quaternary compounds, e.g. GaAlAs, InGaAs, InGaAsP comprising a nitride compounds, e.g. InGaN
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/184Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIIBV compounds, e.g. GaAs, InP
    • H01L31/1844Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIIBV compounds, e.g. GaAs, InP comprising ternary or quaternary compounds, e.g. Ga Al As, In Ga As P
    • H01L31/1848Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIIBV compounds, e.g. GaAs, InP comprising ternary or quaternary compounds, e.g. Ga Al As, In Ga As P comprising nitride compounds, e.g. InGaN, InGaAlN
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/184Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIIBV compounds, e.g. GaAs, InP
    • H01L31/1856Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIIBV compounds, e.g. GaAs, InP comprising nitride compounds, e.g. GaN
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • H01L33/0062Processes for devices with an active region comprising only III-V compounds
    • H01L33/0066Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
    • H01L33/007Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • H01L33/0093Wafer bonding; Removal of the growth substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H01L33/382Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending partially in or entirely through the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/0206Substrates, e.g. growth, shape, material, removal or bonding
    • H01S5/0207Substrates having a special shape
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N80/00Bulk negative-resistance effect devices
    • H10N80/10Gunn-effect devices
    • H10N80/107Gunn diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/20Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
    • H01L29/2003Nitride compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015Shape
    • H01L2924/10155Shape being other than a cuboid
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/04Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042Electrical excitation ; Circuits therefor
    • H01S5/0425Electrodes, e.g. characterised by the structure
    • H01S5/04254Electrodes, e.g. characterised by the structure characterised by the shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • H01S5/32Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • H01S5/323Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
    • H01S5/32308Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
    • H01S5/32341Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/544Solar cells from Group III-V materials

Abstract

The invention provides gallium nitride material devices, structures and methods of forming the same. The devices include a gallium nitride material formed over a substrate, such as silicon. Exemplary devices include light emitting devices (e.g., LED's, lasers), light detecting devices (such as detectors and sensors), power rectifier diodes and FETs (e.g., HFETs), amongst others.
PCT/US2004/027657 2003-08-25 2004-08-25 Gallium nitride material devices and methods of forming the same WO2005022639A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/650,122 US7233028B2 (en) 2001-02-23 2003-08-25 Gallium nitride material devices and methods of forming the same
US10/650,122 2003-08-25

Publications (2)

Publication Number Publication Date
WO2005022639A2 WO2005022639A2 (en) 2005-03-10
WO2005022639A3 true WO2005022639A3 (en) 2006-01-19

Family

ID=34273355

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/027657 WO2005022639A2 (en) 2003-08-25 2004-08-25 Gallium nitride material devices and methods of forming the same

Country Status (2)

Country Link
US (2) US7233028B2 (en)
WO (1) WO2005022639A2 (en)

Families Citing this family (156)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7233028B2 (en) * 2001-02-23 2007-06-19 Nitronex Corporation Gallium nitride material devices and methods of forming the same
CN1505843B (en) * 2001-06-15 2010-05-05 克里公司 GaN based LED formed on a SiC substrate
US20060005763A1 (en) * 2001-12-24 2006-01-12 Crystal Is, Inc. Method and apparatus for producing large, single-crystals of aluminum nitride
US8545629B2 (en) 2001-12-24 2013-10-01 Crystal Is, Inc. Method and apparatus for producing large, single-crystals of aluminum nitride
US7638346B2 (en) * 2001-12-24 2009-12-29 Crystal Is, Inc. Nitride semiconductor heterostructures and related methods
JP2005150393A (en) * 2003-11-14 2005-06-09 Sharp Corp Submount for light receiving/emitting element
US7098077B2 (en) * 2004-01-20 2006-08-29 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor chip singulation method
US7339205B2 (en) * 2004-06-28 2008-03-04 Nitronex Corporation Gallium nitride materials and methods associated with the same
US7361946B2 (en) * 2004-06-28 2008-04-22 Nitronex Corporation Semiconductor device-based sensors
US9368428B2 (en) * 2004-06-30 2016-06-14 Cree, Inc. Dielectric wafer level bonding with conductive feed-throughs for electrical connection and thermal management
US7687827B2 (en) * 2004-07-07 2010-03-30 Nitronex Corporation III-nitride materials including low dislocation densities and methods associated with the same
KR100728533B1 (en) * 2004-11-23 2007-06-15 삼성코닝 주식회사 Single crystalline gallium nitride thick film and preparation thereof
WO2006098215A1 (en) * 2005-03-16 2006-09-21 Matsushita Electric Industrial Co., Ltd. Nitride semiconductor device and method for manufacturing same
US7781886B2 (en) 2005-06-14 2010-08-24 John Trezza Electronic chip contact structure
US7946331B2 (en) 2005-06-14 2011-05-24 Cufer Asset Ltd. L.L.C. Pin-type chip tooling
US7851348B2 (en) 2005-06-14 2010-12-14 Abhay Misra Routingless chip architecture
US7786592B2 (en) * 2005-06-14 2010-08-31 John Trezza Chip capacitive coupling
US7838997B2 (en) 2005-06-14 2010-11-23 John Trezza Remote chip attachment
US7767493B2 (en) 2005-06-14 2010-08-03 John Trezza Post & penetration interconnection
US7687400B2 (en) 2005-06-14 2010-03-30 John Trezza Side stacking apparatus and method
US8456015B2 (en) 2005-06-14 2013-06-04 Cufer Asset Ltd. L.L.C. Triaxial through-chip connection
US7560813B2 (en) 2005-06-14 2009-07-14 John Trezza Chip-based thermo-stack
US9331192B2 (en) 2005-06-29 2016-05-03 Cree, Inc. Low dislocation density group III nitride layers on silicon carbide substrates and methods of making the same
KR20070012930A (en) * 2005-07-25 2007-01-30 엘지이노텍 주식회사 Semiconductor light emitting device and fabrication method thereof
DE102005042074A1 (en) * 2005-08-31 2007-03-08 Forschungsverbund Berlin E.V. Method for producing plated-through holes in semiconductor wafers
WO2007064689A1 (en) 2005-12-02 2007-06-07 Nitronex Corporation Gallium nitride material devices and associated methods
WO2007065018A2 (en) 2005-12-02 2007-06-07 Crystal Is, Inc. Doped aluminum nitride crystals and methods of making them
US7566913B2 (en) 2005-12-02 2009-07-28 Nitronex Corporation Gallium nitride material devices including conductive regions and methods associated with the same
US8664664B2 (en) * 2006-01-10 2014-03-04 Cree, Inc. Silicon carbide dimpled substrate
JP2007243080A (en) * 2006-03-13 2007-09-20 Fuji Electric Holdings Co Ltd Semiconductor device and its manufacturing method
US9034103B2 (en) 2006-03-30 2015-05-19 Crystal Is, Inc. Aluminum nitride bulk crystals having high transparency to ultraviolet light and methods of forming them
CN101454487B (en) * 2006-03-30 2013-01-23 晶体公司 Methods for controllable doping of aluminum nitride bulk crystals
US7687397B2 (en) 2006-06-06 2010-03-30 John Trezza Front-end processed wafer having through-chip connections
US20080035143A1 (en) * 2006-08-14 2008-02-14 Sievers Robert E Human-powered dry powder inhaler and dry powder inhaler compositions
US10873002B2 (en) * 2006-10-20 2020-12-22 Cree, Inc. Permanent wafer bonding using metal alloy preform discs
US9771666B2 (en) 2007-01-17 2017-09-26 Crystal Is, Inc. Defect reduction in seeded aluminum nitride crystal growth
US8323406B2 (en) * 2007-01-17 2012-12-04 Crystal Is, Inc. Defect reduction in seeded aluminum nitride crystal growth
WO2008094464A2 (en) * 2007-01-26 2008-08-07 Crystal Is, Inc. Thick pseudomorphic nitride epitaxial layers
US8080833B2 (en) * 2007-01-26 2011-12-20 Crystal Is, Inc. Thick pseudomorphic nitride epitaxial layers
US7670874B2 (en) 2007-02-16 2010-03-02 John Trezza Plated pillar package formation
DE102007022947B4 (en) * 2007-04-26 2022-05-05 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelectronic semiconductor body and method for producing such
US8088220B2 (en) 2007-05-24 2012-01-03 Crystal Is, Inc. Deep-eutectic melt growth of nitride crystals
US7745848B1 (en) 2007-08-15 2010-06-29 Nitronex Corporation Gallium nitride material devices and thermal designs thereof
US8026581B2 (en) * 2008-02-05 2011-09-27 International Rectifier Corporation Gallium nitride material devices including diamond regions and methods associated with the same
US8519438B2 (en) 2008-04-23 2013-08-27 Transphorm Inc. Enhancement mode III-N HEMTs
US8343824B2 (en) * 2008-04-29 2013-01-01 International Rectifier Corporation Gallium nitride material processing and related device structures
KR101449035B1 (en) * 2008-04-30 2014-10-08 엘지이노텍 주식회사 Semiconductor light emitting device
KR100969128B1 (en) * 2008-05-08 2010-07-09 엘지이노텍 주식회사 Light emitting device and method for fabricating the same
US20110062430A1 (en) * 2008-06-02 2011-03-17 Van Veggel Franciscus Cornelis Jacobus Maria Blue light emitting nanomaterials and synthesis thereof
US8287346B2 (en) * 2008-11-03 2012-10-16 Cfph, Llc Late game series information change
US8008683B2 (en) 2008-10-22 2011-08-30 Samsung Led Co., Ltd. Semiconductor light emitting device
GB2467911B (en) * 2009-02-16 2013-06-05 Rfmd Uk Ltd A semiconductor structure and a method of manufacture thereof
US20100244065A1 (en) * 2009-03-30 2010-09-30 Koninklijke Philips Electronics N.V. Semiconductor light emitting device grown on an etchable substrate
DE102009019161A1 (en) 2009-04-28 2010-11-04 Osram Opto Semiconductors Gmbh Light-emitting diode and method for producing a light-emitting diode
US8742459B2 (en) 2009-05-14 2014-06-03 Transphorm Inc. High voltage III-nitride semiconductor devices
DE102009023849B4 (en) * 2009-06-04 2022-10-20 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelectronic semiconductor body and optoelectronic semiconductor chip
US20100319764A1 (en) * 2009-06-23 2010-12-23 Solar Junction Corp. Functional Integration Of Dilute Nitrides Into High Efficiency III-V Solar Cells
US8405068B2 (en) * 2009-07-22 2013-03-26 Rfmd (Uk) Limited Reflecting light emitting structure and method of manufacture thereof
KR20120041237A (en) 2009-08-04 2012-04-30 갠 시스템즈 인크. Island matrixed gallium nitride microwave and power switching transistors
US9029866B2 (en) 2009-08-04 2015-05-12 Gan Systems Inc. Gallium nitride power devices using island topography
US9818857B2 (en) 2009-08-04 2017-11-14 Gan Systems Inc. Fault tolerant design for large area nitride semiconductor devices
JP2013502724A (en) * 2009-08-19 2013-01-24 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア Structure and method for achieving selective etching in (Ga, Al, In, B) N laser diodes
KR100986407B1 (en) * 2009-10-22 2010-10-08 엘지이노텍 주식회사 Light emitting device and method for fabricating the same
US20110114163A1 (en) * 2009-11-18 2011-05-19 Solar Junction Corporation Multijunction solar cells formed on n-doped substrates
KR101662037B1 (en) * 2009-12-02 2016-10-05 삼성전자 주식회사 Light Emitting Device and method for manufacturing the same
US8389977B2 (en) * 2009-12-10 2013-03-05 Transphorm Inc. Reverse side engineered III-nitride devices
US9299664B2 (en) * 2010-01-18 2016-03-29 Semiconductor Components Industries, Llc Method of forming an EM protected semiconductor die
KR101630152B1 (en) * 2010-02-24 2016-06-14 엘지디스플레이 주식회사 Hybrid light emitting diode chip and light emitting diode device having the same, and manufacturing method thereof
US20110232730A1 (en) 2010-03-29 2011-09-29 Solar Junction Corp. Lattice matchable alloy for solar cells
US8791508B2 (en) 2010-04-13 2014-07-29 Gan Systems Inc. High density gallium nitride devices using island topology
KR101028327B1 (en) 2010-04-15 2011-04-12 엘지이노텍 주식회사 Light emitting device, fabrication method of light emitting device, and light emitting device package
US8772832B2 (en) * 2010-06-04 2014-07-08 Hrl Laboratories, Llc GaN HEMTs with a back gate connected to the source
JP5806734B2 (en) 2010-06-30 2015-11-10 クリスタル アイエス, インコーポレーテッドCrystal Is, Inc. Large single crystal growth of aluminum nitride by thermal gradient control
JP5952998B2 (en) * 2010-07-26 2016-07-13 住友電工デバイス・イノベーション株式会社 Manufacturing method of semiconductor device
US9287452B2 (en) 2010-08-09 2016-03-15 Micron Technology, Inc. Solid state lighting devices with dielectric insulation and methods of manufacturing
US9214580B2 (en) 2010-10-28 2015-12-15 Solar Junction Corporation Multi-junction solar cell with dilute nitride sub-cell having graded doping
EP2636077A2 (en) * 2010-11-02 2013-09-11 Koninklijke Philips Electronics N.V. Light emitting device with improved extraction efficiency
US8742460B2 (en) 2010-12-15 2014-06-03 Transphorm Inc. Transistors with isolation regions
US8536594B2 (en) * 2011-01-28 2013-09-17 Micron Technology, Inc. Solid state lighting devices with reduced dimensions and methods of manufacturing
US8643062B2 (en) 2011-02-02 2014-02-04 Transphorm Inc. III-N device structures and methods
US8962991B2 (en) 2011-02-25 2015-02-24 Solar Junction Corporation Pseudomorphic window layer for multijunction solar cells
EP2495772A1 (en) * 2011-03-02 2012-09-05 Azzurro Semiconductors AG Semiconductor light emitter device
US8772842B2 (en) 2011-03-04 2014-07-08 Transphorm, Inc. Semiconductor diodes with low reverse bias currents
US8716141B2 (en) 2011-03-04 2014-05-06 Transphorm Inc. Electrode configurations for semiconductor devices
US20120274366A1 (en) 2011-04-28 2012-11-01 International Rectifier Corporation Integrated Power Stage
US8962359B2 (en) 2011-07-19 2015-02-24 Crystal Is, Inc. Photon extraction from nitride ultraviolet light-emitting devices
US8901604B2 (en) 2011-09-06 2014-12-02 Transphorm Inc. Semiconductor devices with guard rings
US9257547B2 (en) 2011-09-13 2016-02-09 Transphorm Inc. III-N device structures having a non-insulating substrate
US8664679B2 (en) 2011-09-29 2014-03-04 Toshiba Techno Center Inc. Light emitting devices having light coupling layers with recessed electrodes
US20130082274A1 (en) 2011-09-29 2013-04-04 Bridgelux, Inc. Light emitting devices having dislocation density maintaining buffer layers
US9178114B2 (en) 2011-09-29 2015-11-03 Manutius Ip, Inc. P-type doping layers for use with light emitting devices
US9012921B2 (en) 2011-09-29 2015-04-21 Kabushiki Kaisha Toshiba Light emitting devices having light coupling layers
US8853668B2 (en) 2011-09-29 2014-10-07 Kabushiki Kaisha Toshiba Light emitting regions for use with light emitting devices
US8698163B2 (en) 2011-09-29 2014-04-15 Toshiba Techno Center Inc. P-type doping layers for use with light emitting devices
US8598937B2 (en) 2011-10-07 2013-12-03 Transphorm Inc. High power semiconductor electronic components with increased reliability
WO2013074530A2 (en) 2011-11-15 2013-05-23 Solar Junction Corporation High efficiency multijunction solar cells
US9165766B2 (en) 2012-02-03 2015-10-20 Transphorm Inc. Buffer layer structures suited for III-nitride devices with foreign substrates
US9379231B2 (en) 2012-02-17 2016-06-28 Infineon Technologies Americas Corp. Transistor having increased breakdown voltage
US9070755B2 (en) 2012-02-17 2015-06-30 International Rectifier Corporation Transistor having elevated drain finger termination
KR20130104612A (en) * 2012-03-14 2013-09-25 서울바이오시스 주식회사 Light emitting diode and method of fabricating the same
US9093366B2 (en) 2012-04-09 2015-07-28 Transphorm Inc. N-polar III-nitride transistors
US9153724B2 (en) 2012-04-09 2015-10-06 Solar Junction Corporation Reverse heterojunctions for solar cells
US9136341B2 (en) 2012-04-18 2015-09-15 Rf Micro Devices, Inc. High voltage field effect transistor finger terminations
US8785975B2 (en) 2012-06-21 2014-07-22 Avogy, Inc. GAN vertical superjunction device structures and fabrication methods
US9184275B2 (en) 2012-06-27 2015-11-10 Transphorm Inc. Semiconductor devices with integrated hole collectors
US9124221B2 (en) 2012-07-16 2015-09-01 Rf Micro Devices, Inc. Wide bandwidth radio frequency amplier having dual gate transistors
DE102012106953A1 (en) * 2012-07-30 2014-01-30 Osram Opto Semiconductors Gmbh Method for producing a plurality of optoelectronic semiconductor chips and optoelectronic semiconductor chip
US9917080B2 (en) 2012-08-24 2018-03-13 Qorvo US. Inc. Semiconductor device with electrical overstress (EOS) protection
US9202874B2 (en) 2012-08-24 2015-12-01 Rf Micro Devices, Inc. Gallium nitride (GaN) device with leakage current-based over-voltage protection
US9142620B2 (en) 2012-08-24 2015-09-22 Rf Micro Devices, Inc. Power device packaging having backmetals couple the plurality of bond pads to the die backside
US8988097B2 (en) 2012-08-24 2015-03-24 Rf Micro Devices, Inc. Method for on-wafer high voltage testing of semiconductor devices
US9147632B2 (en) 2012-08-24 2015-09-29 Rf Micro Devices, Inc. Semiconductor device having improved heat dissipation
US9070761B2 (en) 2012-08-27 2015-06-30 Rf Micro Devices, Inc. Field effect transistor (FET) having fingers with rippled edges
WO2014035794A1 (en) 2012-08-27 2014-03-06 Rf Micro Devices, Inc Lateral semiconductor device with vertical breakdown region
KR101979944B1 (en) * 2012-10-18 2019-05-17 엘지이노텍 주식회사 Light emitting device
US9325281B2 (en) 2012-10-30 2016-04-26 Rf Micro Devices, Inc. Power amplifier controller
CN102969411B (en) * 2012-11-30 2015-10-21 中国科学院半导体研究所 The manufacture method of gallium nitrate based 3D light emitting diode with vertical structure
KR101988893B1 (en) * 2012-12-12 2019-09-30 한국전자통신연구원 Semiconductor device and a method of manufacturing the same
JP6522521B2 (en) 2013-02-15 2019-05-29 トランスフォーム インコーポレーテッド Electrode of semiconductor device and method of manufacturing the same
US9087718B2 (en) 2013-03-13 2015-07-21 Transphorm Inc. Enhancement-mode III-nitride devices
US9773884B2 (en) 2013-03-15 2017-09-26 Hrl Laboratories, Llc III-nitride transistor with engineered substrate
US9245992B2 (en) 2013-03-15 2016-01-26 Transphorm Inc. Carbon doping semiconductor devices
CN108511567A (en) 2013-03-15 2018-09-07 晶体公司 With the counterfeit plane contact with electronics and photoelectric device
US9443938B2 (en) 2013-07-19 2016-09-13 Transphorm Inc. III-nitride transistor including a p-type depleting layer
EP3103142B1 (en) 2014-02-05 2020-08-19 Array Photonics, Inc. Monolithic multijunction power converter
US20150270356A1 (en) * 2014-03-20 2015-09-24 Massachusetts Institute Of Technology Vertical nitride semiconductor device
US9671507B2 (en) * 2014-03-26 2017-06-06 University Of Houston System Solid-state neutron detector device
US9112077B1 (en) 2014-04-28 2015-08-18 Industrial Technology Research Institute Semiconductor structure
JP6174253B2 (en) * 2014-05-26 2017-08-02 シャープ株式会社 Nitride compound semiconductor
US9455327B2 (en) 2014-06-06 2016-09-27 Qorvo Us, Inc. Schottky gated transistor with interfacial layer
US9318593B2 (en) 2014-07-21 2016-04-19 Transphorm Inc. Forming enhancement mode III-nitride devices
US9536803B2 (en) 2014-09-05 2017-01-03 Qorvo Us, Inc. Integrated power module with improved isolation and thermal conductivity
US9536967B2 (en) 2014-12-16 2017-01-03 Transphorm Inc. Recessed ohmic contacts in a III-N device
US9536966B2 (en) 2014-12-16 2017-01-03 Transphorm Inc. Gate structures for III-N devices
US10062684B2 (en) 2015-02-04 2018-08-28 Qorvo Us, Inc. Transition frequency multiplier semiconductor device
US10615158B2 (en) 2015-02-04 2020-04-07 Qorvo Us, Inc. Transition frequency multiplier semiconductor device
US20170110613A1 (en) 2015-10-19 2017-04-20 Solar Junction Corporation High efficiency multijunction photovoltaic cells
US9780176B2 (en) * 2015-11-05 2017-10-03 Electronics And Telecommunications Research Institute High reliability field effect power device and manufacturing method thereof
US9991776B2 (en) 2015-12-16 2018-06-05 Semiconductor Components Industries, Llc Switched mode power supply converter
US11322599B2 (en) 2016-01-15 2022-05-03 Transphorm Technology, Inc. Enhancement mode III-nitride devices having an Al1-xSixO gate insulator
US10224401B2 (en) 2016-05-31 2019-03-05 Transphorm Inc. III-nitride devices including a graded depleting layer
DE102016125430A1 (en) * 2016-12-22 2018-06-28 Osram Opto Semiconductors Gmbh Surface-mountable semiconductor laser, arrangement with such a semiconductor laser and operating method therefor
US10224285B2 (en) 2017-02-21 2019-03-05 Raytheon Company Nitride structure having gold-free contact and methods for forming such structures
US10096550B2 (en) 2017-02-21 2018-10-09 Raytheon Company Nitride structure having gold-free contact and methods for forming such structures
WO2019010037A1 (en) 2017-07-06 2019-01-10 Solar Junction Corporation Hybrid mocvd/mbe epitaxial growth of high-efficiency lattice-matched multijunction solar cells
DE102017117645A1 (en) * 2017-08-03 2019-02-07 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor chip and method for producing an optoelectronic semiconductor chip
WO2019067553A1 (en) 2017-09-27 2019-04-04 Solar Junction Corporation Short wavelength infrared optoelectronic devices having a dilute nitride layer
WO2019066866A1 (en) * 2017-09-28 2019-04-04 Intel Corporation Group iii-nitride devices on soi substrates having a compliant layer
WO2020000184A1 (en) 2018-06-26 2020-01-02 苏州晶湛半导体有限公司 Semiconductor structure and manufacturing method therefor
US11018129B2 (en) 2018-09-10 2021-05-25 Semiconductor Components Industries, Llc Circuit that changes voltage of back electrode of transistor based on error condition
US20210074880A1 (en) * 2018-12-18 2021-03-11 Bolb Inc. Light-output-power self-awareness light-emitting device
DE102019100410A1 (en) * 2019-01-09 2020-07-09 Osram Opto Semiconductors Gmbh Volume emitter and method for its production
WO2020185528A1 (en) 2019-03-11 2020-09-17 Array Photonics, Inc. Short wavelength infrared optoelectronic devices having graded or stepped dilute nitride active regions
TWI683370B (en) * 2019-03-12 2020-01-21 環球晶圓股份有限公司 Semiconductor device and manufacturng method thereof
CN110148884B (en) * 2019-07-04 2021-04-20 扬州乾照光电有限公司 Vertical cavity surface emitting laser and preparation method thereof
DE102019125847A1 (en) * 2019-09-25 2021-03-25 Technische Universität Darmstadt Gunn diode and process for their manufacture

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10242584A (en) * 1997-02-28 1998-09-11 Hitachi Ltd Semiconductor light-emitting element
US20010040245A1 (en) * 1998-05-28 2001-11-15 Hiroji Kawai Semiconductor device and its manufacturing method
US20020074552A1 (en) * 2000-12-14 2002-06-20 Weeks T. Warren Gallium nitride materials and methods
US20020117681A1 (en) * 2001-02-23 2002-08-29 Weeks T. Warren Gallium nitride material devices and methods including backside vias
US20030116791A1 (en) * 2000-05-26 2003-06-26 Robert Baptist Semiconductor device with vertical electron injection and method for making same

Family Cites Families (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3696262A (en) * 1970-01-19 1972-10-03 Varian Associates Multilayered iii-v photocathode having a transition layer and a high quality active layer
CH600578A5 (en) * 1974-09-05 1978-06-15 Centre Electron Horloger
GB1478152A (en) * 1974-10-03 1977-06-29 Standard Telephones Cables Ltd Light emissive diode
US4537654A (en) * 1983-12-09 1985-08-27 Trw Inc. Two-gate non-coplanar FET with self-aligned source
US4582952A (en) * 1984-04-30 1986-04-15 Astrosystems, Inc. Gallium arsenide phosphide top solar cell
US4706101A (en) * 1984-10-27 1987-11-10 Kabushiki Kaisha Toshiba Light emitting diode formed of a compound semiconductor material
US4821093A (en) * 1986-08-18 1989-04-11 The United States Of America As Represented By The Secretary Of The Army Dual channel high electron mobility field effect transistor
JPH02257643A (en) * 1989-03-29 1990-10-18 Mitsubishi Electric Corp Semiconductor device and its manufacture
US5192987A (en) * 1991-05-17 1993-03-09 Apa Optics, Inc. High electron mobility transistor with GaN/Alx Ga1-x N heterojunctions
US5252842A (en) * 1991-07-26 1993-10-12 Westinghouse Electric Corp. Low-loss semiconductor device and backside etching method for manufacturing same
JP3352712B2 (en) * 1991-12-18 2002-12-03 浩 天野 Gallium nitride based semiconductor device and method of manufacturing the same
JPH06310547A (en) * 1993-02-25 1994-11-04 Mitsubishi Electric Corp Semiconductor device and manufacture thereof
US5393993A (en) * 1993-12-13 1995-02-28 Cree Research, Inc. Buffer structure between silicon carbide and gallium nitride and resulting semiconductor devices
US5679152A (en) * 1994-01-27 1997-10-21 Advanced Technology Materials, Inc. Method of making a single crystals Ga*N article
JP3717196B2 (en) * 1994-07-19 2005-11-16 豊田合成株式会社 Light emitting element
US5592501A (en) * 1994-09-20 1997-01-07 Cree Research, Inc. Low-strain laser structures with group III nitride active layers
US5523589A (en) * 1994-09-20 1996-06-04 Cree Research, Inc. Vertical geometry light emitting diode with group III nitride active layer and extended lifetime
JP3557011B2 (en) * 1995-03-30 2004-08-25 株式会社東芝 Semiconductor light emitting device and manufacturing method thereof
JPH08307001A (en) 1995-04-28 1996-11-22 Mitsubishi Electric Corp Semiconductor laser diode and method of manufacture
US5739554A (en) * 1995-05-08 1998-04-14 Cree Research, Inc. Double heterojunction light emitting diode with gallium nitride active layer
DE69633203T2 (en) 1995-09-18 2005-09-01 Hitachi, Ltd. Semiconductor laser devices
JP3396356B2 (en) * 1995-12-11 2003-04-14 三菱電機株式会社 Semiconductor device and method of manufacturing the same
US5874747A (en) * 1996-02-05 1999-02-23 Advanced Technology Materials, Inc. High brightness electroluminescent device emitting in the green to ultraviolet spectrum and method of making the same
JP3164016B2 (en) * 1996-05-31 2001-05-08 住友電気工業株式会社 Light emitting device and method for manufacturing wafer for light emitting device
JP3756575B2 (en) 1996-06-04 2006-03-15 富士電機ホールディングス株式会社 Group III nitride semiconductor device
US5905275A (en) * 1996-06-17 1999-05-18 Kabushiki Kaisha Toshiba Gallium nitride compound semiconductor light-emitting device
JP3179346B2 (en) * 1996-08-27 2001-06-25 松下電子工業株式会社 Method for producing gallium nitride crystal
JPH10270802A (en) * 1997-03-25 1998-10-09 Sharp Corp Nitride iii-v compound semiconductor device and its manufacture
US6069394A (en) * 1997-04-09 2000-05-30 Matsushita Electronics Corporation Semiconductor substrate, semiconductor device and method of manufacturing the same
ATE550461T1 (en) * 1997-04-11 2012-04-15 Nichia Corp GROWTH METHOD FOR A NITRIDE SEMICONDUCTOR
JP3813740B2 (en) * 1997-07-11 2006-08-23 Tdk株式会社 Substrates for electronic devices
US6201262B1 (en) * 1997-10-07 2001-03-13 Cree, Inc. Group III nitride photonic devices on silicon carbide substrates with conductive buffer interlay structure
JP3036495B2 (en) * 1997-11-07 2000-04-24 豊田合成株式会社 Method for manufacturing gallium nitride-based compound semiconductor
US6051849A (en) * 1998-02-27 2000-04-18 North Carolina State University Gallium nitride semiconductor structures including a lateral gallium nitride layer that extends from an underlying gallium nitride layer
JP3707279B2 (en) * 1998-03-02 2005-10-19 松下電器産業株式会社 Semiconductor light emitting device
US6500257B1 (en) 1998-04-17 2002-12-31 Agilent Technologies, Inc. Epitaxial material grown laterally within a trench and method for producing same
US6265289B1 (en) * 1998-06-10 2001-07-24 North Carolina State University Methods of fabricating gallium nitride semiconductor layers by lateral growth from sidewalls into trenches, and gallium nitride semiconductor structures fabricated thereby
JP4352473B2 (en) * 1998-06-26 2009-10-28 ソニー株式会社 Manufacturing method of semiconductor device
JP3316562B2 (en) 1998-07-21 2002-08-19 株式会社村田製作所 Semiconductor light emitting device and method of forming ZnO film
US6177688B1 (en) * 1998-11-24 2001-01-23 North Carolina State University Pendeoepitaxial gallium nitride semiconductor layers on silcon carbide substrates
US6255198B1 (en) * 1998-11-24 2001-07-03 North Carolina State University Methods of fabricating gallium nitride microelectronic layers on silicon layers and gallium nitride microelectronic structures formed thereby
US6521917B1 (en) * 1999-03-26 2003-02-18 Matsushita Electric Industrial Co., Ltd. Semiconductor structures using a group III-nitride quaternary material system with reduced phase separation
DE60042187D1 (en) * 1999-06-09 2009-06-25 Toshiba Kawasaki Kk Bond-type semiconductor substrate, semiconductor light-emitting device, and manufacturing method
US6225648B1 (en) * 1999-07-09 2001-05-01 Epistar Corporation High-brightness light emitting diode
US6521514B1 (en) 1999-11-17 2003-02-18 North Carolina State University Pendeoepitaxial methods of fabricating gallium nitride semiconductor layers on sapphire substrates
WO2001043174A2 (en) 1999-12-13 2001-06-14 North Carolina State University Fabrication of gallium nitride layers on textured silicon substrates
US6380108B1 (en) 1999-12-21 2002-04-30 North Carolina State University Pendeoepitaxial methods of fabricating gallium nitride semiconductor layers on weak posts, and gallium nitride semiconductor structures fabricated thereby
US6355497B1 (en) * 2000-01-18 2002-03-12 Xerox Corporation Removable large area, low defect density films for led and laser diode growth
CN1248288C (en) 2000-02-09 2006-03-29 北卡罗来纳州大学 Methods of fabricating gallium nitride semicnductor layers on substrates including non-gallium nitride posts and gallium nitride
US6261929B1 (en) * 2000-02-24 2001-07-17 North Carolina State University Methods of forming a plurality of semiconductor layers using spaced trench arrays
US6475889B1 (en) * 2000-04-11 2002-11-05 Cree, Inc. Method of forming vias in silicon carbide and resulting devices and circuits
US6707074B2 (en) * 2000-07-04 2004-03-16 Matsushita Electric Industrial Co., Ltd. Semiconductor light-emitting device and apparatus for driving the same
US6429460B1 (en) * 2000-09-28 2002-08-06 United Epitaxy Company, Ltd. Highly luminous light emitting device
US6657237B2 (en) * 2000-12-18 2003-12-02 Samsung Electro-Mechanics Co., Ltd. GaN based group III-V nitride semiconductor light-emitting diode and method for fabricating the same
US7233028B2 (en) * 2001-02-23 2007-06-19 Nitronex Corporation Gallium nitride material devices and methods of forming the same
US7361946B2 (en) * 2004-06-28 2008-04-22 Nitronex Corporation Semiconductor device-based sensors

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10242584A (en) * 1997-02-28 1998-09-11 Hitachi Ltd Semiconductor light-emitting element
US20010040245A1 (en) * 1998-05-28 2001-11-15 Hiroji Kawai Semiconductor device and its manufacturing method
US20030116791A1 (en) * 2000-05-26 2003-06-26 Robert Baptist Semiconductor device with vertical electron injection and method for making same
US20020074552A1 (en) * 2000-12-14 2002-06-20 Weeks T. Warren Gallium nitride materials and methods
US20020117681A1 (en) * 2001-02-23 2002-08-29 Weeks T. Warren Gallium nitride material devices and methods including backside vias

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 14 31 December 1998 (1998-12-31) *

Also Published As

Publication number Publication date
US20070295985A1 (en) 2007-12-27
US20040130002A1 (en) 2004-07-08
WO2005022639A2 (en) 2005-03-10
US7233028B2 (en) 2007-06-19

Similar Documents

Publication Publication Date Title
WO2005022639A3 (en) Gallium nitride material devices and methods of forming the same
TW200623465A (en) High output group III nitride light emitting diodes
EP1636858A4 (en) A light emitting device using nitride semiconductor and fabrication method of the same
GB2411522B (en) GaN based group III-V nitride semi-conductor light emitting diode
GB2352329B (en) Unipolar light emitting devices based on III- Nitride semiconductor superlattices
DE60236900D1 (en) Single-crystal GaN substrate and laser diode made therewith
SG115549A1 (en) Epitaxial substrate for compound semiconductor light emitting device, method for producing the same and light emitting device
AU2003257717A1 (en) Nitride semiconductor led and fabrication method thereof
AU2001295987A1 (en) Light emitting or light receiving semiconductor module and method for manufacturing the same
EP1360713A4 (en) Light emitting semiconductor package
AU2003281568A1 (en) Hetero integration of semiconductor materials on silicon
AU2002306569A1 (en) Gallium nitride material based semiconductor devices including thermally conductive regions
WO2004045001A3 (en) Organic light emitting materials and devices
GB2379798B (en) Light emitting diode and method for manufacturing the same
EP2267802A3 (en) High efficiency group III nitride LED with lenticular surface
AU2001225045A1 (en) Radiation-emitting semiconductor element, method for production thereof and radiation emitting optical component
WO2004075307A3 (en) Group iii nitride contact structures for light emitting devices
EP1441426A4 (en) Method for fabricating semiconductor light emitting element, semiconductor light emitting element, method for fabricating semiconductor element, semiconductor element, method for fabricating element and element
TW200605394A (en) Nitride semiconductor light emitting device
WO2002025746A1 (en) Nitride semiconductor light emitting element and optical device containing it
BR0204571A (en) Red light emitting organic devices
AU2003234828A1 (en) Semiconductor light-emitting device
AU2003284756A1 (en) Tb,b-based yellow phosphor, its preparation method, and white semiconductor light emitting device incorporating the same
DE60109534D1 (en) Laser diode, semiconductor light-emitting element and its manufacture
AU2002258739A1 (en) Iii-v arsenide nitride semiconductor substrate

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
122 Ep: pct application non-entry in european phase