WO2005022639A3 - Gallium nitride material devices and methods of forming the same - Google Patents
Gallium nitride material devices and methods of forming the same Download PDFInfo
- Publication number
- WO2005022639A3 WO2005022639A3 PCT/US2004/027657 US2004027657W WO2005022639A3 WO 2005022639 A3 WO2005022639 A3 WO 2005022639A3 US 2004027657 W US2004027657 W US 2004027657W WO 2005022639 A3 WO2005022639 A3 WO 2005022639A3
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- WO
- WIPO (PCT)
- Prior art keywords
- gallium nitride
- nitride material
- methods
- forming
- same
- Prior art date
Links
- 229910002601 GaN Inorganic materials 0.000 title abstract 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 title abstract 3
- 239000000463 material Substances 0.000 title abstract 3
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
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- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
- H01S5/32341—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP
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Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/650,122 US7233028B2 (en) | 2001-02-23 | 2003-08-25 | Gallium nitride material devices and methods of forming the same |
US10/650,122 | 2003-08-25 |
Publications (2)
Publication Number | Publication Date |
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WO2005022639A2 WO2005022639A2 (en) | 2005-03-10 |
WO2005022639A3 true WO2005022639A3 (en) | 2006-01-19 |
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Application Number | Title | Priority Date | Filing Date |
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PCT/US2004/027657 WO2005022639A2 (en) | 2003-08-25 | 2004-08-25 | Gallium nitride material devices and methods of forming the same |
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US (2) | US7233028B2 (en) |
WO (1) | WO2005022639A2 (en) |
Families Citing this family (156)
Publication number | Priority date | Publication date | Assignee | Title |
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US7233028B2 (en) * | 2001-02-23 | 2007-06-19 | Nitronex Corporation | Gallium nitride material devices and methods of forming the same |
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US20060005763A1 (en) * | 2001-12-24 | 2006-01-12 | Crystal Is, Inc. | Method and apparatus for producing large, single-crystals of aluminum nitride |
US8545629B2 (en) | 2001-12-24 | 2013-10-01 | Crystal Is, Inc. | Method and apparatus for producing large, single-crystals of aluminum nitride |
US7638346B2 (en) * | 2001-12-24 | 2009-12-29 | Crystal Is, Inc. | Nitride semiconductor heterostructures and related methods |
JP2005150393A (en) * | 2003-11-14 | 2005-06-09 | Sharp Corp | Submount for light receiving/emitting element |
US7098077B2 (en) * | 2004-01-20 | 2006-08-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor chip singulation method |
US7339205B2 (en) * | 2004-06-28 | 2008-03-04 | Nitronex Corporation | Gallium nitride materials and methods associated with the same |
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US7687827B2 (en) * | 2004-07-07 | 2010-03-30 | Nitronex Corporation | III-nitride materials including low dislocation densities and methods associated with the same |
KR100728533B1 (en) * | 2004-11-23 | 2007-06-15 | 삼성코닝 주식회사 | Single crystalline gallium nitride thick film and preparation thereof |
WO2006098215A1 (en) * | 2005-03-16 | 2006-09-21 | Matsushita Electric Industrial Co., Ltd. | Nitride semiconductor device and method for manufacturing same |
US7781886B2 (en) | 2005-06-14 | 2010-08-24 | John Trezza | Electronic chip contact structure |
US7946331B2 (en) | 2005-06-14 | 2011-05-24 | Cufer Asset Ltd. L.L.C. | Pin-type chip tooling |
US7851348B2 (en) | 2005-06-14 | 2010-12-14 | Abhay Misra | Routingless chip architecture |
US7786592B2 (en) * | 2005-06-14 | 2010-08-31 | John Trezza | Chip capacitive coupling |
US7838997B2 (en) | 2005-06-14 | 2010-11-23 | John Trezza | Remote chip attachment |
US7767493B2 (en) | 2005-06-14 | 2010-08-03 | John Trezza | Post & penetration interconnection |
US7687400B2 (en) | 2005-06-14 | 2010-03-30 | John Trezza | Side stacking apparatus and method |
US8456015B2 (en) | 2005-06-14 | 2013-06-04 | Cufer Asset Ltd. L.L.C. | Triaxial through-chip connection |
US7560813B2 (en) | 2005-06-14 | 2009-07-14 | John Trezza | Chip-based thermo-stack |
US9331192B2 (en) | 2005-06-29 | 2016-05-03 | Cree, Inc. | Low dislocation density group III nitride layers on silicon carbide substrates and methods of making the same |
KR20070012930A (en) * | 2005-07-25 | 2007-01-30 | 엘지이노텍 주식회사 | Semiconductor light emitting device and fabrication method thereof |
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Also Published As
Publication number | Publication date |
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US20070295985A1 (en) | 2007-12-27 |
US20040130002A1 (en) | 2004-07-08 |
WO2005022639A2 (en) | 2005-03-10 |
US7233028B2 (en) | 2007-06-19 |
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