WO2005029634A3 - Dielectric loading of distributed printed circuits - Google Patents

Dielectric loading of distributed printed circuits Download PDF

Info

Publication number
WO2005029634A3
WO2005029634A3 PCT/IL2004/000876 IL2004000876W WO2005029634A3 WO 2005029634 A3 WO2005029634 A3 WO 2005029634A3 IL 2004000876 W IL2004000876 W IL 2004000876W WO 2005029634 A3 WO2005029634 A3 WO 2005029634A3
Authority
WO
WIPO (PCT)
Prior art keywords
conductive pattern
printed circuits
dielectric loading
distributed printed
pcb
Prior art date
Application number
PCT/IL2004/000876
Other languages
French (fr)
Other versions
WO2005029634A2 (en
Inventor
Meir Gazit
Danny Alon
Original Assignee
Vishay Advanced Technologies L
Meir Gazit
Danny Alon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vishay Advanced Technologies L, Meir Gazit, Danny Alon filed Critical Vishay Advanced Technologies L
Publication of WO2005029634A2 publication Critical patent/WO2005029634A2/en
Publication of WO2005029634A3 publication Critical patent/WO2005029634A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Abstract

A method for making a conductive pattern (104) with distributed printed circuit (DPC) properties on a substrate (102) and dielectrically loading it by applying a high dielectric constant low loss layer (106) that substantially encapsulates the conductive pattern (104), the conductive pattern is a small antenna (100) formed on a printed circuit board (PCB) and covered by a high dielectric constant (104), low loss plate pressed against the antenna and glued to the PCB.
PCT/IL2004/000876 2003-09-22 2004-09-21 Dielectric loading of distributed printed circuits WO2005029634A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US50387903P 2003-09-22 2003-09-22
US60/503,879 2003-09-22

Publications (2)

Publication Number Publication Date
WO2005029634A2 WO2005029634A2 (en) 2005-03-31
WO2005029634A3 true WO2005029634A3 (en) 2005-08-04

Family

ID=34375409

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IL2004/000876 WO2005029634A2 (en) 2003-09-22 2004-09-21 Dielectric loading of distributed printed circuits

Country Status (2)

Country Link
TW (1) TW200524491A (en)
WO (1) WO2005029634A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8716603B2 (en) 2010-11-24 2014-05-06 Nokia Corporation Printed wiring board with dielectric material sections having different dissipation factors
DE102012201367B4 (en) 2012-01-31 2020-04-09 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Millimeter wave radar
TWI553732B (en) * 2013-01-25 2016-10-11 矽品精密工業股份有限公司 Electronic package structure

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3157847A (en) * 1961-07-11 1964-11-17 Robert M Williams Multilayered waveguide circuitry formed by stacking plates having surface grooves
US4706050A (en) * 1984-09-22 1987-11-10 Smiths Industries Public Limited Company Microstrip devices
US5245745A (en) * 1990-07-11 1993-09-21 Ball Corporation Method of making a thick-film patch antenna structure
US5781110A (en) * 1996-05-01 1998-07-14 James River Paper Company, Inc. Electronic article surveillance tag product and method of manufacturing same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3157847A (en) * 1961-07-11 1964-11-17 Robert M Williams Multilayered waveguide circuitry formed by stacking plates having surface grooves
US4706050A (en) * 1984-09-22 1987-11-10 Smiths Industries Public Limited Company Microstrip devices
US5245745A (en) * 1990-07-11 1993-09-21 Ball Corporation Method of making a thick-film patch antenna structure
US5781110A (en) * 1996-05-01 1998-07-14 James River Paper Company, Inc. Electronic article surveillance tag product and method of manufacturing same

Also Published As

Publication number Publication date
WO2005029634A2 (en) 2005-03-31
TW200524491A (en) 2005-07-16

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