WO2005036698A3 - Microelectromechanical system package with environmental and interference shield - Google Patents

Microelectromechanical system package with environmental and interference shield Download PDF

Info

Publication number
WO2005036698A3
WO2005036698A3 PCT/US2003/028673 US0328673W WO2005036698A3 WO 2005036698 A3 WO2005036698 A3 WO 2005036698A3 US 0328673 W US0328673 W US 0328673W WO 2005036698 A3 WO2005036698 A3 WO 2005036698A3
Authority
WO
WIPO (PCT)
Prior art keywords
microelectromechanical system
substrate
cover
environmental
system package
Prior art date
Application number
PCT/US2003/028673
Other languages
French (fr)
Other versions
WO2005036698A2 (en
Inventor
Anthony D Minervini
Original Assignee
Knowles Electronics Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34656491&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2005036698(A3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority to US10/238,256 priority Critical patent/US6781231B2/en
Application filed by Knowles Electronics Llc filed Critical Knowles Electronics Llc
Priority to PCT/US2003/028673 priority patent/WO2005036698A2/en
Publication of WO2005036698A2 publication Critical patent/WO2005036698A2/en
Publication of WO2005036698A3 publication Critical patent/WO2005036698A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0064—Packages or encapsulation for protecting against electromagnetic or electrostatic interferences
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A microelectromechanical system package (10) has a micro-electromechanical system microphone, a substrate (14), and a cover (20). The substrate (14) has a surface for supporting the micro-electromechanical microphone. The cover (20) includes a conductive layer having a center portion bounded by a peripheral edge portion. A housing (22) is formed by connecting the peripheral edge portion of the cover (20) to the substrate (14). The center portion of the cover is spaced from the surface of the substrate to accommodate the microelectromechanical system microphone. The housing (22) includes an acoustic port (44) for allowing an acoustic signal to reach the microelectromechanical system microphone.
PCT/US2003/028673 2002-09-10 2003-09-12 Microelectromechanical system package with environmental and interference shield WO2005036698A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/238,256 US6781231B2 (en) 2002-09-10 2002-09-10 Microelectromechanical system package with environmental and interference shield
PCT/US2003/028673 WO2005036698A2 (en) 2002-09-10 2003-09-12 Microelectromechanical system package with environmental and interference shield

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/238,256 US6781231B2 (en) 2002-09-10 2002-09-10 Microelectromechanical system package with environmental and interference shield
PCT/US2003/028673 WO2005036698A2 (en) 2002-09-10 2003-09-12 Microelectromechanical system package with environmental and interference shield

Publications (2)

Publication Number Publication Date
WO2005036698A2 WO2005036698A2 (en) 2005-04-21
WO2005036698A3 true WO2005036698A3 (en) 2009-04-23

Family

ID=34656491

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/028673 WO2005036698A2 (en) 2002-09-10 2003-09-12 Microelectromechanical system package with environmental and interference shield

Country Status (2)

Country Link
US (1) US6781231B2 (en)
WO (1) WO2005036698A2 (en)

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