WO2005041256A3 - An integrated circuit micro-cooler using self-assembled nano structures - Google Patents

An integrated circuit micro-cooler using self-assembled nano structures Download PDF

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Publication number
WO2005041256A3
WO2005041256A3 PCT/US2004/027449 US2004027449W WO2005041256A3 WO 2005041256 A3 WO2005041256 A3 WO 2005041256A3 US 2004027449 W US2004027449 W US 2004027449W WO 2005041256 A3 WO2005041256 A3 WO 2005041256A3
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WO
WIPO (PCT)
Prior art keywords
integrated circuit
cooler
self
nano structures
assembled nano
Prior art date
Application number
PCT/US2004/027449
Other languages
French (fr)
Other versions
WO2005041256A2 (en
Inventor
Carlos Dangelo
Original Assignee
Nanoconduction Inc
Carlos Dangelo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanoconduction Inc, Carlos Dangelo filed Critical Nanoconduction Inc
Priority to EP04809610A priority Critical patent/EP1658634A4/en
Publication of WO2005041256A2 publication Critical patent/WO2005041256A2/en
Publication of WO2005041256A3 publication Critical patent/WO2005041256A3/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0652—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/70—Nanostructure
    • Y10S977/734—Fullerenes, i.e. graphene-based structures, such as nanohorns, nanococoons, nanoscrolls or fullerene-like structures, e.g. WS2 or MoS2 chalcogenide nanotubes, planar C3N4, etc.
    • Y10S977/742—Carbon nanotubes, CNTs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/70—Nanostructure
    • Y10S977/762—Nanowire or quantum wire, i.e. axially elongated structure having two dimensions of 100 nm or less
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/70—Nanostructure
    • Y10S977/762—Nanowire or quantum wire, i.e. axially elongated structure having two dimensions of 100 nm or less
    • Y10S977/763—Nanowire or quantum wire, i.e. axially elongated structure having two dimensions of 100 nm or less formed along or from crystallographic terraces or ridges

Abstract

Heat sink structures employing carbon nanotube or nanowire arrays to reduce the thermal interface resistance between an integrated circuit chip and the heat sink are disclosed. Carbon nanotube arrays are combined with a thermally conductive metal filler disposed between the nanotubes. This structure produces a thermal interface with high axial and lateral thermal conductivities.
PCT/US2004/027449 2003-08-25 2004-08-25 An integrated circuit micro-cooler using self-assembled nano structures WO2005041256A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP04809610A EP1658634A4 (en) 2003-08-25 2004-08-25 System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US49784903P 2003-08-25 2003-08-25
US60/497,849 2003-08-25

Publications (2)

Publication Number Publication Date
WO2005041256A2 WO2005041256A2 (en) 2005-05-06
WO2005041256A3 true WO2005041256A3 (en) 2006-04-13

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/027449 WO2005041256A2 (en) 2003-08-25 2004-08-25 An integrated circuit micro-cooler using self-assembled nano structures

Country Status (5)

Country Link
US (2) US7109581B2 (en)
EP (1) EP1658634A4 (en)
KR (1) KR20070027482A (en)
CN (1) CN100416781C (en)
WO (1) WO2005041256A2 (en)

Families Citing this family (156)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7454295B2 (en) 1998-12-17 2008-11-18 The Watereye Corporation Anti-terrorism water quality monitoring system
US9056783B2 (en) * 1998-12-17 2015-06-16 Hach Company System for monitoring discharges into a waste water collection system
US20110125412A1 (en) * 1998-12-17 2011-05-26 Hach Company Remote monitoring of carbon nanotube sensor
US8958917B2 (en) * 1998-12-17 2015-02-17 Hach Company Method and system for remote monitoring of fluid quality and treatment
US6921462B2 (en) 2001-12-17 2005-07-26 Intel Corporation Method and apparatus for producing aligned carbon nanotube thermal interface structure
US7767270B1 (en) * 2002-12-13 2010-08-03 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Selective functionalization of carbon nanotubes based upon distance traveled
US9574290B2 (en) 2003-01-13 2017-02-21 Nantero Inc. Methods for arranging nanotube elements within nanotube fabrics and films
US7273095B2 (en) * 2003-03-11 2007-09-25 United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Nanoengineered thermal materials based on carbon nanotube array composites
US8920619B2 (en) 2003-03-19 2014-12-30 Hach Company Carbon nanotube sensor
US8048688B2 (en) * 2006-10-24 2011-11-01 Samsung Electronics Co., Ltd. Method and apparatus for evaluation and improvement of mechanical and thermal properties of CNT/CNF arrays
US20070126116A1 (en) * 2004-08-24 2007-06-07 Carlos Dangelo Integrated Circuit Micro-Cooler Having Tubes of a CNT Array in Essentially the Same Height over a Surface
US8080871B2 (en) 2003-08-25 2011-12-20 Samsung Electronics Co., Ltd. Carbon nanotube-based structures and methods for removing heat from solid-state devices
US7109581B2 (en) * 2003-08-25 2006-09-19 Nanoconduction, Inc. System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler
US8039961B2 (en) * 2003-08-25 2011-10-18 Samsung Electronics Co., Ltd. Composite carbon nanotube-based structures and methods for removing heat from solid-state devices
US20070114658A1 (en) * 2004-08-24 2007-05-24 Carlos Dangelo Integrated Circuit Micro-Cooler with Double-Sided Tubes of a CNT Array
US20090302295A1 (en) * 2003-08-25 2009-12-10 Peter Schwartz Structures & Methods for Combining Carbon Nanotube Array and Organic Materials as a Variable Gap Interposer for Removing Heat from Solid-State Devices
US7538422B2 (en) * 2003-08-25 2009-05-26 Nanoconduction Inc. Integrated circuit micro-cooler having multi-layers of tubes of a CNT array
US7477527B2 (en) * 2005-03-21 2009-01-13 Nanoconduction, Inc. Apparatus for attaching a cooling structure to an integrated circuit
US20080131655A1 (en) * 2006-03-21 2008-06-05 Barbara Wacker Double Layer Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices
US7732918B2 (en) * 2003-08-25 2010-06-08 Nanoconduction, Inc. Vapor chamber heat sink having a carbon nanotube fluid interface
US20080131722A1 (en) * 2006-03-21 2008-06-05 Ephraim Suhir Single Layer Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices
US20050126766A1 (en) * 2003-09-16 2005-06-16 Koila,Inc. Nanostructure augmentation of surfaces for enhanced thermal transfer with improved contact
US20050214197A1 (en) * 2003-09-17 2005-09-29 Molecular Nanosystems, Inc. Methods for producing and using catalytic substrates for carbon nanotube growth
WO2005025734A2 (en) * 2003-09-17 2005-03-24 Molecular Nanosystems, Inc. Methods for producing and using catalytic substrates for carbon nanotube growth
JP2005129734A (en) * 2003-10-23 2005-05-19 Sony Corp Electronic device
US7456052B2 (en) * 2003-12-30 2008-11-25 Intel Corporation Thermal intermediate apparatus, systems, and methods
AU2005230961B2 (en) * 2004-01-15 2010-11-11 Nanocomp Technologies, Inc. Systems and methods for synthesis of extended length nanostructures
TWI232013B (en) * 2004-01-30 2005-05-01 Oriental Inst Technology Device and method for cooling hot spot in micro system
US7713849B2 (en) * 2004-08-20 2010-05-11 Illuminex Corporation Metallic nanowire arrays and methods for making and using same
JP2006073651A (en) * 2004-08-31 2006-03-16 Fujitsu Ltd Semiconductor device
US7196411B2 (en) * 2004-09-17 2007-03-27 Taiwan Semiconductor Manufacturing Company, Ltd. Heat dissipation for chip-on-chip IC packages
US7279916B2 (en) 2004-10-05 2007-10-09 Nanoconduction, Inc. Apparatus and test device for the application and measurement of prescribed, predicted and controlled contact pressure on wires
TWI388042B (en) * 2004-11-04 2013-03-01 Taiwan Semiconductor Mfg Integrated circuit nanotube-based substrate
TW200633171A (en) * 2004-11-04 2006-09-16 Koninkl Philips Electronics Nv Nanotube-based fluid interface material and approach
JP4179292B2 (en) * 2005-02-21 2008-11-12 サンケン電気株式会社 Semiconductor device
US7671398B2 (en) * 2005-02-23 2010-03-02 Tran Bao Q Nano memory, light, energy, antenna and strand-based systems and methods
US7476982B2 (en) * 2005-02-28 2009-01-13 Regents Of The University Of California Fabricated adhesive microstructures for making an electrical connection
US20060231237A1 (en) * 2005-03-21 2006-10-19 Carlos Dangelo Apparatus and method for cooling ICs using nano-rod based chip-level heat sinks
CN100337981C (en) * 2005-03-24 2007-09-19 清华大学 Thermal interface material and its production method
US20060231946A1 (en) * 2005-04-14 2006-10-19 Molecular Nanosystems, Inc. Nanotube surface coatings for improved wettability
US7596751B2 (en) * 2005-04-22 2009-09-29 Hewlett-Packard Development Company, L.P. Contact sheet based image management
JP5349042B2 (en) * 2005-05-03 2013-11-20 ナノコンプ テクノロジーズ インコーポレイテッド Carbon composite material and method for producing the same
US20060251897A1 (en) * 2005-05-06 2006-11-09 Molecular Nanosystems, Inc. Growth of carbon nanotubes to join surfaces
US7449776B2 (en) * 2005-05-10 2008-11-11 Hewlett-Packard Development Company, L.P. Cooling devices that use nanowires
CA2609712C (en) * 2005-05-26 2015-04-07 Nanocomp Technologies, Inc. Systems and methods for thermal management of electronic components
US7886813B2 (en) * 2005-06-29 2011-02-15 Intel Corporation Thermal interface material with carbon nanotubes and particles
KR100674404B1 (en) * 2005-07-05 2007-01-29 재단법인서울대학교산학협력재단 Cooling device with carbon nanotube coating and method of forming the same
JP4864093B2 (en) * 2005-07-28 2012-01-25 ナノコンプ テクノロジーズ インコーポレイテッド Systems and methods for the formation and harvesting of nanofibrous materials
US20070031684A1 (en) * 2005-08-03 2007-02-08 Anderson Jeffrey T Thermally conductive grease
US8093715B2 (en) * 2005-08-05 2012-01-10 Purdue Research Foundation Enhancement of thermal interface conductivities with carbon nanotube arrays
CA2621924A1 (en) * 2005-09-06 2007-03-06 Nantero, Inc. Carbon nanotubes for the selective transfer of heat from electronics
CN1937094A (en) * 2005-09-22 2007-03-28 清华大学 Scanning thermal microscope probe
US7715456B2 (en) * 2005-10-27 2010-05-11 Limo Patentverwaltung Gmbh & Co. Kg Semiconductor laser device
US7360581B2 (en) * 2005-11-07 2008-04-22 3M Innovative Properties Company Structured thermal transfer article
US7695808B2 (en) * 2005-11-07 2010-04-13 3M Innovative Properties Company Thermal transfer coating
CN100517661C (en) * 2005-11-26 2009-07-22 鸿富锦精密工业（深圳）有限公司 Preparation method of heat radiator
CN100459124C (en) * 2005-12-30 2009-02-04 日月光半导体制造股份有限公司 Multiple chip packaging arrangement
US7545030B2 (en) * 2005-12-30 2009-06-09 Intel Corporation Article having metal impregnated within carbon nanotube array
US20070152325A1 (en) * 2005-12-30 2007-07-05 Intel Corporation Chip package dielectric sheet for body-biasing
CN101001515B (en) * 2006-01-10 2011-05-04 鸿富锦精密工业（深圳）有限公司 Plate radiating pipe and manufacturing method thereof
DE102006001792B8 (en) 2006-01-12 2013-09-26 Infineon Technologies Ag Semiconductor module with semiconductor chip stack and method for producing the same
US7494910B2 (en) 2006-03-06 2009-02-24 Micron Technology, Inc. Methods of forming semiconductor package
US7550841B2 (en) * 2006-03-23 2009-06-23 Intel Corporation Methods of forming a diamond micro-channel structure and resulting devices
US20070227700A1 (en) * 2006-03-29 2007-10-04 Dimitrakopoulos Christos D VLSI chip hot-spot minimization using nanotubes
US7557438B2 (en) * 2006-04-27 2009-07-07 Intel Corporation Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same
WO2007137095A2 (en) * 2006-05-16 2007-11-29 Nanoconduction, Inc. Carbon nanotube-based structures and methods for removing heat from solid-state devices
US20080292835A1 (en) * 2006-08-30 2008-11-27 Lawrence Pan Methods for forming freestanding nanotube objects and objects so formed
EP2064736A1 (en) * 2006-09-04 2009-06-03 Nxp B.V. Fabrication of self-assembled nanowire-type interconnects on a semiconductor device
US7659143B2 (en) * 2006-09-29 2010-02-09 Intel Corporation Dual-chip integrated heat spreader assembly, packages containing same, and systems containing same
CA2666815C (en) * 2006-10-17 2013-05-28 Purdue Research Foundation Electrothermal interface material enhancer
US20080131658A1 (en) * 2006-12-05 2008-06-05 Vijay Wakharkar Electronic packages and components thereof formed by co-deposited carbon nanotubes
CN101232794B (en) * 2007-01-24 2011-11-30 富准精密工业(深圳)有限公司 Soaking plate and heat radiating device
WO2008127776A1 (en) * 2007-02-14 2008-10-23 The Regents Of The University Of California A method to determine thermal profiles of nanoscale circuitry
KR20090115794A (en) * 2007-02-22 2009-11-06 다우 코닝 코포레이션 Process for preparing conductive films and articles prepared using the process
EP2125359B1 (en) * 2007-02-27 2016-07-27 Nanocomp Technologies, Inc. Materials for thermal protection and methods of manufacturing same
WO2008109164A1 (en) * 2007-03-08 2008-09-12 Nanocomp Technologies, Inc. Supercapacitors and methods of manufacturing same
JP5194513B2 (en) * 2007-03-29 2013-05-08 富士通セミコンダクター株式会社 Wiring structure and method for forming the same
WO2008129525A1 (en) * 2007-04-23 2008-10-30 University College Cork - National University Of Ireland, Cork A thermal interface material
US7639356B2 (en) * 2007-05-18 2009-12-29 The United States Of America As Represented By The Secretary Of The Navy Highly efficient surface enhanced Raman and fluorescence nanostructure substrates
JP4953206B2 (en) * 2007-06-08 2012-06-13 株式会社デンソー Heat exchange member and heat exchange device
US9061913B2 (en) * 2007-06-15 2015-06-23 Nanocomp Technologies, Inc. Injector apparatus and methods for production of nanostructures
CA2693403A1 (en) * 2007-07-09 2009-03-05 Nanocomp Technologies, Inc. Chemically-assisted alignment of nanotubes within extensible structures
JP5496887B2 (en) * 2007-07-25 2014-05-21 ナノコンプ テクノロジーズ インコーポレイテッド System and method for controlling nanotube chirality
WO2009021069A1 (en) * 2007-08-07 2009-02-12 Nanocomp Technologies, Inc. Electrically and thermally non-metallic conductive nanostructure-based adapters
US20090044848A1 (en) * 2007-08-14 2009-02-19 Nanocomp Technologies, Inc. Nanostructured Material-Based Thermoelectric Generators
US8919428B2 (en) * 2007-10-17 2014-12-30 Purdue Research Foundation Methods for attaching carbon nanotubes to a carbon substrate
US20090173334A1 (en) * 2007-11-08 2009-07-09 Sunrgi Composite material compositions, arrangements and methods having enhanced thermal conductivity behavior
US20090266395A1 (en) * 2007-11-08 2009-10-29 Sunrgi Solar concentration and cooling devices, arrangements and methods
FR2924861B1 (en) * 2007-12-07 2010-02-12 Thales Sa ELECTRONIC DEVICE COMPRISING A FILM BASED ON CARBON NANOTUBES TO ENSURE THERMAL MANAGEMENT AND METHOD OF MANUFACTURING THE SAME
US8262835B2 (en) 2007-12-19 2012-09-11 Purdue Research Foundation Method of bonding carbon nanotubes
US7479590B1 (en) 2008-01-03 2009-01-20 International Business Machines Corporation Dry adhesives, methods of manufacture thereof and articles comprising the same
US7900690B2 (en) * 2008-01-07 2011-03-08 King Fahd University Of Petroleum And Minerals Moving carbon nanotube heat sink
WO2009091882A2 (en) * 2008-01-15 2009-07-23 Georgia Tech Research Corporation Systems and methods for fabrication & transfer of carbon nanotubes
WO2010036405A1 (en) 2008-05-07 2010-04-01 Nanocomp Technologies, Inc. Nanostructure composite sheets and methods of use
WO2009137725A1 (en) * 2008-05-07 2009-11-12 Nanocomp Technologies, Inc. Nanostructure-based heating devices and method of use
CN101671442A (en) * 2008-09-12 2010-03-17 清华大学 Preparation method of carbon nano tube array composite material
TWI401308B (en) * 2008-12-23 2013-07-11 Kuo Chun Ying Nano-scale heat sink material
US20100190023A1 (en) * 2009-01-26 2010-07-29 Adam Franklin Gross Metal bonded nanotube array
US8541058B2 (en) * 2009-03-06 2013-09-24 Timothy S. Fisher Palladium thiolate bonding of carbon nanotubes
US8323439B2 (en) * 2009-03-08 2012-12-04 Hewlett-Packard Development Company, L.P. Depositing carbon nanotubes onto substrate
US7862342B2 (en) * 2009-03-18 2011-01-04 Eaton Corporation Electrical interfaces including a nano-particle layer
CN101562148B (en) * 2009-04-24 2011-08-24 北京大学 Method for carbon nano tube to achieve vertical interconnection of upper and lower layers of conductive material
US8354593B2 (en) * 2009-07-10 2013-01-15 Nanocomp Technologies, Inc. Hybrid conductors and method of making same
US10164135B2 (en) * 2009-08-07 2018-12-25 Guardian Glass, LLC Electronic device including graphene-based layer(s), and/or method or making the same
US8236118B2 (en) 2009-08-07 2012-08-07 Guardian Industries Corp. Debonding and transfer techniques for hetero-epitaxially grown graphene, and products including the same
US8507797B2 (en) * 2009-08-07 2013-08-13 Guardian Industries Corp. Large area deposition and doping of graphene, and products including the same
US10167572B2 (en) * 2009-08-07 2019-01-01 Guardian Glass, LLC Large area deposition of graphene via hetero-epitaxial growth, and products including the same
US20110039459A1 (en) * 2009-08-11 2011-02-17 Yancey Jerry W Solderless carbon nanotube and nanowire electrical contacts and methods of use thereof
US8709538B1 (en) 2009-09-29 2014-04-29 The Boeing Company Substantially aligned boron nitride nano-element arrays and methods for their use and preparation
US8808810B2 (en) * 2009-12-15 2014-08-19 Guardian Industries Corp. Large area deposition of graphene on substrates, and products including the same
US8460747B2 (en) 2010-03-04 2013-06-11 Guardian Industries Corp. Large-area transparent conductive coatings including alloyed carbon nanotubes and nanowire composites, and methods of making the same
US8518472B2 (en) 2010-03-04 2013-08-27 Guardian Industries Corp. Large-area transparent conductive coatings including doped carbon nanotubes and nanowire composites, and methods of making the same
US8604332B2 (en) 2010-03-04 2013-12-10 Guardian Industries Corp. Electronic devices including transparent conductive coatings including carbon nanotubes and nanowire composites, and methods of making the same
WO2011111112A1 (en) * 2010-03-12 2011-09-15 富士通株式会社 Heat dissipating structure and production method therefor
KR101938425B1 (en) 2010-03-30 2019-01-14 난테로 인크. Methods for arranging nanoscopic elements within networks, fabrics, and films
US8564954B2 (en) * 2010-06-15 2013-10-22 Chipmos Technologies Inc. Thermally enhanced electronic package
US9096784B2 (en) 2010-07-23 2015-08-04 International Business Machines Corporation Method and system for allignment of graphite nanofibers for enhanced thermal interface material performance
US20120090816A1 (en) * 2010-10-13 2012-04-19 William Marsh Rice University Systems and methods for heat transfer utilizing heat exchangers with carbon nanotubes
NL2007834A (en) 2010-12-23 2012-06-27 Asml Netherlands Bv Lithographic apparatus and removable member.
KR101273365B1 (en) * 2010-12-30 2013-06-11 연세대학교 산학협력단 Heat transfer element
US20120211199A1 (en) * 2011-02-22 2012-08-23 Gerald Ho Kim Silicon-Based Cooling Package with Diamond Coating for Heat-Generating Devices
JP5760668B2 (en) * 2011-05-11 2015-08-12 富士通株式会社 Sheet-like structure, manufacturing method thereof, electronic device, and manufacturing method thereof
US9217555B2 (en) * 2011-05-17 2015-12-22 Bridgelux Incorporated LED module with integrated thermal spreader
US9111899B2 (en) 2012-09-13 2015-08-18 Lenovo Horizontally and vertically aligned graphite nanofibers thermal interface material for use in chip stacks
US8921994B2 (en) 2012-09-14 2014-12-30 Freescale Semiconductor, Inc. Thermally enhanced package with lid heat spreader
US9159643B2 (en) * 2012-09-14 2015-10-13 Freescale Semiconductor, Inc. Matrix lid heatspreader for flip chip package
US9245813B2 (en) 2013-01-30 2016-01-26 International Business Machines Corporation Horizontally aligned graphite nanofibers in etched silicon wafer troughs for enhanced thermal performance
US9090004B2 (en) 2013-02-06 2015-07-28 International Business Machines Corporation Composites comprised of aligned carbon fibers in chain-aligned polymer binder
US10431354B2 (en) 2013-03-15 2019-10-01 Guardian Glass, LLC Methods for direct production of graphene on dielectric substrates, and associated articles/devices
US9593019B2 (en) 2013-03-15 2017-03-14 Guardian Industries Corp. Methods for low-temperature graphene precipitation onto glass, and associated articles/devices
ES2943257T3 (en) 2013-06-17 2023-06-12 Nanocomp Technologies Inc Exfoliating-dispersing agents for nanotubes, bundles and fibers
US9082744B2 (en) 2013-07-08 2015-07-14 International Business Machines Corporation Method for aligning carbon nanotubes containing magnetic nanoparticles in a thermosetting polymer using a magnetic field
US10468330B2 (en) * 2013-12-12 2019-11-05 Samsung Electronics Co., Ltd. Semiconductor chip and electronic system including the same
WO2015095245A1 (en) * 2013-12-16 2015-06-25 KULR Technology Corporation Carbon fiber heat exchangers
US9324628B2 (en) 2014-02-25 2016-04-26 International Business Machines Corporation Integrated circuit heat dissipation using nanostructures
US9482477B2 (en) * 2014-07-28 2016-11-01 Northrop Grumman Systems Corporation Nano-thermal agents for enhanced interfacial thermal conductance
US9484281B2 (en) * 2014-08-14 2016-11-01 Qualcomm Incorporated Systems and methods for thermal dissipation
US20160106005A1 (en) * 2014-10-13 2016-04-14 Ntherma Corporation Carbon nanotubes as a thermal interface material
US11434581B2 (en) 2015-02-03 2022-09-06 Nanocomp Technologies, Inc. Carbon nanotube structures and methods for production thereof
US9468989B2 (en) 2015-02-26 2016-10-18 Northrop Grumman Systems Corporation High-conductivity bonding of metal nanowire arrays
US10145005B2 (en) 2015-08-19 2018-12-04 Guardian Glass, LLC Techniques for low temperature direct graphene growth on glass
CN105261695B (en) * 2015-11-06 2018-12-14 天津三安光电有限公司 A kind of bonding structure for III-V compound device
US11186732B2 (en) 2016-06-27 2021-11-30 Ironwood 12 Llc Vertically-aligned carbon nanotube substrate having increased surface area
US10876201B2 (en) 2016-06-27 2020-12-29 Ironwood 12 Llc Broadband fluorescence amplification assembly
US10782014B2 (en) 2016-11-11 2020-09-22 Habib Technologies LLC Plasmonic energy conversion device for vapor generation
US10581082B2 (en) 2016-11-15 2020-03-03 Nanocomp Technologies, Inc. Systems and methods for making structures defined by CNT pulp networks
US11279836B2 (en) 2017-01-09 2022-03-22 Nanocomp Technologies, Inc. Intumescent nanostructured materials and methods of manufacturing same
TWI755492B (en) * 2017-03-06 2022-02-21 美商卡爾拜斯有限公司 Carbon nanotube-based thermal interface materials and methods of making and using thereof
JP6885175B2 (en) * 2017-04-14 2021-06-09 富士電機株式会社 Semiconductor device
US10607919B2 (en) * 2017-04-28 2020-03-31 Semiconductor Components Industries, Llc Semiconductor package having junction cooling pipes embedded in substrates
JP2018192534A (en) * 2017-05-12 2018-12-06 国立大学法人 東京大学 Heat flow direction control structure
WO2019086619A1 (en) * 2017-11-03 2019-05-09 Jenoptik Laser Gmbh Diode laser
KR102584991B1 (en) * 2019-06-14 2023-10-05 삼성전기주식회사 Semiconductor package
US11315852B2 (en) * 2019-10-11 2022-04-26 Aptiv Technologies Limited Thermal interface layer for electronic device
WO2022122146A1 (en) * 2020-12-09 2022-06-16 HELLA GmbH & Co. KGaA Heat sink arrangement, heat sink and electronic control unit
US11653475B2 (en) * 2021-02-01 2023-05-16 Microsoft Technology Licensing, Llc Thermally conductive microtubes for evenly distributing heat flux on a cooling system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040218362A1 (en) * 2003-02-19 2004-11-04 Amaro Allen J. System and apparatus for heat removal
US20040261987A1 (en) * 2003-06-30 2004-12-30 Yuegang Zhang Thermal interface apparatus, systems, and methods
US6965513B2 (en) * 2001-12-20 2005-11-15 Intel Corporation Carbon nanotube thermal interface structures

Family Cites Families (89)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US680886A (en) * 1900-09-24 1901-08-20 Charles Rath Wheeled scraper.
IT1138371B (en) * 1981-05-20 1986-09-17 Brev Elettrogalvan Superfinitu SEALING DEVICE WITH FLEXIBLE SEALS, FOR BAR CHROMING AND SIMILAR TANKS
US4932052A (en) * 1989-06-26 1990-06-05 Jack Lo Self-adjusting headset-handset combination
US5006924A (en) * 1989-12-29 1991-04-09 International Business Machines Corporation Heat sink for utilization with high density integrated circuit substrates
US5060543A (en) * 1990-01-30 1991-10-29 Warheit William A Self-adjusting tool
US5217094A (en) * 1991-08-09 1993-06-08 Atwood Industries, Inc. Self-adjusting, push-to-release parking brake control
US5891724A (en) * 1992-10-27 1999-04-06 Queen's University At Kingston Methods for conferring multidrug resistance on a cell
US5837081A (en) * 1993-04-07 1998-11-17 Applied Sciences, Inc. Method for making a carbon-carbon composite
US5780101A (en) * 1995-02-17 1998-07-14 Arizona Board Of Regents On Behalf Of The University Of Arizona Method for producing encapsulated nanoparticles and carbon nanotubes using catalytic disproportionation of carbon monoxide
US5713690A (en) * 1996-05-28 1998-02-03 International Business Machines Corporation Apparatus for attaching heatsinks
US6395991B1 (en) * 1996-07-29 2002-05-28 International Business Machines Corporation Column grid array substrate attachment with heat sink stress relief
JP2000516708A (en) * 1996-08-08 2000-12-12 ウィリアム・マーシュ・ライス・ユニバーシティ Macroscopically operable nanoscale devices fabricated from nanotube assemblies
US5932925A (en) * 1996-09-09 1999-08-03 Intricast, Inc. Adjustable-pressure mount heatsink system
US5818700A (en) * 1996-09-24 1998-10-06 Texas Instruments Incorporated Microelectronic assemblies including Z-axis conductive films
US5990552A (en) * 1997-02-07 1999-11-23 Intel Corporation Apparatus for attaching a heat sink to the back side of a flip chip package
US6683783B1 (en) * 1997-03-07 2004-01-27 William Marsh Rice University Carbon fibers formed from single-wall carbon nanotubes
US5808236A (en) * 1997-04-10 1998-09-15 International Business Machines Corporation High density heatsink attachment
US6231744B1 (en) 1997-04-24 2001-05-15 Massachusetts Institute Of Technology Process for fabricating an array of nanowires
US6061239A (en) 1997-05-16 2000-05-09 Psc Computer Products Cam-type retainer clip for heat sinks for electronic integrated circuits
US5969947A (en) * 1997-12-17 1999-10-19 International Business Machines Corporation Integral design features for heatsink attach for electronic packages
US6156256A (en) * 1998-05-13 2000-12-05 Applied Sciences, Inc. Plasma catalysis of carbon nanofibers
US6713151B1 (en) * 1998-06-24 2004-03-30 Honeywell International Inc. Compliant fibrous thermal interface
US6232706B1 (en) * 1998-11-12 2001-05-15 The Board Of Trustees Of The Leland Stanford Junior University Self-oriented bundles of carbon nanotubes and method of making same
US6361861B2 (en) * 1999-06-14 2002-03-26 Battelle Memorial Institute Carbon nanotubes on a substrate
US6913075B1 (en) * 1999-06-14 2005-07-05 Energy Science Laboratories, Inc. Dendritic fiber material
US6504292B1 (en) * 1999-07-15 2003-01-07 Agere Systems Inc. Field emitting device comprising metallized nanostructures and method for making the same
US6340822B1 (en) * 1999-10-05 2002-01-22 Agere Systems Guardian Corp. Article comprising vertically nano-interconnected circuit devices and method for making the same
US6413487B1 (en) * 2000-06-02 2002-07-02 The Board Of Regents Of The University Of Oklahoma Method and apparatus for producing carbon nanotubes
US6417563B1 (en) * 2000-07-14 2002-07-09 Advanced Micro Devices, Inc. Spring frame for protecting packaged electronic devices
US6407922B1 (en) * 2000-09-29 2002-06-18 Intel Corporation Heat spreader, electronic package including the heat spreader, and methods of manufacturing the heat spreader
JP2002121404A (en) * 2000-10-19 2002-04-23 Polymatech Co Ltd Heat-conductive polymer sheet
US6591658B1 (en) * 2000-10-25 2003-07-15 Advanced Micro Devices, Inc. Carbon nanotubes as linewidth standards for SEM & AFM
US6783589B2 (en) * 2001-01-19 2004-08-31 Chevron U.S.A. Inc. Diamondoid-containing materials in microelectronics
US6667548B2 (en) * 2001-04-06 2003-12-23 Intel Corporation Diamond heat spreading and cooling technique for integrated circuits
US7084507B2 (en) 2001-05-02 2006-08-01 Fujitsu Limited Integrated circuit device and method of producing the same
JP4714371B2 (en) * 2001-06-06 2011-06-29 ポリマテック株式会社 Thermally conductive molded body and method for producing the same
US6432740B1 (en) 2001-06-28 2002-08-13 Hewlett-Packard Company Fabrication of molecular electronic circuit by imprinting
US6449155B1 (en) * 2001-08-09 2002-09-10 International Business Machines Corporation Land grid array subassembly for multichip modules
JP3946975B2 (en) * 2001-10-09 2007-07-18 富士通株式会社 Cooling system
US6910666B2 (en) * 2001-10-12 2005-06-28 William J. Burr Adjustable leveling mount
GB2384008B (en) * 2001-12-12 2005-07-20 Electrovac Method of synthesising carbon nano tubes
US6921462B2 (en) * 2001-12-17 2005-07-26 Intel Corporation Method and apparatus for producing aligned carbon nanotube thermal interface structure
US6658971B2 (en) * 2002-02-05 2003-12-09 Oberg Industries Self-adjusting tool utilizing a cam
US6821415B2 (en) * 2002-02-13 2004-11-23 Matthew L. Sharb Self-adjusting fluid surface skimmer and fluid treatment system using same
US20040013598A1 (en) 2002-02-22 2004-01-22 Mcelrath Kenneth O. Molecular-level thermal management materials comprising single-wall carbon nanotubes
TW593730B (en) * 2002-03-25 2004-06-21 Ind Tech Res Inst Process of direct low-temperature growth of carbon nanotubes on a substrate
US6872645B2 (en) * 2002-04-02 2005-03-29 Nanosys, Inc. Methods of positioning and/or orienting nanostructures
US6946410B2 (en) * 2002-04-05 2005-09-20 E. I. Du Pont De Nemours And Company Method for providing nano-structures of uniform length
EP1503956A1 (en) * 2002-04-08 2005-02-09 William Marsh Rice University Method for cutting single-wall carbon nanotubes through fluorination
US6724906B2 (en) * 2002-05-07 2004-04-20 Alex Naksen Adjustable headphone
JP4416376B2 (en) 2002-05-13 2010-02-17 富士通株式会社 Semiconductor device and manufacturing method thereof
US6853068B1 (en) * 2002-05-22 2005-02-08 Volterra Semiconductor Corporation Heatsinking and packaging of integrated circuit chips
US6891724B2 (en) * 2002-06-12 2005-05-10 Intel Corporation Increasing thermal conductivity of thermal interface using carbon nanotubes and CVD
US6856016B2 (en) * 2002-07-02 2005-02-15 Intel Corp Method and apparatus using nanotubes for cooling and grounding die
US6892652B2 (en) * 2002-08-19 2005-05-17 Branson Ultrasonics Corporation Self-adjusting dynamic floating fixture
AU2003298998A1 (en) * 2002-09-05 2004-04-08 Nanosys, Inc. Oriented nanostructures and methods of preparing
CN1248959C (en) * 2002-09-17 2006-04-05 清华大学 Carbon nano pipe array growth method
US20040072994A1 (en) * 2002-10-15 2004-04-15 Herr Daniel J.C. Nanostructures including controllably positioned and aligned synthetic nanotubes, and related methods
CN1296994C (en) * 2002-11-14 2007-01-24 清华大学 A thermal interfacial material and method for manufacturing same
CN1239387C (en) * 2002-11-21 2006-02-01 清华大学 Carbon nano transistor array and grwoth method thereof
US6859367B2 (en) * 2003-01-03 2005-02-22 Intel Corporation Heat sink attachment device
US6992893B2 (en) * 2003-01-10 2006-01-31 Hewlett-Packard Development Company, L.P. Heat sink attachment
US20040152240A1 (en) * 2003-01-24 2004-08-05 Carlos Dangelo Method and apparatus for the use of self-assembled nanowires for the removal of heat from integrated circuits
US7316061B2 (en) * 2003-02-03 2008-01-08 Intel Corporation Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface
US7273095B2 (en) * 2003-03-11 2007-09-25 United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Nanoengineered thermal materials based on carbon nanotube array composites
US20040182600A1 (en) * 2003-03-20 2004-09-23 Fujitsu Limited Method for growing carbon nanotubes, and electronic device having structure of ohmic connection to carbon element cylindrical structure body and production method thereof
CN1244491C (en) * 2003-03-25 2006-03-08 清华大学 Carbon nano tube array structure and its preparing method
US7118941B2 (en) 2003-06-25 2006-10-10 Intel Corporation Method of fabricating a composite carbon nanotube thermal interface device
US20040266063A1 (en) 2003-06-25 2004-12-30 Montgomery Stephen W. Apparatus and method for manufacturing thermal interface device having aligned carbon nanotubes
US7112472B2 (en) 2003-06-25 2006-09-26 Intel Corporation Methods of fabricating a composite carbon nanotube thermal interface device
US6976532B2 (en) 2003-06-26 2005-12-20 The Regents Of The University Of California Anisotropic thermal applications of composites of ceramics and carbon nanotubes
US6864571B2 (en) * 2003-07-07 2005-03-08 Gelcore Llc Electronic devices and methods for making same using nanotube regions to assist in thermal heat-sinking
US6856511B1 (en) * 2003-07-17 2005-02-15 Cisco Technology, Inc. Methods and apparatus for attaching a heat sink to a circuit board component
US6880799B2 (en) * 2003-08-01 2005-04-19 Honeywell International Inc. Self-adjusting system for a damper
US7416019B2 (en) * 2003-08-13 2008-08-26 The Johns Hopkins University Thermal interface and switch using carbon nanotube arrays
US7109581B2 (en) * 2003-08-25 2006-09-19 Nanoconduction, Inc. System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler
US6989325B2 (en) 2003-09-03 2006-01-24 Industrial Technology Research Institute Self-assembled nanometer conductive bumps and method for fabricating
US20050116336A1 (en) * 2003-09-16 2005-06-02 Koila, Inc. Nano-composite materials for thermal management applications
US20050061496A1 (en) * 2003-09-24 2005-03-24 Matabayas James Christopher Thermal interface material with aligned carbon nanotubes
JP4339657B2 (en) * 2003-09-30 2009-10-07 富士通株式会社 Semiconductor device and manufacturing method thereof
TW200517042A (en) 2003-11-04 2005-05-16 Hon Hai Prec Ind Co Ltd Heat sink
US7186020B2 (en) * 2003-12-12 2007-03-06 University Of Washington Thermal interface material (TIM) with carbon nanotubes (CNT) and low thermal impedance
TWI253467B (en) * 2003-12-23 2006-04-21 Hon Hai Prec Ind Co Ltd Thermal interface material and method for making same
US7180174B2 (en) * 2003-12-30 2007-02-20 Intel Corporation Nanotube modified solder thermal intermediate structure, systems, and methods
US7456052B2 (en) * 2003-12-30 2008-11-25 Intel Corporation Thermal intermediate apparatus, systems, and methods
US7612370B2 (en) * 2003-12-31 2009-11-03 Intel Corporation Thermal interface
CN100383213C (en) * 2004-04-02 2008-04-23 清华大学 Thermal interface material and its manufacturing method
US20050238810A1 (en) * 2004-04-26 2005-10-27 Mainstream Engineering Corp. Nanotube/metal substrate composites and methods for producing such composites
US20050260412A1 (en) * 2004-05-19 2005-11-24 Lockheed Martin Corporation System, method, and apparatus for producing high efficiency heat transfer device with carbon nanotubes

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6965513B2 (en) * 2001-12-20 2005-11-15 Intel Corporation Carbon nanotube thermal interface structures
US20040218362A1 (en) * 2003-02-19 2004-11-04 Amaro Allen J. System and apparatus for heat removal
US20040261987A1 (en) * 2003-06-30 2004-12-30 Yuegang Zhang Thermal interface apparatus, systems, and methods

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
ZHANG.: "Formation of Metal Nanowires On Suspended Single- Walled carbon nanotubes.", APPL PHYS LETT., vol. 77, no. 19, 2000, pages 3015 - 3017, XP012026542 *

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