WO2005042427A3 - Method of forming microstructures on a substrate and a microstructured assembly used for same - Google Patents

Method of forming microstructures on a substrate and a microstructured assembly used for same Download PDF

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Publication number
WO2005042427A3
WO2005042427A3 PCT/US2004/033170 US2004033170W WO2005042427A3 WO 2005042427 A3 WO2005042427 A3 WO 2005042427A3 US 2004033170 W US2004033170 W US 2004033170W WO 2005042427 A3 WO2005042427 A3 WO 2005042427A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
forming microstructures
same
assembly used
microstructured assembly
Prior art date
Application number
PCT/US2004/033170
Other languages
French (fr)
Other versions
WO2005042427A2 (en
Inventor
Chikafumi Yokoyama
Takaki Sugimoto
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Priority to CA002543518A priority Critical patent/CA2543518A1/en
Priority to EP04816912A priority patent/EP1685074A2/en
Priority to JP2006538030A priority patent/JP2007513467A/en
Publication of WO2005042427A2 publication Critical patent/WO2005042427A2/en
Publication of WO2005042427A3 publication Critical patent/WO2005042427A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/006—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character
    • C03C17/008—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character comprising a mixture of materials covered by two or more of the groups C03C17/02, C03C17/06, C03C17/22 and C03C17/28
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B29C33/424—Moulding surfaces provided with means for marking or patterning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/10—AC-PDPs with at least one main electrode being out of contact with the plasma
    • H01J11/12—AC-PDPs with at least one main electrode being out of contact with the plasma with main electrodes provided on both sides of the discharge space
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/34—Vessels, containers or parts thereof, e.g. substrates
    • H01J11/36—Spacers, barriers, ribs, partitions or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/241—Manufacture or joining of vessels, leading-in conductors or bases the vessel being for a flat panel display
    • H01J9/242—Spacers between faceplate and backplate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/10—Moulds or cores; Details thereof or accessories therefor with incorporated venting means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3475—Displays, monitors, TV-sets, computer screens
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2218/00—Methods for coating glass
    • C03C2218/10—Deposition methods
    • C03C2218/11—Deposition methods from solutions or suspensions
    • C03C2218/119—Deposition methods from solutions or suspensions by printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • C09K2323/02—Alignment layer characterised by chemical composition
    • C09K2323/021—Inorganic, e.g. glass or silicon oxide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
    • H01J2211/20—Constructional details
    • H01J2211/34—Vessels, containers or parts thereof, e.g. substrates
    • H01J2211/36—Spacers, barriers, ribs, partitions or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
    • H01J2211/20—Constructional details
    • H01J2211/34—Vessels, containers or parts thereof, e.g. substrates
    • H01J2211/36—Spacers, barriers, ribs, partitions or the like
    • H01J2211/361—Spacers, barriers, ribs, partitions or the like characterized by the shape
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24628—Nonplanar uniform thickness material

Abstract

A method of forming microstructures on a substrate is disclosed. A microstructured assembly that may be used in the method for forming microstructures on a substrate is also disclosed. The methods and assemblies of the present disclosure can reduce the amount of air entrapped in barrier ribs formed on substrates used in Plasma Display devices.
PCT/US2004/033170 2003-10-31 2004-10-08 Method of forming microstructures on a substrate and a microstructured assembly used for same WO2005042427A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CA002543518A CA2543518A1 (en) 2003-10-31 2004-10-08 Method of forming microstructures on a substrate and a microstructured assembly used for same
EP04816912A EP1685074A2 (en) 2003-10-31 2004-10-08 Method of forming microstructures on a substrate and a microstructured assembly used for same
JP2006538030A JP2007513467A (en) 2003-10-31 2004-10-08 Method for forming microstructure group on substrate and microstructure assembly used in the method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/698,200 2003-10-31
US10/698,200 US7288013B2 (en) 2003-10-31 2003-10-31 Method of forming microstructures on a substrate and a microstructured assembly used for same

Publications (2)

Publication Number Publication Date
WO2005042427A2 WO2005042427A2 (en) 2005-05-12
WO2005042427A3 true WO2005042427A3 (en) 2005-07-07

Family

ID=34550565

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/033170 WO2005042427A2 (en) 2003-10-31 2004-10-08 Method of forming microstructures on a substrate and a microstructured assembly used for same

Country Status (8)

Country Link
US (2) US7288013B2 (en)
EP (1) EP1685074A2 (en)
JP (1) JP2007513467A (en)
KR (1) KR20060096069A (en)
CN (1) CN100521038C (en)
CA (1) CA2543518A1 (en)
TW (1) TW200519415A (en)
WO (1) WO2005042427A2 (en)

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US6761607B2 (en) * 2000-01-11 2004-07-13 3M Innovative Properties Company Apparatus, mold and method for producing substrate for plasma display panel
US7288013B2 (en) * 2003-10-31 2007-10-30 3M Innovative Properties Company Method of forming microstructures on a substrate and a microstructured assembly used for same
JP2005288933A (en) * 2004-04-01 2005-10-20 Three M Innovative Properties Co Flexible molding die and its manufacturing method
JP4647258B2 (en) * 2004-07-29 2011-03-09 株式会社日立製作所 Molding material transfer method, substrate structure
WO2006026142A1 (en) * 2004-08-26 2006-03-09 3M Innovative Properties Company Method of forming microstructures with a discrete mold provided on a roller
JP2008511122A (en) * 2004-08-26 2008-04-10 スリーエム イノベイティブ プロパティズ カンパニー Method for forming microstructures in multiple separate molds
CN101010772A (en) * 2004-08-26 2007-08-01 3M创新有限公司 Method of forming microstructures with a template
JP2006147584A (en) * 2004-11-23 2006-06-08 Lg Electronics Inc Plasma display panel
US20070018363A1 (en) * 2005-07-20 2007-01-25 3M Innovative Properties Company Methods of aligning mold and articles
US20070018348A1 (en) * 2005-07-20 2007-01-25 3M Innovative Properties Company Aligned mold comprising support
TWI265543B (en) * 2005-11-22 2006-11-01 Marketech Int Corp The manufacturing method of the shadow mask of an opposed discharge plasma display panel
JP2007147829A (en) * 2005-11-25 2007-06-14 Brother Ind Ltd Method for manufacturing partition wall and substrate in electrophoretic display medium, and electrophoretic display medium
US20070126158A1 (en) * 2005-12-01 2007-06-07 3M Innovative Properties Company Method of cleaning polymeric mold
KR100761137B1 (en) * 2006-01-05 2007-09-21 엘지전자 주식회사 Plasma Display Panel
US20080036114A1 (en) * 2006-08-14 2008-02-14 3M Innovative Properties Company Mold having surface modified non-molding regions
JP2008085323A (en) * 2006-08-31 2008-04-10 National Institute Of Advanced Industrial & Technology Transparent electrode substrate for solar cell
US20080093776A1 (en) * 2006-10-05 2008-04-24 3M Innovative Properties Company Method of molding ultraviolet cured microstructures and molds
KR20100026454A (en) * 2008-08-29 2010-03-10 삼성전기주식회사 Manufacturing method of ceramic green sheet and manufacturing method of multilayer ceramic circuit board
WO2010030032A1 (en) * 2008-09-12 2010-03-18 日本碍子株式会社 Manufacturing method for three-dimensional molded parts
WO2011068884A2 (en) * 2009-12-01 2011-06-09 University Of Massachusetts A system for producing patterned silicon carbide structures
TW201341211A (en) * 2012-04-12 2013-10-16 Inhon Internat Co Ltd Method of fabricating in-mold release film
CN110908238A (en) 2012-09-06 2020-03-24 Ev 集团 E·索尔纳有限责任公司 Structural stamp, apparatus and method for imprinting
US8936461B2 (en) * 2013-03-14 2015-01-20 Dominic Palazzolo Transfer device and method of using
DE102013107909B4 (en) * 2013-07-24 2015-04-09 Schott Ag Method and system for embossing a structure on a substrate coated with a lacquer
DE102014113854A1 (en) * 2014-09-24 2016-03-24 Ev Group E. Thallner Gmbh Method for producing a glass optical element
JP7325533B2 (en) 2019-11-28 2023-08-14 京セラ株式会社 mirror

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Also Published As

Publication number Publication date
US20110039040A9 (en) 2011-02-17
CN100521038C (en) 2009-07-29
US20090061116A1 (en) 2009-03-05
KR20060096069A (en) 2006-09-05
JP2007513467A (en) 2007-05-24
US7288013B2 (en) 2007-10-30
WO2005042427A2 (en) 2005-05-12
US20050093202A1 (en) 2005-05-05
EP1685074A2 (en) 2006-08-02
CN1875448A (en) 2006-12-06
TW200519415A (en) 2005-06-16
CA2543518A1 (en) 2005-05-12

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