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Patentes

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Número de publicaciónWO2005043627 A1
Tipo de publicaciónSolicitud
Número de solicitudPCT/US2004/034768
Fecha de publicación12 May 2005
Fecha de presentación20 Oct 2004
Fecha de prioridad22 Oct 2003
También publicado comoCA2549822A1, CN1871710A, CN1871710B, CN102148316A, CN102148316B, DE602004023409D1, EP1680816A1, EP1680816A4, EP1680816B1, EP2139051A1, EP2139051B1, US7244965, US8188488, US8530915, US8710514, US20040079957, US20070200127, US20110121345, US20120235199, US20140284643
Número de publicaciónPCT/2004/34768, PCT/US/2004/034768, PCT/US/2004/34768, PCT/US/4/034768, PCT/US/4/34768, PCT/US2004/034768, PCT/US2004/34768, PCT/US2004034768, PCT/US200434768, PCT/US4/034768, PCT/US4/34768, PCT/US4034768, PCT/US434768, WO 2005/043627 A1, WO 2005043627 A1, WO 2005043627A1, WO-A1-2005043627, WO2005/043627A1, WO2005043627 A1, WO2005043627A1
InventoresPeter S. Andrews, Ban P. Loh
SolicitanteCree, Inc.
Exportar citaBiBTeX, EndNote, RefMan
Enlaces externos:  Patentscope, Espacenet
Power surface mount light emitting die package
WO 2005043627 A1
Descripción  disponible en inglés
Reclamaciones  disponible en inglés
Citas de patentes
Patente citada Fecha de presentación Fecha de publicación Solicitante Título
US5785418 *20 Oct 199728 Jul 1998Hochstein; Peter A.Thermally protected LED array
US5907151 *27 May 199725 May 1999Siemens AktiengesellschaftSurface mountable optoelectronic transducer and method for its production
US5959316 *1 Sep 199828 Sep 1999Hewlett-Packard CompanyMultiple encapsulation of phosphor-LED devices
US6274924 *5 Nov 199814 Ago 2001Lumileds Lighting, U.S. LlcSurface mountable LED package
Otras citas
Referencia
1 *See also references of EP1680816A1
Citada por
Patente citante Fecha de presentación Fecha de publicación Solicitante Título
WO2006003563A2 *23 Jun 200512 Ene 2006Koninklijke Philips Electronics N.V.Light emitting diode module
WO2006003563A3 *23 Jun 200530 Mar 2006Koninkl Philips Electronics NvLight emitting diode module
WO2006135496A2 *27 Abr 200621 Dic 2006Cree, Inc.Led package
WO2006135496A3 *27 Abr 200626 Abr 2007Cree IncLed package
WO2009080354A1 *22 Dic 20082 Jul 2009Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.Reflektive sekundäroptik und halbleiterbaugruppe sowie verfahren zu dessen herstellung
WO2010001309A1 *24 Jun 20097 Ene 2010Koninklijke Philips Electronics N.V.Close proximity collimator for led
WO2011033516A1 *20 Sep 201024 Mar 2011Viagan Ltd.Wafer level packaging of electronic devices
WO2011161183A1 *22 Jun 201129 Dic 2011Osram Opto Semiconductors GmbhOptoelektronisches halbleiterbauelement
CN102084508B *24 Jun 200920 Ene 2016皇家飞利浦电子股份有限公司用于led的紧密靠近准直器
EP2034529A2 *3 Sep 200811 Mar 2009Seoul Semiconductor Co., Ltd.Light emitting diode package having heat dissipating slugs
EP2034529A3 *3 Sep 20082 Nov 2011Seoul Semiconductor Co., Ltd.Light emitting diode package having heat dissipating slugs
EP2073280A1 *20 Dic 200724 Jun 2009Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.Reflektive Sekundäroptik und Halbleiterbaugruppe sowie Verfahren zu dessen Herstellung
US747966229 Ago 200320 Ene 2009Lumination LlcCoated LED with improved efficiency
US763591526 Abr 200622 Dic 2009Cree Hong Kong LimitedApparatus and method for use in mounting electronic elements
US767514528 Mar 20069 Mar 2010Cree Hong Kong LimitedApparatus, system and method for use in mounting electronic elements
US77756858 Feb 200717 Ago 2010Cree, Inc.Power surface mount light emitting die package
US782102323 May 200826 Oct 2010Cree, Inc.Solid state lighting component
US798074314 Jun 200519 Jul 2011Cree, Inc.LED backlighting for displays
US804923016 May 20081 Nov 2011Cree Huizhou Opto LimitedApparatus and system for miniature surface mount devices
US81200544 Sep 200821 Feb 2012Seoul Semiconductor Co., Ltd.Light emitting diode package having heat dissipating slugs
US818848822 Mar 200729 May 2012Cree, Inc.Power surface mount light emitting die package
US821741216 Sep 201010 Jul 2012Cree, Inc.Solid state lighting component
US83626059 Nov 200929 Ene 2013Cree Huizhou Opto LimitedApparatus and method for use in mounting electronic elements
US836794516 Ago 20065 Feb 2013Cree Huizhou Opto LimitedApparatus, system and method for use in mounting electronic elements
US836811214 Ene 20095 Feb 2013Cree Huizhou Opto LimitedAligned multiple emitter package
US84156926 Jul 20099 Abr 2013Cree, Inc.LED packages with scattering particle regions
US845588230 Sep 20114 Jun 2013Cree, Inc.High efficiency LEDs
US84820255 May 20109 Jul 2013Osram Opto Semiconductors GmbhOptoelectronic semiconductor component
US856400429 Nov 201122 Oct 2013Cree, Inc.Complex primary optics with intermediate elements
US859880919 Ago 20093 Dic 2013Cree, Inc.White light color changing solid state lighting and methods
US866957210 Jun 200511 Mar 2014Cree, Inc.Power lamp package
US86981715 Jun 201215 Abr 2014Cree, Inc.Solid state lighting component
US873592031 Jul 200627 May 2014Cree, Inc.Light emitting diode package with optical element
US874891525 Ago 201010 Jun 2014Cree Hong Kong LimitedEmitter package with angled or vertical LED
US87914717 Nov 200829 Jul 2014Cree Hong Kong LimitedMulti-chip light emitting diode modules
US88600683 Ene 201214 Oct 2014Seoul Semiconductor Co. Ltd.Light emitting diode package having heat dissipating slugs and wall
US900054822 Dic 20087 Abr 2015Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.Reflective secondary lens system and semiconductor assembly and also method for the production thereof
US90129389 Abr 201021 Abr 2015Cree, Inc.High reflective substrate of light emitting devices with improved light output
US903543928 Ene 201019 May 2015Cree Huizhou Solid State Lighting Company LimitedApparatus, system and method for use in mounting electronic elements
US907085031 Oct 200730 Jun 2015Cree, Inc.Light emitting diode package and method for fabricating same
US907694020 Ago 20137 Jul 2015Cree, Inc.Solid state lighting component
US941292426 Mar 20149 Ago 2016Seoul Semiconductor Co., Ltd.Light emitting diode package having heat dissipating slugs
US942517224 Oct 200823 Ago 2016Cree, Inc.Light emitter array
US951872330 Abr 201513 Dic 2016Brite Shot, Inc.Lighting fixture extension
US960167011 Jul 201421 Mar 2017Cree, Inc.Method to form primary optic with variable shapes and/or geometries without a substrate
US96079702 Dic 201528 Mar 2017Sharp Kabushiki KaishaLight-emitting device having a plurality of concentric light transmitting areas
US967994221 Jun 201613 Jun 2017Sharp Kabushiki KaishaLight emitting device
US971170312 Feb 200818 Jul 2017Cree Huizhou Opto LimitedApparatus, system and method for use in mounting electronic elements
US972215815 Oct 20121 Ago 2017Cree Huizhou Solid State Lighting Company LimitedAligned multiple emitter package
US97932475 Jun 200817 Oct 2017Cree, Inc.Solid state lighting component
USD61550431 Oct 200711 May 2010Cree, Inc.Emitter package
USD63363114 Dic 20071 Mar 2011Cree Hong Kong LimitedLight source of light emitting diode
USD63486310 Ene 200822 Mar 2011Cree Hong Kong LimitedLight source of light emitting diode
USD6569068 Dic 20103 Abr 2012Cree Hong Kong LimitedLED package
USD66290225 Oct 20103 Jul 2012Cree Hong Kong LimitedLED package
USD6716618 Feb 201227 Nov 2012Cree Hong Kong LimitedLED package
Clasificaciones
Clasificación internacionalH01L33/54, H01L33/58, H01L33/64, H01L29/227, H01L29/22, H01L29/24, H01L33/60, H01L33/62, H01L33/48
Clasificación cooperativaH01L33/62, H01L2924/12041, H01L33/647, H01L2924/01079, H01L33/58, H01L2224/48247, H01L33/641, H01L33/54, H01L2924/01025, H01L2224/48227, H01L2224/48091, H01L33/642, H01L2924/01078, H01L2924/0102, H01L33/60, H01L33/486, H01L33/64, H01L33/52
Clasificación europeaH01L33/58, H01L33/64C, H01L33/64, H01L33/48C2, H01L33/60
Eventos legales
FechaCódigoEventoDescripción
12 May 2005ALDesignated countries for regional patents
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