WO2005059057A3 - Additives to stop copper attack by alkaline etching agents such as ammonia and monoethanol amine (mea) - Google Patents
Additives to stop copper attack by alkaline etching agents such as ammonia and monoethanol amine (mea) Download PDFInfo
- Publication number
- WO2005059057A3 WO2005059057A3 PCT/US2004/041840 US2004041840W WO2005059057A3 WO 2005059057 A3 WO2005059057 A3 WO 2005059057A3 US 2004041840 W US2004041840 W US 2004041840W WO 2005059057 A3 WO2005059057 A3 WO 2005059057A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- mea
- ammonia
- additives
- alkaline etching
- monoethanol amine
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
- C23G1/20—Other heavy metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/14—Nitrogen-containing compounds
- C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
- H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/735,424 | 2003-12-12 | ||
US10/735,424 US7211204B2 (en) | 2003-12-12 | 2003-12-12 | Additives to stop copper attack by alkaline etching agents such as ammonia and monoethanol amine (MEA) |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005059057A2 WO2005059057A2 (en) | 2005-06-30 |
WO2005059057A3 true WO2005059057A3 (en) | 2005-11-10 |
Family
ID=34653617
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/041840 WO2005059057A2 (en) | 2003-12-12 | 2004-12-13 | Additives to stop copper attack by alkaline etching agents such as ammonia and monoethanol amine (mea) |
Country Status (2)
Country | Link |
---|---|
US (2) | US7211204B2 (en) |
WO (1) | WO2005059057A2 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6141870A (en) | 1997-08-04 | 2000-11-07 | Peter K. Trzyna | Method for making electrical device |
JP3807505B2 (en) * | 2004-07-13 | 2006-08-09 | セイコーエプソン株式会社 | Wiring board manufacturing method |
US7767009B2 (en) * | 2005-09-14 | 2010-08-03 | OMG Electronic Chemicals, Inc. | Solution and process for improving the solderability of a metal surface |
TWI453301B (en) * | 2007-11-08 | 2014-09-21 | Enthone | Self assembled molecules on immersion silver coatings |
JP5946827B2 (en) | 2010-07-06 | 2016-07-06 | イーサイオニック コーポレーション | Method for manufacturing a printed wiring board |
US9763336B2 (en) | 2010-07-06 | 2017-09-12 | Atotech Deutschland Gmbh | Methods of treating metal surfaces and devices formed thereby |
CN105855557B (en) * | 2011-11-28 | 2018-07-27 | 重庆有研重冶新材料有限公司 | A kind of metallic tin powder production method for friction material |
US9338896B2 (en) | 2012-07-25 | 2016-05-10 | Enthone, Inc. | Adhesion promotion in printed circuit boards |
KR20160056892A (en) * | 2013-08-16 | 2016-05-20 | 엔쏜 인코포레이티드 | Adhesion promotion in printed circuit boards |
GB2551191B (en) * | 2016-06-10 | 2020-01-15 | Imperial Innovations Ltd | Electrically conductive composite coating with azole corrosion inhibitor |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5061566A (en) * | 1989-12-28 | 1991-10-29 | Chomerics, Inc. | Corrosion inhibiting emi/rfi shielding coating and method of its use |
US6344157B1 (en) * | 1999-02-12 | 2002-02-05 | National Starch And Chemical Investment Holding Corporation | Conductive and resistive materials with electrical stability for use in electronics devices |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2448047C3 (en) * | 1974-10-09 | 1979-04-05 | Chemische Werke Huels Ag, 4370 Marl | Gelstippenannes Polylaurinlactant |
US4287077A (en) * | 1979-11-23 | 1981-09-01 | The Dow Chemical Company | Glycol compositions containing an ether modified silicone to inhibit gelling |
US4587028A (en) * | 1984-10-15 | 1986-05-06 | Texaco Inc. | Non-silicate antifreeze formulations |
US5139642A (en) * | 1991-05-01 | 1992-08-18 | Olin Corporation | Process for preparing a nonconductive substrate for electroplating |
US5375731A (en) * | 1993-04-05 | 1994-12-27 | Jones; Eugene E. | Junction box locking apparatus |
US5476580A (en) * | 1993-05-17 | 1995-12-19 | Electrochemicals Inc. | Processes for preparing a non-conductive substrate for electroplating |
US5690805A (en) * | 1993-05-17 | 1997-11-25 | Electrochemicals Inc. | Direct metallization process |
US5389270A (en) * | 1993-05-17 | 1995-02-14 | Electrochemicals, Inc. | Composition and process for preparing a non-conductive substrate for electroplating |
US5725807A (en) * | 1993-05-17 | 1998-03-10 | Electrochemicals Inc. | Carbon containing composition for electroplating |
US6203605B1 (en) * | 1998-03-20 | 2001-03-20 | Scitex Digital Printing, Inc. | Process for improving dried film resistivity of a chemically modified carbon black dispersion |
US20040069454A1 (en) * | 1998-11-02 | 2004-04-15 | Bonsignore Patrick V. | Composition for enhancing thermal conductivity of a heat transfer medium and method of use thereof |
US6432320B1 (en) * | 1998-11-02 | 2002-08-13 | Patrick Bonsignore | Refrigerant and heat transfer fluid additive |
US6440331B1 (en) * | 1999-06-03 | 2002-08-27 | Electrochemicals Inc. | Aqueous carbon composition and method for coating a non conductive substrate |
US6375731B1 (en) | 2000-01-06 | 2002-04-23 | Electrochemicals Inc. | Conditioning of through holes and glass |
AU1500902A (en) * | 2000-10-11 | 2002-04-22 | Chemetall Gmbh | Method for coating metallic surfaces with an aqueous composition, the aqueous composition and use of the coated substrates |
JP4406182B2 (en) * | 2000-12-28 | 2010-01-27 | セイコーエプソン株式会社 | Black ink composition, ink set, recording method and recorded material |
US6730149B2 (en) * | 2001-01-22 | 2004-05-04 | Ricoh Company Limited | Ink composition and inkjet recording method and apparatus using the ink composition |
US6811821B2 (en) * | 2001-03-30 | 2004-11-02 | J & G Chemical Specialities, Llc | Barrier coatings |
US6583201B2 (en) * | 2001-04-25 | 2003-06-24 | National Starch And Chemical Investment Holding Corporation | Conductive materials with electrical stability for use in electronics devices |
-
2003
- 2003-12-12 US US10/735,424 patent/US7211204B2/en not_active Expired - Lifetime
-
2004
- 2004-12-13 WO PCT/US2004/041840 patent/WO2005059057A2/en active Application Filing
-
2005
- 2005-12-29 US US11/321,409 patent/US20060102879A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5061566A (en) * | 1989-12-28 | 1991-10-29 | Chomerics, Inc. | Corrosion inhibiting emi/rfi shielding coating and method of its use |
US6344157B1 (en) * | 1999-02-12 | 2002-02-05 | National Starch And Chemical Investment Holding Corporation | Conductive and resistive materials with electrical stability for use in electronics devices |
Also Published As
Publication number | Publication date |
---|---|
US20060102879A1 (en) | 2006-05-18 |
US7211204B2 (en) | 2007-05-01 |
US20050126429A1 (en) | 2005-06-16 |
WO2005059057A2 (en) | 2005-06-30 |
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