WO2005060689A3 - Emi-emc shield for silicon-based optical transceiver - Google Patents

Emi-emc shield for silicon-based optical transceiver Download PDF

Info

Publication number
WO2005060689A3
WO2005060689A3 PCT/US2004/042741 US2004042741W WO2005060689A3 WO 2005060689 A3 WO2005060689 A3 WO 2005060689A3 US 2004042741 W US2004042741 W US 2004042741W WO 2005060689 A3 WO2005060689 A3 WO 2005060689A3
Authority
WO
WIPO (PCT)
Prior art keywords
emi
soi
shielding
layer
metallic
Prior art date
Application number
PCT/US2004/042741
Other languages
French (fr)
Other versions
WO2005060689A2 (en
Inventor
David Piede
Margaret Ghiron
Prakash Gothoskar
Robert Keith Montgomery
Vipulkumar Patel
Kalpendu Shastri
Soham Pathak
Katherine A Yanushefski
Original Assignee
Sioptical Inc
David Piede
Margaret Ghiron
Prakash Gothoskar
Robert Keith Montgomery
Vipulkumar Patel
Kalpendu Shastri
Soham Pathak
Katherine A Yanushefski
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sioptical Inc, David Piede, Margaret Ghiron, Prakash Gothoskar, Robert Keith Montgomery, Vipulkumar Patel, Kalpendu Shastri, Soham Pathak, Katherine A Yanushefski filed Critical Sioptical Inc
Publication of WO2005060689A2 publication Critical patent/WO2005060689A2/en
Publication of WO2005060689A3 publication Critical patent/WO2005060689A3/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

An SOI-based opto-electronic structure includes various electronic components disposed with their associated optical components within a single SOI layer, forming a monolithic arrangement. EMI/EMC shielding is provided by forming a metallized outer layer on the surface of an external prism coupler that interfaces with the SOI layer, the metallized layer including transparent apertures to allow an optical signal to be coupled into and out of the SOI layer. The opposing surface of the prism coupler may also be coated with a metallic material to provide additional shielding. Further, metallic shielding plates may be formed on the SOI structure itself, overlying the locations of EMI-sensitive electronics. All of these metallic layers are ultimately coupled to an external ground plane to isolate the structure and provide the necessary shielding.
PCT/US2004/042741 2003-12-18 2004-12-17 Emi-emc shield for silicon-based optical transceiver WO2005060689A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US53052003P 2003-12-18 2003-12-18
US60/530,520 2003-12-18
US11/013,722 US20050135727A1 (en) 2003-12-18 2004-12-16 EMI-EMC shield for silicon-based optical transceiver
US11/013,722 2004-12-16

Publications (2)

Publication Number Publication Date
WO2005060689A2 WO2005060689A2 (en) 2005-07-07
WO2005060689A3 true WO2005060689A3 (en) 2006-02-23

Family

ID=34680899

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/042741 WO2005060689A2 (en) 2003-12-18 2004-12-17 Emi-emc shield for silicon-based optical transceiver

Country Status (2)

Country Link
US (1) US20050135727A1 (en)
WO (1) WO2005060689A2 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7672558B2 (en) * 2004-01-12 2010-03-02 Honeywell International, Inc. Silicon optical device
US7177489B2 (en) * 2004-03-18 2007-02-13 Honeywell International, Inc. Silicon-insulator-silicon thin-film structures for optical modulators and methods of manufacture
US7149388B2 (en) * 2004-03-18 2006-12-12 Honeywell International, Inc. Low loss contact structures for silicon based optical modulators and methods of manufacture
US7217584B2 (en) * 2004-03-18 2007-05-15 Honeywell International Inc. Bonded thin-film structures for optical modulators and methods of manufacture
US20050214989A1 (en) * 2004-03-29 2005-09-29 Honeywell International Inc. Silicon optoelectronic device
US20060063679A1 (en) * 2004-09-17 2006-03-23 Honeywell International Inc. Semiconductor-insulator-semiconductor structure for high speed applications
US8238699B2 (en) * 2005-03-04 2012-08-07 Finisar Corporation Semiconductor-based optical transceiver
US7202552B2 (en) 2005-07-15 2007-04-10 Silicon Matrix Pte. Ltd. MEMS package using flexible substrates, and method thereof
US20070101927A1 (en) * 2005-11-10 2007-05-10 Honeywell International Inc. Silicon based optical waveguide structures and methods of manufacture
US7362443B2 (en) * 2005-11-17 2008-04-22 Honeywell International Inc. Optical gyro with free space resonator and method for sensing inertial rotation rate
US7514285B2 (en) * 2006-01-17 2009-04-07 Honeywell International Inc. Isolation scheme for reducing film stress in a MEMS device
US7442589B2 (en) * 2006-01-17 2008-10-28 Honeywell International Inc. System and method for uniform multi-plane silicon oxide layer formation for optical applications
US20070274655A1 (en) * 2006-04-26 2007-11-29 Honeywell International Inc. Low-loss optical device structure
US7454102B2 (en) * 2006-04-26 2008-11-18 Honeywell International Inc. Optical coupling structure
US8169059B2 (en) * 2008-09-30 2012-05-01 Infineon Technologies Ag On-chip RF shields with through substrate conductors
US8178953B2 (en) 2008-09-30 2012-05-15 Infineon Technologies Ag On-chip RF shields with front side redistribution lines
US8063469B2 (en) * 2008-09-30 2011-11-22 Infineon Technologies Ag On-chip radio frequency shield with interconnect metallization
US8889548B2 (en) 2008-09-30 2014-11-18 Infineon Technologies Ag On-chip RF shields with backside redistribution lines
US7948064B2 (en) 2008-09-30 2011-05-24 Infineon Technologies Ag System on a chip with on-chip RF shield
FR2942047B1 (en) * 2009-02-09 2011-06-17 Commissariat Energie Atomique STRUCTURE AND METHOD FOR ALIGNING OPTICAL FIBER AND SUBMICRONIC WAVEGUIDE
US8837872B2 (en) * 2010-12-30 2014-09-16 Qualcomm Incorporated Waveguide structures for signal and/or power transmission in a semiconductor device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4980223A (en) * 1988-07-27 1990-12-25 Toyo Aluminium Kabushiki Kaisha Sheet for forming article having electromagnetic wave shieldability
US20020146200A1 (en) * 2001-03-16 2002-10-10 Kudrle Thomas David Electrostatically actuated micro-electro-mechanical devices and method of manufacture
US20030039430A1 (en) * 2001-05-17 2003-02-27 Shrenik Deliwala Integrated optical/electronic circuits and associated methods of simultaneous generation thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3699407A (en) * 1971-09-29 1972-10-17 Motorola Inc Electro-optical coupled-pair using a schottky barrier diode detector
US5562838A (en) * 1993-03-29 1996-10-08 Martin Marietta Corporation Optical light pipe and microwave waveguide interconnects in multichip modules formed using adaptive lithography
US6369924B1 (en) * 1998-04-20 2002-04-09 Stratos Lightwave, Inc. Optical transceiver with enhanced shielding and related methods
US6497588B1 (en) * 1998-06-16 2002-12-24 Stratos Lightwave, Inc. Communications transceiver with internal EMI shield and associated methods
US6430061B1 (en) * 2000-11-10 2002-08-06 Yazaki North America Self-tolerancing fiber optic transceiver shield
US6755578B1 (en) * 2000-12-08 2004-06-29 Optical Communication Products, Inc. Optical subassembly enclosure
US6607308B2 (en) * 2001-02-12 2003-08-19 E20 Communications, Inc. Fiber-optic modules with shielded housing/covers having mixed finger types
US20030152309A1 (en) * 2002-02-14 2003-08-14 Howard James Robert Printed circuit board containing optical elements

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4980223A (en) * 1988-07-27 1990-12-25 Toyo Aluminium Kabushiki Kaisha Sheet for forming article having electromagnetic wave shieldability
US20020146200A1 (en) * 2001-03-16 2002-10-10 Kudrle Thomas David Electrostatically actuated micro-electro-mechanical devices and method of manufacture
US20030039430A1 (en) * 2001-05-17 2003-02-27 Shrenik Deliwala Integrated optical/electronic circuits and associated methods of simultaneous generation thereof

Also Published As

Publication number Publication date
US20050135727A1 (en) 2005-06-23
WO2005060689A2 (en) 2005-07-07

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