WO2005065238A3 - Micro pin grid array with pin motion isolation - Google Patents

Micro pin grid array with pin motion isolation Download PDF

Info

Publication number
WO2005065238A3
WO2005065238A3 PCT/US2004/043049 US2004043049W WO2005065238A3 WO 2005065238 A3 WO2005065238 A3 WO 2005065238A3 US 2004043049 W US2004043049 W US 2004043049W WO 2005065238 A3 WO2005065238 A3 WO 2005065238A3
Authority
WO
WIPO (PCT)
Prior art keywords
pin
flexible substrate
conductive terminals
grid array
microelectronic element
Prior art date
Application number
PCT/US2004/043049
Other languages
French (fr)
Other versions
WO2005065238A2 (en
Inventor
Philip Damberg
Belgacem Haba
David B Tuckerman
Teck-Gyu Kang
Original Assignee
Tessera Inc
Philip Damberg
Belgacem Haba
David B Tuckerman
Teck-Gyu Kang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tessera Inc, Philip Damberg, Belgacem Haba, David B Tuckerman, Teck-Gyu Kang filed Critical Tessera Inc
Publication of WO2005065238A2 publication Critical patent/WO2005065238A2/en
Publication of WO2005065238A3 publication Critical patent/WO2005065238A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Abstract

A microelectronic package (20) includes a microelectronic element (22) having faces and contacts (26), a flexible substrate (30) overlying and spaced from a first face (24) of the microelectronic element (22), and a plurality of conductive terminals (42) exposed at a surface of the flexible substrate. The conductive terminals (42) are electrically interconnected with the microelectronic element (22) and the flexible substrate (30) includes a gap (50) extending at least partially around at least one of the conductive terminals (42). In certain embodiments, the package includes a support layer, such as a compliant layer (48), disposed between the first face (24) of the microelectronic element (22) and the flexible substrate (30). In other embodiments, the support layer includes at least one opening that is at least partially aligned with one of the conductive terminals.
PCT/US2004/043049 2003-12-30 2004-12-21 Micro pin grid array with pin motion isolation WO2005065238A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US53343703P 2003-12-30 2003-12-30
US60/533,437 2003-12-30
US10/985,119 US7709968B2 (en) 2003-12-30 2004-11-10 Micro pin grid array with pin motion isolation
US10/985,119 2004-11-10

Publications (2)

Publication Number Publication Date
WO2005065238A2 WO2005065238A2 (en) 2005-07-21
WO2005065238A3 true WO2005065238A3 (en) 2009-03-26

Family

ID=34752997

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/043049 WO2005065238A2 (en) 2003-12-30 2004-12-21 Micro pin grid array with pin motion isolation

Country Status (2)

Country Link
US (2) US7709968B2 (en)
WO (1) WO2005065238A2 (en)

Families Citing this family (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6826827B1 (en) * 1994-12-29 2004-12-07 Tessera, Inc. Forming conductive posts by selective removal of conductive material
US7183643B2 (en) * 2003-11-04 2007-02-27 Tessera, Inc. Stacked packages and systems incorporating the same
WO2006009772A2 (en) * 2004-06-18 2006-01-26 Tessera, Inc. Multi-frequency noise suppression capacitor set
WO2006004671A2 (en) * 2004-06-25 2006-01-12 Tessera, Inc. Microelectronic package structure with spherical contact pins
US7453157B2 (en) * 2004-06-25 2008-11-18 Tessera, Inc. Microelectronic packages and methods therefor
US20060033515A1 (en) * 2004-08-13 2006-02-16 Tessera, Inc. Test fixture with movable pin contacts
WO2006052616A1 (en) 2004-11-03 2006-05-18 Tessera, Inc. Stacked packaging improvements
US7687925B2 (en) 2005-09-07 2010-03-30 Infineon Technologies Ag Alignment marks for polarized light lithography and method for use thereof
JP2007103410A (en) * 2005-09-30 2007-04-19 Elpida Memory Inc Semiconductor device having dense contact hole
US8026611B2 (en) 2005-12-01 2011-09-27 Tessera, Inc. Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another
US8058101B2 (en) 2005-12-23 2011-11-15 Tessera, Inc. Microelectronic packages and methods therefor
US7453139B2 (en) * 2005-12-27 2008-11-18 Tessera, Inc. Compliant terminal mountings with vented spaces and methods
US7534652B2 (en) * 2005-12-27 2009-05-19 Tessera, Inc. Microelectronic elements with compliant terminal mountings and methods for making the same
US7632708B2 (en) * 2005-12-27 2009-12-15 Tessera, Inc. Microelectronic component with photo-imageable substrate
US7732912B2 (en) * 2006-08-11 2010-06-08 Tessera, Inc. Semiconductor chip packages and assemblies with chip carrier units
US7545029B2 (en) * 2006-08-18 2009-06-09 Tessera, Inc. Stack microelectronic assemblies
US8133808B2 (en) 2006-09-18 2012-03-13 Tessera, Inc. Wafer level chip package and a method of fabricating thereof
US20090115047A1 (en) * 2007-10-10 2009-05-07 Tessera, Inc. Robust multi-layer wiring elements and assemblies with embedded microelectronic elements
US8258410B2 (en) * 2008-01-26 2012-09-04 International Business Machines Corporation Construction of reliable stacked via in electronic substrates—vertical stiffness control method
US7982316B1 (en) * 2008-02-04 2011-07-19 Amkor Technology, Inc. Semiconductor package having a land to absorb thermal and mechanical stress and fabricating method thereof
US20100090339A1 (en) * 2008-09-12 2010-04-15 Kumar Ananda H Structures and Methods for Wafer Packages, and Probes
JP2012004166A (en) * 2010-06-14 2012-01-05 Fujitsu Ltd Wiring board, wiring board assembly and semiconductor device
US8482111B2 (en) 2010-07-19 2013-07-09 Tessera, Inc. Stackable molded microelectronic packages
US9159708B2 (en) 2010-07-19 2015-10-13 Tessera, Inc. Stackable molded microelectronic packages with area array unit connectors
US8823166B2 (en) 2010-08-30 2014-09-02 Taiwan Semiconductor Manufacturing Company, Ltd. Pillar bumps and process for making same
KR101075241B1 (en) 2010-11-15 2011-11-01 테세라, 인코포레이티드 Microelectronic package with terminals on dielectric mass
US20120146206A1 (en) 2010-12-13 2012-06-14 Tessera Research Llc Pin attachment
US9137903B2 (en) 2010-12-21 2015-09-15 Tessera, Inc. Semiconductor chip assembly and method for making same
KR101128063B1 (en) 2011-05-03 2012-04-23 테세라, 인코포레이티드 Package-on-package assembly with wire bonds to encapsulation surface
US8618659B2 (en) 2011-05-03 2013-12-31 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
US8872318B2 (en) 2011-08-24 2014-10-28 Tessera, Inc. Through interposer wire bond using low CTE interposer with coarse slot apertures
US8404520B1 (en) 2011-10-17 2013-03-26 Invensas Corporation Package-on-package assembly with wire bond vias
US8946757B2 (en) 2012-02-17 2015-02-03 Invensas Corporation Heat spreading substrate with embedded interconnects
US9349706B2 (en) 2012-02-24 2016-05-24 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US8372741B1 (en) 2012-02-24 2013-02-12 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US8835228B2 (en) 2012-05-22 2014-09-16 Invensas Corporation Substrate-less stackable package with wire-bond interconnect
US9391008B2 (en) 2012-07-31 2016-07-12 Invensas Corporation Reconstituted wafer-level package DRAM
US9502390B2 (en) 2012-08-03 2016-11-22 Invensas Corporation BVA interposer
US8975738B2 (en) 2012-11-12 2015-03-10 Invensas Corporation Structure for microelectronic packaging with terminals on dielectric mass
US8878353B2 (en) 2012-12-20 2014-11-04 Invensas Corporation Structure for microelectronic packaging with bond elements to encapsulation surface
US9136254B2 (en) 2013-02-01 2015-09-15 Invensas Corporation Microelectronic package having wire bond vias and stiffening layer
US9023691B2 (en) 2013-07-15 2015-05-05 Invensas Corporation Microelectronic assemblies with stack terminals coupled by connectors extending through encapsulation
US9034696B2 (en) 2013-07-15 2015-05-19 Invensas Corporation Microelectronic assemblies having reinforcing collars on connectors extending through encapsulation
US8883563B1 (en) 2013-07-15 2014-11-11 Invensas Corporation Fabrication of microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation
US9167710B2 (en) 2013-08-07 2015-10-20 Invensas Corporation Embedded packaging with preformed vias
US9685365B2 (en) 2013-08-08 2017-06-20 Invensas Corporation Method of forming a wire bond having a free end
US20150076714A1 (en) 2013-09-16 2015-03-19 Invensas Corporation Microelectronic element with bond elements to encapsulation surface
JP2015060947A (en) * 2013-09-19 2015-03-30 イビデン株式会社 Printed wiring board having metal post and method of manufacturing printed wiring board having metal post
US9087815B2 (en) 2013-11-12 2015-07-21 Invensas Corporation Off substrate kinking of bond wire
US9082753B2 (en) 2013-11-12 2015-07-14 Invensas Corporation Severing bond wire by kinking and twisting
US9263394B2 (en) 2013-11-22 2016-02-16 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9583456B2 (en) 2013-11-22 2017-02-28 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9379074B2 (en) 2013-11-22 2016-06-28 Invensas Corporation Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
US9583411B2 (en) 2014-01-17 2017-02-28 Invensas Corporation Fine pitch BVA using reconstituted wafer with area array accessible for testing
US10090267B2 (en) * 2014-03-13 2018-10-02 Taiwan Semiconductor Manufacturing Co., Ltd Bump structure and method for forming the same
US9214454B2 (en) 2014-03-31 2015-12-15 Invensas Corporation Batch process fabrication of package-on-package microelectronic assemblies
US10381326B2 (en) 2014-05-28 2019-08-13 Invensas Corporation Structure and method for integrated circuits packaging with increased density
US9646917B2 (en) 2014-05-29 2017-05-09 Invensas Corporation Low CTE component with wire bond interconnects
US9412714B2 (en) 2014-05-30 2016-08-09 Invensas Corporation Wire bond support structure and microelectronic package including wire bonds therefrom
US9735084B2 (en) 2014-12-11 2017-08-15 Invensas Corporation Bond via array for thermal conductivity
US9888579B2 (en) * 2015-03-05 2018-02-06 Invensas Corporation Pressing of wire bond wire tips to provide bent-over tips
US9502372B1 (en) 2015-04-30 2016-11-22 Invensas Corporation Wafer-level packaging using wire bond wires in place of a redistribution layer
US9761554B2 (en) 2015-05-07 2017-09-12 Invensas Corporation Ball bonding metal wire bond wires to metal pads
US10490528B2 (en) 2015-10-12 2019-11-26 Invensas Corporation Embedded wire bond wires
US9490222B1 (en) 2015-10-12 2016-11-08 Invensas Corporation Wire bond wires for interference shielding
US10332854B2 (en) 2015-10-23 2019-06-25 Invensas Corporation Anchoring structure of fine pitch bva
US10181457B2 (en) 2015-10-26 2019-01-15 Invensas Corporation Microelectronic package for wafer-level chip scale packaging with fan-out
US10043779B2 (en) 2015-11-17 2018-08-07 Invensas Corporation Packaged microelectronic device for a package-on-package device
US9659848B1 (en) 2015-11-18 2017-05-23 Invensas Corporation Stiffened wires for offset BVA
US9984992B2 (en) 2015-12-30 2018-05-29 Invensas Corporation Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
US9935075B2 (en) 2016-07-29 2018-04-03 Invensas Corporation Wire bonding method and apparatus for electromagnetic interference shielding
US10299368B2 (en) 2016-12-21 2019-05-21 Invensas Corporation Surface integrated waveguides and circuit structures therefor
CN114449751B (en) * 2021-07-14 2023-07-18 荣耀终端有限公司 Circuit board assembly and electronic equipment

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4975079A (en) * 1990-02-23 1990-12-04 International Business Machines Corp. Connector assembly for chip testing
US5068714A (en) * 1989-04-05 1991-11-26 Robert Bosch Gmbh Method of electrically and mechanically connecting a semiconductor to a substrate using an electrically conductive tacky adhesive and the device so made
US5615824A (en) * 1994-06-07 1997-04-01 Tessera, Inc. Soldering with resilient contacts

Family Cites Families (182)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3214827A (en) * 1962-12-10 1965-11-02 Sperry Rand Corp Electrical circuitry fabrication
US3775844A (en) * 1970-06-25 1973-12-04 Bunker Ramo Method of fabricating a multiwafer electrical circuit structure
US3766439A (en) * 1972-01-12 1973-10-16 Gen Electric Electronic module using flexible printed circuit board with heat sink means
US3873889A (en) * 1973-08-08 1975-03-25 Sperry Rand Corp Indicator module and method of manufacturing same
US4225900A (en) * 1978-10-25 1980-09-30 Raytheon Company Integrated circuit device package interconnect means
US4567543A (en) * 1983-02-15 1986-01-28 Motorola, Inc. Double-sided flexible electronic circuit module
US4576543A (en) * 1983-11-07 1986-03-18 Kmw Products Limited Knock-down construction for front end loader
US5220488A (en) * 1985-09-04 1993-06-15 Ufe Incorporated Injection molded printed circuits
US4716049A (en) * 1985-12-20 1987-12-29 Hughes Aircraft Company Compressive pedestal for microminiature connections
US4924353A (en) * 1985-12-20 1990-05-08 Hughes Aircraft Company Connector system for coupling to an integrated circuit chip
US4695870A (en) * 1986-03-27 1987-09-22 Hughes Aircraft Company Inverted chip carrier
JPS6397941A (en) * 1986-10-14 1988-04-28 Fuji Photo Film Co Ltd Photosensitive material
KR970003915B1 (en) * 1987-06-24 1997-03-22 미다 가쓰시게 Semiconductor device and the use memory module
US5138438A (en) * 1987-06-24 1992-08-11 Akita Electronics Co. Ltd. Lead connections means for stacked tab packaged IC chips
US4781601A (en) * 1987-07-06 1988-11-01 Motorola, Inc. Header for an electronic circuit
US4804132A (en) * 1987-08-28 1989-02-14 Difrancesco Louis Method for cold bonding
US5198888A (en) * 1987-12-28 1993-03-30 Hitachi, Ltd. Semiconductor stacked device
US5028986A (en) * 1987-12-28 1991-07-02 Hitachi, Ltd. Semiconductor device and semiconductor module with a plurality of stacked semiconductor devices
US4991290A (en) * 1988-07-21 1991-02-12 Microelectronics And Computer Technology Flexible electrical interconnect and method of making
JPH02174255A (en) * 1988-12-27 1990-07-05 Mitsubishi Electric Corp Semiconductor integrated circuit
US5077598A (en) * 1989-11-08 1991-12-31 Hewlett-Packard Company Strain relief flip-chip integrated circuit assembly with test fixturing
CA2034703A1 (en) * 1990-01-23 1991-07-24 Masanori Nishiguchi Substrate for packaging a semiconductor device
AU637874B2 (en) * 1990-01-23 1993-06-10 Sumitomo Electric Industries, Ltd. Substrate for packaging a semiconductor device
US5083697A (en) * 1990-02-14 1992-01-28 Difrancesco Louis Particle-enhanced joining of metal surfaces
US5046238A (en) * 1990-03-15 1991-09-10 Rogers Corporation Method of manufacturing a multilayer circuit board
US5345205A (en) * 1990-04-05 1994-09-06 General Electric Company Compact high density interconnected microwave system
EP0476091B1 (en) * 1990-04-09 1995-01-04 Ascom Tech Ag Bit and frame synchronizing unit for an access node in an optical transmission device
US5148265A (en) * 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
US5679977A (en) * 1990-09-24 1997-10-21 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
US5148266A (en) * 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies having interposer and flexible lead
US5117282A (en) * 1990-10-29 1992-05-26 Harris Corporation Stacked configuration for integrated circuit devices
US5172303A (en) * 1990-11-23 1992-12-15 Motorola, Inc. Electronic component assembly
US5116459A (en) * 1991-03-06 1992-05-26 International Business Machines Corporation Processes for electrically conductive decals filled with organic insulator material
JPH0513967A (en) * 1991-07-03 1993-01-22 Mitsubishi Electric Corp Semiconductor storage control device and high density mounting method therefor
JPH06510122A (en) * 1991-08-23 1994-11-10 エヌチップ　インコーポレイテッド Burn-in techniques for unpackaged integrated circuits
US5397916A (en) * 1991-12-10 1995-03-14 Normington; Peter J. C. Semiconductor device including stacked die
US5281852A (en) * 1991-12-10 1994-01-25 Normington Peter J C Semiconductor device including stacked die
US5224023A (en) * 1992-02-10 1993-06-29 Smith Gary W Foldable electronic assembly module
US5222014A (en) * 1992-03-02 1993-06-22 Motorola, Inc. Three-dimensional multi-chip pad array carrier
JP2894071B2 (en) * 1992-03-09 1999-05-24 株式会社日立製作所 Semiconductor device
US5422435A (en) * 1992-05-22 1995-06-06 National Semiconductor Corporation Stacked multi-chip modules and method of manufacturing
US5247423A (en) * 1992-05-26 1993-09-21 Motorola, Inc. Stacking three dimensional leadless multi-chip module and method for making the same
US5820770A (en) * 1992-07-21 1998-10-13 Seagate Technology, Inc. Thin film magnetic head including vias formed in alumina layer and process for making the same
US6054756A (en) * 1992-07-24 2000-04-25 Tessera, Inc. Connection components with frangible leads and bus
AU4782293A (en) * 1992-07-24 1994-02-14 Tessera, Inc. Semiconductor connection components and methods with releasable lead support
EP0586888B1 (en) * 1992-08-05 2001-07-18 Fujitsu Limited Three-dimensional multichip module
US5324892A (en) * 1992-08-07 1994-06-28 International Business Machines Corporation Method of fabricating an electronic interconnection
JP3105089B2 (en) * 1992-09-11 2000-10-30 株式会社東芝 Semiconductor device
JP2716336B2 (en) 1993-03-10 1998-02-18 日本電気株式会社 Integrated circuit device
US5455740A (en) * 1994-03-07 1995-10-03 Staktek Corporation Bus communication system for stacked high density integrated circuit packages
US5811982A (en) * 1995-11-27 1998-09-22 International Business Machines Corporation High density cantilevered probe for electronic devices
US5390844A (en) * 1993-07-23 1995-02-21 Tessera, Inc. Semiconductor inner lead bonding tool
US5398863A (en) * 1993-07-23 1995-03-21 Tessera, Inc. Shaped lead structure and method
US5397921A (en) * 1993-09-03 1995-03-14 Advanced Semiconductor Assembly Technology Tab grid array
US5454160A (en) * 1993-12-03 1995-10-03 Ncr Corporation Apparatus and method for stacking integrated circuit devices
US5455390A (en) * 1994-02-01 1995-10-03 Tessera, Inc. Microelectronics unit mounting with multiple lead bonding
US5448511A (en) * 1994-06-01 1995-09-05 Storage Technology Corporation Memory stack with an integrated interconnect and mounting structure
US5802699A (en) * 1994-06-07 1998-09-08 Tessera, Inc. Methods of assembling microelectronic assembly with socket for engaging bump leads
US5989936A (en) * 1994-07-07 1999-11-23 Tessera, Inc. Microelectronic assembly fabrication with terminal formation from a conductive layer
US5518964A (en) * 1994-07-07 1996-05-21 Tessera, Inc. Microelectronic mounting with multiple lead deformation and bonding
US5798286A (en) * 1995-09-22 1998-08-25 Tessera, Inc. Connecting multiple microelectronic elements with lead deformation
US6177636B1 (en) * 1994-12-29 2001-01-23 Tessera, Inc. Connection components with posts
US5656550A (en) * 1994-08-24 1997-08-12 Fujitsu Limited Method of producing a semicondutor device having a lead portion with outer connecting terminal
US5491302A (en) * 1994-09-19 1996-02-13 Tessera, Inc. Microelectronic bonding with lead motion
US5659952A (en) * 1994-09-20 1997-08-26 Tessera, Inc. Method of fabricating compliant interface for semiconductor chip
JP2570628B2 (en) * 1994-09-21 1997-01-08 日本電気株式会社 Semiconductor package and manufacturing method thereof
US5587342A (en) * 1995-04-03 1996-12-24 Motorola, Inc. Method of forming an electrical interconnect
JP2606177B2 (en) * 1995-04-26 1997-04-30 日本電気株式会社 Printed wiring board
US5985692A (en) * 1995-06-07 1999-11-16 Microunit Systems Engineering, Inc. Process for flip-chip bonding a semiconductor die having gold bump electrodes
JPH0997791A (en) 1995-09-27 1997-04-08 Internatl Business Mach Corp <Ibm> Bump structure, formation of bump and installation connection body
US5777379A (en) * 1995-08-18 1998-07-07 Tessera, Inc. Semiconductor assemblies with reinforced peripheral regions
JP3549294B2 (en) * 1995-08-23 2004-08-04 新光電気工業株式会社 Semiconductor device and its mounting structure
US5810609A (en) * 1995-08-28 1998-09-22 Tessera, Inc. Socket for engaging bump leads on a microelectronic device and methods therefor
US5861666A (en) * 1995-08-30 1999-01-19 Tessera, Inc. Stacked chip assembly
US5674785A (en) * 1995-11-27 1997-10-07 Micron Technology, Inc. Method of producing a single piece package for semiconductor die
US5646446A (en) * 1995-12-22 1997-07-08 Fairchild Space And Defense Corporation Three-dimensional flexible assembly of integrated circuits
US5731709A (en) * 1996-01-26 1998-03-24 Motorola, Inc. Method for testing a ball grid array semiconductor device and a device for such testing
US6001671A (en) * 1996-04-18 1999-12-14 Tessera, Inc. Methods for manufacturing a semiconductor package having a sacrificial layer
US5789815A (en) * 1996-04-23 1998-08-04 Motorola, Inc. Three dimensional semiconductor package having flexible appendages
US5689091A (en) * 1996-09-19 1997-11-18 Vlsi Technology, Inc. Multi-layer substrate structure
US5762845A (en) * 1996-11-19 1998-06-09 Packard Hughes Interconnect Company Method of making circuit with conductive and non-conductive raised features
US5929521A (en) 1997-03-26 1999-07-27 Micron Technology, Inc. Projected contact structure for bumped semiconductor device and resulting articles and assemblies
JPH1140694A (en) * 1997-07-16 1999-02-12 Oki Electric Ind Co Ltd Semiconductor package, and semiconductor device and their manufacture
US6335571B1 (en) 1997-07-21 2002-01-01 Miguel Albert Capote Semiconductor flip-chip package and method for the fabrication thereof
WO1999009595A1 (en) * 1997-08-19 1999-02-25 Hitachi, Ltd. Multichip module structure and method for manufacturing the same
CA2213590C (en) * 1997-08-21 2006-11-07 Keith C. Carroll Flexible circuit connector and method of making same
JP3937265B2 (en) * 1997-09-29 2007-06-27 エルピーダメモリ株式会社 Semiconductor device
US6217972B1 (en) * 1997-10-17 2001-04-17 Tessera, Inc. Enhancements in framed sheet processing
US6222136B1 (en) * 1997-11-12 2001-04-24 International Business Machines Corporation Printed circuit board with continuous connective bumps
JPH11163022A (en) * 1997-11-28 1999-06-18 Sony Corp Semiconductor and manufacture of the same and electronic equipment
US6052287A (en) * 1997-12-09 2000-04-18 Sandia Corporation Silicon ball grid array chip carrier
US5973391A (en) * 1997-12-11 1999-10-26 Read-Rite Corporation Interposer with embedded circuitry and method for using the same to package microelectronic units
US6329594B1 (en) 1998-01-16 2001-12-11 Bae Systems Information And Electronic Systems Integration, Inc. Integrated circuit package
US5956234A (en) * 1998-01-20 1999-09-21 Integrated Device Technology, Inc. Method and structure for a surface mountable rigid-flex printed circuit board
US6061245A (en) * 1998-01-22 2000-05-09 International Business Machines Corporation Free standing, three dimensional, multi-chip, carrier package with air flow baffle
US6235996B1 (en) 1998-01-28 2001-05-22 International Business Machines Corporation Interconnection structure and process module assembly and rework
US6300679B1 (en) 1998-06-01 2001-10-09 Semiconductor Components Industries, Llc Flexible substrate for packaging a semiconductor component
US6414391B1 (en) * 1998-06-30 2002-07-02 Micron Technology, Inc. Module assembly for stacked BGA packages with a common bus bar in the assembly
US5854507A (en) * 1998-07-21 1998-12-29 Hewlett-Packard Company Multiple chip assembly
US6515355B1 (en) * 1998-09-02 2003-02-04 Micron Technology, Inc. Passivation layer for packaged integrated circuits
JP3407275B2 (en) 1998-10-28 2003-05-19 インターナショナル・ビジネス・マシーンズ・コーポレーション Bump and method of forming the same
US6332270B2 (en) * 1998-11-23 2001-12-25 International Business Machines Corporation Method of making high density integral test probe
US6965166B2 (en) 1999-02-24 2005-11-15 Rohm Co., Ltd. Semiconductor device of chip-on-chip structure
US6980017B1 (en) 1999-03-10 2005-12-27 Micron Technology, Inc. Test interconnect for bumped semiconductor components and method of fabrication
JP2000277649A (en) 1999-03-26 2000-10-06 Matsushita Electric Works Ltd Semiconductor and manufacture of the same
US6177729B1 (en) * 1999-04-03 2001-01-23 International Business Machines Corporation Rolling ball connector
JP3446825B2 (en) 1999-04-06 2003-09-16 沖電気工業株式会社 Semiconductor device and manufacturing method thereof
US6258625B1 (en) * 1999-05-18 2001-07-10 International Business Machines Corporation Method of interconnecting electronic components using a plurality of conductive studs
US6782610B1 (en) * 1999-05-21 2004-08-31 North Corporation Method for fabricating a wiring substrate by electroplating a wiring film on a metal base
JP3973340B2 (en) 1999-10-05 2007-09-12 Ｎｅｃエレクトロニクス株式会社 Semiconductor device, wiring board, and manufacturing method thereof
US6882045B2 (en) 1999-10-28 2005-04-19 Thomas J. Massingill Multi-chip module and method for forming and method for deplating defective capacitors
US6869750B2 (en) 1999-10-28 2005-03-22 Fujitsu Limited Structure and method for forming a multilayered structure
US6362525B1 (en) * 1999-11-09 2002-03-26 Cypress Semiconductor Corp. Circuit structure including a passive element formed within a grid array substrate and method for making the same
US6534861B1 (en) * 1999-11-15 2003-03-18 Substrate Technologies Incorporated Ball grid substrate for lead-on-chip semiconductor package
US6322903B1 (en) 1999-12-06 2001-11-27 Tru-Si Technologies, Inc. Package of integrated circuits and vertical integration
US6216941B1 (en) 2000-01-06 2001-04-17 Trw Inc. Method for forming high frequency connections to high temperature superconductor circuits and other fragile materials
JP3865989B2 (en) 2000-01-13 2007-01-10 新光電気工業株式会社 Multilayer wiring board, wiring board, multilayer wiring board manufacturing method, wiring board manufacturing method, and semiconductor device
US20030001286A1 (en) 2000-01-28 2003-01-02 Ryoichi Kajiwara Semiconductor package and flip chip bonding method therein
JP3752949B2 (en) 2000-02-28 2006-03-08 日立化成工業株式会社 Wiring substrate and semiconductor device
EP1278612B1 (en) 2000-03-10 2010-02-24 Chippac, Inc. Flip chip Interconnection structure and method of obtaining the same
JP2001308095A (en) 2000-04-19 2001-11-02 Toyo Kohan Co Ltd Semiconductor device and method of manufacture
US6578754B1 (en) * 2000-04-27 2003-06-17 Advanpack Solutions Pte. Ltd. Pillar connections for semiconductor chips and method of manufacture
US6522018B1 (en) * 2000-05-16 2003-02-18 Micron Technology, Inc. Ball grid array chip packages having improved testing and stacking characteristics
US6647310B1 (en) * 2000-05-30 2003-11-11 Advanced Micro Devices, Inc. Temperature control of an integrated circuit
US6560117B2 (en) * 2000-06-28 2003-05-06 Micron Technology, Inc. Packaged microelectronic die assemblies and methods of manufacture
JP2002289768A (en) 2000-07-17 2002-10-04 Rohm Co Ltd Semiconductor device and its manufacturing method
US6462575B1 (en) * 2000-08-28 2002-10-08 Micron Technology, Inc. Method and system for wafer level testing and burning-in semiconductor components
JP3874062B2 (en) * 2000-09-05 2007-01-31 セイコーエプソン株式会社 Semiconductor device
JP3735526B2 (en) 2000-10-04 2006-01-18 日本電気株式会社 Semiconductor device and manufacturing method thereof
JP2002124548A (en) 2000-10-17 2002-04-26 Hitachi Cable Ltd Tape carrier and semiconductor device using the tape carrier
US6555906B2 (en) 2000-12-15 2003-04-29 Intel Corporation Microelectronic package having a bumpless laminated interconnection layer
US6734539B2 (en) 2000-12-27 2004-05-11 Lucent Technologies Inc. Stacked module package
US6800169B2 (en) * 2001-01-08 2004-10-05 Fujitsu Limited Method for joining conductive structures and an electrical conductive article
US6388322B1 (en) * 2001-01-17 2002-05-14 Aralight, Inc. Article comprising a mechanically compliant bump
TWI313507B (en) 2002-10-25 2009-08-11 Megica Corporatio Method for assembling chips
US6648213B1 (en) 2001-03-05 2003-11-18 Saturn Electronics & Engineering, Inc. Manufacturing method for attaching components to a substrate
US20050097727A1 (en) * 2001-03-28 2005-05-12 Tomoo Iijima Multi-layer wiring board, method for producing multi-layer wiring board, polishing machine for multi-layer wiring board, and metal sheet for producing wiring board
JP2002313996A (en) 2001-04-18 2002-10-25 Toshiba Chem Corp Substrate for semiconductor package, and its manufacturing method
JP2003007768A (en) 2001-06-25 2003-01-10 Sumitomo Metal Mining Co Ltd Interlayer connection material, and manufacturing method and using method therefor
US6550666B2 (en) * 2001-08-21 2003-04-22 Advanpack Solutions Pte Ltd Method for forming a flip chip on leadframe semiconductor package
US6992379B2 (en) * 2001-09-05 2006-01-31 International Business Machines Corporation Electronic package having a thermal stretching layer
US6977440B2 (en) * 2001-10-09 2005-12-20 Tessera, Inc. Stacked packages
US6897565B2 (en) * 2001-10-09 2005-05-24 Tessera, Inc. Stacked packages
JP3583396B2 (en) 2001-10-31 2004-11-04 富士通株式会社 Semiconductor device manufacturing method, thin film multilayer substrate, and manufacturing method thereof
JP3875077B2 (en) 2001-11-16 2007-01-31 富士通株式会社 Electronic device and device connection method
TWI245402B (en) 2002-01-07 2005-12-11 Megic Corp Rod soldering structure and manufacturing process thereof
SG115456A1 (en) * 2002-03-04 2005-10-28 Micron Technology Inc Semiconductor die packages with recessed interconnecting structures and methods for assembling the same
TWI284973B (en) 2002-04-03 2007-08-01 Advanced Semiconductor Eng Flip-chip joint structure, and fabricating process thereof
US6744142B2 (en) 2002-06-19 2004-06-01 National Central University Flip chip interconnection structure and process of making the same
US6803303B1 (en) 2002-07-11 2004-10-12 Micron Technology, Inc. Method of fabricating semiconductor component having encapsulated, bonded, interconnect contacts
JP2005026645A (en) 2002-10-15 2005-01-27 Shinko Electric Ind Co Ltd Circuit board and its manufacturing method
US7087458B2 (en) 2002-10-30 2006-08-08 Advanpack Solutions Pte. Ltd. Method for fabricating a flip chip package with pillar bump and no flow underfill
TW200423344A (en) 2002-12-31 2004-11-01 Texas Instruments Inc Composite metal column for mounting semiconductor device
JP2004221450A (en) 2003-01-17 2004-08-05 Toppan Printing Co Ltd Printed board and its manufacturing method
TW200507218A (en) 2003-03-31 2005-02-16 North Corp Layout circuit substrate, manufacturing method of layout circuit substrate, and circuit module
TWI234252B (en) * 2003-05-13 2005-06-11 Siliconware Precision Industries Co Ltd Flash-preventing window ball grid array semiconductor package and chip carrier and method for fabricating the same
JP4389471B2 (en) 2003-05-19 2009-12-24 パナソニック株式会社 Electronic circuit connection structure and connection method
JP4104490B2 (en) 2003-05-21 2008-06-18 オリンパス株式会社 Manufacturing method of semiconductor device
US6888255B2 (en) 2003-05-30 2005-05-03 Texas Instruments Incorporated Built-up bump pad structure and method for same
US7005241B2 (en) * 2003-06-09 2006-02-28 Shinko Electric Industries Co., Ltd. Process for making circuit board or lead frame
JP4056001B2 (en) 2003-07-11 2008-03-05 テセラ・インターコネクト・マテリアルズ，インコーポレイテッド Method for manufacturing printed circuit board
US7462936B2 (en) * 2003-10-06 2008-12-09 Tessera, Inc. Formation of circuitry with modification of feature height
US7495179B2 (en) 2003-10-06 2009-02-24 Tessera, Inc. Components with posts and pads
US8641913B2 (en) 2003-10-06 2014-02-04 Tessera, Inc. Fine pitch microcontacts and method for forming thereof
JP2005216696A (en) 2004-01-30 2005-08-11 Ngk Spark Plug Co Ltd Relay board and board with relay board
US7453157B2 (en) * 2004-06-25 2008-11-18 Tessera, Inc. Microelectronic packages and methods therefor
WO2006004672A1 (en) 2004-06-25 2006-01-12 Tessera, Inc. Components with posts and pads
US6956165B1 (en) 2004-06-28 2005-10-18 Altera Corporation Underfill for maximum flip chip package reliability
JP4908750B2 (en) 2004-11-25 2012-04-04 ローム株式会社 Semiconductor device
US8294279B2 (en) 2005-01-25 2012-10-23 Megica Corporation Chip package with dam bar restricting flow of underfill
JP2007023338A (en) 2005-07-15 2007-02-01 Shinko Electric Ind Co Ltd Method for forming metal sheet pattern and circuit board
TWI273667B (en) 2005-08-30 2007-02-11 Via Tech Inc Chip package and bump connecting structure thereof
TWI286829B (en) 2006-01-17 2007-09-11 Via Tech Inc Chip package
US7964800B2 (en) 2006-05-25 2011-06-21 Fujikura Ltd. Printed wiring board, method for forming the printed wiring board, and board interconnection structure
US7911805B2 (en) 2007-06-29 2011-03-22 Tessera, Inc. Multilayer wiring element having pin interface
KR101542478B1 (en) 2007-08-15 2015-08-06 테세라, 인코포레이티드 A method of fabricating an interconnection element having conductive posts
KR101388538B1 (en) 2007-09-28 2014-04-23 테세라, 인코포레이티드 Flip chip interconnection with double post
US20090115047A1 (en) 2007-10-10 2009-05-07 Tessera, Inc. Robust multi-layer wiring elements and assemblies with embedded microelectronic elements
JP2009158593A (en) 2007-12-25 2009-07-16 Tessera Interconnect Materials Inc Bump structure and method of manufacturing the same
US20100044860A1 (en) 2008-08-21 2010-02-25 Tessera Interconnect Materials, Inc. Microelectronic substrate or element having conductive pads and metal posts joined thereto using bond layer
US7569935B1 (en) 2008-11-12 2009-08-04 Powertech Technology Inc. Pillar-to-pillar flip-chip assembly
US8115310B2 (en) 2009-06-11 2012-02-14 Texas Instruments Incorporated Copper pillar bonding for fine pitch flip chip devices

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5068714A (en) * 1989-04-05 1991-11-26 Robert Bosch Gmbh Method of electrically and mechanically connecting a semiconductor to a substrate using an electrically conductive tacky adhesive and the device so made
US4975079A (en) * 1990-02-23 1990-12-04 International Business Machines Corp. Connector assembly for chip testing
US5615824A (en) * 1994-06-07 1997-04-01 Tessera, Inc. Soldering with resilient contacts
US5980270A (en) * 1994-06-07 1999-11-09 Tessera, Inc. Soldering with resilient contacts

Also Published As

Publication number Publication date
US7709968B2 (en) 2010-05-04
US20050173805A1 (en) 2005-08-11
US20100193970A1 (en) 2010-08-05
US8531039B2 (en) 2013-09-10
WO2005065238A2 (en) 2005-07-21

Similar Documents

Publication Publication Date Title
WO2005065238A3 (en) Micro pin grid array with pin motion isolation
WO2006012127A3 (en) Microelectronic packages and methods therefor
US6812424B2 (en) Elastic sheet structure having an improved electrical continuity function, and printed circuit board structure
WO2005011060A3 (en) Electrical interconnect assembly with interlocking contact system
KR100776894B1 (en) Electrical connecting member capable of achieving stable connection with a simple structure and connector using the same
WO2005065207A3 (en) Microelectronic packages and methods therefor
WO2006101861A3 (en) Microelectronic packages and methods therefor
WO2006023283A3 (en) Electrical connector with stepped housing
WO2005055311A3 (en) Device having a compliant electrical interconnects and compliant sealing element
TW428258B (en) Semiconductor device with connection terminals in the form of a grid array
US6877993B2 (en) Packaged device adapter assembly with alignment structure and methods regarding same
WO2002075783A8 (en) Wafer level interposer
EP1455392A4 (en) Semiconductor device and method for manufacturing the same
WO2006031296A3 (en) Ball grid array connector
WO2006091793A8 (en) Microelectronic assemblies having compliancy
WO2002055431A3 (en) Wafer level interconnection
WO2008051596A3 (en) Solid state light sheet and encapsulated bare die semiconductor circuits
WO2004100276A3 (en) Light-emitting devices having coplanar electrical contacts adjacent to a substrate surface opposite an active region and methods of forming the same
JP2008226841A (en) Electric interconnection structure
WO2002029890A3 (en) Semiconductor stacked die devices and methods of forming semiconductor stacked die devices
US4643499A (en) Component mounting apparatus
WO2005039266A3 (en) Land grid array socket with diverse contacts
TW200505055A (en) Light-emitting devices having an active region with electrical contacts coupled to opposing surfaces thereof and methods of forming the same
WO2003028044A3 (en) Non-conductive substrate forming a strip or a panel, on which a plurality of carrier elements are configured
WO2004023166A3 (en) Optical microsystem and method for making same

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
NENP Non-entry into the national phase

Ref country code: DE

WWW Wipo information: withdrawn in national office

Country of ref document: DE

122 Ep: pct application non-entry in european phase