WO2005067663A3 - Devices and methods for optical endpoint detection during semiconductor wafer polishing - Google Patents
Devices and methods for optical endpoint detection during semiconductor wafer polishing Download PDFInfo
- Publication number
- WO2005067663A3 WO2005067663A3 PCT/US2005/000614 US2005000614W WO2005067663A3 WO 2005067663 A3 WO2005067663 A3 WO 2005067663A3 US 2005000614 W US2005000614 W US 2005000614W WO 2005067663 A3 WO2005067663 A3 WO 2005067663A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- methods
- devices
- semiconductor wafer
- wafer polishing
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 4
- 238000000034 method Methods 0.000 title abstract 2
- 230000003287 optical effect Effects 0.000 title abstract 2
- 238000001514 detection method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006549458A JP2007518279A (en) | 2004-01-08 | 2005-01-07 | Apparatus and method for optical endpoint detection in semiconductor wafer polishing |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/754,360 | 2004-01-08 | ||
US10/754,360 US7235154B2 (en) | 2004-01-08 | 2004-01-08 | Devices and methods for optical endpoint detection during semiconductor wafer polishing |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005067663A2 WO2005067663A2 (en) | 2005-07-28 |
WO2005067663A3 true WO2005067663A3 (en) | 2006-07-20 |
Family
ID=34739373
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/000614 WO2005067663A2 (en) | 2004-01-08 | 2005-01-07 | Devices and methods for optical endpoint detection during semiconductor wafer polishing |
Country Status (5)
Country | Link |
---|---|
US (2) | US7235154B2 (en) |
JP (1) | JP2007518279A (en) |
KR (1) | KR20060108763A (en) |
CN (1) | CN1929952A (en) |
WO (1) | WO2005067663A2 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7235154B2 (en) * | 2004-01-08 | 2007-06-26 | Strasbaugh | Devices and methods for optical endpoint detection during semiconductor wafer polishing |
US20070235133A1 (en) * | 2006-03-29 | 2007-10-11 | Strasbaugh | Devices and methods for measuring wafer characteristics during semiconductor wafer polishing |
US7821637B1 (en) | 2007-02-22 | 2010-10-26 | J.A. Woollam Co., Inc. | System for controlling intensity of a beam of electromagnetic radiation and method for investigating materials with low specular reflectance and/or are depolarizing |
US8182312B2 (en) * | 2008-09-06 | 2012-05-22 | Strasbaugh | CMP system with wireless endpoint detection system |
CN101769848B (en) * | 2008-12-30 | 2011-06-15 | 中芯国际集成电路制造(上海)有限公司 | Method for detecting etching fluid filter |
CN101954621B (en) * | 2009-07-16 | 2012-05-23 | 中芯国际集成电路制造(上海)有限公司 | Method for judging grinding terminal of chemical mechanical grinding process |
US20130017762A1 (en) * | 2011-07-15 | 2013-01-17 | Infineon Technologies Ag | Method and Apparatus for Determining a Measure of a Thickness of a Polishing Pad of a Polishing Machine |
JP7197999B2 (en) | 2018-05-11 | 2022-12-28 | キオクシア株式会社 | polishing equipment and polishing pads |
CN114975157B (en) * | 2022-08-01 | 2022-10-21 | 波粒(北京)光电科技有限公司 | Photoluminescence detection device of solar cell |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5665199A (en) * | 1995-06-23 | 1997-09-09 | Advanced Micro Devices, Inc. | Methodology for developing product-specific interlayer dielectric polish processes |
US6190234B1 (en) * | 1999-01-25 | 2001-02-20 | Applied Materials, Inc. | Endpoint detection with light beams of different wavelengths |
US6230069B1 (en) * | 1998-06-26 | 2001-05-08 | Advanced Micro Devices, Inc. | System and method for controlling the manufacture of discrete parts in semiconductor fabrication using model predictive control |
US6485354B1 (en) * | 2000-06-09 | 2002-11-26 | Strasbaugh | Polishing pad with built-in optical sensor |
US6503361B1 (en) * | 1997-06-10 | 2003-01-07 | Canon Kabushiki Kaisha | Polishing method and polishing apparatus using the same |
US20050101224A1 (en) * | 2000-07-10 | 2005-05-12 | Nils Johansson | Combined eddy current sensing and optical monitoring for chemical mechanical polishing |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3783822A (en) * | 1972-05-10 | 1974-01-08 | J Wollam | Apparatus for use in deposition of films from a vapor phase |
JPH03234467A (en) | 1990-02-05 | 1991-10-18 | Canon Inc | Polishing method of metal mold mounting surface of stamper and polishing machine therefor |
US5081796A (en) | 1990-08-06 | 1992-01-21 | Micron Technology, Inc. | Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer |
US6614529B1 (en) | 1992-12-28 | 2003-09-02 | Applied Materials, Inc. | In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization |
JP3270282B2 (en) | 1994-02-21 | 2002-04-02 | 株式会社東芝 | Semiconductor manufacturing apparatus and semiconductor device manufacturing method |
US5893796A (en) | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
US5838447A (en) | 1995-07-20 | 1998-11-17 | Ebara Corporation | Polishing apparatus including thickness or flatness detector |
JPH1148134A (en) * | 1997-08-11 | 1999-02-23 | Nikon Corp | Method and device for detecting final point of polishing, and polishing device having it |
US6068539A (en) | 1998-03-10 | 2000-05-30 | Lam Research Corporation | Wafer polishing device with movable window |
WO1999054924A1 (en) * | 1998-04-21 | 1999-10-28 | Hitachi, Ltd. | Apparatus and method for measuring thickness of thin film and method and apparatus for manufacturing thin film device using the same |
US6106662A (en) | 1998-06-08 | 2000-08-22 | Speedfam-Ipec Corporation | Method and apparatus for endpoint detection for chemical mechanical polishing |
US6247998B1 (en) | 1999-01-25 | 2001-06-19 | Applied Materials, Inc. | Method and apparatus for determining substrate layer thickness during chemical mechanical polishing |
US6146242A (en) | 1999-06-11 | 2000-11-14 | Strasbaugh, Inc. | Optical view port for chemical mechanical planarization endpoint detection |
US6726528B2 (en) * | 2002-05-14 | 2004-04-27 | Strasbaugh | Polishing pad with optical sensor |
JP3782629B2 (en) | 1999-12-13 | 2006-06-07 | 株式会社荏原製作所 | Film thickness measuring method and film thickness measuring apparatus |
WO2002026445A1 (en) * | 2000-09-29 | 2002-04-04 | Strasbaugh, Inc. | Polishing pad with built-in optical sensor |
JP3932836B2 (en) * | 2001-07-27 | 2007-06-20 | 株式会社日立製作所 | Thin film thickness measuring method and apparatus, and device manufacturing method using the same |
US20030190866A1 (en) * | 2002-04-08 | 2003-10-09 | Wolf Stephan H. | Optical coupler hub for chemical-mechanical-planarization polishing pads with an integrated optical waveguide. |
US6696005B2 (en) * | 2002-05-13 | 2004-02-24 | Strasbaugh | Method for making a polishing pad with built-in optical sensor |
TWI248598B (en) * | 2002-12-31 | 2006-02-01 | Hon Hai Prec Ind Co Ltd | Driving apparatus of LED |
US7235154B2 (en) * | 2004-01-08 | 2007-06-26 | Strasbaugh | Devices and methods for optical endpoint detection during semiconductor wafer polishing |
-
2004
- 2004-01-08 US US10/754,360 patent/US7235154B2/en active Active
-
2005
- 2005-01-07 WO PCT/US2005/000614 patent/WO2005067663A2/en active Application Filing
- 2005-01-07 JP JP2006549458A patent/JP2007518279A/en active Pending
- 2005-01-07 CN CNA2005800070893A patent/CN1929952A/en active Pending
- 2005-01-07 KR KR1020067015796A patent/KR20060108763A/en not_active Application Discontinuation
-
2007
- 2007-06-26 US US11/768,873 patent/US7549909B2/en not_active Expired - Lifetime
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5665199A (en) * | 1995-06-23 | 1997-09-09 | Advanced Micro Devices, Inc. | Methodology for developing product-specific interlayer dielectric polish processes |
US6503361B1 (en) * | 1997-06-10 | 2003-01-07 | Canon Kabushiki Kaisha | Polishing method and polishing apparatus using the same |
US6230069B1 (en) * | 1998-06-26 | 2001-05-08 | Advanced Micro Devices, Inc. | System and method for controlling the manufacture of discrete parts in semiconductor fabrication using model predictive control |
US6190234B1 (en) * | 1999-01-25 | 2001-02-20 | Applied Materials, Inc. | Endpoint detection with light beams of different wavelengths |
US6485354B1 (en) * | 2000-06-09 | 2002-11-26 | Strasbaugh | Polishing pad with built-in optical sensor |
US20030109196A1 (en) * | 2000-06-09 | 2003-06-12 | Strasbaugh | Endpoint detection system for wafer polishing |
US20050101224A1 (en) * | 2000-07-10 | 2005-05-12 | Nils Johansson | Combined eddy current sensing and optical monitoring for chemical mechanical polishing |
Also Published As
Publication number | Publication date |
---|---|
US7549909B2 (en) | 2009-06-23 |
US20050150599A1 (en) | 2005-07-14 |
US7235154B2 (en) | 2007-06-26 |
KR20060108763A (en) | 2006-10-18 |
CN1929952A (en) | 2007-03-14 |
JP2007518279A (en) | 2007-07-05 |
US20080032602A1 (en) | 2008-02-07 |
WO2005067663A2 (en) | 2005-07-28 |
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