WO2005068538A1 - ポリマーの製造方法、ポリマー、絶縁膜形成用組成物、絶縁膜の製造方法、および絶縁膜 - Google Patents
ポリマーの製造方法、ポリマー、絶縁膜形成用組成物、絶縁膜の製造方法、および絶縁膜 Download PDFInfo
- Publication number
- WO2005068538A1 WO2005068538A1 PCT/JP2005/000372 JP2005000372W WO2005068538A1 WO 2005068538 A1 WO2005068538 A1 WO 2005068538A1 JP 2005000372 W JP2005000372 W JP 2005000372W WO 2005068538 A1 WO2005068538 A1 WO 2005068538A1
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- WO
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- Prior art keywords
- silane
- polymer
- group
- insulating film
- butyl
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/20—Manufacture of shaped structures of ion-exchange resins
- C08J5/22—Films, membranes or diaphragms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/14—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
- H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
- H01L21/02214—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen
- H01L21/02216—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/312—Organic layers, e.g. photoresist
- H01L21/3121—Layers comprising organo-silicon compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/312—Organic layers, e.g. photoresist
- H01L21/3121—Layers comprising organo-silicon compounds
- H01L21/3122—Layers comprising organo-silicon compounds layers comprising polysiloxane compounds
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- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Silicon Polymers (AREA)
- Formation Of Insulating Films (AREA)
- Paints Or Removers (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Organic Insulating Materials (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005517075A JP5110243B2 (ja) | 2004-01-16 | 2005-01-14 | ポリマーの製造方法 |
EP05703611A EP1705206A4 (en) | 2004-01-16 | 2005-01-14 | PROCESS FOR PREPARING POLYMER, POLYMER, COMPOSITION FOR FORMING AN INSULATING FILM, PROCESS FOR PREPARING INSULATING FILM AND INSULATING FILM |
KR1020067016327A KR101129875B1 (ko) | 2004-01-16 | 2005-01-14 | 중합체의 제조 방법, 중합체, 절연막 형성용 조성물,절연막의 제조 방법 및 절연막 |
US11/484,604 US20070015892A1 (en) | 2004-01-16 | 2006-07-12 | Method for producing polymer, polymer, composition for forming insulating film, method for producing insulating film, and insulating film |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004-009205 | 2004-01-16 | ||
JP2004009205 | 2004-01-16 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/484,604 Continuation US20070015892A1 (en) | 2004-01-16 | 2006-07-12 | Method for producing polymer, polymer, composition for forming insulating film, method for producing insulating film, and insulating film |
Publications (1)
Publication Number | Publication Date |
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WO2005068538A1 true WO2005068538A1 (ja) | 2005-07-28 |
Family
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Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/000373 WO2005068539A1 (ja) | 2004-01-16 | 2005-01-14 | ポリマーの製造方法、ポリマー、絶縁膜形成用組成物、絶縁膜の製造方法、および絶縁膜 |
PCT/JP2005/000372 WO2005068538A1 (ja) | 2004-01-16 | 2005-01-14 | ポリマーの製造方法、ポリマー、絶縁膜形成用組成物、絶縁膜の製造方法、および絶縁膜 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/000373 WO2005068539A1 (ja) | 2004-01-16 | 2005-01-14 | ポリマーの製造方法、ポリマー、絶縁膜形成用組成物、絶縁膜の製造方法、および絶縁膜 |
Country Status (6)
Country | Link |
---|---|
US (2) | US20070015892A1 (ja) |
EP (2) | EP1705207B1 (ja) |
JP (2) | JP5110243B2 (ja) |
KR (2) | KR101129875B1 (ja) |
TW (2) | TW200536621A (ja) |
WO (2) | WO2005068539A1 (ja) |
Cited By (11)
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JP2005350653A (ja) * | 2004-05-11 | 2005-12-22 | Jsr Corp | 有機シリカ系膜の形成方法、有機シリカ系膜、配線構造体、半導体装置、および膜形成用組成物 |
JP2005350651A (ja) * | 2004-05-11 | 2005-12-22 | Jsr Corp | 絶縁膜形成用組成物およびその製造方法、ならびにシリカ系絶縁膜およびその形成方法 |
WO2007088908A1 (ja) | 2006-02-02 | 2007-08-09 | Jsr Corporation | 有機シリカ系膜およびその形成方法、半導体装置の絶縁膜形成用組成物およびその製造方法、ならびに配線構造体および半導体装置 |
JP2007254595A (ja) * | 2006-03-23 | 2007-10-04 | Jsr Corp | 絶縁膜形成用組成物、ポリマーおよびその製造方法、絶縁膜の製造方法、ならびにシリカ系絶縁膜 |
WO2007119554A1 (ja) * | 2006-03-29 | 2007-10-25 | Jsr Corporation | ポリマーの製造方法、ポリマー、ポリマー膜形成用組成物、ポリマー膜の形成方法およびポリマー膜 |
WO2007139004A1 (ja) * | 2006-05-31 | 2007-12-06 | Jsr Corporation | 絶縁膜形成用組成物およびその製造方法、ならびにシリカ系絶縁膜およびその形成方法 |
WO2008096656A1 (ja) * | 2007-02-07 | 2008-08-14 | Jsr Corporation | ケイ素含有ポリマーおよびその合成方法、膜形成用組成物、ならびにシリカ系膜およびその形成方法 |
US7497965B2 (en) * | 2005-08-11 | 2009-03-03 | Fujifilm Corporation | Insulating film-forming composition, insulating film and production method thereof |
JP2010106099A (ja) * | 2008-10-29 | 2010-05-13 | Jsr Corp | 絶縁膜形成用組成物、ならびに絶縁膜およびその形成方法 |
JP5013045B2 (ja) * | 2004-01-16 | 2012-08-29 | Jsr株式会社 | ポリマーの製造方法 |
JP5105041B2 (ja) * | 2004-01-16 | 2012-12-19 | Jsr株式会社 | 絶縁膜形成用組成物およびその製造方法、ならびにシリカ系絶縁膜およびその形成方法 |
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EP1719793A4 (en) * | 2004-02-26 | 2009-05-20 | Jsr Corp | POLYMER AND MANUFACTURING METHOD THEREFOR, COMPOSITION FOR FORMING AN INSULATING FILM AND PRODUCTION METHOD THEREFOR |
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US7790630B2 (en) * | 2005-04-12 | 2010-09-07 | Intel Corporation | Silicon-doped carbon dielectrics |
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US7714092B2 (en) * | 2006-01-13 | 2010-05-11 | Starfire Systems, Inc. | Composition, preparation of polycarbosilanes and their uses |
JP5007511B2 (ja) * | 2006-02-14 | 2012-08-22 | 富士通株式会社 | 露光光遮蔽膜形成用材料、多層配線及びその製造方法、並びに半導体装置 |
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- 2005-01-14 KR KR1020067016327A patent/KR101129875B1/ko not_active IP Right Cessation
- 2005-01-14 JP JP2005517075A patent/JP5110243B2/ja active Active
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- 2005-01-14 WO PCT/JP2005/000372 patent/WO2005068538A1/ja active Application Filing
- 2005-01-14 KR KR1020067016328A patent/KR20060123549A/ko not_active Application Discontinuation
- 2005-01-14 JP JP2005517076A patent/JP5013045B2/ja active Active
- 2005-01-14 EP EP05703612A patent/EP1705207B1/en not_active Not-in-force
- 2005-01-14 TW TW094101152A patent/TWI265172B/zh not_active IP Right Cessation
- 2005-01-14 EP EP05703611A patent/EP1705206A4/en not_active Withdrawn
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2006
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JP5013045B2 (ja) * | 2004-01-16 | 2012-08-29 | Jsr株式会社 | ポリマーの製造方法 |
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JP2007254595A (ja) * | 2006-03-23 | 2007-10-04 | Jsr Corp | 絶縁膜形成用組成物、ポリマーおよびその製造方法、絶縁膜の製造方法、ならびにシリカ系絶縁膜 |
WO2007119554A1 (ja) * | 2006-03-29 | 2007-10-25 | Jsr Corporation | ポリマーの製造方法、ポリマー、ポリマー膜形成用組成物、ポリマー膜の形成方法およびポリマー膜 |
JP5218765B2 (ja) * | 2006-03-29 | 2013-06-26 | Jsr株式会社 | ポリマーの製造方法、ポリマー、ポリマー膜形成用組成物、ポリマー膜の形成方法およびポリマー膜 |
JP2007324283A (ja) * | 2006-05-31 | 2007-12-13 | Jsr Corp | 絶縁膜形成用組成物およびその製造方法、ならびにシリカ系絶縁膜およびその形成方法 |
WO2007139004A1 (ja) * | 2006-05-31 | 2007-12-06 | Jsr Corporation | 絶縁膜形成用組成物およびその製造方法、ならびにシリカ系絶縁膜およびその形成方法 |
WO2008096656A1 (ja) * | 2007-02-07 | 2008-08-14 | Jsr Corporation | ケイ素含有ポリマーおよびその合成方法、膜形成用組成物、ならびにシリカ系膜およびその形成方法 |
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Also Published As
Publication number | Publication date |
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TW200536621A (en) | 2005-11-16 |
JP5013045B2 (ja) | 2012-08-29 |
KR101129875B1 (ko) | 2012-03-28 |
TW200538490A (en) | 2005-12-01 |
KR20060123548A (ko) | 2006-12-01 |
WO2005068539A1 (ja) | 2005-07-28 |
JP5110243B2 (ja) | 2012-12-26 |
EP1705206A4 (en) | 2009-06-24 |
EP1705207B1 (en) | 2012-10-24 |
JPWO2005068539A1 (ja) | 2007-12-27 |
EP1705207A4 (en) | 2009-06-24 |
US7528207B2 (en) | 2009-05-05 |
US20070015892A1 (en) | 2007-01-18 |
EP1705207A1 (en) | 2006-09-27 |
TWI292349B (ja) | 2008-01-11 |
JPWO2005068538A1 (ja) | 2007-12-27 |
EP1705206A1 (en) | 2006-09-27 |
KR20060123549A (ko) | 2006-12-01 |
US20070021580A1 (en) | 2007-01-25 |
TWI265172B (en) | 2006-11-01 |
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