WO2005089477A3 - Direct cooling of leds - Google Patents

Direct cooling of leds Download PDF

Info

Publication number
WO2005089477A3
WO2005089477A3 PCT/US2005/009076 US2005009076W WO2005089477A3 WO 2005089477 A3 WO2005089477 A3 WO 2005089477A3 US 2005009076 W US2005009076 W US 2005009076W WO 2005089477 A3 WO2005089477 A3 WO 2005089477A3
Authority
WO
WIPO (PCT)
Prior art keywords
led array
leds
direct cooling
coolant
circulates
Prior art date
Application number
PCT/US2005/009076
Other languages
French (fr)
Other versions
WO2005089477A2 (en
Inventor
Mark D Owen
Duwayne R Anderson
Francois Vlach
Original Assignee
Phoseon Technology Inc
Mark D Owen
Duwayne R Anderson
Francois Vlach
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoseon Technology Inc, Mark D Owen, Duwayne R Anderson, Francois Vlach filed Critical Phoseon Technology Inc
Priority to EP05725887.3A priority Critical patent/EP1754259B1/en
Publication of WO2005089477A2 publication Critical patent/WO2005089477A2/en
Publication of WO2005089477A3 publication Critical patent/WO2005089477A3/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F21V29/59—Cooling arrangements using liquid coolants with forced flow of the coolant
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The present invention provides a thermal management system for semiconductor devices such as an LED array that applies a coolant directly to the LED array. Preferable, the coolant is an optically transparent cooling fluid that flows across the LED array and circulates through a system to remove heat generated by the LED array.
PCT/US2005/009076 2004-03-18 2005-03-18 Direct cooling of leds WO2005089477A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP05725887.3A EP1754259B1 (en) 2004-03-18 2005-03-18 Direct and indirect cooling of leds

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US55463204P 2004-03-18 2004-03-18
US60/554,632 2004-03-18

Publications (2)

Publication Number Publication Date
WO2005089477A2 WO2005089477A2 (en) 2005-09-29
WO2005089477A3 true WO2005089477A3 (en) 2006-12-21

Family

ID=34994377

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/009076 WO2005089477A2 (en) 2004-03-18 2005-03-18 Direct cooling of leds

Country Status (4)

Country Link
US (2) US7235878B2 (en)
EP (1) EP1754259B1 (en)
TW (1) TWI257718B (en)
WO (1) WO2005089477A2 (en)

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US7285445B2 (en) 2007-10-23
US20060216865A1 (en) 2006-09-28
EP1754259A4 (en) 2012-08-08
EP1754259A2 (en) 2007-02-21
TW200534516A (en) 2005-10-16
US20050253252A1 (en) 2005-11-17
EP1754259B1 (en) 2019-07-17
WO2005089477A2 (en) 2005-09-29
TWI257718B (en) 2006-07-01
US7235878B2 (en) 2007-06-26

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