WO2005098462A3 - Probe card and method for constructing same - Google Patents

Probe card and method for constructing same Download PDF

Info

Publication number
WO2005098462A3
WO2005098462A3 PCT/US2005/009984 US2005009984W WO2005098462A3 WO 2005098462 A3 WO2005098462 A3 WO 2005098462A3 US 2005009984 W US2005009984 W US 2005009984W WO 2005098462 A3 WO2005098462 A3 WO 2005098462A3
Authority
WO
WIPO (PCT)
Prior art keywords
probe card
cantilevers
probes
substrate
constructing same
Prior art date
Application number
PCT/US2005/009984
Other languages
French (fr)
Other versions
WO2005098462A2 (en
Inventor
James E Nulty
James A Hunter
Alexander J Herrera
Original Assignee
Cypress Semiconductor Corp
James E Nulty
James A Hunter
Alexander J Herrera
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cypress Semiconductor Corp, James E Nulty, James A Hunter, Alexander J Herrera filed Critical Cypress Semiconductor Corp
Publication of WO2005098462A2 publication Critical patent/WO2005098462A2/en
Publication of WO2005098462A3 publication Critical patent/WO2005098462A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49151—Assembling terminal to base by deforming or shaping
    • Y10T29/49153—Assembling terminal to base by deforming or shaping with shaping or forcing terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Abstract

In one embodiment, a probe card for testing dice on a wafer (240) includes a substrate (120), a number of cantilevers (122) formed on a surface thereof, and a number of probes (128) extending from unsupported ends of the cantilevers. The unsupported ends of the cantilevers (122) project over cavities (124) on the surface of the substrate (120). The probes (128) have tips to contact pads (241) on the dice under test. The probe card may include a compressive layer (130) above the surface of the substrate (120) with a number of holes through which the probes (128) extend.
PCT/US2005/009984 2004-03-26 2005-03-24 Probe card and method for constructing same WO2005098462A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US55655604P 2004-03-26 2004-03-26
US60/556,556 2004-03-26
US11/084,671 US7332921B2 (en) 2004-03-26 2005-03-18 Probe card and method for constructing same
US11/084,671 2005-03-18

Publications (2)

Publication Number Publication Date
WO2005098462A2 WO2005098462A2 (en) 2005-10-20
WO2005098462A3 true WO2005098462A3 (en) 2006-08-17

Family

ID=34989054

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/009984 WO2005098462A2 (en) 2004-03-26 2005-03-24 Probe card and method for constructing same

Country Status (3)

Country Link
US (2) US7332921B2 (en)
TW (1) TWI368740B (en)
WO (1) WO2005098462A2 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6812718B1 (en) 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
US7382142B2 (en) 2000-05-23 2008-06-03 Nanonexus, Inc. High density interconnect system having rapid fabrication cycle
US7952373B2 (en) * 2000-05-23 2011-05-31 Verigy (Singapore) Pte. Ltd. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US7332921B2 (en) * 2004-03-26 2008-02-19 Cypress Semiconductor Corporation Probe card and method for constructing same
JP4535494B2 (en) * 2004-10-20 2010-09-01 ルネサスエレクトロニクス株式会社 Thin film probe sheet manufacturing method and semiconductor chip inspection method
US7489151B2 (en) * 2005-10-03 2009-02-10 Pdf Solutions, Inc. Layout for DUT arrays used in semiconductor wafer testing
TWI276805B (en) * 2005-11-10 2007-03-21 Mjc Probe Inc Probe of probe card and manufacturing method thereof
WO2008127541A1 (en) * 2007-03-22 2008-10-23 Johnson Morgan T Fully tested wafers having bond pads undamaged by probing and applications thereof
KR101153815B1 (en) * 2010-11-16 2012-06-14 에스케이하이닉스 주식회사 Semiconductor apparatus and fabrication method of the same
JP6305736B2 (en) 2013-11-20 2018-04-04 測位衛星技術株式会社 Information management system, data bank apparatus, data management method, database management method, and program
US9459288B2 (en) * 2014-01-16 2016-10-04 Infineon Technologies Ag Wide interposer for an electronic testing system
CN107112292B (en) * 2015-01-28 2021-04-27 惠普发展公司，有限责任合伙企业 Inserter device
US11340260B2 (en) 2019-12-24 2022-05-24 Teradyne, Inc. Probe card pad geometry in automated test equipment
US11333683B2 (en) 2019-12-24 2022-05-17 Teradyne, Inc. Transposed via arrangement in probe card for automated test equipment
US11162980B2 (en) 2019-12-24 2021-11-02 Teradyne, Inc. Coaxial via arrangement in probe card for automated test equipment
US11215641B2 (en) 2019-12-24 2022-01-04 Teradyne, Inc. Probe card assembly in automated test equipment
KR20230165258A (en) * 2021-03-23 2023-12-05 닐슨 싸이언티픽, 엘엘씨 cryogenic probe card

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5172050A (en) * 1991-02-15 1992-12-15 Motorola, Inc. Micromachined semiconductor probe card
US5555422A (en) * 1993-03-10 1996-09-10 Co-Operative Facility For Aging Tester Development Prober for semiconductor integrated circuit element wafer
US6724204B2 (en) * 2001-04-18 2004-04-20 Ic Mems, Inc. Probe structure for testing semiconductor devices and method for fabricating the same
US6759865B1 (en) * 2002-07-30 2004-07-06 Cypress Semiconductor Corporation Array of dice for testing integrated circuits
US6922069B2 (en) * 2003-04-11 2005-07-26 Yulim Hitech, Inc. Needle assembly of probe card

Family Cites Families (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4232928A (en) * 1979-06-27 1980-11-11 Dit-Mco International Corporation Apparatus employing flexible diaphragm for effecting substantially uniform force, individual couplings with multiple electrical contacts or the like
US4754316A (en) * 1982-06-03 1988-06-28 Texas Instruments Incorporated Solid state interconnection system for three dimensional integrated circuit structures
US5380318A (en) * 1986-05-12 1995-01-10 Surgical Laser Technologies, Inc. Contact or insertion laser probe having wide angle radiation
US5070297A (en) * 1990-06-04 1991-12-03 Texas Instruments Incorporated Full wafer integrated circuit testing device
US5061033A (en) * 1990-12-03 1991-10-29 Motorola, Inc. Removable optical interconnect for electronic modules
JP2511621B2 (en) * 1991-09-03 1996-07-03 エイ・ティ・アンド・ティ・コーポレーション Wafer inspection device
US5477160A (en) * 1992-08-12 1995-12-19 Fujitsu Limited Module test card
US5811982A (en) * 1995-11-27 1998-09-22 International Business Machines Corporation High density cantilevered probe for electronic devices
US6064213A (en) * 1993-11-16 2000-05-16 Formfactor, Inc. Wafer-level burn-in and test
US5625299A (en) * 1995-02-03 1997-04-29 Uhling; Thomas F. Multiple lead analog voltage probe with high signal integrity over a wide band width
US5600257A (en) * 1995-08-09 1997-02-04 International Business Machines Corporation Semiconductor wafer test and burn-in
KR0150334B1 (en) * 1995-08-17 1998-12-01 남재우 Probe card having vertical needle
US5807767A (en) * 1996-01-02 1998-09-15 Micron Technology, Inc. Technique for attaching die to leads
JPH09321102A (en) * 1996-05-31 1997-12-12 Tokyo Electron Ltd Inspecting apparatus
US5763879A (en) * 1996-09-16 1998-06-09 Pacific Western Systems Diamond probe tip
US6551844B1 (en) * 1997-01-15 2003-04-22 Formfactor, Inc. Test assembly including a test die for testing a semiconductor product die
US6060891A (en) * 1997-02-11 2000-05-09 Micron Technology, Inc. Probe card for semiconductor wafers and method and system for testing wafers
US5915231A (en) * 1997-02-26 1999-06-22 Micron Technology, Inc. Method in an integrated circuit (IC) manufacturing process for identifying and redirecting IC's mis-processed during their manufacture
TW377482B (en) * 1997-04-08 1999-12-21 Tokyo Electron Ltd Cleaner with protuberances for inspection, inspection apparatus and inspection method for integrated circuits
US6004835A (en) * 1997-04-25 1999-12-21 Micron Technology, Inc. Method of forming integrated circuitry, conductive lines, a conductive grid, a conductive network, an electrical interconnection to anode location and an electrical interconnection with a transistor source/drain region
US5926029A (en) * 1997-05-27 1999-07-20 International Business Machines Corporation Ultra fine probe contacts
EP0915499B1 (en) * 1997-11-05 2011-03-23 Tokyo Electron Limited Semiconductor wafer holding apparatus
US6133610A (en) * 1998-01-20 2000-10-17 International Business Machines Corporation Silicon-on-insulator chip having an isolation barrier for reliability and process of manufacture
US6208155B1 (en) * 1998-01-27 2001-03-27 Cerprobe Corporation Probe tip and method for making electrical contact with a solder ball contact of an integrated circuit device
US6246245B1 (en) * 1998-02-23 2001-06-12 Micron Technology, Inc. Probe card, test method and test system for semiconductor wafers
US20010024127A1 (en) * 1998-03-30 2001-09-27 William E. Bernier Semiconductor testing using electrically conductive adhesives
US6074904A (en) * 1998-04-21 2000-06-13 Advanced Micro Devices, Inc. Method and structure for isolating semiconductor devices after transistor formation
US6246250B1 (en) * 1998-05-11 2001-06-12 Micron Technology, Inc. Probe card having on-board multiplex circuitry for expanding tester resources
US6146970A (en) * 1998-05-26 2000-11-14 Motorola Inc. Capped shallow trench isolation and method of formation
US6452411B1 (en) * 1999-03-01 2002-09-17 Formfactor, Inc. Efficient parallel testing of integrated circuit devices using a known good device to generate expected responses
US6627954B1 (en) * 1999-03-19 2003-09-30 Silicon Wave, Inc. Integrated circuit capacitor in a silicon-on-insulator integrated circuit
JP3565086B2 (en) * 1999-04-16 2004-09-15 富士通株式会社 Probe card and method for testing semiconductor device
US6285081B1 (en) * 1999-07-13 2001-09-04 Micron Technology, Inc. Deflectable interconnect
US6759858B2 (en) * 1999-10-20 2004-07-06 Intel Corporation Integrated circuit test probe having ridge contact
US6400173B1 (en) * 1999-11-19 2002-06-04 Hitachi, Ltd. Test system and manufacturing of semiconductor device
US6469530B1 (en) * 2000-02-15 2002-10-22 Agilent Technologies, Inc. Method and apparatus for testing of ball grid array circuitry
US6661244B2 (en) * 2000-03-06 2003-12-09 Wentworth Laboratories, Inc. Nickel alloy probe card frame laminate
US6366467B1 (en) * 2000-03-31 2002-04-02 Intel Corporation Dual-socket interposer and method of fabrication therefor
US6531335B1 (en) * 2000-04-28 2003-03-11 Micron Technology, Inc. Interposers including upwardly protruding dams, semiconductor device assemblies including the interposers, and methods
US6483330B1 (en) * 2000-09-11 2002-11-19 Eaglestone Partners I, Llc Method for selecting components for a matched set using wafer interposers
US6527563B2 (en) * 2000-10-04 2003-03-04 Gary A. Clayton Grid interposer
US6627484B1 (en) * 2000-11-13 2003-09-30 Advanced Micro Devices, Inc. Method of forming a buried interconnect on a semiconductor on insulator wafer and a device including a buried interconnect
US7381630B2 (en) * 2001-01-02 2008-06-03 The Charles Stark Draper Laboratory, Inc. Method for integrating MEMS device and interposer
US6558994B2 (en) * 2001-03-01 2003-05-06 Chartered Semiconductors Maufacturing Ltd. Dual silicon-on-insulator device wafer die
US6912778B2 (en) * 2001-07-19 2005-07-05 Micron Technology, Inc. Methods of fabricating full-wafer silicon probe cards for burn-in and testing of semiconductor devices
JP4100936B2 (en) * 2002-03-01 2008-06-11 Ｎｅｃエレクトロニクス株式会社 Manufacturing method of semiconductor device
SG111935A1 (en) * 2002-03-04 2005-06-29 Micron Technology Inc Interposer configured to reduce the profiles of semiconductor device assemblies and packages including the same and methods
US6847218B1 (en) * 2002-05-13 2005-01-25 Cypress Semiconductor Corporation Probe card with an adapter layer for testing integrated circuits
US7112974B1 (en) * 2002-05-23 2006-09-26 Cypress Semiconductor Corporation Proble for testing integrated circuits
US6774395B1 (en) * 2003-01-15 2004-08-10 Advanced Micro Devices, Inc. Apparatus and methods for characterizing floating body effects in SOI devices
US7112975B1 (en) * 2003-03-26 2006-09-26 Cypress Semiconductor Corporation Advanced probe card and method of fabricating same
JP2005233858A (en) * 2004-02-23 2005-09-02 Japan Electronic Materials Corp Probe card
US7332921B2 (en) * 2004-03-26 2008-02-19 Cypress Semiconductor Corporation Probe card and method for constructing same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5172050A (en) * 1991-02-15 1992-12-15 Motorola, Inc. Micromachined semiconductor probe card
US5555422A (en) * 1993-03-10 1996-09-10 Co-Operative Facility For Aging Tester Development Prober for semiconductor integrated circuit element wafer
US6724204B2 (en) * 2001-04-18 2004-04-20 Ic Mems, Inc. Probe structure for testing semiconductor devices and method for fabricating the same
US6759865B1 (en) * 2002-07-30 2004-07-06 Cypress Semiconductor Corporation Array of dice for testing integrated circuits
US6922069B2 (en) * 2003-04-11 2005-07-26 Yulim Hitech, Inc. Needle assembly of probe card

Also Published As

Publication number Publication date
TW200602641A (en) 2006-01-16
US7685705B2 (en) 2010-03-30
US20080110019A1 (en) 2008-05-15
WO2005098462A2 (en) 2005-10-20
US20050212540A1 (en) 2005-09-29
US7332921B2 (en) 2008-02-19
TWI368740B (en) 2012-07-21

Similar Documents

Publication Publication Date Title
WO2005098462A3 (en) Probe card and method for constructing same
WO2007002297A8 (en) Temporary planar electrical contact device and method using vertically-compressible nanotube contact structures
WO2006073736A3 (en) Probe head arrays
EP1418436A3 (en) Electrical contactor, especially wafer level contactor, using fluid pressure
TW200624838A (en) Method to build a wirebond probe card in a many at a time fashion
EP1847834A4 (en) Interposer, probe card and method for manufacturing interposer
WO2008045225A3 (en) Probe cards employing probes having retaining portions for potting in a potting region
SG99365A1 (en) Reliable metal bumps on top of i/o pads with test probe marks
WO2007146584A3 (en) Contactor having a global spring structure and methods of making and using the contactor
EP1653473A3 (en) Resistive memory device having array of probes and method of manufacturing the resistive memory device
WO2006014894A3 (en) Method and apparatus for producing co-planar bonding pads on a substrate
WO2009048255A3 (en) Method for wafer test and probe card for the same
TW200615557A (en) Apparatus and method for testing conductive bumps
WO2008093465A1 (en) Testing apparatus and probe card
TW200624820A (en) Reinforced probes for testing semiconductor devices
TW200715440A (en) Method for manufacturing semiconductor integrated circuit device
TW200709316A (en) Substrate and testing method thereof
WO2005043594A3 (en) Method for forming photo-defined micro electrical contacts
WO2000074110A3 (en) Integrated circuit wafer probe card assembly
KR20100055911A (en) Probe and menufacturing method of the same
WO2006002334A3 (en) Intelligent probe chips/heads
WO2008120518A1 (en) Tcp handling apparatus
WO2003035541A3 (en) Probe needle for testing semiconductor chips and method for producing said probe needle
Kandalaft et al. Low-contact resistance probe card using MEMS technology
WO2006065701A3 (en) Interleaved mems-based probes for testing integrated circuits

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
NENP Non-entry into the national phase

Ref country code: DE

WWW Wipo information: withdrawn in national office

Country of ref document: DE

122 Ep: pct application non-entry in european phase