WO2005098462A3 - Probe card and method for constructing same - Google Patents
Probe card and method for constructing same Download PDFInfo
- Publication number
- WO2005098462A3 WO2005098462A3 PCT/US2005/009984 US2005009984W WO2005098462A3 WO 2005098462 A3 WO2005098462 A3 WO 2005098462A3 US 2005009984 W US2005009984 W US 2005009984W WO 2005098462 A3 WO2005098462 A3 WO 2005098462A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- probe card
- cantilevers
- probes
- substrate
- constructing same
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49151—Assembling terminal to base by deforming or shaping
- Y10T29/49153—Assembling terminal to base by deforming or shaping with shaping or forcing terminal into base aperture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Abstract
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US55655604P | 2004-03-26 | 2004-03-26 | |
US60/556,556 | 2004-03-26 | ||
US11/084,671 US7332921B2 (en) | 2004-03-26 | 2005-03-18 | Probe card and method for constructing same |
US11/084,671 | 2005-03-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005098462A2 WO2005098462A2 (en) | 2005-10-20 |
WO2005098462A3 true WO2005098462A3 (en) | 2006-08-17 |
Family
ID=34989054
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/009984 WO2005098462A2 (en) | 2004-03-26 | 2005-03-24 | Probe card and method for constructing same |
Country Status (3)
Country | Link |
---|---|
US (2) | US7332921B2 (en) |
TW (1) | TWI368740B (en) |
WO (1) | WO2005098462A2 (en) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
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US6812718B1 (en) | 1999-05-27 | 2004-11-02 | Nanonexus, Inc. | Massively parallel interface for electronic circuits |
US7382142B2 (en) | 2000-05-23 | 2008-06-03 | Nanonexus, Inc. | High density interconnect system having rapid fabrication cycle |
US7952373B2 (en) * | 2000-05-23 | 2011-05-31 | Verigy (Singapore) Pte. Ltd. | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
US7332921B2 (en) * | 2004-03-26 | 2008-02-19 | Cypress Semiconductor Corporation | Probe card and method for constructing same |
JP4535494B2 (en) * | 2004-10-20 | 2010-09-01 | ルネサスエレクトロニクス株式会社 | Thin film probe sheet manufacturing method and semiconductor chip inspection method |
US7489151B2 (en) * | 2005-10-03 | 2009-02-10 | Pdf Solutions, Inc. | Layout for DUT arrays used in semiconductor wafer testing |
TWI276805B (en) * | 2005-11-10 | 2007-03-21 | Mjc Probe Inc | Probe of probe card and manufacturing method thereof |
WO2008127541A1 (en) * | 2007-03-22 | 2008-10-23 | Johnson Morgan T | Fully tested wafers having bond pads undamaged by probing and applications thereof |
KR101153815B1 (en) * | 2010-11-16 | 2012-06-14 | 에스케이하이닉스 주식회사 | Semiconductor apparatus and fabrication method of the same |
JP6305736B2 (en) | 2013-11-20 | 2018-04-04 | 測位衛星技術株式会社 | Information management system, data bank apparatus, data management method, database management method, and program |
US9459288B2 (en) * | 2014-01-16 | 2016-10-04 | Infineon Technologies Ag | Wide interposer for an electronic testing system |
CN107112292B (en) * | 2015-01-28 | 2021-04-27 | 惠普发展公司,有限责任合伙企业 | Inserter device |
US11340260B2 (en) | 2019-12-24 | 2022-05-24 | Teradyne, Inc. | Probe card pad geometry in automated test equipment |
US11333683B2 (en) | 2019-12-24 | 2022-05-17 | Teradyne, Inc. | Transposed via arrangement in probe card for automated test equipment |
US11162980B2 (en) | 2019-12-24 | 2021-11-02 | Teradyne, Inc. | Coaxial via arrangement in probe card for automated test equipment |
US11215641B2 (en) | 2019-12-24 | 2022-01-04 | Teradyne, Inc. | Probe card assembly in automated test equipment |
KR20230165258A (en) * | 2021-03-23 | 2023-12-05 | 닐슨 싸이언티픽, 엘엘씨 | cryogenic probe card |
Citations (5)
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US5172050A (en) * | 1991-02-15 | 1992-12-15 | Motorola, Inc. | Micromachined semiconductor probe card |
US5555422A (en) * | 1993-03-10 | 1996-09-10 | Co-Operative Facility For Aging Tester Development | Prober for semiconductor integrated circuit element wafer |
US6724204B2 (en) * | 2001-04-18 | 2004-04-20 | Ic Mems, Inc. | Probe structure for testing semiconductor devices and method for fabricating the same |
US6759865B1 (en) * | 2002-07-30 | 2004-07-06 | Cypress Semiconductor Corporation | Array of dice for testing integrated circuits |
US6922069B2 (en) * | 2003-04-11 | 2005-07-26 | Yulim Hitech, Inc. | Needle assembly of probe card |
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US7112974B1 (en) * | 2002-05-23 | 2006-09-26 | Cypress Semiconductor Corporation | Proble for testing integrated circuits |
US6774395B1 (en) * | 2003-01-15 | 2004-08-10 | Advanced Micro Devices, Inc. | Apparatus and methods for characterizing floating body effects in SOI devices |
US7112975B1 (en) * | 2003-03-26 | 2006-09-26 | Cypress Semiconductor Corporation | Advanced probe card and method of fabricating same |
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US7332921B2 (en) * | 2004-03-26 | 2008-02-19 | Cypress Semiconductor Corporation | Probe card and method for constructing same |
-
2005
- 2005-03-18 US US11/084,671 patent/US7332921B2/en not_active Expired - Fee Related
- 2005-03-24 WO PCT/US2005/009984 patent/WO2005098462A2/en active Application Filing
- 2005-03-25 TW TW094109340A patent/TWI368740B/en not_active IP Right Cessation
-
2008
- 2008-01-11 US US12/008,483 patent/US7685705B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5172050A (en) * | 1991-02-15 | 1992-12-15 | Motorola, Inc. | Micromachined semiconductor probe card |
US5555422A (en) * | 1993-03-10 | 1996-09-10 | Co-Operative Facility For Aging Tester Development | Prober for semiconductor integrated circuit element wafer |
US6724204B2 (en) * | 2001-04-18 | 2004-04-20 | Ic Mems, Inc. | Probe structure for testing semiconductor devices and method for fabricating the same |
US6759865B1 (en) * | 2002-07-30 | 2004-07-06 | Cypress Semiconductor Corporation | Array of dice for testing integrated circuits |
US6922069B2 (en) * | 2003-04-11 | 2005-07-26 | Yulim Hitech, Inc. | Needle assembly of probe card |
Also Published As
Publication number | Publication date |
---|---|
TW200602641A (en) | 2006-01-16 |
US7685705B2 (en) | 2010-03-30 |
US20080110019A1 (en) | 2008-05-15 |
WO2005098462A2 (en) | 2005-10-20 |
US20050212540A1 (en) | 2005-09-29 |
US7332921B2 (en) | 2008-02-19 |
TWI368740B (en) | 2012-07-21 |
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