WO2005098911A1 - 移動体の駆動方法、ステージ装置及び露光装置 - Google Patents
移動体の駆動方法、ステージ装置及び露光装置 Download PDFInfo
- Publication number
- WO2005098911A1 WO2005098911A1 PCT/JP2005/006739 JP2005006739W WO2005098911A1 WO 2005098911 A1 WO2005098911 A1 WO 2005098911A1 JP 2005006739 W JP2005006739 W JP 2005006739W WO 2005098911 A1 WO2005098911 A1 WO 2005098911A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- moving body
- stage
- driving
- axis
- axis direction
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70766—Reaction force control means, e.g. countermass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05728443A EP1746637B1 (en) | 2004-04-09 | 2005-04-06 | Drive method for mobile body, stage device, and exposure device |
US11/547,245 US7852034B2 (en) | 2004-04-09 | 2005-04-06 | Drive method of moving body, stage unit, and exposure apparatus |
JP2006512094A JP5130714B2 (ja) | 2004-04-09 | 2005-04-06 | 移動体の駆動方法、ステージ装置、露光装置、露光方法、及びデバイス製造方法 |
KR1020067020950A KR101206671B1 (ko) | 2004-04-09 | 2005-04-06 | 이동체의 구동 방법, 스테이지 장치 및 노광 장치 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004-116043 | 2004-04-09 | ||
JP2004116043 | 2004-04-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005098911A1 true WO2005098911A1 (ja) | 2005-10-20 |
Family
ID=35125349
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/006739 WO2005098911A1 (ja) | 2004-04-09 | 2005-04-06 | 移動体の駆動方法、ステージ装置及び露光装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7852034B2 (ja) |
EP (1) | EP1746637B1 (ja) |
JP (1) | JP5130714B2 (ja) |
KR (1) | KR101206671B1 (ja) |
WO (1) | WO2005098911A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011002441A (ja) * | 2008-09-22 | 2011-01-06 | Nikon Corp | 移動体装置、露光装置及び露光方法、並びにデバイス製造方法 |
US8325326B2 (en) | 2004-06-07 | 2012-12-04 | Nikon Corporation | Stage unit, exposure apparatus, and exposure method |
JP2013239721A (ja) * | 2008-09-22 | 2013-11-28 | Nikon Corp | 露光装置及び露光方法、並びにデバイス製造方法 |
JP7433181B2 (ja) | 2020-09-23 | 2024-02-19 | 株式会社Screenホールディングス | 描画装置 |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7442476B2 (en) * | 2004-12-27 | 2008-10-28 | Asml Netherlands B.V. | Method and system for 3D alignment in wafer scale integration |
US8120304B2 (en) * | 2008-12-12 | 2012-02-21 | Formfactor, Inc. | Method for improving motion times of a stage |
US8773635B2 (en) * | 2008-12-19 | 2014-07-08 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
US8472008B2 (en) * | 2009-06-19 | 2013-06-25 | Nikon Corporation | Movable body apparatus, exposure apparatus and device manufacturing method |
US20110008734A1 (en) | 2009-06-19 | 2011-01-13 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US8446569B2 (en) * | 2009-06-19 | 2013-05-21 | Nikon Corporation | Exposure apparatus, exposure method and device manufacturing method |
US8355116B2 (en) | 2009-06-19 | 2013-01-15 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US8355114B2 (en) | 2009-06-19 | 2013-01-15 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US8294878B2 (en) | 2009-06-19 | 2012-10-23 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US20110085150A1 (en) | 2009-09-30 | 2011-04-14 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
US20110075120A1 (en) | 2009-09-30 | 2011-03-31 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
US20110086315A1 (en) | 2009-09-30 | 2011-04-14 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
WO2011052703A1 (en) | 2009-10-30 | 2011-05-05 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US8598538B2 (en) * | 2010-09-07 | 2013-12-03 | Nikon Corporation | Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method |
JP5677025B2 (ja) * | 2010-10-22 | 2015-02-25 | 株式会社トプコン | 載置ステージ |
CN106933051B (zh) * | 2015-12-31 | 2019-04-12 | 上海微电子装备(集团)股份有限公司 | 运动台装置、曝光装置及光刻机 |
US10192773B2 (en) * | 2016-06-20 | 2019-01-29 | Nexperia B.V. | Semiconductor device positioning system and method for semiconductor device positioning |
WO2018024529A1 (en) * | 2016-08-04 | 2018-02-08 | Asml Netherlands B.V. | Positioning system, control system, method to position, lithographic apparatus and device manufacturing method |
Citations (5)
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JP2000206279A (ja) | 1999-01-11 | 2000-07-28 | Canon Inc | 位置決め装置、露光装置およびデバイス製造方法 |
JP2002208562A (ja) | 2000-12-20 | 2002-07-26 | Nikon Corp | 露光装置及び露光方法 |
US20030142281A1 (en) | 1999-12-16 | 2003-07-31 | Nikon Corporation | Exposure method and apparatus |
WO2003063212A1 (fr) | 2002-01-21 | 2003-07-31 | Nikon Corporation | Dispositif de platine et dispositif d'exposition |
JP2003243279A (ja) * | 2002-02-13 | 2003-08-29 | Nikon Corp | 駆動装置、ステージ装置、露光方法、及び露光装置 |
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JPS6144429A (ja) | 1984-08-09 | 1986-03-04 | Nippon Kogaku Kk <Nikon> | 位置合わせ方法、及び位置合せ装置 |
US4780617A (en) | 1984-08-09 | 1988-10-25 | Nippon Kogaku K.K. | Method for successive alignment of chip patterns on a substrate |
KR100300618B1 (ko) | 1992-12-25 | 2001-11-22 | 오노 시게오 | 노광방법,노광장치,및그장치를사용하는디바이스제조방법 |
JP3316833B2 (ja) | 1993-03-26 | 2002-08-19 | 株式会社ニコン | 走査露光方法、面位置設定装置、走査型露光装置、及び前記方法を使用するデバイス製造方法 |
JP3412704B2 (ja) | 1993-02-26 | 2003-06-03 | 株式会社ニコン | 投影露光方法及び装置、並びに露光装置 |
US7365513B1 (en) | 1994-04-01 | 2008-04-29 | Nikon Corporation | Positioning device having dynamically isolated frame, and lithographic device provided with such a positioning device |
US5528118A (en) | 1994-04-01 | 1996-06-18 | Nikon Precision, Inc. | Guideless stage with isolated reaction stage |
US6989647B1 (en) | 1994-04-01 | 2006-01-24 | Nikon Corporation | Positioning device having dynamically isolated frame, and lithographic device provided with such a positioning device |
US5874820A (en) | 1995-04-04 | 1999-02-23 | Nikon Corporation | Window frame-guided stage mechanism |
GB2290568B (en) | 1994-06-25 | 1997-09-03 | Phi Design Ltd | A ventilated tile |
US6246204B1 (en) | 1994-06-27 | 2001-06-12 | Nikon Corporation | Electromagnetic alignment and scanning apparatus |
JP3800616B2 (ja) * | 1994-06-27 | 2006-07-26 | 株式会社ニコン | 目標物移動装置、位置決め装置及び可動ステージ装置 |
US6008500A (en) | 1995-04-04 | 1999-12-28 | Nikon Corporation | Exposure apparatus having dynamically isolated reaction frame |
AU2747999A (en) | 1998-03-26 | 1999-10-18 | Nikon Corporation | Projection exposure method and system |
US6885430B2 (en) | 2000-11-16 | 2005-04-26 | Nikon Corporation | System and method for resetting a reaction mass assembly of a stage assembly |
US6958808B2 (en) | 2000-11-16 | 2005-10-25 | Nikon Corporation | System and method for resetting a reaction mass assembly of a stage assembly |
JP2004140145A (ja) | 2002-10-17 | 2004-05-13 | Nikon Corp | 露光装置 |
US20040119436A1 (en) | 2002-12-23 | 2004-06-24 | Michael Binnard | Method and apparatus for reducing countermass stroke with initial velocity |
US6963821B2 (en) | 2003-02-11 | 2005-11-08 | Nikon Corporation | Stage counter mass system |
EP1780786A4 (en) * | 2004-06-07 | 2009-11-25 | Nikon Corp | STAGE DEVICE, EXPOSURE DEVICE AND EXPOSURE METHOD |
US8994923B2 (en) * | 2008-09-22 | 2015-03-31 | Nikon Corporation | Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method |
-
2005
- 2005-04-06 EP EP05728443A patent/EP1746637B1/en not_active Not-in-force
- 2005-04-06 WO PCT/JP2005/006739 patent/WO2005098911A1/ja active Application Filing
- 2005-04-06 JP JP2006512094A patent/JP5130714B2/ja not_active Expired - Fee Related
- 2005-04-06 US US11/547,245 patent/US7852034B2/en active Active
- 2005-04-06 KR KR1020067020950A patent/KR101206671B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000206279A (ja) | 1999-01-11 | 2000-07-28 | Canon Inc | 位置決め装置、露光装置およびデバイス製造方法 |
US20030142281A1 (en) | 1999-12-16 | 2003-07-31 | Nikon Corporation | Exposure method and apparatus |
JP2002208562A (ja) | 2000-12-20 | 2002-07-26 | Nikon Corp | 露光装置及び露光方法 |
WO2003063212A1 (fr) | 2002-01-21 | 2003-07-31 | Nikon Corporation | Dispositif de platine et dispositif d'exposition |
JP2003243279A (ja) * | 2002-02-13 | 2003-08-29 | Nikon Corp | 駆動装置、ステージ装置、露光方法、及び露光装置 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8325326B2 (en) | 2004-06-07 | 2012-12-04 | Nikon Corporation | Stage unit, exposure apparatus, and exposure method |
JP2011002441A (ja) * | 2008-09-22 | 2011-01-06 | Nikon Corp | 移動体装置、露光装置及び露光方法、並びにデバイス製造方法 |
JP2013239721A (ja) * | 2008-09-22 | 2013-11-28 | Nikon Corp | 露光装置及び露光方法、並びにデバイス製造方法 |
US8994923B2 (en) | 2008-09-22 | 2015-03-31 | Nikon Corporation | Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method |
US8994924B2 (en) | 2008-09-22 | 2015-03-31 | Nikon Corporation | Movable body apparatus, movable body drive method, exposure apparatus, exposure method, and device manufacturing method |
JP7433181B2 (ja) | 2020-09-23 | 2024-02-19 | 株式会社Screenホールディングス | 描画装置 |
Also Published As
Publication number | Publication date |
---|---|
JP5130714B2 (ja) | 2013-01-30 |
EP1746637A4 (en) | 2010-03-10 |
US20080143994A1 (en) | 2008-06-19 |
KR20070011366A (ko) | 2007-01-24 |
KR101206671B1 (ko) | 2012-11-29 |
EP1746637A1 (en) | 2007-01-24 |
US7852034B2 (en) | 2010-12-14 |
JPWO2005098911A1 (ja) | 2008-03-06 |
EP1746637B1 (en) | 2012-06-20 |
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