WO2005100961A3 - Imaging semiconductor strucutures using solid state illumination - Google Patents

Imaging semiconductor strucutures using solid state illumination Download PDF

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Publication number
WO2005100961A3
WO2005100961A3 PCT/US2005/013448 US2005013448W WO2005100961A3 WO 2005100961 A3 WO2005100961 A3 WO 2005100961A3 US 2005013448 W US2005013448 W US 2005013448W WO 2005100961 A3 WO2005100961 A3 WO 2005100961A3
Authority
WO
WIPO (PCT)
Prior art keywords
solid state
strucutures
state illumination
imaging semiconductor
imaging
Prior art date
Application number
PCT/US2005/013448
Other languages
French (fr)
Other versions
WO2005100961A2 (en
Inventor
Mark D Owen
Francois Vlach
Steven J Olson
Original Assignee
Phoseon Technology Inc
Mark D Owen
Francois Vlach
Steven J Olson
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoseon Technology Inc, Mark D Owen, Francois Vlach, Steven J Olson filed Critical Phoseon Technology Inc
Priority to EP05745456.3A priority Critical patent/EP1738156A4/en
Publication of WO2005100961A2 publication Critical patent/WO2005100961A2/en
Publication of WO2005100961A3 publication Critical patent/WO2005100961A3/en

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers
    • G01N21/9505Wafer internal defects, e.g. microcracks
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects

Abstract

The invention consists of a camera, light sources, lenses and software algorithms that are used to image and inspect semiconductor structures, including through infrared radiation. The use of various configurations of solid state lighting and software algorithms enhances the imaging and inspection.
PCT/US2005/013448 2004-04-19 2005-04-19 Imaging semiconductor strucutures using solid state illumination WO2005100961A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP05745456.3A EP1738156A4 (en) 2004-04-19 2005-04-19 Imaging semiconductor strucutures using solid state illumination

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US56385604P 2004-04-19 2004-04-19
US60/563,856 2004-04-19

Publications (2)

Publication Number Publication Date
WO2005100961A2 WO2005100961A2 (en) 2005-10-27
WO2005100961A3 true WO2005100961A3 (en) 2007-02-08

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/013448 WO2005100961A2 (en) 2004-04-19 2005-04-19 Imaging semiconductor strucutures using solid state illumination

Country Status (4)

Country Link
US (1) US8077305B2 (en)
EP (1) EP1738156A4 (en)
TW (1) TWI302756B (en)
WO (1) WO2005100961A2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8496356B2 (en) 2002-05-08 2013-07-30 Phoseon Technology, Inc. High efficiency solid-state light source and methods of use and manufacture
US8637332B2 (en) 2004-03-18 2014-01-28 Phoseon Technology, Inc. Micro-reflectors on a substrate for high-density LED array

Families Citing this family (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2839147B1 (en) * 2002-04-30 2004-07-09 Soitec Silicon On Insulator DEVICE AND METHOD FOR AUTOMATICALLY CONTROLLING THE CONDITION OF THE PLATE SURFACE BY MEASURING THE ADHESIVE SPEED
US7819550B2 (en) 2003-10-31 2010-10-26 Phoseon Technology, Inc. Collection optics for led array with offset hemispherical or faceted surfaces
US7235878B2 (en) 2004-03-18 2007-06-26 Phoseon Technology, Inc. Direct cooling of LEDs
EP1743384B1 (en) * 2004-03-30 2015-08-05 Phoseon Technology, Inc. Led array having array-based led detectors
WO2005101535A2 (en) * 2004-04-12 2005-10-27 Phoseon Technology, Inc. High density led array
US8077305B2 (en) 2004-04-19 2011-12-13 Owen Mark D Imaging semiconductor structures using solid state illumination
JP4800324B2 (en) 2004-12-30 2011-10-26 フォーセン テクノロジー インク Exposure equipment
JP4778755B2 (en) * 2005-09-09 2011-09-21 株式会社日立ハイテクノロジーズ Defect inspection method and apparatus using the same
DE102005061785B4 (en) * 2005-12-23 2008-04-03 Basler Ag Method and apparatus for detecting cracks in silicon wafers
JP4707605B2 (en) 2006-05-16 2011-06-22 三菱電機株式会社 Image inspection method and image inspection apparatus using the method
US8363048B2 (en) * 2006-11-16 2013-01-29 General Electric Company Methods and apparatus for visualizing data
US7561329B2 (en) 2006-12-14 2009-07-14 Cytyc Corporation Illumination source for stained biological samples
US8115213B2 (en) * 2007-02-08 2012-02-14 Phoseon Technology, Inc. Semiconductor light sources, systems, and methods
JP4407707B2 (en) * 2007-03-02 2010-02-03 日産自動車株式会社 IMAGING DEVICE, IMAGE DISPLAY SYSTEM, AND IMAGING DEVICE CONTROL METHOD
WO2008119550A1 (en) * 2007-04-02 2008-10-09 Viscom Ag Inspection apparatus and method
EP2137518B1 (en) * 2007-04-16 2017-11-29 Viscom Ag Through-substrate optical imaging device and method
WO2008152020A1 (en) * 2007-06-12 2008-12-18 Icos Vision Systems Nv Method for semiconductor substrate inspection
WO2009027517A1 (en) 2007-08-31 2009-03-05 Icos Vision Systems Nv Apparatus and method for detecting semiconductor substrate anomalies
US8605256B2 (en) * 2008-02-26 2013-12-10 3M Innovative Properties Company Multi-photon exposure system
US7891159B2 (en) * 2008-05-30 2011-02-22 Cryovac, Inc. Method for positioning a loaded bag in a vacuum chamber
GB2461510A (en) * 2008-06-30 2010-01-06 Ubidyne Inc Reconfigurable Bandpass Delta-Sigma Modulator
SG158782A1 (en) 2008-07-28 2010-02-26 Chan Sok Leng Method and system for detecting micro-cracks in wafers
SG158787A1 (en) 2008-07-28 2010-02-26 Chan Sok Leng Apparatus for detecting micro-cracks in wafers and method therefor
US20100193412A1 (en) * 2009-02-02 2010-08-05 Satake Usa, Inc. Beam splitter
CN102378909B (en) 2009-04-30 2014-07-02 威尔科克斯联营公司 An inspection method and an inspection apparatus
EP2284523A1 (en) * 2009-07-28 2011-02-16 VITRONIC Dr.-Ing. Stein Bildverarbeitungssysteme GmbH Method and device for inspecting at least one solar cell
DE102009050711A1 (en) * 2009-10-26 2011-05-05 Schott Ag Method and device for detecting cracks in semiconductor substrates
US8138476B2 (en) * 2009-11-05 2012-03-20 The Aerospace Corporation Refraction assisted illumination for imaging
US8461532B2 (en) 2009-11-05 2013-06-11 The Aerospace Corporation Refraction assisted illumination for imaging
US8450688B2 (en) 2009-11-05 2013-05-28 The Aerospace Corporation Refraction assisted illumination for imaging
WO2011060401A1 (en) * 2009-11-16 2011-05-19 Rudolph Technologies, Inc. Infrared inspection of bonded substrates
TWI412736B (en) * 2009-12-04 2013-10-21 Delta Electronics Inc A apparatus and method for inspecting inner defect of substrate
US8947664B2 (en) * 2009-12-23 2015-02-03 Infineon Technologies Ag Apparatus and method for aligning a wafer's backside to a wafer's frontside
EP2556350A4 (en) * 2010-04-09 2017-10-18 Northeastern University A tunable laser-based infrared imaging system and method of use thereof
KR101214806B1 (en) * 2010-05-11 2012-12-24 가부시키가이샤 사무코 Apparatus and method for defect inspection of wafer
TWI422814B (en) * 2010-08-23 2014-01-11 Delta Electronics Inc An apparatus and method for inspecting inner defect of substrate
JP5451894B2 (en) * 2010-09-22 2014-03-26 富士フイルム株式会社 Stereo imaging device and shading correction method
US8766192B2 (en) * 2010-11-01 2014-07-01 Asm Assembly Automation Ltd Method for inspecting a photovoltaic substrate
JP6000546B2 (en) 2011-06-30 2016-09-28 浜松ホトニクス株式会社 Optical device for microscopic observation
KR102093108B1 (en) * 2012-05-09 2020-03-25 시게이트 테크놀로지 엘엘씨 Surface features mapping
US8896827B2 (en) 2012-06-26 2014-11-25 Kla-Tencor Corporation Diode laser based broad band light sources for wafer inspection tools
US9212900B2 (en) * 2012-08-11 2015-12-15 Seagate Technology Llc Surface features characterization
FR2994734B1 (en) * 2012-08-21 2017-08-25 Fogale Nanotech DEVICE AND METHOD FOR MAKING DIMENSION MEASUREMENTS ON MULTI-LAYER OBJECTS SUCH AS WAFERS.
US9427776B2 (en) * 2012-08-23 2016-08-30 Raytheon Company Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays
JP5862522B2 (en) * 2012-09-06 2016-02-16 株式会社島津製作所 Inspection device
US9297759B2 (en) 2012-10-05 2016-03-29 Seagate Technology Llc Classification of surface features using fluorescence
US9297751B2 (en) 2012-10-05 2016-03-29 Seagate Technology Llc Chemical characterization of surface features
US9377394B2 (en) * 2012-10-16 2016-06-28 Seagate Technology Llc Distinguishing foreign surface features from native surface features
US9007454B2 (en) 2012-10-31 2015-04-14 The Aerospace Corporation Optimized illumination for imaging
US9217714B2 (en) 2012-12-06 2015-12-22 Seagate Technology Llc Reflective surfaces for surface features of an article
US9274064B2 (en) 2013-05-30 2016-03-01 Seagate Technology Llc Surface feature manager
US9217715B2 (en) 2013-05-30 2015-12-22 Seagate Technology Llc Apparatuses and methods for magnetic features of articles
US9201019B2 (en) 2013-05-30 2015-12-01 Seagate Technology Llc Article edge inspection
US9513215B2 (en) 2013-05-30 2016-12-06 Seagate Technology Llc Surface features by azimuthal angle
DE102013112885A1 (en) * 2013-11-21 2015-05-21 Osram Opto Semiconductors Gmbh Method for optically characterizing an optoelectronic semiconductor material and device for carrying out the method
MX364011B (en) 2014-05-05 2019-04-11 Arconic Inc Apparatus and methods for weld measurement.
US9766169B2 (en) * 2014-05-16 2017-09-19 Arconic Inc. Peeling apparatus and method for separating welded layers
US20160056065A1 (en) * 2014-08-25 2016-02-25 Robert E. Stahlbush Method and apparatus for removing experimental artifacts from ensemble images
ES2757920T3 (en) 2015-04-14 2020-04-30 Sealed Air Corp Method of positioning and sealing a bag in a vacuum chamber, bag positioning and sealing apparatus
GB2549071B (en) * 2016-03-23 2020-11-11 Sony Interactive Entertainment Inc 3D printing system
JP7134096B2 (en) * 2016-06-02 2022-09-09 東京エレクトロン株式会社 Substrate inspection method, device and system
KR20170138207A (en) * 2016-06-07 2017-12-15 삼성전자주식회사 Method for Inspecting Surface
US11137356B2 (en) * 2017-11-03 2021-10-05 Sela Semiconductor Engineering Laboratories Ltd. System and method of cleaving of buried defects
WO2019094442A1 (en) * 2017-11-07 2019-05-16 Abb Schweiz Ag Method and apparatus for imaging analysis of a switchgear or the like
CN108593564B (en) * 2018-02-11 2021-01-29 常德金德新材料科技股份有限公司 Color quality detection method for cigarette label printing stock
TW202036059A (en) * 2018-11-07 2020-10-01 荷蘭商露明控股公司 Illumination module
CN109540918B (en) * 2018-11-28 2021-04-16 鞍钢集团自动化有限公司 Hot-rolled coil edge defect detection device and method
TWI802843B (en) * 2021-02-04 2023-05-21 敬鵬工業股份有限公司 Intelligent logistics data collection system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4595289A (en) * 1984-01-25 1986-06-17 At&T Bell Laboratories Inspection system utilizing dark-field illumination
US5892579A (en) * 1996-07-16 1999-04-06 Orbot Instruments Ltd. Optical inspection method and apparatus
US6141040A (en) * 1996-01-09 2000-10-31 Agilent Technologies, Inc. Measurement and inspection of leads on integrated circuit packages

Family Cites Families (150)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1218852A (en) * 1968-04-02 1971-01-13 English Electric Co Ltd High voltage thyristor equipment
US4435732A (en) * 1973-06-04 1984-03-06 Hyatt Gilbert P Electro-optical illumination control system
US3936686A (en) 1973-05-07 1976-02-03 Moore Donald W Reflector lamp cooling and containing assemblies
US4011575A (en) * 1974-07-26 1977-03-08 Litton Systems, Inc. Light emitting diode array having a plurality of conductive paths for each light emitting diode
US4118873A (en) 1976-12-13 1978-10-10 Airco, Inc. Method and apparatus for inerting the atmosphere above a moving product surface
JPS57180005A (en) 1981-04-30 1982-11-05 Hitachi Ltd Silicon carbide electric insulator with low dielectric constant
US4530040A (en) 1984-03-08 1985-07-16 Rayovac Corporation Optical focusing system
US4680644A (en) * 1984-07-23 1987-07-14 Canon Kabushiki Kaisha Method and apparatus for reading an image
JPH0825302B1 (en) 1984-09-27 1996-03-13 Sanyo Denki Kk
DE3578768D1 (en) * 1985-03-14 1990-08-23 Toppan Printing Co Ltd DEVICE FOR CHECKING PRINTING.
US4684801A (en) * 1986-02-28 1987-08-04 Carroll Touch Inc. Signal preconditioning for touch entry device
KR880014692A (en) * 1987-05-30 1988-12-24 강진구 Semiconductor Light Emitting Device with Reflector
GB2224374A (en) 1988-08-24 1990-05-02 Plessey Co Plc Temperature control of light-emitting devices
DE8815418U1 (en) 1988-12-12 1989-02-16 Isensee-Electronic-Gmbh, 7012 Fellbach, De
EP0454174B1 (en) * 1990-04-27 1997-03-05 Omron Corporation Light emitting semiconductor device with Fresnel lens
JPH0424541A (en) * 1990-05-21 1992-01-28 Mitsui Mining & Smelting Co Ltd Method and apparatus for measuring internal defect
US5018853A (en) * 1990-06-04 1991-05-28 Bear Automotive Service Equipment Company Angle sensor with CCD
US5150623A (en) 1990-07-17 1992-09-29 The Boeing Company Inspection device for flush head bolts and rivets
US5032734A (en) * 1990-10-15 1991-07-16 Vti, Inc. Method and apparatus for nondestructively measuring micro defects in materials
US5195102A (en) * 1991-09-13 1993-03-16 Litton Systems Inc. Temperature controlled laser diode package
JP3025109B2 (en) * 1992-03-11 2000-03-27 シャープ株式会社 Light source and light source device
US5397867A (en) * 1992-09-04 1995-03-14 Lucas Industries, Inc. Light distribution for illuminated keyboard switches and displays
JPH06301304A (en) 1993-02-19 1994-10-28 Minolta Camera Co Ltd Fixing device
US6118383A (en) 1993-05-07 2000-09-12 Hegyi; Dennis J. Multi-function light sensor for vehicle
FR2707223B1 (en) * 1993-07-07 1995-09-29 Valeo Vision Improved signaling light with light-emitting diodes.
US5424544A (en) * 1994-04-29 1995-06-13 Texas Instruments Incorporated Inter-pixel thermal isolation for hybrid thermal detectors
US5449926A (en) 1994-05-09 1995-09-12 Motorola, Inc. High density LED arrays with semiconductor interconnects
US5632551A (en) 1994-07-18 1997-05-27 Grote Industries, Inc. LED vehicle lamp assembly
US5698866A (en) 1994-09-19 1997-12-16 Pdt Systems, Inc. Uniform illuminator for phototherapy
US5555038A (en) * 1994-10-28 1996-09-10 Bausch & Lomb Incorporated Unitary lens for eyewear
US5660461A (en) * 1994-12-08 1997-08-26 Quantum Devices, Inc. Arrays of optoelectronic devices and method of making same
US5522225A (en) * 1994-12-19 1996-06-04 Xerox Corporation Thermoelectric cooler and temperature sensor subassembly with improved temperature control
US5554849A (en) * 1995-01-17 1996-09-10 Flir Systems, Inc. Micro-bolometric infrared staring array
US5623510A (en) 1995-05-08 1997-04-22 The United States Of America As Represented By The United States Department Of Energy Tunable, diode side-pumped Er: YAG laser
US20020054291A1 (en) * 1997-06-27 2002-05-09 Tsai Bin-Ming Benjamin Inspection system simultaneously utilizing monochromatic darkfield and broadband brightfield illumination sources
US5719589A (en) 1996-01-11 1998-02-17 Motorola, Inc. Organic light emitting diode array drive apparatus
US5981949A (en) * 1996-01-18 1999-11-09 The United States Of America As Represented By The Secretary Of The Air Force Locating defects in solid material
US5806965A (en) * 1996-01-30 1998-09-15 R&M Deese, Inc. LED beacon light
US5936353A (en) * 1996-04-03 1999-08-10 Pressco Technology Inc. High-density solid-state lighting array for machine vision applications
US5777729A (en) * 1996-05-07 1998-07-07 Nikon Corporation Wafer inspection method and apparatus using diffracted light
US5880828A (en) * 1996-07-26 1999-03-09 Hitachi Electronics Engineering Co., Ltd. Surface defect inspection device and shading correction method therefor
US6058012A (en) * 1996-08-26 2000-05-02 Compaq Computer Corporation Apparatus, method and system for thermal management of an electronic system having semiconductor devices
US5857767A (en) * 1996-09-23 1999-01-12 Relume Corporation Thermal management system for L.E.D. arrays
US5715270A (en) 1996-09-27 1998-02-03 Mcdonnell Douglas Corporation High efficiency, high power direct diode laser systems and methods therefor
US5910706A (en) 1996-12-18 1999-06-08 Ultra Silicon Technology (Uk) Limited Laterally transmitting thin film electroluminescent device
TW402856B (en) 1996-12-26 2000-08-21 Palite Corp LED illuminator
US5783909A (en) * 1997-01-10 1998-07-21 Relume Corporation Maintaining LED luminous intensity
US5877899A (en) 1997-05-13 1999-03-02 Northeast Robotics Llc Imaging system and method for imaging indicia on wafer
US6319425B1 (en) 1997-07-07 2001-11-20 Asahi Rubber Inc. Transparent coating member for light-emitting diodes and a fluorescent color light source
US6376329B1 (en) 1997-08-04 2002-04-23 Nikon Corporation Semiconductor wafer alignment using backside illumination
US6459919B1 (en) * 1997-08-26 2002-10-01 Color Kinetics, Incorporated Precision illumination methods and systems
US6577332B2 (en) 1997-09-12 2003-06-10 Ricoh Company, Ltd. Optical apparatus and method of manufacturing optical apparatus
US6163036A (en) * 1997-09-15 2000-12-19 Oki Data Corporation Light emitting element module with a parallelogram-shaped chip and a staggered chip array
US6273596B1 (en) 1997-09-23 2001-08-14 Teledyne Lighting And Display Products, Inc. Illuminating lens designed by extrinsic differential geometry
US6200134B1 (en) * 1998-01-20 2001-03-13 Kerr Corporation Apparatus and method for curing materials with radiation
EP0935145A1 (en) 1998-02-04 1999-08-11 IMS Industrial Micro System AG Optical signal and display device
US6239702B1 (en) 1998-03-10 2001-05-29 Raytheon Company Electromagnetic energy detection
US6088185A (en) * 1998-06-05 2000-07-11 Seagate Technology, Inc. Rotational vibration detection using a velocity sense coil
US6536923B1 (en) * 1998-07-01 2003-03-25 Sidler Gmbh & Co. Optical attachment for a light-emitting diode and brake light for a motor vehicle
JP3195294B2 (en) * 1998-08-27 2001-08-06 スタンレー電気株式会社 Vehicle lighting
US6291839B1 (en) * 1998-09-11 2001-09-18 Lulileds Lighting, U.S. Llc Light emitting device having a finely-patterned reflective contact
GB9821311D0 (en) 1998-10-02 1998-11-25 Koninkl Philips Electronics Nv Reflective liquid crystal display device
DE19852323C2 (en) * 1998-11-12 2001-08-16 Steag Hamatech Ag Method for determining the thickness of layers provided on a substrate
US6534791B1 (en) * 1998-11-27 2003-03-18 Lumileds Lighting U.S., Llc Epitaxial aluminium-gallium nitride semiconductor substrate
US20010042866A1 (en) * 1999-02-05 2001-11-22 Carrie Carter Coman Inxalygazn optical emitters fabricated via substrate removal
US6320206B1 (en) * 1999-02-05 2001-11-20 Lumileds Lighting, U.S., Llc Light emitting devices having wafer bonded aluminum gallium indium nitride structures and mirror stacks
US6155699A (en) * 1999-03-15 2000-12-05 Agilent Technologies, Inc. Efficient phosphor-conversion led structure
EP1175276B1 (en) 1999-04-07 2004-06-23 MV Research Limited Material inspection
JP3536203B2 (en) * 1999-06-09 2004-06-07 東芝セラミックス株式会社 Method and apparatus for measuring crystal defects in wafer
JP4332933B2 (en) * 1999-06-10 2009-09-16 ソニー株式会社 Inspection device
US6285449B1 (en) * 1999-06-11 2001-09-04 University Of Chicago Optical method and apparatus for detection of defects and microstructural changes in ceramics and ceramic coatings
DE19931689A1 (en) 1999-07-08 2001-01-11 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Planar LED assembly on thermally-conductive board, increases cooling, component packing density and life, whilst permitting active device integration to form display- or illumination panel in or on e.g. vehicle
US6366017B1 (en) * 1999-07-14 2002-04-02 Agilent Technologies, Inc/ Organic light emitting diodes with distributed bragg reflector
TW457732B (en) * 1999-08-27 2001-10-01 Lumileds Lighting Bv Luminaire, optical element and method of illuminating an object
JP4131891B2 (en) * 1999-09-03 2008-08-13 ローム株式会社 Lens array and method for manufacturing lens array
US6788895B2 (en) 1999-12-10 2004-09-07 Altera Corporation Security mapping and auto reconfiguration
JP2001194321A (en) * 2000-01-12 2001-07-19 Tokyo Seimitsu Co Ltd Semiconductor wafer inspection device
US6318886B1 (en) * 2000-02-11 2001-11-20 Whelen Engineering Company High flux led assembly
US7320593B2 (en) 2000-03-08 2008-01-22 Tir Systems Ltd. Light emitting diode light source for curing dental composites
US6328456B1 (en) 2000-03-24 2001-12-11 Ledcorp Illuminating apparatus and light emitting diode
US6419384B1 (en) * 2000-03-24 2002-07-16 Buztronics Inc Drinking vessel with indicator activated by inertial switch
KR100643225B1 (en) * 2000-04-28 2006-11-10 에이에스엠엘 네델란즈 비.브이. Lithographic projection apparatus, a method for determining a position of a substrate alignment mark, a device manufacturing method and device manufactured thereby
EP1158761A1 (en) 2000-05-26 2001-11-28 GRETAG IMAGING Trading AG Photographic image acquisition device using led chips
US6850637B1 (en) * 2000-06-28 2005-02-01 Teradyne, Inc. Lighting arrangement for automated optical inspection system
KR100869866B1 (en) * 2000-06-29 2008-11-24 코닌클리즈케 필립스 일렉트로닉스 엔.브이. Optoelectric element
JP4142234B2 (en) * 2000-07-04 2008-09-03 株式会社エンプラス Surface light source device and liquid crystal display device
US7099005B1 (en) * 2000-09-27 2006-08-29 Kla-Tencor Technologies Corporation System for scatterometric measurements and applications
JP4529353B2 (en) 2000-09-29 2010-08-25 パナソニック電工株式会社 Semiconductor device with protection function
US6578989B2 (en) * 2000-09-29 2003-06-17 Omron Corporation Optical device for an optical element and apparatus employing the device
US7714301B2 (en) 2000-10-27 2010-05-11 Molecular Devices, Inc. Instrument excitation source and calibration method
US6525335B1 (en) * 2000-11-06 2003-02-25 Lumileds Lighting, U.S., Llc Light emitting semiconductor devices including wafer bonded heterostructures
GB2369428B (en) * 2000-11-22 2004-11-10 Imperial College Detection system
CA2332190A1 (en) 2001-01-25 2002-07-25 Efos Inc. Addressable semiconductor array light source for localized radiation delivery
GB0101985D0 (en) * 2001-01-25 2001-03-14 Marconi Comm Ltd Optical component
US7075112B2 (en) * 2001-01-31 2006-07-11 Gentex Corporation High power radiation emitter device and heat dissipating package for electronic components
US6547249B2 (en) * 2001-03-29 2003-04-15 Lumileds Lighting U.S., Llc Monolithic series/parallel led arrays formed on highly resistive substrates
US6755647B2 (en) * 2001-04-26 2004-06-29 New Photonics, Llc Photocuring device with axial array of light emitting diodes and method of curing
US6607286B2 (en) * 2001-05-04 2003-08-19 Lumileds Lighting, U.S., Llc Lens and lens cap with sawtooth portion for light emitting diode
US6630689B2 (en) * 2001-05-09 2003-10-07 Lumileds Lighting, U.S. Llc Semiconductor LED flip-chip with high reflectivity dielectric coating on the mesa
US6578986B2 (en) * 2001-06-29 2003-06-17 Permlight Products, Inc. Modular mounting arrangement and method for light emitting diodes
US6785001B2 (en) * 2001-08-21 2004-08-31 Silicon Light Machines, Inc. Method and apparatus for measuring wavelength jitter of light signal
JP4067802B2 (en) * 2001-09-18 2008-03-26 松下電器産業株式会社 Lighting device
US6561808B2 (en) 2001-09-27 2003-05-13 Ceramoptec Industries, Inc. Method and tools for oral hygiene
US6942018B2 (en) 2001-09-28 2005-09-13 The Board Of Trustees Of The Leland Stanford Junior University Electroosmotic microchannel cooling system
US6498355B1 (en) 2001-10-09 2002-12-24 Lumileds Lighting, U.S., Llc High flux LED array
US6561640B1 (en) * 2001-10-31 2003-05-13 Xerox Corporation Systems and methods of printing with ultraviolet photosensitive resin-containing materials using light emitting devices
US8057903B2 (en) * 2001-11-30 2011-11-15 Sabic Innovative Plastics Ip B.V. Multilayer articles comprising resorcinol arylate polyester and method for making thereof
EP1335577A3 (en) * 2002-02-08 2006-04-05 Canon Kabushiki Kaisha Illumination Apparatus and Image Reading Apparatus
IL148566A (en) * 2002-03-07 2007-06-17 Nova Measuring Instr Ltd Method and system for overlay measurement
JP3991730B2 (en) 2002-03-13 2007-10-17 チッソ株式会社 Polymerizable compound and polymer thereof
US6724473B2 (en) * 2002-03-27 2004-04-20 Kla-Tencor Technologies Corporation Method and system using exposure control to inspect a surface
US6796698B2 (en) * 2002-04-01 2004-09-28 Gelcore, Llc Light emitting diode-based signal light
TWI229946B (en) * 2002-05-08 2005-03-21 Phoseon Technology Inc High efficiency solid-state light source and methods of use and manufacture
US6642066B1 (en) * 2002-05-15 2003-11-04 Advanced Micro Devices, Inc. Integrated process for depositing layer of high-K dielectric with in-situ control of K value and thickness of high-K dielectric layer
DE10223201C1 (en) * 2002-05-24 2003-05-28 Fraunhofer Ges Forschung Optical detection device for optical data has primary detection diode and secondary detection diodes coupled to respective read-out circuits with different read-out rates
US6573536B1 (en) * 2002-05-29 2003-06-03 Optolum, Inc. Light emitting diode light source
GB2396331A (en) 2002-12-20 2004-06-23 Inca Digital Printers Ltd Curing ink
US7279069B2 (en) 2002-07-18 2007-10-09 Origin Electric Company Limited Adhesive curing method, curing apparatus, and optical disc lamination apparatus using the curing apparatus
US20040134603A1 (en) * 2002-07-18 2004-07-15 Hideo Kobayashi Method and apparatus for curing adhesive between substrates, and disc substrate bonding apparatus
WO2004011848A2 (en) 2002-07-25 2004-02-05 Dahm Jonathan S Method and apparatus for using light emitting diodes for curing
AU2003298561A1 (en) 2002-08-23 2004-05-13 Jonathan S. Dahm Method and apparatus for using light emitting diodes
US7084935B2 (en) 2002-08-28 2006-08-01 Adaptive Micro Systems, Llc Display device with molded light guide
US7008795B2 (en) 2002-09-20 2006-03-07 Mitsubishi Electric Research Labs, Inc. Multi-way LED-based chemochromic sensor
US20040207836A1 (en) * 2002-09-27 2004-10-21 Rajeshwar Chhibber High dynamic range optical inspection system and method
US6822991B2 (en) * 2002-09-30 2004-11-23 Lumileds Lighting U.S., Llc Light emitting devices including tunnel junctions
US6880954B2 (en) 2002-11-08 2005-04-19 Smd Software, Inc. High intensity photocuring system
US6708501B1 (en) * 2002-12-06 2004-03-23 Nanocoolers, Inc. Cooling of electronics by electrically conducting fluids
TW571449B (en) * 2002-12-23 2004-01-11 Epistar Corp Light-emitting device having micro-reflective structure
US7465909B2 (en) 2003-01-09 2008-12-16 Con-Trol-Cure, Inc. UV LED control loop and controller for causing emitting UV light at a much greater intensity for UV curing
US7175712B2 (en) * 2003-01-09 2007-02-13 Con-Trol-Cure, Inc. Light emitting apparatus and method for curing inks, coatings and adhesives
US7211299B2 (en) * 2003-01-09 2007-05-01 Con-Trol-Cure, Inc. UV curing method and apparatus
GB0304761D0 (en) 2003-03-01 2003-04-02 Integration Technology Ltd Ultraviolet curing
US20040206970A1 (en) 2003-04-16 2004-10-21 Martin Paul S. Alternating current light emitting device
US7068363B2 (en) * 2003-06-06 2006-06-27 Kla-Tencor Technologies Corp. Systems for inspection of patterned or unpatterned wafers and other specimen
US7002677B2 (en) 2003-07-23 2006-02-21 Kla-Tencor Technologies Corporation Darkfield inspection system having a programmable light selection array
US7271921B2 (en) * 2003-07-23 2007-09-18 Kla-Tencor Technologies Corporation Method and apparatus for determining surface layer thickness using continuous multi-wavelength surface scanning
CA2536371A1 (en) 2003-08-26 2005-03-10 Redshift Systems Corporation Infrared camera system
US7102172B2 (en) * 2003-10-09 2006-09-05 Permlight Products, Inc. LED luminaire
US8264431B2 (en) 2003-10-23 2012-09-11 Massachusetts Institute Of Technology LED array with photodetector
US7819550B2 (en) 2003-10-31 2010-10-26 Phoseon Technology, Inc. Collection optics for led array with offset hemispherical or faceted surfaces
WO2005043598A2 (en) 2003-10-31 2005-05-12 Phoseon Technology, Inc. Use of potting gels for fabricating microoptic arrays
US7524085B2 (en) 2003-10-31 2009-04-28 Phoseon Technology, Inc. Series wiring of highly reliable light sources
US7179670B2 (en) * 2004-03-05 2007-02-20 Gelcore, Llc Flip-chip light emitting diode device without sub-mount
WO2005091392A1 (en) 2004-03-18 2005-09-29 Phoseon Technology, Inc. Micro-reflectors on a substrate for high-density led array
US7235878B2 (en) * 2004-03-18 2007-06-26 Phoseon Technology, Inc. Direct cooling of LEDs
EP1743384B1 (en) * 2004-03-30 2015-08-05 Phoseon Technology, Inc. Led array having array-based led detectors
WO2005101535A2 (en) 2004-04-12 2005-10-27 Phoseon Technology, Inc. High density led array
US8077305B2 (en) 2004-04-19 2011-12-13 Owen Mark D Imaging semiconductor structures using solid state illumination
JP4800324B2 (en) 2004-12-30 2011-10-26 フォーセン テクノロジー インク Exposure equipment
US7554656B2 (en) * 2005-10-06 2009-06-30 Kla-Tencor Technologies Corp. Methods and systems for inspection of a wafer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4595289A (en) * 1984-01-25 1986-06-17 At&T Bell Laboratories Inspection system utilizing dark-field illumination
US6141040A (en) * 1996-01-09 2000-10-31 Agilent Technologies, Inc. Measurement and inspection of leads on integrated circuit packages
US5892579A (en) * 1996-07-16 1999-04-06 Orbot Instruments Ltd. Optical inspection method and apparatus

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1738156A4 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8496356B2 (en) 2002-05-08 2013-07-30 Phoseon Technology, Inc. High efficiency solid-state light source and methods of use and manufacture
US8637332B2 (en) 2004-03-18 2014-01-28 Phoseon Technology, Inc. Micro-reflectors on a substrate for high-density LED array

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TWI302756B (en) 2008-11-01
EP1738156A4 (en) 2017-09-27
US20050231713A1 (en) 2005-10-20
TW200539489A (en) 2005-12-01
US8077305B2 (en) 2011-12-13
EP1738156A2 (en) 2007-01-03
WO2005100961A2 (en) 2005-10-27

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