WO2005104324A3 - Folded, fully buffered memory module - Google Patents
Folded, fully buffered memory module Download PDFInfo
- Publication number
- WO2005104324A3 WO2005104324A3 PCT/US2005/012854 US2005012854W WO2005104324A3 WO 2005104324 A3 WO2005104324 A3 WO 2005104324A3 US 2005012854 W US2005012854 W US 2005012854W WO 2005104324 A3 WO2005104324 A3 WO 2005104324A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- leaves
- folded
- memory
- medium
- buffer
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/186—Securing of expansion boards in correspondence to slots provided at the computer enclosure
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/184—Mounting of motherboards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/185—Mounting of expansion boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5387—Flexible insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10159—Memory
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US56295604P | 2004-04-15 | 2004-04-15 | |
US60/562,956 | 2004-04-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005104324A2 WO2005104324A2 (en) | 2005-11-03 |
WO2005104324A3 true WO2005104324A3 (en) | 2006-03-16 |
Family
ID=35197635
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/012854 WO2005104324A2 (en) | 2004-04-15 | 2005-04-15 | Folded, fully buffered memory module |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2005104324A2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006028643A2 (en) * | 2004-09-03 | 2006-03-16 | Staktek Group L.P. | Circuit module system and method |
US20160118734A1 (en) * | 2014-10-28 | 2016-04-28 | Hamilton Sundstrand Corporation | Single flex printed wiring board for electric system controller |
FR3038130B1 (en) | 2015-06-25 | 2017-08-11 | 3D Plus | 3D ELECTRONIC MODULE COMPRISING A STACK OF BALL CASES |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6021048A (en) * | 1998-02-17 | 2000-02-01 | Smith; Gary W. | High speed memory module |
US6222739B1 (en) * | 1998-01-20 | 2001-04-24 | Viking Components | High-density computer module with stacked parallel-plane packaging |
US6590781B2 (en) * | 2000-05-10 | 2003-07-08 | Rambus, Inc. | Clock routing in multiple channel modules and bus systems |
US6614664B2 (en) * | 2000-10-24 | 2003-09-02 | Samsung Electronics Co., Ltd. | Memory module having series-connected printed circuit boards |
US6762942B1 (en) * | 2002-09-05 | 2004-07-13 | Gary W. Smith | Break away, high speed, folded, jumperless electronic assembly |
US6891729B2 (en) * | 2001-09-10 | 2005-05-10 | Samsung Electronics Co., Ltd. | Memory module |
-
2005
- 2005-04-15 WO PCT/US2005/012854 patent/WO2005104324A2/en active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6222739B1 (en) * | 1998-01-20 | 2001-04-24 | Viking Components | High-density computer module with stacked parallel-plane packaging |
US6021048A (en) * | 1998-02-17 | 2000-02-01 | Smith; Gary W. | High speed memory module |
US6590781B2 (en) * | 2000-05-10 | 2003-07-08 | Rambus, Inc. | Clock routing in multiple channel modules and bus systems |
US6614664B2 (en) * | 2000-10-24 | 2003-09-02 | Samsung Electronics Co., Ltd. | Memory module having series-connected printed circuit boards |
US6891729B2 (en) * | 2001-09-10 | 2005-05-10 | Samsung Electronics Co., Ltd. | Memory module |
US6762942B1 (en) * | 2002-09-05 | 2004-07-13 | Gary W. Smith | Break away, high speed, folded, jumperless electronic assembly |
Also Published As
Publication number | Publication date |
---|---|
WO2005104324A2 (en) | 2005-11-03 |
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