WO2005111757A1 - Four phase charge pump operable without phase overlap with improved efficiency - Google Patents

Four phase charge pump operable without phase overlap with improved efficiency Download PDF

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Publication number
WO2005111757A1
WO2005111757A1 PCT/US2005/015762 US2005015762W WO2005111757A1 WO 2005111757 A1 WO2005111757 A1 WO 2005111757A1 US 2005015762 W US2005015762 W US 2005015762W WO 2005111757 A1 WO2005111757 A1 WO 2005111757A1
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Prior art keywords
charge
diode
charge transfer
transfer transistor
node
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PCT/US2005/015762
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French (fr)
Inventor
Feng Pan
Trung Pham
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Sandisk Corporation
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    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00Conversion of dc power input into dc power output
    • H02M3/02Conversion of dc power input into dc power output without intermediate conversion into ac
    • H02M3/04Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
    • H02M3/06Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using resistors or capacitors, e.g. potential divider
    • H02M3/07Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode, e.g. charge pumps
    • H02M3/073Charge pumps of the Schenkel-type
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00Conversion of dc power input into dc power output
    • H02M3/02Conversion of dc power input into dc power output without intermediate conversion into ac
    • H02M3/04Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
    • H02M3/06Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using resistors or capacitors, e.g. potential divider
    • H02M3/07Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode, e.g. charge pumps
    • H02M3/073Charge pumps of the Schenkel-type
    • H02M3/075Charge pumps of the Schenkel-type including a plurality of stages and two sets of clock signals, one set for the odd and one set for the even numbered stages
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00Conversion of dc power input into dc power output
    • H02M3/02Conversion of dc power input into dc power output without intermediate conversion into ac
    • H02M3/04Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
    • H02M3/06Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using resistors or capacitors, e.g. potential divider
    • H02M3/07Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode, e.g. charge pumps
    • H02M3/073Charge pumps of the Schenkel-type
    • H02M3/078Charge pumps of the Schenkel-type with means for reducing the back bias effect, i.e. the effect which causes the threshold voltage of transistors to increase as more stages are added to the converters

Definitions

  • This invention relates generally to electric circuits that generate a voltage larger than a supply voltage from which they operate by the switching of charge along serial capacitive cells, known as charge pumps.
  • a well known charge pump is the Dickson charge pump, which is shown in Fig.l. As described by Louie Pylarinos of the University of Toronto in “Charge Pumps: An Overview", the circuit has two pumping clocks which are anti-phased and have a voltage amplitude of ⁇ or F ⁇ .
  • Serial diodes or diode connected NMOSFETS, Dl - D4 operate as self-timed switches characterized by a forward biased voltage, Vt, which is the threshold voltage of each diode.
  • Vt forward biased voltage of each diode.
  • Each diode has a stray capacitance, Cs, associated therewith.
  • the charge pump operates by pumping charge along the diode chain as capacitors Cl - C4 are successively charged and discharged during each clock cycle.
  • Vou, Vm + N - (V* - Vd) - V ll (1)
  • the stray capacitance, Cs can be taken into account by noticing that it reduces the C transferred clock voltage, Vn, , by a factor .
  • the actual output voltage C + Cs becomes
  • Equation (3) leads to an equivalent circuit of the charge pump as shown in Fig. 2.
  • Limitations of the Dickson charge pump when implemented with NMOS transistors or diode connected transistors lies in the trapped charge associated with each node due to the threshold voltage, V t , of each NMOS diode. While increasing capacitor charge reduces effective series resistance, R s , there is a practical limitation of capacitor size in an integrated circuit. While clock frequency, f osc , reduces series resistance, the charge must be able to be transferred from node to node within a cycle, otherwise increasing frequency will not improve pump performance.
  • a more efficient charge pump is provided by altering the Dickson charge pump in accordance with the present invention.
  • a parallel transistor is provided with each transfer diode whereby residual trapped charge of each node is transferred by the transistor. This requires a transistor clock within each cycle of the diode clock.
  • Clock frequency can be increased by providing with each parallel transistor a pre-charge diode to pre-charge the gate of the parallel transistor after the input node is charge is raised but before the charge transfer. This facilitates the conductance of the transistor with each transistor cycle.
  • the pre-charge diode guarantees pre-charge of gate Tl, the parallel transistor, without the need for clock phase overlap.
  • a recovery transistor couples the gate of the parallel transistor to the input node to return transistor bias voltage to source voltage in the recovery period where the input node again goes low and the output node is high.
  • the charge pump in accordance with the invention can operate with 50/50 clock pulses having no overlap.
  • Fig. 1 illustrates a prior art Dickson charge pump.
  • Fig. 2 illustrates an equivalent circuit of the Dickson charge pump.
  • Fig. 3 is a schematic of a charge pump in accordance with one embodiment of the invention.
  • Fig. 4 illustrates clocks for operating the charge pump of Fig. 3.
  • DETAILED DESCRIPTION OF ILLUSTRATED EMBODIMENT [0009] Fig.
  • FIG. 3 is a schematic of a charge pump in accordance with one embodiment of the invention in which the cells of the conventional Dickson charge pump are modified to facilitate charge transfer and to accommodate a higher clock frequency or fosc- Fig. 3 shows two adjacent cells, such as diodes Dl and D2 of the Dickson charge pump of Fig.1, for transferring charge from node VI to node V2.
  • Each cell is modified by providing a MOS transistor Tl or T2 in parallel with diode Dl or diode D2 which facilitate the transfer of residual trapped charge at each node.
  • a recovery transistor TR is connected between the gate of transistor Tl and node VI with the gate of transistor TR controlled by the voltage on node V2.
  • Fig. 4 illustrates the four phase clock operation of the charge pump of Fig. 3.
  • Charge transfer from node VI to node V2 must occur during clock cycle ⁇ l when charge coupled through capacitor CO raises the charge of node VI and forward biases diode Dl which partially transfers the charge to node V2.
  • Transistor Tl is in parallel with diode Dl and conducts in response to clock ⁇ 3 which is shorter than clock ⁇ l and lies within clock cycle ⁇ l.
  • clock ⁇ 3 When ⁇ l goes high, diode Dl conducts but the current is limited because of the high V t of the diode.
  • clock ⁇ 3 pumps node VC high and transistor Tl conducts fully and transfers the remaining trapped charge at node VI to node V2, with node VI and node V2 equalized. This operation is repeated for diode D2 and transistor T2 when clock ⁇ 2 is high for stage 2.
  • Tl Since the voltages of Tl gate and source are the same, Tl is completely shut off to prevent any backward leakage.
  • a pre- charge diode DPC is connected between node VI and the gate of transistor Tl to apply VI minus V t on the gate of transistor Tl before charge transfer. Then, any rise of clock ⁇ 3 will cause the immediate conduction of transistor Tl and accelerate the transfer of residual charge through transistor Tl.
  • the pre-charge diode guarantees pre-charge of gate Tl, the parallel transistor, without the need for clock phase overlap.
  • gate of Tl is returned to pre-charge level, which could be slightly higher (initial ramp up phase) or lower (after initial ramp up phase) than after VI node fully transfers charge to V2, and Tl could be slightly on or off.
  • V2 is coupled high and VI is coupled low, and if it is 50/50 transition, the gate of Tl is a very low capacitive node compared with that of VI, V2 nodes.
  • the gate of TR is at V2 voltage, which is much higher than gate of Tl, and the charge on gate of Tl can be quickly discharged. Even if Tl could be slightly turned on during the recovery phase, since its gate is discharged to source quickly, it is in weak conduction state, the amount of charge that could potentially leak backward from V2 to VI is a very small percentage of charge transferred. If the recovery phase and clock phases are overlapped, it is more like normal four phase charge pump recovery. By using 50/50 clock phases in recovery, no overlap of clocks is required, the clock can run at faster frequencies and the gain of high frequency is much more significant when compared with any potential loss of charge by leakage during recovery transition.
  • turn on and turn off of transistor Tl is facilitated by the guaranteed pre-charge of the gate of transistor Tl to the voltage on node VI minus V t prior to turn on, and the equalizing of voltage at the gate of transistor Tl and the voltage at VI in recovery.
  • This guaranteed pre-charging and recovery permits maximum charge transfer forward and minimum charge leakage backward.
  • the charge pump can operate with 50% cross over of clocks, or overlap of overlap clocks ⁇ l and ⁇ 2, which is unlike prior art four phase charge pumps which require ⁇ l and ⁇ 2 overlap to do both pre-charge and discharge of gate equivalent Tl transistor.
  • the charge pump in accordance with the invention permits greater efficiency in charge transfer with the same size capacitors as in the prior art Dickson charge pump.

Abstract

In a Dickson type charge pump in which a plurality of serially connected diodes sequentially respond to anti-phase 50/50 clock cross over or overlapped (f1, f2), efficiency of the charge pump is increased by providing with each diode a charge transfer transistor in parallel therewith between two adjacent nodes, and driving the charge transfer transistor to conduction during a time when the parallel diode is conducting thereby transferring any residual trapped charge at one node through the charge transfer transistor to the next node. Operating frequency can be increased by providing a pre-charge diode coupling an input node to the gate of the charge transfer transistor to facilitate conductance of the charge transfer transistor, and by coupling the control terminal of the charge transfer transistor to an input node in response to charge on an output node to thereby equalize charge on the control terminal and on the input node during a recovery period.

Description

FOUR PHASE CHARGE PUMP OPERABLE WITHOUT PHASE OVERLAP WITH IMPROVED EFFICIENCY BACKGROUND OF THE INVENTION
[0001] This invention relates generally to electric circuits that generate a voltage larger than a supply voltage from which they operate by the switching of charge along serial capacitive cells, known as charge pumps.
[0002] A well known charge pump is the Dickson charge pump, which is shown in Fig.l. As described by Louie Pylarinos of the University of Toronto in "Charge Pumps: An Overview", the circuit has two pumping clocks which are anti-phased and have a voltage amplitude of φ or Fφ . Serial diodes or diode connected NMOSFETS, Dl - D4, operate as self-timed switches characterized by a forward biased voltage, Vt, which is the threshold voltage of each diode. Each diode has a stray capacitance, Cs, associated therewith. The charge pump operates by pumping charge along the diode chain as capacitors Cl - C4 are successively charged and discharged during each clock cycle. For example, when φ goes high, diode Dl conducts and the voltage at its anode, VI, is boosted by voltage φ and transferred to node V2 less a voltage drop, Vt, associated with diode Dl. Then when Fφ goes low, and φ goes high, the charge at node V2 is transferred to node V3 less a voltage drop, Vt, associated with diode V2. After N stages, it is seen that the output voltage is
Vou, = Vm + N - (V* - Vd) - Vll (1)
The stray capacitance, Cs, can be taken into account by noticing that it reduces the C transferred clock voltage, Vn, , by a factor . Thus, the actual output voltage C + Cs becomes
Figure imgf000002_0001
[0003] Until now is has been assumed that no load was connected to the output of the charge pump. In the presence of such a load which draws a current, lout, the output
Figure imgf000002_0002
voltage is reduced by an amount ' ^ + ^ ' Josc , where fosc is the operating frequency of the charge pump. The output voltage now becomes
Figure imgf000003_0001
From this equation it becomes apparent that the voltage multiplication will occur only if
Figure imgf000003_0002
Following Dickson, eq (3) can be written as
Figure imgf000003_0003
where
Figure imgf000003_0004
and
Figure imgf000003_0005
Equation (3) leads to an equivalent circuit of the charge pump as shown in Fig. 2. [0004] Limitations of the Dickson charge pump when implemented with NMOS transistors or diode connected transistors lies in the trapped charge associated with each node due to the threshold voltage, Vt, of each NMOS diode. While increasing capacitor charge reduces effective series resistance, Rs, there is a practical limitation of capacitor size in an integrated circuit. While clock frequency, fosc, reduces series resistance, the charge must be able to be transferred from node to node within a cycle, otherwise increasing frequency will not improve pump performance.
SUMMARY OF THE INVENTION
[0005] A more efficient charge pump is provided by altering the Dickson charge pump in accordance with the present invention.
[0006] To facilitate charge transfer from one node to the next node, a parallel transistor is provided with each transfer diode whereby residual trapped charge of each node is transferred by the transistor. This requires a transistor clock within each cycle of the diode clock.
[0007] Clock frequency can be increased by providing with each parallel transistor a pre-charge diode to pre-charge the gate of the parallel transistor after the input node is charge is raised but before the charge transfer. This facilitates the conductance of the transistor with each transistor cycle.
[0008] During pre-charge, the pre-charge diode guarantees pre-charge of gate Tl, the parallel transistor, without the need for clock phase overlap. A recovery transistor couples the gate of the parallel transistor to the input node to return transistor bias voltage to source voltage in the recovery period where the input node again goes low and the output node is high. Unlike known four phase charge pumps which require overlap of the pumping clocks, the charge pump in accordance with the invention can operate with 50/50 clock pulses having no overlap.
[0009] The invention and objects and features thereof will be more readily apparent from the following detailed description and appended claims when taken with the drawings. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 illustrates a prior art Dickson charge pump. Fig. 2 illustrates an equivalent circuit of the Dickson charge pump. Fig. 3 is a schematic of a charge pump in accordance with one embodiment of the invention. Fig. 4 illustrates clocks for operating the charge pump of Fig. 3. DETAILED DESCRIPTION OF ILLUSTRATED EMBODIMENT [0009] Fig. 3 is a schematic of a charge pump in accordance with one embodiment of the invention in which the cells of the conventional Dickson charge pump are modified to facilitate charge transfer and to accommodate a higher clock frequency or fosc- Fig. 3 shows two adjacent cells, such as diodes Dl and D2 of the Dickson charge pump of Fig.1, for transferring charge from node VI to node V2. Each cell is modified by providing a MOS transistor Tl or T2 in parallel with diode Dl or diode D2 which facilitate the transfer of residual trapped charge at each node. A recovery transistor TR is connected between the gate of transistor Tl and node VI with the gate of transistor TR controlled by the voltage on node V2. When charge is transferred from node VI to node V2, the increased voltage at node V2 causes transistor TR to conduct and bring the voltage on the gate of transistor Tl to the voltage level of node VI. After clock φ3 is removed, the conductance of transistor Tl is terminated.
[0010] Fig. 4 illustrates the four phase clock operation of the charge pump of Fig. 3. Charge transfer from node VI to node V2 must occur during clock cycle φl when charge coupled through capacitor CO raises the charge of node VI and forward biases diode Dl which partially transfers the charge to node V2.
[0011] Transistor Tl is in parallel with diode Dl and conducts in response to clock φ3 which is shorter than clock φl and lies within clock cycle φl. Thus, when φl goes high, diode Dl conducts but the current is limited because of the high Vt of the diode. After a short delay, to allow pre-charge from VI to the gate of Tl, clock φ3 pumps node VC high and transistor Tl conducts fully and transfers the remaining trapped charge at node VI to node V2, with node VI and node V2 equalized. This operation is repeated for diode D2 and transistor T2 when clock φ2 is high for stage 2. [0012] After charge is transferred from node VI to node V2 in the first half cycle (Phil=l , Phi2=0, Phi3=l, Phi4=0), Phi3 goes from 1 to 0 bring down the gate of Tl back to the pre-charge level before charge is transferred. Tl is weakly on at this point or Tl could be completely off depending upon pump operations. In the second half cycle (Phil 1=0, Phil2=l), V2 is coupled up by Phi2, VI is coupled down by Phill, transistor TR is turned on (V2-Vl-Vt>0) and brings the voltage on the gate of transistor Tl to the voltage level of node VI . Since the voltages of Tl gate and source are the same, Tl is completely shut off to prevent any backward leakage. [0013] To facilitate the conductance of transistor Tl in response to clock φ3, a pre- charge diode DPC is connected between node VI and the gate of transistor Tl to apply VI minus Vt on the gate of transistor Tl before charge transfer. Then, any rise of clock φ3 will cause the immediate conduction of transistor Tl and accelerate the transfer of residual charge through transistor Tl.
[0014] During pre-charge, the pre-charge diode guarantees pre-charge of gate Tl, the parallel transistor, without the need for clock phase overlap. Before recovery, since Phi3 goes low before Phil/Phi2 clocks switch, gate of Tl is returned to pre-charge level, which could be slightly higher (initial ramp up phase) or lower (after initial ramp up phase) than after VI node fully transfers charge to V2, and Tl could be slightly on or off. In recovery phase, V2 is coupled high and VI is coupled low, and if it is 50/50 transition, the gate of Tl is a very low capacitive node compared with that of VI, V2 nodes. The gate of TR is at V2 voltage, which is much higher than gate of Tl, and the charge on gate of Tl can be quickly discharged. Even if Tl could be slightly turned on during the recovery phase, since its gate is discharged to source quickly, it is in weak conduction state, the amount of charge that could potentially leak backward from V2 to VI is a very small percentage of charge transferred. If the recovery phase and clock phases are overlapped, it is more like normal four phase charge pump recovery. By using 50/50 clock phases in recovery, no overlap of clocks is required, the clock can run at faster frequencies and the gain of high frequency is much more significant when compared with any potential loss of charge by leakage during recovery transition.
[0015] As noted above, turn on and turn off of transistor Tl is facilitated by the guaranteed pre-charge of the gate of transistor Tl to the voltage on node VI minus Vt prior to turn on, and the equalizing of voltage at the gate of transistor Tl and the voltage at VI in recovery. This guaranteed pre-charging and recovery permits maximum charge transfer forward and minimum charge leakage backward. Moreover, the charge pump can operate with 50% cross over of clocks, or overlap of overlap clocks φl and φ2, which is unlike prior art four phase charge pumps which require φl and φ2 overlap to do both pre-charge and discharge of gate equivalent Tl transistor. Because charge can be fully transferred by boosted Tl transistor, without V, drop, capacitance can be reduced per stage to have the same efficiency since no Vt drops. The equivalent resistance of Tl is much smaller due to boosted gate voltage, and the RC delay per stage to fully transfer charge is much smaller compared with the normal Dickson charge pump. Clock frequency can be in creased due to the smaller RC delay, and faster clock frequency can allow even smaller capacitance per stage to be used to meet the same performance. Accordingly, the charge pump in accordance with the invention permits greater efficiency in charge transfer with the same size capacitors as in the prior art Dickson charge pump. [0016] While the invention has been described with reference to a specific embodiment, the description is illustrative of the invention, and is not to be construed limiting the invention. Various modifications and applications may occur to those skilled in the art without departing from the true spirit and scope of the invention as defined by the appended claims.

Claims

CLAIMS What is claimed is:
1. A charge pump comprising a plurality of serially connected cells for pumping and transferring charge along a series of nodes between the cells, each cell including: a) a charge transfer diode connected between adjacent nodes and responsive to an increasing charge at one node in response to a first clock, φl, or a second antiphase second clock, φ2, and b) a charge transfer transistor connected between the adjacent nodes in parallel with the charge transfer diode and responsive to a third clock, φ3, within the period of clock φl or to a fourth clock φ4 within the period of clock φ2, whereby each charge transfer diode transfers charge from one node to a next node in response to a clock (φl or φ2) and each charge transfer transistor transfers residual trapped charge at the one node to the next node while the charge transfer diode is conducting charge.
2. The charge pump as defined by claim 1 wherein each cell further includes a pre charge diode coupling an input node to a control terminal of the charge transfer transistor to facilitate the conductance of the charge transfer transistor in response to the third clock (φ3) or the fourth clock (φ4) .
3. The charge pump as defined by claim 2 wherein each cell further includes a recovery transistor for equalizing charge on the control terminal of the charge transfer transistor to charge on the input node during a recovery period.
4. The charge pump as defined by claim 3 wherein each diode comprises a diode NMOSFET and each charge transfer transistor comprises a NMOSFET.
5. The charge pump as defined by claim 1 wherein each cell further includes a recovery transistor for equalizing charge on the control terminal of the charge transfer transistor to charge on the input node during a recovery period.
6. The charge pump as defined by claim 5 wherein each diode comprises a diode comiected NMOSFET and each charge transfer transistor comprises a NMOSFET.
7. The charge pump as defined by claim 1 wherein each diode comprises a diode connect NMOSFET and each charge transfer transistor comprises a NMOSFET.
8. A method of increasing efficiency in charge transfer in a charge pump having a plurality of serially connected diodes which sequentially respond to anti-phase pumping clocks (φl, φ2) comprising the steps of: a) providing for each diode a charge transfer transistor in parallel therewith between two adjacent nodes, and b) driving the charge transfer transistor to conduction during a time when the parallel diode is conducting, thereby transferring any residual trapped charge at one node through the charge transfer transistor to the next node.
9. The method as defined by claim 8 and further including the step of: c) precharging a control terminal of the charge transfer transistor to facilitate the conductance of the charge transfer transistor.
10. The method as defined by claim 9 and further including the step of: d) coupling the control terminal of the charge transfer transistor to an input node in response to charge on an output node to thereby equalize charge on the control terminal and on the input node during a recovery period.
11. The method as defined by claim 10 wherein each diode comprises a diode connected NMOSFET and each charge transfer transistor comprises a NMOSFET.
12. The method as defined by claim 8 and further including the step of: c) coupling the control terminal of the charge transfer transistor to an input node in response to charge on an output node to thereby equalize charge on the control terminal and on the input node during a recovery period.
13. The method as defined by claim 8 wherein each diode comprises a diode connected NMOSFET and each charge transfer transistor comprises a NMOSFET.
PCT/US2005/015762 2004-05-10 2005-05-05 Four phase charge pump operable without phase overlap with improved efficiency WO2005111757A1 (en)

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US10/842,910 2004-05-10

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Families Citing this family (85)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006311703A (en) * 2005-04-28 2006-11-09 Seiko Instruments Inc Electronic apparatus having charge pump circuit
CA2655964C (en) * 2006-06-22 2014-10-28 Board Of Regents Of The University Of Nebraska Magnetically coupleable robotic devices and related methods
JP4284345B2 (en) * 2006-08-30 2009-06-24 株式会社 日立ディスプレイズ Voltage conversion circuit and display device including the voltage conversion circuit
JP2008092667A (en) * 2006-10-02 2008-04-17 Seiko Instruments Inc Electronic equipment with step-up circuit
US7477092B2 (en) * 2006-12-29 2009-01-13 Sandisk Corporation Unified voltage generation apparatus with improved power efficiency
US7440342B2 (en) 2006-12-29 2008-10-21 Sandisk Corporation Unified voltage generation method with improved power efficiency
US7741898B2 (en) * 2007-01-23 2010-06-22 Etron Technology, Inc. Charge pump circuit for high voltage generation
KR100877623B1 (en) * 2007-02-12 2009-01-09 삼성전자주식회사 High voltage generation circuit and method for reducing peak current and power noise
US7515488B2 (en) * 2007-03-30 2009-04-07 Sandisk 3D Llc Method for load-based voltage generation
US7580296B2 (en) * 2007-03-30 2009-08-25 Sandisk 3D Llc Load management for memory device
US7558129B2 (en) * 2007-03-30 2009-07-07 Sandisk 3D Llc Device with load-based voltage generation
US7580298B2 (en) * 2007-03-30 2009-08-25 Sandisk 3D Llc Method for managing electrical load of an electronic device
TWI328925B (en) * 2007-04-11 2010-08-11 Au Optronics Corp Negative voltage converter
US7446596B1 (en) * 2007-05-25 2008-11-04 Atmel Corporation Low voltage charge pump
US8044705B2 (en) 2007-08-28 2011-10-25 Sandisk Technologies Inc. Bottom plate regulation of charge pumps
US20090058507A1 (en) * 2007-08-28 2009-03-05 Prajit Nandi Bottom Plate Regulated Charge Pump
US7714636B2 (en) * 2007-11-26 2010-05-11 Elite Semiconductor Memory Technology Inc. Charge pump circuit and cell thereof
US7586363B2 (en) * 2007-12-12 2009-09-08 Sandisk Corporation Diode connected regulation of charge pumps
US7586362B2 (en) * 2007-12-12 2009-09-08 Sandisk Corporation Low voltage charge pump with regulation
TW200945751A (en) * 2008-04-17 2009-11-01 Sitronix Technology Corp Charge pump
US20090302930A1 (en) * 2008-06-09 2009-12-10 Feng Pan Charge Pump with Vt Cancellation Through Parallel Structure
US7969235B2 (en) 2008-06-09 2011-06-28 Sandisk Corporation Self-adaptive multi-stage charge pump
US8710907B2 (en) 2008-06-24 2014-04-29 Sandisk Technologies Inc. Clock generator circuit for a charge pump
US7683700B2 (en) 2008-06-25 2010-03-23 Sandisk Corporation Techniques of ripple reduction for charge pumps
US7795952B2 (en) 2008-12-17 2010-09-14 Sandisk Corporation Regulation of recovery rates in charge pumps
US7973592B2 (en) 2009-07-21 2011-07-05 Sandisk Corporation Charge pump with current based regulation
US8339183B2 (en) 2009-07-24 2012-12-25 Sandisk Technologies Inc. Charge pump with reduced energy consumption through charge sharing and clock boosting suitable for high voltage word line in flash memories
JP5204902B2 (en) * 2009-07-29 2013-06-05 京セラ株式会社 Transfer gate circuit and power combiner circuit, power amplifier circuit, transmitter and communication device using the same
US20110133820A1 (en) * 2009-12-09 2011-06-09 Feng Pan Multi-Stage Charge Pump with Variable Number of Boosting Stages
US20110148509A1 (en) 2009-12-17 2011-06-23 Feng Pan Techniques to Reduce Charge Pump Overshoot
US8432732B2 (en) 2010-07-09 2013-04-30 Sandisk Technologies Inc. Detection of word-line leakage in memory arrays
US8514630B2 (en) 2010-07-09 2013-08-20 Sandisk Technologies Inc. Detection of word-line leakage in memory arrays: current based approach
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US8294509B2 (en) 2010-12-20 2012-10-23 Sandisk Technologies Inc. Charge pump systems with reduction in inefficiencies due to charge sharing between capacitances
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US8537593B2 (en) 2011-04-28 2013-09-17 Sandisk Technologies Inc. Variable resistance switch suitable for supplying high voltage to drive load
US8379454B2 (en) 2011-05-05 2013-02-19 Sandisk Technologies Inc. Detection of broken word-lines in memory arrays
US8750042B2 (en) 2011-07-28 2014-06-10 Sandisk Technologies Inc. Combined simultaneous sensing of multiple wordlines in a post-write read (PWR) and detection of NAND failures
US8726104B2 (en) 2011-07-28 2014-05-13 Sandisk Technologies Inc. Non-volatile memory and method with accelerated post-write read using combined verification of multiple pages
US8775901B2 (en) 2011-07-28 2014-07-08 SanDisk Technologies, Inc. Data recovery for defective word lines during programming of non-volatile memory arrays
US8699247B2 (en) 2011-09-09 2014-04-15 Sandisk Technologies Inc. Charge pump system dynamically reconfigurable for read and program
US8400212B1 (en) 2011-09-22 2013-03-19 Sandisk Technologies Inc. High voltage charge pump regulation system with fine step adjustment
US8514628B2 (en) 2011-09-22 2013-08-20 Sandisk Technologies Inc. Dynamic switching approach to reduce area and power consumption of high voltage charge pumps
US8395434B1 (en) 2011-10-05 2013-03-12 Sandisk Technologies Inc. Level shifter with negative voltage capability
TWI496143B (en) * 2011-10-18 2015-08-11 Winbond Electronics Corp Voltage generator
CN103138566B (en) * 2011-11-23 2015-10-14 上海华虹宏力半导体制造有限公司 Single charge pump exports the control circuit of multiple high pressure
US8928395B2 (en) * 2012-01-17 2015-01-06 Winbond Electronics Corp. Voltage generator
US8730722B2 (en) 2012-03-02 2014-05-20 Sandisk Technologies Inc. Saving of data in cases of word-line to word-line short in memory arrays
CN102624222B (en) * 2012-03-27 2017-03-29 上海华虹宏力半导体制造有限公司 charge pump and charge pump system
US8710909B2 (en) 2012-09-14 2014-04-29 Sandisk Technologies Inc. Circuits for prevention of reverse leakage in Vth-cancellation charge pumps
US9164526B2 (en) 2012-09-27 2015-10-20 Sandisk Technologies Inc. Sigma delta over-sampling charge pump analog-to-digital converter
US9810723B2 (en) 2012-09-27 2017-11-07 Sandisk Technologies Llc Charge pump based over-sampling ADC for current detection
US9343455B2 (en) * 2012-12-19 2016-05-17 Knowles Electronics, Llc Apparatus and method for high voltage I/O electro-static discharge protection
US8836412B2 (en) 2013-02-11 2014-09-16 Sandisk 3D Llc Charge pump with a power-controlled clock buffer to reduce power consumption and output voltage ripple
US8981835B2 (en) 2013-06-18 2015-03-17 Sandisk Technologies Inc. Efficient voltage doubler
US9024680B2 (en) 2013-06-24 2015-05-05 Sandisk Technologies Inc. Efficiency for charge pumps with low supply voltages
US9077238B2 (en) 2013-06-25 2015-07-07 SanDisk Technologies, Inc. Capacitive regulation of charge pumps without refresh operation interruption
US9007046B2 (en) 2013-06-27 2015-04-14 Sandisk Technologies Inc. Efficient high voltage bias regulation circuit
US9165683B2 (en) 2013-09-23 2015-10-20 Sandisk Technologies Inc. Multi-word line erratic programming detection
US9083231B2 (en) 2013-09-30 2015-07-14 Sandisk Technologies Inc. Amplitude modulation for pass gate to improve charge pump efficiency
US9154027B2 (en) 2013-12-09 2015-10-06 Sandisk Technologies Inc. Dynamic load matching charge pump for reduced current consumption
US20160006348A1 (en) * 2014-07-07 2016-01-07 Ememory Technology Inc. Charge pump apparatus
US9484086B2 (en) 2014-07-10 2016-11-01 Sandisk Technologies Llc Determination of word line to local source line shorts
US9443612B2 (en) 2014-07-10 2016-09-13 Sandisk Technologies Llc Determination of bit line to low voltage signal shorts
US9460809B2 (en) 2014-07-10 2016-10-04 Sandisk Technologies Llc AC stress mode to screen out word line to word line shorts
US9514835B2 (en) 2014-07-10 2016-12-06 Sandisk Technologies Llc Determination of word line to word line shorts between adjacent blocks
CN105336368B (en) * 2014-07-18 2022-11-18 兆易创新科技集团股份有限公司 Non-overlapping four-phase clock generation circuit
US9330776B2 (en) 2014-08-14 2016-05-03 Sandisk Technologies Inc. High voltage step down regulator with breakdown protection
US9240249B1 (en) 2014-09-02 2016-01-19 Sandisk Technologies Inc. AC stress methods to screen out bit line defects
US9202593B1 (en) 2014-09-02 2015-12-01 Sandisk Technologies Inc. Techniques for detecting broken word lines in non-volatile memories
US9449694B2 (en) 2014-09-04 2016-09-20 Sandisk Technologies Llc Non-volatile memory with multi-word line select for defect detection operations
CN104767383B (en) * 2015-04-21 2017-07-14 苏州芯宽电子科技有限公司 A kind of phase charge pump booster circuit of low pressure four
US9917507B2 (en) 2015-05-28 2018-03-13 Sandisk Technologies Llc Dynamic clock period modulation scheme for variable charge pump load currents
US9647536B2 (en) 2015-07-28 2017-05-09 Sandisk Technologies Llc High voltage generation using low voltage devices
US9659666B2 (en) 2015-08-31 2017-05-23 Sandisk Technologies Llc Dynamic memory recovery at the sub-block level
US9520776B1 (en) 2015-09-18 2016-12-13 Sandisk Technologies Llc Selective body bias for charge pump transfer switches
US9698676B1 (en) 2016-03-11 2017-07-04 Sandisk Technologies Llc Charge pump based over-sampling with uniform step size for current detection
US9917510B2 (en) * 2016-07-21 2018-03-13 Dialog Semiconductor (Uk) Limited Multi-staged buck converter with efficient low power operation
US10461635B1 (en) 2018-05-15 2019-10-29 Analog Devices Global Unlimited Company Low VIN high efficiency chargepump
US10707749B2 (en) * 2018-07-31 2020-07-07 Samsung Electronics Co., Ltd. Charge pump, and high voltage generator and flash memory device having the same
US10847227B2 (en) * 2018-10-16 2020-11-24 Silicon Storage Technology, Inc. Charge pump for use in non-volatile flash memory devices
NL2023359B1 (en) * 2019-06-21 2021-02-01 Nowi Energy B V DC-DC converter
US11908521B2 (en) 2022-02-01 2024-02-20 Western Digital Technologies, Inc. Non-volatile memory with redundant control line driver

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5754476A (en) * 1995-10-31 1998-05-19 Sgs-Thomson Microelectronics S.R.L. Negative charge pump circuit for electrically erasable semiconductor memory devices
US20030214346A1 (en) * 2002-02-25 2003-11-20 Stmicroelectronics S.R.I. Charge pump for negative voltages

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3385960B2 (en) * 1998-03-16 2003-03-10 日本電気株式会社 Negative voltage charge pump circuit
US6373324B2 (en) * 1998-08-21 2002-04-16 Intel Corporation Voltage blocking method and apparatus for a charge pump with diode connected pull-up and pull-down on boot nodes
US6292048B1 (en) * 1999-11-11 2001-09-18 Intel Corporation Gate enhancement charge pump for low voltage power supply
US6452438B1 (en) * 2000-12-28 2002-09-17 Intel Corporation Triple well no body effect negative charge pump
KR100399359B1 (en) * 2001-07-07 2003-09-26 삼성전자주식회사 Charge pump circuit
KR100510552B1 (en) * 2003-10-27 2005-08-26 삼성전자주식회사 Charge pump circuit having improved charge transfer effiency
TWI233617B (en) * 2004-01-02 2005-06-01 Univ Nat Chiao Tung Charge pump circuit suitable for low voltage process

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5754476A (en) * 1995-10-31 1998-05-19 Sgs-Thomson Microelectronics S.R.L. Negative charge pump circuit for electrically erasable semiconductor memory devices
US20030214346A1 (en) * 2002-02-25 2003-11-20 Stmicroelectronics S.R.I. Charge pump for negative voltages

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US7030683B2 (en) 2006-04-18

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