WO2005113167A1 - Compositions and methods for drying patterned wafers during manufacture of integrated circuitry products - Google Patents
Compositions and methods for drying patterned wafers during manufacture of integrated circuitry products Download PDFInfo
- Publication number
- WO2005113167A1 WO2005113167A1 PCT/US2004/014353 US2004014353W WO2005113167A1 WO 2005113167 A1 WO2005113167 A1 WO 2005113167A1 US 2004014353 W US2004014353 W US 2004014353W WO 2005113167 A1 WO2005113167 A1 WO 2005113167A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- composition
- water
- contacting
- supercritical fluid
- carried out
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0021—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by liquid gases or supercritical fluids
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNA2004800432546A CN1960813A (en) | 2004-05-07 | 2004-05-07 | Compositions and methods for drying patterned wafers during manufacture of integrated circuitry products |
PCT/US2004/014353 WO2005113167A1 (en) | 2004-05-07 | 2004-05-07 | Compositions and methods for drying patterned wafers during manufacture of integrated circuitry products |
EP04751653A EP1765526A4 (en) | 2004-05-07 | 2004-05-07 | Compositions and methods for drying patterned wafers during manufacture of integrated circuitry products |
JP2007511332A JP2007536730A (en) | 2004-05-07 | 2004-05-07 | Compositions and methods for drying patterned wafers during the manufacture of integrated circuit products |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2004/014353 WO2005113167A1 (en) | 2004-05-07 | 2004-05-07 | Compositions and methods for drying patterned wafers during manufacture of integrated circuitry products |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005113167A1 true WO2005113167A1 (en) | 2005-12-01 |
Family
ID=35428293
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/014353 WO2005113167A1 (en) | 2004-05-07 | 2004-05-07 | Compositions and methods for drying patterned wafers during manufacture of integrated circuitry products |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1765526A4 (en) |
JP (1) | JP2007536730A (en) |
CN (1) | CN1960813A (en) |
WO (1) | WO2005113167A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8440573B2 (en) * | 2010-01-26 | 2013-05-14 | Lam Research Corporation | Method and apparatus for pattern collapse free wet processing of semiconductor devices |
TWI689004B (en) | 2012-11-26 | 2020-03-21 | 美商應用材料股份有限公司 | Stiction-free drying process with contaminant removal for high-aspect-ratio semiconductor device structures |
WO2016007874A1 (en) | 2014-07-11 | 2016-01-14 | Applied Materials, Inc. | Supercritical carbon dioxide process for low-k thin films |
US10026629B2 (en) * | 2014-10-17 | 2018-07-17 | Tokyo Electron Limited | Substrate liquid processing apparatus, substrate liquid processing method, and computer-readable storage medium storing substrate liquid processing program |
CN108140549B (en) | 2015-10-04 | 2022-12-20 | 应用材料公司 | Reduced volume processing chamber |
WO2017062141A1 (en) | 2015-10-04 | 2017-04-13 | Applied Materials, Inc. | Substrate support and baffle apparatus |
CN108140546B (en) | 2015-10-04 | 2022-04-12 | 应用材料公司 | Drying process for high aspect ratio features |
KR102314667B1 (en) | 2015-10-04 | 2021-10-20 | 어플라이드 머티어리얼스, 인코포레이티드 | Small thermal mass pressurized chamber |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5730874A (en) * | 1991-06-12 | 1998-03-24 | Idaho Research Foundation, Inc. | Extraction of metals using supercritical fluid and chelate forming legand |
US6187911B1 (en) * | 1998-05-08 | 2001-02-13 | Idaho Research Foundation, Inc. | Method for separating metal chelates from other materials based on solubilities in supercritical fluids |
US6398875B1 (en) * | 2001-06-27 | 2002-06-04 | International Business Machines Corporation | Process of drying semiconductor wafers using liquid or supercritical carbon dioxide |
US20030047195A1 (en) * | 2001-09-13 | 2003-03-13 | Deyoung James | Methods and apparatus for cleaning and/or treating a substrate using CO2 |
US6558475B1 (en) * | 2000-04-10 | 2003-05-06 | International Business Machines Corporation | Process for cleaning a workpiece using supercritical carbon dioxide |
US6576066B1 (en) * | 1999-12-06 | 2003-06-10 | Nippon Telegraph And Telephone Corporation | Supercritical drying method and supercritical drying apparatus |
US20030125225A1 (en) * | 2001-12-31 | 2003-07-03 | Chongying Xu | Supercritical fluid cleaning of semiconductor substrates |
US6602351B2 (en) * | 2001-02-15 | 2003-08-05 | Micell Technologies, Inc. | Methods for the control of contaminants following carbon dioxide cleaning of microelectronic structures |
US6684525B2 (en) * | 2000-09-26 | 2004-02-03 | University Of North Carolina At Chapel Hill | Phosphate fluorosurfactants for use in carbon dioxide |
US6764552B1 (en) * | 2002-04-18 | 2004-07-20 | Novellus Systems, Inc. | Supercritical solutions for cleaning photoresist and post-etch residue from low-k materials |
US6804900B2 (en) * | 2002-08-22 | 2004-10-19 | Kabushiki Kaisha Kobe Seiko Sho | Method for drying microstructure member |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030075185A (en) * | 2001-02-15 | 2003-09-22 | 미셀 테크놀로지즈, 인코포레이티드 | Methods for cleaning microelectronic structures |
US6846380B2 (en) * | 2002-06-13 | 2005-01-25 | The Boc Group, Inc. | Substrate processing apparatus and related systems and methods |
-
2004
- 2004-05-07 CN CNA2004800432546A patent/CN1960813A/en active Pending
- 2004-05-07 EP EP04751653A patent/EP1765526A4/en not_active Withdrawn
- 2004-05-07 WO PCT/US2004/014353 patent/WO2005113167A1/en active Application Filing
- 2004-05-07 JP JP2007511332A patent/JP2007536730A/en not_active Withdrawn
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5730874A (en) * | 1991-06-12 | 1998-03-24 | Idaho Research Foundation, Inc. | Extraction of metals using supercritical fluid and chelate forming legand |
US6187911B1 (en) * | 1998-05-08 | 2001-02-13 | Idaho Research Foundation, Inc. | Method for separating metal chelates from other materials based on solubilities in supercritical fluids |
US6576066B1 (en) * | 1999-12-06 | 2003-06-10 | Nippon Telegraph And Telephone Corporation | Supercritical drying method and supercritical drying apparatus |
US6558475B1 (en) * | 2000-04-10 | 2003-05-06 | International Business Machines Corporation | Process for cleaning a workpiece using supercritical carbon dioxide |
US6684525B2 (en) * | 2000-09-26 | 2004-02-03 | University Of North Carolina At Chapel Hill | Phosphate fluorosurfactants for use in carbon dioxide |
US6602351B2 (en) * | 2001-02-15 | 2003-08-05 | Micell Technologies, Inc. | Methods for the control of contaminants following carbon dioxide cleaning of microelectronic structures |
US6398875B1 (en) * | 2001-06-27 | 2002-06-04 | International Business Machines Corporation | Process of drying semiconductor wafers using liquid or supercritical carbon dioxide |
US20030047195A1 (en) * | 2001-09-13 | 2003-03-13 | Deyoung James | Methods and apparatus for cleaning and/or treating a substrate using CO2 |
US20030125225A1 (en) * | 2001-12-31 | 2003-07-03 | Chongying Xu | Supercritical fluid cleaning of semiconductor substrates |
US6764552B1 (en) * | 2002-04-18 | 2004-07-20 | Novellus Systems, Inc. | Supercritical solutions for cleaning photoresist and post-etch residue from low-k materials |
US6804900B2 (en) * | 2002-08-22 | 2004-10-19 | Kabushiki Kaisha Kobe Seiko Sho | Method for drying microstructure member |
Non-Patent Citations (1)
Title |
---|
See also references of EP1765526A4 * |
Also Published As
Publication number | Publication date |
---|---|
CN1960813A (en) | 2007-05-09 |
EP1765526A1 (en) | 2007-03-28 |
EP1765526A4 (en) | 2007-11-14 |
JP2007536730A (en) | 2007-12-13 |
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