WO2005114726A3 - Stacked module systems and methods - Google Patents
Stacked module systems and methods Download PDFInfo
- Publication number
- WO2005114726A3 WO2005114726A3 PCT/US2005/016764 US2005016764W WO2005114726A3 WO 2005114726 A3 WO2005114726 A3 WO 2005114726A3 US 2005016764 W US2005016764 W US 2005016764W WO 2005114726 A3 WO2005114726 A3 WO 2005114726A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- csps
- flex circuitry
- standard
- conductive layers
- form standard
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1047—Details of electrical connections between containers
- H01L2225/107—Indirect electrical connections, e.g. via an interposer, a flexible substrate, using TAB
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/845,029 | 2004-05-13 | ||
US10/845,029 US20050056921A1 (en) | 2003-09-15 | 2004-05-13 | Stacked module systems and methods |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005114726A2 WO2005114726A2 (en) | 2005-12-01 |
WO2005114726A3 true WO2005114726A3 (en) | 2006-04-27 |
Family
ID=34274995
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/016764 WO2005114726A2 (en) | 2004-05-13 | 2005-05-11 | Stacked module systems and methods |
Country Status (2)
Country | Link |
---|---|
US (2) | US20050056921A1 (en) |
WO (1) | WO2005114726A2 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100650731B1 (en) | 2004-12-28 | 2006-11-27 | 주식회사 하이닉스반도체 | stacked package |
US7888185B2 (en) * | 2006-08-17 | 2011-02-15 | Micron Technology, Inc. | Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device |
US7425758B2 (en) * | 2006-08-28 | 2008-09-16 | Micron Technology, Inc. | Metal core foldover package structures |
JP2012033875A (en) * | 2010-06-30 | 2012-02-16 | Canon Inc | Stacked-type semiconductor device |
KR101796116B1 (en) | 2010-10-20 | 2017-11-10 | 삼성전자 주식회사 | Semiconductor device, memory module and memory system having the same and operating method thereof |
US11201096B2 (en) * | 2019-07-09 | 2021-12-14 | Texas Instruments Incorporated | Packaged device with die wrapped by a substrate |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5362656A (en) * | 1992-12-02 | 1994-11-08 | Intel Corporation | Method of making an electronic assembly having a flexible circuit wrapped around a substrate |
US6028352A (en) * | 1997-06-13 | 2000-02-22 | Irvine Sensors Corporation | IC stack utilizing secondary leadframes |
US6300679B1 (en) * | 1998-06-01 | 2001-10-09 | Semiconductor Components Industries, Llc | Flexible substrate for packaging a semiconductor component |
US6504104B2 (en) * | 1997-12-10 | 2003-01-07 | Siemens Aktiengesellschaft | Flexible wiring for the transformation of a substrate with edge contacts into a ball grid array |
US6914324B2 (en) * | 2001-10-26 | 2005-07-05 | Staktek Group L.P. | Memory expansion and chip scale stacking system and method |
Family Cites Families (106)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US139577A (en) * | 1873-06-03 | Improvement in sole-pressing machines | ||
US164838A (en) * | 1875-06-22 | Improvement in machines for cutting fan-leaves | ||
US6032A (en) * | 1849-01-16 | Stop-cock wots | ||
US101261A (en) * | 1870-03-29 | Improvement in pumps | ||
US3436604A (en) * | 1966-04-25 | 1969-04-01 | Texas Instruments Inc | Complex integrated circuit array and method for fabricating same |
US3654394A (en) * | 1969-07-08 | 1972-04-04 | Gordon Eng Co | Field effect transistor switch, particularly for multiplexing |
US3727064A (en) * | 1971-03-17 | 1973-04-10 | Monsanto Co | Opto-isolator devices and method for the fabrication thereof |
US4079511A (en) * | 1976-07-30 | 1978-03-21 | Amp Incorporated | Method for packaging hermetically sealed integrated circuit chips on lead frames |
US4437235A (en) * | 1980-12-29 | 1984-03-20 | Honeywell Information Systems Inc. | Integrated circuit package |
US4513368A (en) * | 1981-05-22 | 1985-04-23 | Data General Corporation | Digital data processing system having object-based logical memory addressing and self-structuring modular memory |
JPS6055458A (en) * | 1983-09-05 | 1985-03-30 | Matsushita Electric Ind Co Ltd | Cmos transistor circuit |
US4587596A (en) * | 1984-04-09 | 1986-05-06 | Amp Incorporated | High density mother/daughter circuit board connector |
WO1986004208A1 (en) * | 1984-12-28 | 1986-07-17 | Micro Engineering Co., Ltd. | Method of stacking printed circuit boards |
EP0218796B1 (en) * | 1985-08-16 | 1990-10-31 | Dai-Ichi Seiko Co. Ltd. | Semiconductor device comprising a plug-in-type package |
US4722691A (en) * | 1986-02-03 | 1988-02-02 | General Motors Corporation | Header assembly for a printed circuit board |
US4821007A (en) * | 1987-02-06 | 1989-04-11 | Tektronix, Inc. | Strip line circuit component and method of manufacture |
US5016138A (en) * | 1987-10-27 | 1991-05-14 | Woodman John K | Three dimensional integrated circuit package |
US4983533A (en) * | 1987-10-28 | 1991-01-08 | Irvine Sensors Corporation | High-density electronic modules - process and product |
US5198888A (en) * | 1987-12-28 | 1993-03-30 | Hitachi, Ltd. | Semiconductor stacked device |
US4833568A (en) * | 1988-01-29 | 1989-05-23 | Berhold G Mark | Three-dimensional circuit component assembly and method corresponding thereto |
JP2600753B2 (en) * | 1988-02-03 | 1997-04-16 | 日本電気株式会社 | Input circuit |
US4891789A (en) * | 1988-03-03 | 1990-01-02 | Bull Hn Information Systems, Inc. | Surface mounted multilayer memory printed circuit board |
US4911643A (en) * | 1988-10-11 | 1990-03-27 | Beta Phase, Inc. | High density and high signal integrity connector |
WO1990006609A1 (en) * | 1988-11-16 | 1990-06-14 | Motorola, Inc. | Flexible substrate electronic assembly |
EP0382203B1 (en) * | 1989-02-10 | 1995-04-26 | Fujitsu Limited | Ceramic package type semiconductor device and method of assembling the same |
US5104820A (en) * | 1989-07-07 | 1992-04-14 | Irvine Sensors Corporation | Method of fabricating electronic circuitry unit containing stacked IC layers having lead rerouting |
US5012323A (en) * | 1989-11-20 | 1991-04-30 | Micron Technology, Inc. | Double-die semiconductor package having a back-bonded die and a face-bonded die interconnected on a single leadframe |
US5499160A (en) * | 1990-08-01 | 1996-03-12 | Staktek Corporation | High density integrated circuit module with snap-on rail assemblies |
AU8519891A (en) * | 1990-08-01 | 1992-03-02 | Staktek Corporation | Ultra high density integrated circuit packages, method and apparatus |
US5117282A (en) * | 1990-10-29 | 1992-05-26 | Harris Corporation | Stacked configuration for integrated circuit devices |
JPH04284661A (en) * | 1991-03-13 | 1992-10-09 | Toshiba Corp | Semiconductor device |
US5289062A (en) * | 1991-03-18 | 1994-02-22 | Quality Semiconductor, Inc. | Fast transmission gate switch |
US5099393A (en) * | 1991-03-25 | 1992-03-24 | International Business Machines Corporation | Electronic package for high density applications |
US5214307A (en) * | 1991-07-08 | 1993-05-25 | Micron Technology, Inc. | Lead frame for semiconductor devices having improved adhesive bond line control |
US5311401A (en) * | 1991-07-09 | 1994-05-10 | Hughes Aircraft Company | Stacked chip assembly and manufacturing method therefor |
US5397916A (en) * | 1991-12-10 | 1995-03-14 | Normington; Peter J. C. | Semiconductor device including stacked die |
US5281852A (en) * | 1991-12-10 | 1994-01-25 | Normington Peter J C | Semiconductor device including stacked die |
US5198965A (en) * | 1991-12-18 | 1993-03-30 | International Business Machines Corporation | Free form packaging of specific functions within a computer system |
MY114547A (en) * | 1992-05-25 | 2002-11-30 | Hitachi Ltd | Thin type semiconductor device, module structure using the device and method of mounting the device on board |
US5729894A (en) * | 1992-07-21 | 1998-03-24 | Lsi Logic Corporation | Method of assembling ball bump grid array semiconductor packages |
JP3105089B2 (en) * | 1992-09-11 | 2000-10-30 | 株式会社東芝 | Semiconductor device |
US5731633A (en) * | 1992-09-16 | 1998-03-24 | Gary W. Hamilton | Thin multichip module |
US5402006A (en) * | 1992-11-10 | 1995-03-28 | Texas Instruments Incorporated | Semiconductor device with enhanced adhesion between heat spreader and leads and plastic mold compound |
US5313097A (en) * | 1992-11-16 | 1994-05-17 | International Business Machines, Corp. | High density memory module |
US6205654B1 (en) * | 1992-12-11 | 2001-03-27 | Staktek Group L.P. | Method of manufacturing a surface mount package |
US5484959A (en) * | 1992-12-11 | 1996-01-16 | Staktek Corporation | High density lead-on-package fabrication method and apparatus |
US5455740A (en) * | 1994-03-07 | 1995-10-03 | Staktek Corporation | Bus communication system for stacked high density integrated circuit packages |
US5386341A (en) * | 1993-11-01 | 1995-01-31 | Motorola, Inc. | Flexible substrate folded in a U-shape with a rigidizer plate located in the notch of the U-shape |
KR970000214B1 (en) * | 1993-11-18 | 1997-01-06 | 삼성전자 주식회사 | Semiconductor device and method of producing the same |
US5502333A (en) * | 1994-03-30 | 1996-03-26 | International Business Machines Corporation | Semiconductor stack structures and fabrication/sparing methods utilizing programmable spare circuit |
US5592364A (en) * | 1995-01-24 | 1997-01-07 | Staktek Corporation | High density integrated circuit module with complex electrical interconnect rails |
US5514907A (en) * | 1995-03-21 | 1996-05-07 | Simple Technology Incorporated | Apparatus for stacking semiconductor chips |
US5612570A (en) * | 1995-04-13 | 1997-03-18 | Dense-Pac Microsystems, Inc. | Chip stack and method of making same |
US6025642A (en) * | 1995-08-17 | 2000-02-15 | Staktek Corporation | Ultra high density integrated circuit packages |
KR0184076B1 (en) * | 1995-11-28 | 1999-03-20 | 김광호 | Three-dimensional stacked package |
US5822856A (en) * | 1996-06-28 | 1998-10-20 | International Business Machines Corporation | Manufacturing circuit board assemblies having filled vias |
US6247228B1 (en) * | 1996-08-12 | 2001-06-19 | Tessera, Inc. | Electrical connection with inwardly deformable contacts |
US6336262B1 (en) * | 1996-10-31 | 2002-01-08 | International Business Machines Corporation | Process of forming a capacitor with multi-level interconnection technology |
US6225688B1 (en) * | 1997-12-11 | 2001-05-01 | Tessera, Inc. | Stacked microelectronic assembly and method therefor |
JP3455040B2 (en) * | 1996-12-16 | 2003-10-06 | 株式会社日立製作所 | Source clock synchronous memory system and memory unit |
JP3011233B2 (en) * | 1997-05-02 | 2000-02-21 | 日本電気株式会社 | Semiconductor package and its semiconductor mounting structure |
US6208521B1 (en) * | 1997-05-19 | 2001-03-27 | Nitto Denko Corporation | Film carrier and laminate type mounting structure using same |
US6014316A (en) * | 1997-06-13 | 2000-01-11 | Irvine Sensors Corporation | IC stack utilizing BGA contacts |
US6040624A (en) * | 1997-10-02 | 2000-03-21 | Motorola, Inc. | Semiconductor device package and method |
US6097087A (en) * | 1997-10-31 | 2000-08-01 | Micron Technology, Inc. | Semiconductor package including flex circuit, interconnects and dense array external contacts |
US5869353A (en) * | 1997-11-17 | 1999-02-09 | Dense-Pac Microsystems, Inc. | Modular panel stacking process |
US5899705A (en) * | 1997-11-20 | 1999-05-04 | Akram; Salman | Stacked leads-over chip multi-chip module |
US6028365A (en) * | 1998-03-30 | 2000-02-22 | Micron Technology, Inc. | Integrated circuit package and method of fabrication |
US6233650B1 (en) * | 1998-04-01 | 2001-05-15 | Intel Corporation | Using FET switches for large memory arrays |
US6172874B1 (en) * | 1998-04-06 | 2001-01-09 | Silicon Graphics, Inc. | System for stacking of integrated circuit packages |
US6329709B1 (en) * | 1998-05-11 | 2001-12-11 | Micron Technology, Inc. | Interconnections for a semiconductor device |
US6187652B1 (en) * | 1998-09-14 | 2001-02-13 | Fujitsu Limited | Method of fabrication of multiple-layer high density substrate |
US6222737B1 (en) * | 1999-04-23 | 2001-04-24 | Dense-Pac Microsystems, Inc. | Universal package and method of forming the same |
US6323060B1 (en) * | 1999-05-05 | 2001-11-27 | Dense-Pac Microsystems, Inc. | Stackable flex circuit IC package and method of making same |
US6351029B1 (en) * | 1999-05-05 | 2002-02-26 | Harlan R. Isaak | Stackable flex circuit chip package and method of making same |
US6376769B1 (en) * | 1999-05-18 | 2002-04-23 | Amerasia International Technology, Inc. | High-density electronic package, and method for making same |
US6361228B1 (en) * | 1999-05-27 | 2002-03-26 | Printronix, Inc. | Thermal printer with improved ribbon transport |
US6675469B1 (en) * | 1999-08-11 | 2004-01-13 | Tessera, Inc. | Vapor phase connection techniques |
KR100344927B1 (en) * | 1999-09-27 | 2002-07-19 | 삼성전자 주식회사 | Stack package and method for manufacturing the same |
US6489178B2 (en) * | 2000-01-26 | 2002-12-03 | Texas Instruments Incorporated | Method of fabricating a molded package for micromechanical devices |
US6528870B2 (en) * | 2000-01-28 | 2003-03-04 | Kabushiki Kaisha Toshiba | Semiconductor device having a plurality of stacked wiring boards |
JP3855594B2 (en) * | 2000-04-25 | 2006-12-13 | セイコーエプソン株式会社 | Semiconductor device |
US20020006032A1 (en) * | 2000-05-23 | 2002-01-17 | Chris Karabatsos | Low-profile registered DIMM |
US6683377B1 (en) * | 2000-05-30 | 2004-01-27 | Amkor Technology, Inc. | Multi-stacked memory package |
US6552910B1 (en) * | 2000-06-28 | 2003-04-22 | Micron Technology, Inc. | Stacked-die assemblies with a plurality of microelectronic devices and methods of manufacture |
US6560117B2 (en) * | 2000-06-28 | 2003-05-06 | Micron Technology, Inc. | Packaged microelectronic die assemblies and methods of manufacture |
JP3390412B2 (en) * | 2000-08-07 | 2003-03-24 | 株式会社キャットアイ | head lamp |
JP4397109B2 (en) * | 2000-08-14 | 2010-01-13 | 富士通株式会社 | Information processing apparatus and crossbar board unit / back panel assembly manufacturing method |
US6717241B1 (en) * | 2000-08-31 | 2004-04-06 | Micron Technology, Inc. | Magnetic shielding for integrated circuits |
US6392162B1 (en) * | 2000-11-10 | 2002-05-21 | Chris Karabatsos | Double-sided flexible jumper assembly and method of manufacture |
US6884653B2 (en) * | 2001-03-21 | 2005-04-26 | Micron Technology, Inc. | Folded interposer |
US6707684B1 (en) * | 2001-04-02 | 2004-03-16 | Advanced Micro Devices, Inc. | Method and apparatus for direct connection between two integrated circuits via a connector |
JP4565767B2 (en) * | 2001-04-11 | 2010-10-20 | ルネサスエレクトロニクス株式会社 | Nonvolatile semiconductor memory device |
JP2003031885A (en) * | 2001-07-19 | 2003-01-31 | Toshiba Corp | Semiconductor laser device |
US6451626B1 (en) * | 2001-07-27 | 2002-09-17 | Charles W.C. Lin | Three-dimensional stacked semiconductor package |
US7605479B2 (en) * | 2001-08-22 | 2009-10-20 | Tessera, Inc. | Stacked chip assembly with encapsulant layer |
US6927471B2 (en) * | 2001-09-07 | 2005-08-09 | Peter C. Salmon | Electronic system modules and method of fabrication |
KR100429878B1 (en) * | 2001-09-10 | 2004-05-03 | 삼성전자주식회사 | Memory module and printed circuit board for the same |
US6977440B2 (en) * | 2001-10-09 | 2005-12-20 | Tessera, Inc. | Stacked packages |
KR20030029743A (en) * | 2001-10-10 | 2003-04-16 | 삼성전자주식회사 | Stack package using flexible double wiring substrate |
US6940729B2 (en) * | 2001-10-26 | 2005-09-06 | Staktek Group L.P. | Integrated circuit stacking system and method |
US6765288B2 (en) * | 2002-08-05 | 2004-07-20 | Tessera, Inc. | Microelectronic adaptors, assemblies and methods |
US7071547B2 (en) * | 2002-09-11 | 2006-07-04 | Tessera, Inc. | Assemblies having stacked semiconductor chips and methods of making same |
US6838761B2 (en) * | 2002-09-17 | 2005-01-04 | Chippac, Inc. | Semiconductor multi-package module having wire bond interconnect between stacked packages and having electrical shield |
KR100592786B1 (en) * | 2003-08-22 | 2006-06-26 | 삼성전자주식회사 | Stack package made of area array type packages, and manufacturing method thereof |
US20050018495A1 (en) * | 2004-01-29 | 2005-01-27 | Netlist, Inc. | Arrangement of integrated circuits in a memory module |
-
2004
- 2004-05-13 US US10/845,029 patent/US20050056921A1/en not_active Abandoned
- 2004-12-17 US US11/015,521 patent/US20050098873A1/en not_active Abandoned
-
2005
- 2005-05-11 WO PCT/US2005/016764 patent/WO2005114726A2/en active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5362656A (en) * | 1992-12-02 | 1994-11-08 | Intel Corporation | Method of making an electronic assembly having a flexible circuit wrapped around a substrate |
US6028352A (en) * | 1997-06-13 | 2000-02-22 | Irvine Sensors Corporation | IC stack utilizing secondary leadframes |
US6504104B2 (en) * | 1997-12-10 | 2003-01-07 | Siemens Aktiengesellschaft | Flexible wiring for the transformation of a substrate with edge contacts into a ball grid array |
US6300679B1 (en) * | 1998-06-01 | 2001-10-09 | Semiconductor Components Industries, Llc | Flexible substrate for packaging a semiconductor component |
US6914324B2 (en) * | 2001-10-26 | 2005-07-05 | Staktek Group L.P. | Memory expansion and chip scale stacking system and method |
Also Published As
Publication number | Publication date |
---|---|
WO2005114726A2 (en) | 2005-12-01 |
US20050098873A1 (en) | 2005-05-12 |
US20050056921A1 (en) | 2005-03-17 |
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