WO2005117071A3 - Optoelektronisches halbleiterbauelement und gehäuse-grundkörper für ein derartiges bauelement - Google Patents
Optoelektronisches halbleiterbauelement und gehäuse-grundkörper für ein derartiges bauelement Download PDFInfo
- Publication number
- WO2005117071A3 WO2005117071A3 PCT/DE2005/000877 DE2005000877W WO2005117071A3 WO 2005117071 A3 WO2005117071 A3 WO 2005117071A3 DE 2005000877 W DE2005000877 W DE 2005000877W WO 2005117071 A3 WO2005117071 A3 WO 2005117071A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- semiconductor chip
- component
- housing base
- recess
- optoelectronic semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/597,971 US8975646B2 (en) | 2004-05-31 | 2005-05-12 | Optoelectronic semiconductor component and housing base for such a component |
EP05748711.8A EP1751806B1 (de) | 2004-05-31 | 2005-05-12 | Optoelektronisches halbleiterbauelement und gehäuse-grundkörper für ein derartiges bauelement |
JP2007513672A JP5366399B2 (ja) | 2004-05-31 | 2005-05-12 | 光電子半導体構成素子及び該構成素子のためのケーシング基体 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004026858.4 | 2004-05-31 | ||
DE102004026858 | 2004-05-31 | ||
DE102004040468.2 | 2004-08-20 | ||
DE102004040468.2A DE102004040468B4 (de) | 2004-05-31 | 2004-08-20 | Optoelektronisches Halbleiterbauelement und Gehäuse-Grundkörper für ein derartiges Bauelement |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005117071A2 WO2005117071A2 (de) | 2005-12-08 |
WO2005117071A3 true WO2005117071A3 (de) | 2006-08-03 |
Family
ID=35433295
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2005/000877 WO2005117071A2 (de) | 2004-05-31 | 2005-05-12 | Optoelektronisches halbleiterbauelement und gehäuse-grundkörper für ein derartiges bauelement |
Country Status (4)
Country | Link |
---|---|
US (1) | US8975646B2 (de) |
EP (1) | EP1751806B1 (de) |
JP (1) | JP5366399B2 (de) |
WO (1) | WO2005117071A2 (de) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
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EP1914809A1 (de) * | 2006-10-20 | 2008-04-23 | Tridonic Optoelectronics GmbH | Hülle für optoelektronische Bauelemente |
KR100831078B1 (ko) * | 2006-10-25 | 2008-05-20 | 주식회사 서호 | Led 리드 프레임 및 그 제조 방법 |
US8217482B2 (en) * | 2007-12-21 | 2012-07-10 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Infrared proximity sensor package with reduced crosstalk |
US8420999B2 (en) * | 2009-05-08 | 2013-04-16 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Metal shield and housing for optical proximity sensor with increased resistance to mechanical deformation |
US8779361B2 (en) * | 2009-06-30 | 2014-07-15 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Optical proximity sensor package with molded infrared light rejection barrier and infrared pass components |
US8957380B2 (en) * | 2009-06-30 | 2015-02-17 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Infrared attenuating or blocking layer in optical proximity sensor |
US9525093B2 (en) | 2009-06-30 | 2016-12-20 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Infrared attenuating or blocking layer in optical proximity sensor |
US8350216B2 (en) * | 2009-09-10 | 2013-01-08 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Miniaturized optical proximity sensor |
US8143608B2 (en) * | 2009-09-10 | 2012-03-27 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Package-on-package (POP) optical proximity sensor |
US8716665B2 (en) * | 2009-09-10 | 2014-05-06 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Compact optical proximity sensor with ball grid array and windowed substrate |
US9733357B2 (en) * | 2009-11-23 | 2017-08-15 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Infrared proximity sensor package with improved crosstalk isolation |
KR101859149B1 (ko) | 2011-04-14 | 2018-05-17 | 엘지이노텍 주식회사 | 발광 소자 패키지 |
KR101103674B1 (ko) | 2010-06-01 | 2012-01-11 | 엘지이노텍 주식회사 | 발광 소자 |
JP2012079723A (ja) * | 2010-09-30 | 2012-04-19 | Toyoda Gosei Co Ltd | 発光装置 |
US8841597B2 (en) | 2010-12-27 | 2014-09-23 | Avago Technologies Ip (Singapore) Pte. Ltd. | Housing for optical proximity sensor |
JP5527286B2 (ja) * | 2011-06-29 | 2014-06-18 | 豊田合成株式会社 | 発光装置 |
CN103262269B (zh) * | 2011-11-24 | 2018-06-19 | 惠州科锐半导体照明有限公司 | Led封装件 |
JP6107229B2 (ja) * | 2013-02-27 | 2017-04-05 | 日亜化学工業株式会社 | 発光装置 |
DE102013222703A1 (de) * | 2013-11-08 | 2015-05-13 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
DE102017109079B4 (de) | 2017-04-27 | 2024-02-22 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauelement und Bauteil mit solch einem Bauelement |
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2005
- 2005-05-12 US US11/597,971 patent/US8975646B2/en active Active
- 2005-05-12 WO PCT/DE2005/000877 patent/WO2005117071A2/de active Application Filing
- 2005-05-12 JP JP2007513672A patent/JP5366399B2/ja active Active
- 2005-05-12 EP EP05748711.8A patent/EP1751806B1/de active Active
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WO2004068594A1 (de) * | 2003-01-30 | 2004-08-12 | Osram Opto Semiconductors Gmbh | Elektromagnetische strahlung aussendendes und/oder empfangendes halbleiter-bauelement und gehäuse-grundkörper für ein derartiges bauelement |
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Title |
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Also Published As
Publication number | Publication date |
---|---|
EP1751806B1 (de) | 2019-09-11 |
WO2005117071A2 (de) | 2005-12-08 |
JP2008501227A (ja) | 2008-01-17 |
US8975646B2 (en) | 2015-03-10 |
EP1751806A2 (de) | 2007-02-14 |
US20080012033A1 (en) | 2008-01-17 |
JP5366399B2 (ja) | 2013-12-11 |
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