WO2005119757A3 - Packaged integrated circuit devices - Google Patents

Packaged integrated circuit devices Download PDF

Info

Publication number
WO2005119757A3
WO2005119757A3 PCT/IB2005/001591 IB2005001591W WO2005119757A3 WO 2005119757 A3 WO2005119757 A3 WO 2005119757A3 IB 2005001591 W IB2005001591 W IB 2005001591W WO 2005119757 A3 WO2005119757 A3 WO 2005119757A3
Authority
WO
WIPO (PCT)
Prior art keywords
integrated circuit
interposer
electrically connected
gel
lead frame
Prior art date
Application number
PCT/IB2005/001591
Other languages
French (fr)
Other versions
WO2005119757A2 (en
Inventor
Der Wiel Appolonius Jacobu Van
Jian Chen
Original Assignee
Melexis Nv
Der Wiel Appolonius Jacobu Van
Jian Chen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Melexis Nv, Der Wiel Appolonius Jacobu Van, Jian Chen filed Critical Melexis Nv
Priority to EP05748165A priority Critical patent/EP1751793A2/en
Priority to JP2007514204A priority patent/JP2008502130A/en
Publication of WO2005119757A2 publication Critical patent/WO2005119757A2/en
Publication of WO2005119757A3 publication Critical patent/WO2005119757A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/49531—Additional leads the additional leads being a wiring board
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
    • B29C33/06—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means using radiation, e.g. electro-magnetic waves, induction heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

An integrated circuit device (100) comprises an integrated circuit (104) encapsulated in a protective package (108). The integrated circuit (104) incorporates at least one active element, which may be a sensing element or a radiation emitting means. The integrated circuit (104) is mounted on and electrically connected to an interposer (103). The interposer (103) has a substantially identical coefficient of thermal expansion to the integrated circuit (104). The interposer (103) is glued to a lead frame (102). The integrated circuit (104) is electrically connected to the interposer (103) by means of bond wires (106) and the interposer (103) is electrically connected to the peripheral portions (101) of the lead frame (102) by means of bond wires (105). Once the integrated circuit (104), interposer (103) and lead frame (102) have been mounted upon one another and electrically connected, the blob of gel (107) is dispensed onto the top surface of said integrated circuit (104) to form a gel covered assembly. The gel coated assembly is inserted into the cavity of a mould tool. Said cavity is provided with a projection, (110) on its inner surface that is adapted to make contact with said gel blob (107). Plastic moulding compound (108) is then injected into the mould cavity to encapsulate the device in a protective package.
PCT/IB2005/001591 2004-06-04 2005-06-06 Packaged integrated circuit devices WO2005119757A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP05748165A EP1751793A2 (en) 2004-06-04 2005-06-06 Packaged integrated circuit devices
JP2007514204A JP2008502130A (en) 2004-06-04 2005-06-06 Packaged integrated circuit device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0412435.0A GB0412435D0 (en) 2004-06-04 2004-06-04 Packaged intergrated circuit devices
GB0412435.0 2004-06-04

Publications (2)

Publication Number Publication Date
WO2005119757A2 WO2005119757A2 (en) 2005-12-15
WO2005119757A3 true WO2005119757A3 (en) 2006-09-14

Family

ID=32696634

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2005/001591 WO2005119757A2 (en) 2004-06-04 2005-06-06 Packaged integrated circuit devices

Country Status (5)

Country Link
EP (1) EP1751793A2 (en)
JP (1) JP2008502130A (en)
KR (1) KR20070024603A (en)
GB (1) GB0412435D0 (en)
WO (1) WO2005119757A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005054631A1 (en) * 2005-11-16 2007-05-24 Robert Bosch Gmbh Sensor arrangement with a substrate and with a housing and method for producing a sensor arrangement
KR20120082192A (en) 2011-01-13 2012-07-23 삼성엘이디 주식회사 Light emitting device package
US9690578B2 (en) * 2013-02-20 2017-06-27 Intel Corporation High dose radiation detector
JP2021071294A (en) * 2019-10-29 2021-05-06 セイコーエプソン株式会社 Vibration device, electronic device, and moving body

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5173766A (en) * 1990-06-25 1992-12-22 Lsi Logic Corporation Semiconductor device package and method of making such a package
EP1211721A1 (en) * 2000-11-30 2002-06-05 STMicroelectronics S.r.l. Improved electronic device package and corresponding manufacturing method
US20020168795A1 (en) * 2001-05-11 2002-11-14 Melexis Nv Tire pressure sensors and methods of making the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5173766A (en) * 1990-06-25 1992-12-22 Lsi Logic Corporation Semiconductor device package and method of making such a package
EP1211721A1 (en) * 2000-11-30 2002-06-05 STMicroelectronics S.r.l. Improved electronic device package and corresponding manufacturing method
US20020168795A1 (en) * 2001-05-11 2002-11-14 Melexis Nv Tire pressure sensors and methods of making the same

Also Published As

Publication number Publication date
WO2005119757A2 (en) 2005-12-15
GB0412435D0 (en) 2004-07-07
JP2008502130A (en) 2008-01-24
EP1751793A2 (en) 2007-02-14
KR20070024603A (en) 2007-03-02

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