WO2006015685A3 - Bauteilanordnung mit optimierter montagefähigkeit - Google Patents

Bauteilanordnung mit optimierter montagefähigkeit Download PDF

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Publication number
WO2006015685A3
WO2006015685A3 PCT/EP2005/007675 EP2005007675W WO2006015685A3 WO 2006015685 A3 WO2006015685 A3 WO 2006015685A3 EP 2005007675 W EP2005007675 W EP 2005007675W WO 2006015685 A3 WO2006015685 A3 WO 2006015685A3
Authority
WO
WIPO (PCT)
Prior art keywords
electronics module
component arrangement
circuit board
printed circuit
heat sink
Prior art date
Application number
PCT/EP2005/007675
Other languages
English (en)
French (fr)
Other versions
WO2006015685A2 (de
Inventor
Anton Mauder
Wolfgang Scholz
Original Assignee
Infineon Technologies Ag
Anton Mauder
Wolfgang Scholz
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag, Anton Mauder, Wolfgang Scholz filed Critical Infineon Technologies Ag
Priority to US11/659,297 priority Critical patent/US8089768B2/en
Publication of WO2006015685A2 publication Critical patent/WO2006015685A2/de
Publication of WO2006015685A3 publication Critical patent/WO2006015685A3/de

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/44—Mechanical structures for providing tensile strength and external protection for fibres, e.g. optical transmission cables
    • G02B6/4401—Optical cables
    • G02B6/4429—Means specially adapted for strengthening or protecting the cables
    • G02B6/44384—Means specially adapted for strengthening or protecting the cables the means comprising water blocking or hydrophobic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/44—Mechanical structures for providing tensile strength and external protection for fibres, e.g. optical transmission cables
    • G02B6/4401—Optical cables
    • G02B6/441—Optical cables built up from sub-bundles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly

Abstract

Die Erfindung betrifft eine Bauteilanordnung mit einem Elektronikmodul. (10), einem mit dem Elektronikmodul (10) kontaktierten Kühlkörper (20), einer Leiterplatte (30) und einem Befestigungsmittel (40) zur Befestigung des Elektronikmoduls (10) mit der Leiterplatte (30) und dem Kühlkörper (20). Dabei weist das Elektronikmodul (10) wenigstens ein elastisches Anschlussbein (11) zur lotfreien Kontaktierung des Elektronikmoduls (10) mit der Leiterplatte (30) sowie eine Aufnahme (14) für das Befestigungsmittel (40) auf. Des weiteren umfasst das Elektronikmodul (10) ein Entkopplungsmittel (12) zur Entkopplung der Druckkraft zwischen dem Anschlussbein (11) und der Leiterplatte (30) von der Anpresskraft zwischen dem Kühlkörper (20) und dem Elektronikmodul (10). Ein weiterer Aspekt der Erfindung ist auf ein Elektronikmodul (10) gerichtet, das bei einer derartigen Bauteilanordnung verwendbar ist.
PCT/EP2005/007675 2004-08-03 2005-07-14 Bauteilanordnung mit optimierter montagefähigkeit WO2006015685A2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/659,297 US8089768B2 (en) 2004-08-03 2005-07-14 Component arragement with an optimized assembly capability

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004037656A DE102004037656B4 (de) 2004-08-03 2004-08-03 Elektronikmodul mit optimierter Montagefähigkeit und Bauteilanordnung mit einem Elektronikmodul
DE102004037656.5 2004-08-03

Publications (2)

Publication Number Publication Date
WO2006015685A2 WO2006015685A2 (de) 2006-02-16
WO2006015685A3 true WO2006015685A3 (de) 2006-06-01

Family

ID=35645666

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2005/007675 WO2006015685A2 (de) 2004-08-03 2005-07-14 Bauteilanordnung mit optimierter montagefähigkeit

Country Status (4)

Country Link
US (1) US8089768B2 (de)
CN (1) CN100579350C (de)
DE (1) DE102004037656B4 (de)
WO (1) WO2006015685A2 (de)

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DE102004037656B4 (de) 2004-08-03 2009-06-18 Infineon Technologies Ag Elektronikmodul mit optimierter Montagefähigkeit und Bauteilanordnung mit einem Elektronikmodul
DE102006021412B3 (de) * 2006-05-09 2007-11-15 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul
DE102006025453B4 (de) 2006-05-31 2009-12-24 Infineon Technologies Ag Halbleiterschaltungsanordnung
DE102007006212B4 (de) * 2007-02-08 2012-09-13 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Kontaktfedern
US9373563B2 (en) * 2007-07-20 2016-06-21 Infineon Technologies Ag Semiconductor assembly having a housing
DE102007045281B4 (de) * 2007-09-21 2010-02-25 Semikron Elektronik Gmbh & Co. Kg Leistungsmodul
US8582941B2 (en) 2009-02-16 2013-11-12 Corning Cable Systems Llc Micromodule cables and breakout cables therefor
JP2011176096A (ja) * 2010-02-24 2011-09-08 Mitsumi Electric Co Ltd 電子機器
DE102011005890A1 (de) * 2011-03-22 2012-09-27 Robert Bosch Gmbh Elektronikgerät mit Schaltungsträger in einem Einschubgehäuse
CN102705336B (zh) * 2011-03-28 2015-08-12 富瑞精密组件（昆山）有限公司 具有防滑功能的螺丝及使用该螺丝的电子装置
US8545258B1 (en) * 2012-04-18 2013-10-01 International Business Machines Corporation Structure for removable processor socket
US9554488B2 (en) * 2014-04-18 2017-01-24 Raytheon Company Method to align surface mount packages for thermal enhancement
US10548248B2 (en) * 2016-02-10 2020-01-28 Dell Products, Lp System and method of unified cooling solution in an IOT device
CN108990251B (zh) * 2017-06-02 2020-12-25 台达电子工业股份有限公司 印刷电路板组装结构及其组装方法
CN109727936B (zh) * 2017-10-27 2022-10-28 伊姆西Ip控股有限责任公司 用于双侧散热器的固定装置和相关联的散热系统
CN107911952A (zh) * 2017-12-20 2018-04-13 周宗铭 一种电力电子元器件与印刷电路板的连接方法
JP7031347B2 (ja) * 2018-02-14 2022-03-08 三菱電機株式会社 パワーモジュール及び半導体装置
EP3964040A1 (de) * 2019-06-13 2022-03-09 Huawei Technologies Co., Ltd. Kühlvorrichtung zum sichern eines ersten moduls und eines zweiten moduls in einem raum
CN111223940B (zh) * 2019-12-04 2021-12-31 中国工程物理研究院材料研究所 一种芯片封装结构、探测头和探测器
CN117130106A (zh) * 2022-05-20 2023-11-28 华为技术有限公司 一种电路板模组及通信设备

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Also Published As

Publication number Publication date
US20090213552A1 (en) 2009-08-27
DE102004037656B4 (de) 2009-06-18
US8089768B2 (en) 2012-01-03
DE102004037656A1 (de) 2006-03-16
CN100579350C (zh) 2010-01-06
WO2006015685A2 (de) 2006-02-16
CN101036425A (zh) 2007-09-12

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