WO2006020194A3 - Imprint alignment method, system, and template - Google Patents

Imprint alignment method, system, and template Download PDF

Info

Publication number
WO2006020194A3
WO2006020194A3 PCT/US2005/025390 US2005025390W WO2006020194A3 WO 2006020194 A3 WO2006020194 A3 WO 2006020194A3 US 2005025390 W US2005025390 W US 2005025390W WO 2006020194 A3 WO2006020194 A3 WO 2006020194A3
Authority
WO
WIPO (PCT)
Prior art keywords
template
features
offset
templates
alignment method
Prior art date
Application number
PCT/US2005/025390
Other languages
French (fr)
Other versions
WO2006020194A2 (en
Inventor
Ronald D Voisin
Original Assignee
Molecular Imprints Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molecular Imprints Inc filed Critical Molecular Imprints Inc
Publication of WO2006020194A2 publication Critical patent/WO2006020194A2/en
Publication of WO2006020194A3 publication Critical patent/WO2006020194A3/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/7035—Proximity or contact printers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/84—Manufacture, treatment, or detection of nanostructure
    • Y10S977/887—Nanoimprint lithography, i.e. nanostamp

Abstract

An improved lithographic alignment method, system, and template. The method includes creating, within a lithographic subfield, subsequent-layer features which are intentionally offset from their respective previous-layer features, where the intentional offset may vary in magnitude and direction from one subfield to the next. The system includes an imprint lithographic machine and first and second lithography templates where the templates are adapted to enable the machine to form first and second features, respectively, and where a second feature is configured to be deliberately offset from a corresponding first feature. The template set includes at least two templates, one having features which are deliberately offset from corresponding features of another template. Also, a method of manufacturing such a template set.
PCT/US2005/025390 2004-07-20 2005-07-18 Imprint alignment method, system, and template WO2006020194A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/895,214 US7785526B2 (en) 2004-07-20 2004-07-20 Imprint alignment method, system, and template
US10/895,214 2004-07-20

Publications (2)

Publication Number Publication Date
WO2006020194A2 WO2006020194A2 (en) 2006-02-23
WO2006020194A3 true WO2006020194A3 (en) 2009-04-09

Family

ID=35657589

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/025390 WO2006020194A2 (en) 2004-07-20 2005-07-18 Imprint alignment method, system, and template

Country Status (3)

Country Link
US (2) US7785526B2 (en)
TW (1) TWI283339B (en)
WO (1) WO2006020194A2 (en)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7162035B1 (en) 2000-05-24 2007-01-09 Tracer Detection Technology Corp. Authentication method and system
EP2270592B1 (en) * 2000-07-17 2015-09-02 Board of Regents, The University of Texas System Method of forming a pattern on a substrate
US20060005657A1 (en) * 2004-06-01 2006-01-12 Molecular Imprints, Inc. Method and system to control movement of a body for nano-scale manufacturing
JP2004523906A (en) * 2000-10-12 2004-08-05 ボード・オブ・リージエンツ，ザ・ユニバーシテイ・オブ・テキサス・システム Templates for room-temperature and low-pressure micro and nano-transfer lithography
US20050064344A1 (en) * 2003-09-18 2005-03-24 University Of Texas System Board Of Regents Imprint lithography templates having alignment marks
US7179079B2 (en) * 2002-07-08 2007-02-20 Molecular Imprints, Inc. Conforming template for patterning liquids disposed on substrates
US20080160129A1 (en) 2006-05-11 2008-07-03 Molecular Imprints, Inc. Template Having a Varying Thickness to Facilitate Expelling a Gas Positioned Between a Substrate and the Template
US7140861B2 (en) * 2004-04-27 2006-11-28 Molecular Imprints, Inc. Compliant hard template for UV imprinting
US7768624B2 (en) * 2004-06-03 2010-08-03 Board Of Regents, The University Of Texas System Method for obtaining force combinations for template deformation using nullspace and methods optimization techniques
CN101379435A (en) * 2004-06-03 2009-03-04 得克萨斯州大学系统董事会 System and method for improvement of alignment and overlay for microlithography
US7309225B2 (en) * 2004-08-13 2007-12-18 Molecular Imprints, Inc. Moat system for an imprint lithography template
US7630067B2 (en) * 2004-11-30 2009-12-08 Molecular Imprints, Inc. Interferometric analysis method for the manufacture of nano-scale devices
US20070231421A1 (en) * 2006-04-03 2007-10-04 Molecular Imprints, Inc. Enhanced Multi Channel Alignment
KR20070086766A (en) * 2004-12-01 2007-08-27 몰레큘러 임프린츠 인코퍼레이티드 Methods of exposure for the purpose of thermal management for imprint lithography processes
US7676088B2 (en) * 2004-12-23 2010-03-09 Asml Netherlands B.V. Imprint lithography
US20060177535A1 (en) * 2005-02-04 2006-08-10 Molecular Imprints, Inc. Imprint lithography template to facilitate control of liquid movement
KR20070120605A (en) * 2005-04-14 2007-12-24 더 프레지던트 앤드 펠로우즈 오브 하바드 칼리지 Adjustable solubility in sacrificial layers for microfabrication
US20070228608A1 (en) * 2006-04-03 2007-10-04 Molecular Imprints, Inc. Preserving Filled Features when Vacuum Wiping
US7517211B2 (en) 2005-12-21 2009-04-14 Asml Netherlands B.V. Imprint lithography
US8142850B2 (en) 2006-04-03 2012-03-27 Molecular Imprints, Inc. Patterning a plurality of fields on a substrate to compensate for differing evaporation times
JP5306989B2 (en) 2006-04-03 2013-10-02 モレキュラー・インプリンツ・インコーポレーテッド Method for simultaneously patterning a substrate having a plurality of fields and alignment marks
US8012395B2 (en) * 2006-04-18 2011-09-06 Molecular Imprints, Inc. Template having alignment marks formed of contrast material
WO2007124007A2 (en) * 2006-04-21 2007-11-01 Molecular Imprints, Inc. Method for detecting a particle in a nanoimprint lithography system
JP5027468B2 (en) * 2006-09-15 2012-09-19 日本ミクロコーティング株式会社 Probe cleaning or probe processing sheet and probe processing method
US7985530B2 (en) 2006-09-19 2011-07-26 Molecular Imprints, Inc. Etch-enhanced technique for lift-off patterning
US7832416B2 (en) 2006-10-10 2010-11-16 Hewlett-Packard Development Company, L.P. Imprint lithography apparatus and methods
US7906274B2 (en) * 2007-11-21 2011-03-15 Molecular Imprints, Inc. Method of creating a template employing a lift-off process
US8012394B2 (en) * 2007-12-28 2011-09-06 Molecular Imprints, Inc. Template pattern density doubling
US20090212012A1 (en) * 2008-02-27 2009-08-27 Molecular Imprints, Inc. Critical dimension control during template formation
US7995196B1 (en) 2008-04-23 2011-08-09 Tracer Detection Technology Corp. Authentication method and system
US20100015270A1 (en) * 2008-07-15 2010-01-21 Molecular Imprints, Inc. Inner cavity system for nano-imprint lithography
TW201022017A (en) * 2008-09-30 2010-06-16 Molecular Imprints Inc Particle mitigation for imprint lithography
US20100092599A1 (en) * 2008-10-10 2010-04-15 Molecular Imprints, Inc. Complementary Alignment Marks for Imprint Lithography
US20100095862A1 (en) * 2008-10-22 2010-04-22 Molecular Imprints, Inc. Double Sidewall Angle Nano-Imprint Template
US8877073B2 (en) * 2008-10-27 2014-11-04 Canon Nanotechnologies, Inc. Imprint lithography template
US9122148B2 (en) * 2008-11-03 2015-09-01 Canon Nanotechnologies, Inc. Master template replication
US8529778B2 (en) * 2008-11-13 2013-09-10 Molecular Imprints, Inc. Large area patterning of nano-sized shapes
CN102438841A (en) * 2009-03-23 2012-05-02 因特瓦克公司 A process for optimization of island to trench ratio in patterned media
US8869982B2 (en) 2009-12-18 2014-10-28 Edwards Lifesciences Corporation Prosthetic heart valve packaging and deployment system
JP5769734B2 (en) * 2010-02-05 2015-08-26 モレキュラー・インプリンツ・インコーポレーテッド Template with high contrast alignment mark
JP2011258605A (en) * 2010-06-04 2011-12-22 Toshiba Corp Patterning method and method of manufacturing semiconductor device
US8996150B1 (en) * 2010-09-30 2015-03-31 W.A. Krapf, Inc. Customization of manufactured products
KR102046933B1 (en) 2010-11-05 2019-11-20 캐논 나노테크놀로지즈 인코퍼레이티드 Patterning of non-convex shaped nanostructures
JP5533769B2 (en) * 2011-04-14 2014-06-25 ウシオ電機株式会社 Mask and workpiece alignment method
WO2012170936A2 (en) 2011-06-09 2012-12-13 Illumina, Inc. Patterned flow-cells useful for nucleic acid analysis
WO2013063382A2 (en) 2011-10-28 2013-05-02 Illumina, Inc. Microarray fabrication system and method
KR101910974B1 (en) * 2011-12-13 2018-10-24 삼성전자주식회사 Imprinting stamp and nano-imprint method using the same
JP5960198B2 (en) * 2013-07-02 2016-08-02 キヤノン株式会社 Pattern forming method, lithographic apparatus, lithographic system, and article manufacturing method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6919152B2 (en) * 2000-07-16 2005-07-19 Board Of Regents, The University Of Texas System High resolution overlay alignment systems for imprint lithography

Family Cites Families (277)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US473155A (en) * 1892-04-19 Harrow
GB494877A (en) 1938-03-01 1938-11-02 Johnson Bros Hanley Ltd Improvements in or relating to pottery ware and the manufacture thereof
GB1139808A (en) 1965-05-11 1969-01-15 Hayes Engineers Leeds Ltd Improvements in or relating to tracer valve control units
GB1146618A (en) 1965-10-11 1969-03-26 Harry Frank Gipe Method for preparing photo-lithographic plates
US3577593A (en) 1968-10-29 1971-05-04 Bird & Son Apparatus for heat and vacuum-pressure machine molding
US3783520A (en) * 1970-09-28 1974-01-08 Bell Telephone Labor Inc High accuracy alignment procedure utilizing moire patterns
FR2325018A1 (en) * 1975-06-23 1977-04-15 Ibm INTERVAL MEASURING DEVICE FOR DEFINING THE DISTANCE BETWEEN TWO OR MORE FACES
GB1578259A (en) 1977-05-11 1980-11-05 Philips Electronic Associated Methods of manufacturing solid-state devices apparatus for use therein and devices manufactured thereby
US4202681A (en) 1978-01-25 1980-05-13 Mcmaster Harold Vacuum holder system and method for use in bending glass
US4201800A (en) 1978-04-28 1980-05-06 International Business Machines Corp. Hardened photoresist master image mask process
US4326805A (en) * 1980-04-11 1982-04-27 Bell Telephone Laboratories, Incorporated Method and apparatus for aligning mask and wafer members
US4444801A (en) 1981-01-14 1984-04-24 Hitachi, Ltd. Method and apparatus for correcting transparent defects on a photomask
US4356018A (en) 1981-09-04 1982-10-26 Mcmaster Harold Method and apparatus for deep bending glass sheets
FR2538923A1 (en) * 1982-12-30 1984-07-06 Thomson Csf METHOD AND DEVICE FOR OPTICALLY ALIGNING PATTERNS IN TWO PLANS RECONCILED IN AN EXPOSURE APPARATUS COMPRISING A DIVERGENT RADIATION SOURCE
US4487623A (en) 1983-07-18 1984-12-11 Ppg Industries, Inc. Method of and apparatus for removing sharply bent glass sheets from press bending molds
US4512848A (en) 1984-02-06 1985-04-23 Exxon Research And Engineering Co. Procedure for fabrication of microstructures over large areas using physical replication
US5554336A (en) 1984-08-08 1996-09-10 3D Systems, Inc. Method and apparatus for production of three-dimensional objects by stereolithography
JPS61116358A (en) 1984-11-09 1986-06-03 Mitsubishi Electric Corp Photomask material
US4724222A (en) * 1986-04-28 1988-02-09 American Telephone And Telegraph Company, At&T Bell Laboratories Wafer chuck comprising a curved reference surface
US4776695A (en) 1986-05-16 1988-10-11 Prometrix Corporation High accuracy film thickness measurement system
KR900004269B1 (en) * 1986-06-11 1990-06-18 가부시기가이샤 도시바 Method and device for positioing 1st body and 2nd body
US4929083A (en) 1986-06-19 1990-05-29 Xerox Corporation Focus and overlay characterization and optimization for photolithographic exposure
JPS6334108A (en) 1986-07-30 1988-02-13 Hitachi Ltd Manufacture of substrate for optical disc and device therefor
FR2604553A1 (en) 1986-09-29 1988-04-01 Rhone Poulenc Chimie RIGID POLYMER SUBSTRATE FOR OPTICAL DISC AND OPTICAL DISCS OBTAINED FROM THE SUBSTRATE
US4707611A (en) 1986-12-08 1987-11-17 Rockwell International Corporation Incremental monitoring of thin films
US4731155A (en) 1987-04-15 1988-03-15 General Electric Company Process for forming a lithographic mask
JPH0712949B2 (en) 1987-07-07 1995-02-15 旭硝子株式会社 Plate glass bending mold
US5028366A (en) 1988-01-12 1991-07-02 Air Products And Chemicals, Inc. Water based mold release compositions for making molded polyurethane foam
US4877437A (en) 1988-04-29 1989-10-31 Glasstech International L.P. Vacuum platen for sharp bends
EP0355496A3 (en) * 1988-08-15 1990-10-10 Sumitomo Heavy Industries Co., Ltd. Position detector employing a sector fresnel zone plate
JP2546350B2 (en) * 1988-09-09 1996-10-23 キヤノン株式会社 Alignment device
US4887283A (en) 1988-09-27 1989-12-12 Mitsubishi Denki Kabushiki Kaisha X-ray mask and exposure method employing the same
US5876550A (en) 1988-10-05 1999-03-02 Helisys, Inc. Laminated object manufacturing apparatus and method
US5235400A (en) 1988-10-12 1993-08-10 Hitachi, Ltd. Method of and apparatus for detecting defect on photomask
US5171490A (en) 1988-11-29 1992-12-15 Fudim Efrem V Method and apparatus for production of three-dimensional objects by irradiation of photopolymers
US5110514A (en) 1989-05-01 1992-05-05 Soane Technologies, Inc. Controlled casting of a shrinkable material
JP2704001B2 (en) * 1989-07-18 1998-01-26 キヤノン株式会社 Position detection device
US4964145A (en) 1989-07-24 1990-10-16 International Business Machines Corporation System for magnification correction of conductive X-ray lithography mask substrates
US5151754A (en) * 1989-10-06 1992-09-29 Kabushiki Kaisha Toshiba Method and an apparatus for measuring a displacement between two objects and a method and an apparatus for measuring a gap distance between two objects
JP3197010B2 (en) * 1990-03-05 2001-08-13 株式会社東芝 Interval setting method and interval setting device
US5160402A (en) 1990-05-24 1992-11-03 Applied Materials, Inc. Multi-channel plasma discharge endpoint detection method
US5016691A (en) 1990-06-19 1991-05-21 Lucien Bernier Apparatus for centering template guide on router
DE4029912A1 (en) 1990-09-21 1992-03-26 Philips Patentverwaltung METHOD FOR FORMING AT LEAST ONE TRENCH IN A SUBSTRATE LAYER
US5331371A (en) 1990-09-26 1994-07-19 Canon Kabushiki Kaisha Alignment and exposure method
US5072126A (en) 1990-10-31 1991-12-10 International Business Machines Corporation Promixity alignment using polarized illumination and double conjugate projection lens
US5362940A (en) 1990-11-09 1994-11-08 Litel Instruments Use of Fresnel zone plates for material processing
US5270222A (en) 1990-12-31 1993-12-14 Texas Instruments Incorporated Method and apparatus for semiconductor device fabrication diagnosis and prognosis
JP2796899B2 (en) 1991-02-16 1998-09-10 住友重機械工業株式会社 Illumination method for band light and multicolor light in a chromatic aberration double focus device
JP2985323B2 (en) 1991-03-04 1999-11-29 株式会社日立製作所 Pattern inspection method and apparatus
US5155749A (en) 1991-03-28 1992-10-13 International Business Machines Corporation Variable magnification mask for X-ray lithography
US5206983A (en) * 1991-06-24 1993-05-04 Wisconsin Alumni Research Foundation Method of manufacturing micromechanical devices
US5280437A (en) * 1991-06-28 1994-01-18 Digital Equipment Corporation Structure and method for direct calibration of registration measurement systems to actual semiconductor wafer process topography
JPH0553289A (en) 1991-08-22 1993-03-05 Nec Corp Production of phase shift reticle
US5563702A (en) 1991-08-22 1996-10-08 Kla Instruments Corporation Automated photomask inspection apparatus and method
JPH05157521A (en) 1991-08-29 1993-06-22 Nkk Corp Measuring method of ellipso parameter and ellipsometer
JPH0580530A (en) 1991-09-24 1993-04-02 Hitachi Ltd Production of thin film pattern
US5877032A (en) 1995-10-12 1999-03-02 Lucent Technologies Inc. Process for device fabrication in which the plasma etch is controlled by monitoring optical emission
JP3074579B2 (en) 1992-01-31 2000-08-07 キヤノン株式会社 Position shift correction method
US5204739A (en) 1992-02-07 1993-04-20 Karl Suss America, Inc. Proximity mask alignment using a stored video image
US5545367A (en) 1992-04-15 1996-08-13 Soane Technologies, Inc. Rapid prototype three dimensional stereolithography
EP0568478A1 (en) 1992-04-29 1993-11-03 International Business Machines Corporation Darkfield alignment system using a confocal spatial filter
DE4215285C1 (en) 1992-05-09 1993-08-19 Vegla Vereinigte Glaswerke Gmbh, 5100 Aachen, De
US5371822A (en) 1992-06-09 1994-12-06 Digital Equipment Corporation Method of packaging and assembling opto-electronic integrated circuits
AU4689293A (en) 1992-07-15 1994-02-14 On-Line Technologies, Inc. Method and apparatus for monitoring layer processing
US5601641A (en) 1992-07-21 1997-02-11 Tse Industries, Inc. Mold release composition with polybutadiene and method of coating a mold core
JP2821073B2 (en) 1992-12-18 1998-11-05 松下電器産業株式会社 Gap control device and gap control method
JPH06183561A (en) * 1992-12-18 1994-07-05 Canon Inc Moving stage device
US6153886A (en) * 1993-02-19 2000-11-28 Nikon Corporation Alignment apparatus in projection exposure apparatus
US5565114A (en) 1993-03-04 1996-10-15 Tokyo Electron Limited Method and device for detecting the end point of plasma process
DE69405451T2 (en) * 1993-03-16 1998-03-12 Koninkl Philips Electronics Nv Method and device for producing a structured relief image from cross-linked photoresist on a flat substrate surface
US5386119A (en) 1993-03-25 1995-01-31 Hughes Aircraft Company Apparatus and method for thick wafer measurement
US5348616A (en) 1993-05-03 1994-09-20 Motorola, Inc. Method for patterning a mold
US5414514A (en) * 1993-06-01 1995-05-09 Massachusetts Institute Of Technology On-axis interferometric alignment of plates using the spatial phase of interference patterns
JP2837063B2 (en) 1993-06-04 1998-12-14 シャープ株式会社 Method of forming resist pattern
JP2866559B2 (en) 1993-09-20 1999-03-08 大日本スクリーン製造株式会社 Film thickness measurement method
US5512131A (en) 1993-10-04 1996-04-30 President And Fellows Of Harvard College Formation of microstamped patterns on surfaces and derivative articles
US6776094B1 (en) * 1993-10-04 2004-08-17 President & Fellows Of Harvard College Kit For Microcontact Printing
US5776748A (en) 1993-10-04 1998-07-07 President And Fellows Of Harvard College Method of formation of microstamped patterns on plates for adhesion of cells and other biological materials, devices and uses therefor
KR0157279B1 (en) 1994-03-15 1999-05-01 모리시타 요이찌 Exposure apparatus for transferring a mask pattern onto a substrate
US5477058A (en) * 1994-11-09 1995-12-19 Kabushiki Kaisha Toshiba Attenuated phase-shifting mask with opaque reticle alignment marks
US5563684A (en) 1994-11-30 1996-10-08 Sgs-Thomson Microelectronics, Inc. Adaptive wafer modulator for placing a selected pattern on a semiconductor wafer
JP2999679B2 (en) 1994-11-30 2000-01-17 大日本スクリーン製造株式会社 Pattern defect inspection equipment
JPH08232087A (en) 1994-12-08 1996-09-10 Sumitomo Metal Ind Ltd Method for detecting end point of etching and etching device
US6034378A (en) * 1995-02-01 2000-03-07 Nikon Corporation Method of detecting position of mark on substrate, position detection apparatus using this method, and exposure apparatus using this position detection apparatus
US5504793A (en) 1995-02-17 1996-04-02 Loral Federal Systems Company Magnification correction for 1-X proximity X-Ray lithography
US5849209A (en) 1995-03-31 1998-12-15 Johnson & Johnson Vision Products, Inc. Mold material made with additives
US5740699A (en) 1995-04-06 1998-04-21 Spar Aerospace Limited Wrist joint which is longitudinally extendible
US6342389B1 (en) 1995-04-10 2002-01-29 Roger S. Cubicciotti Modified phycobilisomes and uses therefore
GB9509487D0 (en) 1995-05-10 1995-07-05 Ici Plc Micro relief element & preparation thereof
US5820769A (en) 1995-05-24 1998-10-13 Regents Of The University Of Minnesota Method for making magnetic storage having discrete elements with quantized magnetic moments
US5808742A (en) * 1995-05-31 1998-09-15 Massachusetts Institute Of Technology Optical alignment apparatus having multiple parallel alignment marks
US5625193A (en) 1995-07-10 1997-04-29 Qc Optics, Inc. Optical inspection system and method for detecting flaws on a diffractive surface
JP3624476B2 (en) 1995-07-17 2005-03-02 セイコーエプソン株式会社 Manufacturing method of semiconductor laser device
JPH0933222A (en) 1995-07-18 1997-02-07 Dainippon Screen Mfg Co Ltd Film-thickness measuring apparatus
US5804017A (en) 1995-07-27 1998-09-08 Imation Corp. Method and apparatus for making an optical information record
US5545570A (en) 1995-09-29 1996-08-13 Taiwan Semiconductor Manufacturing Company Method of inspecting first layer overlay shift in global alignment process
US5849222A (en) 1995-09-29 1998-12-15 Johnson & Johnson Vision Products, Inc. Method for reducing lens hole defects in production of contact lens blanks
US20040137734A1 (en) 1995-11-15 2004-07-15 Princeton University Compositions and processes for nanoimprinting
US5772905A (en) * 1995-11-15 1998-06-30 Regents Of The University Of Minnesota Nanoimprint lithography
US6482742B1 (en) * 2000-07-18 2002-11-19 Stephen Y. Chou Fluid pressure imprint lithography
US6518189B1 (en) 1995-11-15 2003-02-11 Regents Of The University Of Minnesota Method and apparatus for high density nanostructures
US6309580B1 (en) * 1995-11-15 2001-10-30 Regents Of The University Of Minnesota Release surfaces, particularly for use in nanoimprint lithography
US20040036201A1 (en) 2000-07-18 2004-02-26 Princeton University Methods and apparatus of field-induced pressure imprint lithography
US7758794B2 (en) 2001-10-29 2010-07-20 Princeton University Method of making an article comprising nanoscale patterns with reduced edge roughness
JP2842362B2 (en) 1996-02-29 1999-01-06 日本電気株式会社 Superposition measurement method
US5669303A (en) 1996-03-04 1997-09-23 Motorola Apparatus and method for stamping a surface
US6355198B1 (en) * 1996-03-15 2002-03-12 President And Fellows Of Harvard College Method of forming articles including waveguides via capillary micromolding and microtransfer molding
US20030179354A1 (en) 1996-03-22 2003-09-25 Nikon Corporation Mask-holding apparatus for a light exposure apparatus and related scanning-exposure method
US5817376A (en) 1996-03-26 1998-10-06 Minnesota Mining And Manufacturing Company Free-radically polymerizable compositions capable of being coated by electrostatic assistance
US5853446A (en) * 1996-04-16 1998-12-29 Corning Incorporated Method for forming glass rib structures
US5942443A (en) 1996-06-28 1999-08-24 Caliper Technologies Corporation High throughput screening assay systems in microscale fluidic devices
US5802914A (en) 1996-05-30 1998-09-08 Eastman Kodak Company Alignment mechanism using flexures
US5888650A (en) 1996-06-03 1999-03-30 Minnesota Mining And Manufacturing Company Temperature-responsive adhesive article
US5717518A (en) 1996-07-22 1998-02-10 Kla Instruments Corporation Broad spectrum ultraviolet catadioptric imaging system
US6753131B1 (en) 1996-07-22 2004-06-22 President And Fellows Of Harvard College Transparent elastomeric, contact-mode photolithography mask, sensor, and wavefront engineering element
US6074827A (en) 1996-07-30 2000-06-13 Aclara Biosciences, Inc. Microfluidic method for nucleic acid purification and processing
US5858580A (en) 1997-09-17 1999-01-12 Numerical Technologies, Inc. Phase shifting circuit manufacture method and apparatus
JP3234872B2 (en) 1996-10-08 2001-12-04 セイコーインスツルメンツ株式会社 Actuator, method of driving the same, computer-readable recording medium storing program for causing a computer to execute the method of driving the actuator, and small machine tool using the actuator
US6112588A (en) 1996-10-25 2000-09-05 Speedline Technologies, Inc. Method and apparatus for measuring the size of drops of a viscous material dispensed from a dispensing system
US5837892A (en) 1996-10-25 1998-11-17 Camelot Systems, Inc. Method and apparatus for measuring the size of drops of a viscous material dispensed from a dispensing system
DE19643935C2 (en) 1996-10-31 1998-10-08 Sekurit Saint Gobain Deutsch Method and device for the gradual bending of glass panes
JPH10172897A (en) 1996-12-05 1998-06-26 Nikon Corp Substrate adaptor, substrate holder and method for holding substrate
US5885514A (en) 1996-12-09 1999-03-23 Dana Corporation Ambient UVL-curable elastomer mold apparatus
US5694207A (en) 1996-12-09 1997-12-02 Taiwan Semiconductor Manufacturing Company, Ltd. Etch rate monitoring by optical emission spectroscopy
US6049373A (en) 1997-02-28 2000-04-11 Sumitomo Heavy Industries, Ltd. Position detection technique applied to proximity exposure
DE19710420C2 (en) 1997-03-13 2001-07-12 Helmut Fischer Gmbh & Co Method and device for measuring the thicknesses of thin layers by means of X-ray fluorescence
US6051179A (en) 1997-03-19 2000-04-18 Replicator Systems, Inc. Apparatus and method for production of three-dimensional models by spatial light modulator
JP3296239B2 (en) 1997-03-27 2002-06-24 ウシオ電機株式会社 Proximity exposure apparatus with gap setting mechanism
US5889303A (en) * 1997-04-07 1999-03-30 Motorola, Inc. Split-Control gate electrically erasable programmable read only memory (EEPROM) cell
EP0872456B1 (en) 1997-04-16 2002-01-23 Pilkington Automotive Deutschland GmbH Method for bending the outer and the inner glass-sheet of bent safety-glass-sheets and press-bending apparatus used therefor
US5948470A (en) 1997-04-28 1999-09-07 Harrison; Christopher Method of nanoscale patterning and products made thereby
US5812629A (en) 1997-04-30 1998-09-22 Clauser; John F. Ultrahigh resolution interferometric x-ray imaging
US6278809B1 (en) 1997-05-30 2001-08-21 Ion Optics, Inc. Fiber optic reflectance apparatus for in situ characterization of thin films
US5798837A (en) 1997-07-11 1998-08-25 Therma-Wave, Inc. Thin film optical measurement system and method with calibrating ellipsometer
US6278519B1 (en) 1998-01-29 2001-08-21 Therma-Wave, Inc. Apparatus for analyzing multi-layer thin film stacks on semiconductors
IT1294942B1 (en) 1997-08-01 1999-04-23 Sacmi PROCESS OF PRESSING CERAMIC POWDERS AND EQUIPMENT FOR IMPLEMENTING THE SAME.
US5974150A (en) 1997-09-30 1999-10-26 Tracer Detection Technology Corp. System and method for authentication of goods
US5877861A (en) 1997-11-14 1999-03-02 International Business Machines Corporation Method for overlay control system
US5937758A (en) 1997-11-26 1999-08-17 Motorola, Inc. Micro-contact printing stamp
US5991022A (en) 1997-12-09 1999-11-23 N&K Technology, Inc. Reflectance spectrophotometric apparatus with toroidal mirrors
US6019166A (en) 1997-12-30 2000-02-01 Intel Corporation Pickup chuck with an integral heatsink
US6117708A (en) * 1998-02-05 2000-09-12 Micron Technology, Inc. Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor device
US6081334A (en) 1998-04-17 2000-06-27 Applied Materials, Inc Endpoint detection for semiconductor processes
WO1999054924A1 (en) 1998-04-21 1999-10-28 Hitachi, Ltd. Apparatus and method for measuring thickness of thin film and method and apparatus for manufacturing thin film device using the same
TW352421B (en) 1998-04-27 1999-02-11 United Microelectronics Corp Method and process of phase shifting mask
US6068783A (en) 1998-04-28 2000-05-30 Winbond Electronics Corp In-situ and non-intrusive method for monitoring plasma etch chamber condition utilizing spectroscopic technique
US6239590B1 (en) 1998-05-26 2001-05-29 Micron Technology, Inc. Calibration target for calibrating semiconductor wafer test systems
JP3780700B2 (en) * 1998-05-26 2006-05-31 セイコーエプソン株式会社 Pattern forming method, pattern forming apparatus, pattern forming plate, pattern forming plate manufacturing method, color filter manufacturing method, conductive film manufacturing method, and liquid crystal panel manufacturing method
US6150231A (en) * 1998-06-15 2000-11-21 Siemens Aktiengesellschaft Overlay measurement technique using moire patterns
DE19832414C2 (en) 1998-07-18 2000-07-20 Rob Borgmann Screen printing method for printing flat objects, in particular glass panes, with a decor and device for carrying out the method
US6523803B1 (en) 1998-09-03 2003-02-25 Micron Technology, Inc. Mold apparatus used during semiconductor device fabrication
US6016696A (en) 1998-09-25 2000-01-25 Lucent Technologies Inc. Method for determining volume changes in viscous liquids
US6713238B1 (en) 1998-10-09 2004-03-30 Stephen Y. Chou Microscale patterning and articles formed thereby
US6261469B1 (en) 1998-10-13 2001-07-17 Honeywell International Inc. Three dimensionally periodic structural assemblies on nanometer and longer scales
US6218316B1 (en) 1998-10-22 2001-04-17 Micron Technology, Inc. Planarization of non-planar surfaces in device fabrication
US6248486B1 (en) 1998-11-23 2001-06-19 U.S. Philips Corporation Method of detecting aberrations of an optical imaging system
JP4846888B2 (en) 1998-12-01 2011-12-28 キヤノン株式会社 Alignment method
US6388755B1 (en) 1998-12-03 2002-05-14 Advanced Optical Technologies, Inc. Wireless position and orientation detecting system
US6204922B1 (en) 1998-12-11 2001-03-20 Filmetrics, Inc. Rapid and accurate thin film measurement of individual layers in a multi-layered or patterned sample
US6251207B1 (en) * 1998-12-31 2001-06-26 Kimberly-Clark Worldwide, Inc. Embossing and laminating irregular bonding patterns
US6274294B1 (en) 1999-02-03 2001-08-14 Electroformed Stents, Inc. Cylindrical photolithography exposure process and apparatus
US6334960B1 (en) * 1999-03-11 2002-01-01 Board Of Regents, The University Of Texas System Step and flash imprint lithography
US6052183A (en) 1999-04-14 2000-04-18 Winbond Electronics Corp In-situ particle monitoring
WO2000072093A1 (en) * 1999-05-25 2000-11-30 Massachusetts Institute Of Technology Optical gap measuring apparatus and method using two-dimensional grating mark with chirp in one direction
WO2001002907A1 (en) 1999-07-01 2001-01-11 Smith Bruce W Apparatus and method of image enhancement through spatial filtering
US6190929B1 (en) * 1999-07-23 2001-02-20 Micron Technology, Inc. Methods of forming semiconductor devices and methods of forming field emission displays
US6780001B2 (en) 1999-07-30 2004-08-24 Formfactor, Inc. Forming tool for forming a contoured microelectronic spring mold
US6517995B1 (en) 1999-09-14 2003-02-11 Massachusetts Institute Of Technology Fabrication of finely featured devices by liquid embossing
US6873087B1 (en) 1999-10-29 2005-03-29 Board Of Regents, The University Of Texas System High precision orientation alignment and gap control stages for imprint lithography processes
US6091485A (en) 1999-12-15 2000-07-18 N & K Technology, Inc. Method and apparatus for optically determining physical parameters of underlayers
CA2395760A1 (en) * 1999-12-23 2001-06-28 University Of Massachusetts Methods and apparatus for forming submicron patterns on films
US6165911A (en) 1999-12-29 2000-12-26 Calveley; Peter Braden Method of patterning a metal layer
US6498640B1 (en) 1999-12-30 2002-12-24 Koninklijke Philips Electronics N.V. Method to measure alignment using latent image grating structures
US6309957B1 (en) 2000-04-03 2001-10-30 Taiwan Semiconductor Maufacturing Company Method of low-K/copper dual damascene
US6245581B1 (en) 2000-04-19 2001-06-12 Advanced Micro Devices, Inc. Method and apparatus for control of critical dimension using feedback etch control
CN1092092C (en) 2000-04-21 2002-10-09 清华大学 Spatial triaxial parallel machine tool structure with two-dimensional shift and one-dimensional rotation
US7859519B2 (en) 2000-05-01 2010-12-28 Tulbert David J Human-machine interface
JP2001358056A (en) 2000-06-15 2001-12-26 Canon Inc Exposure apparatus
US6262464B1 (en) 2000-06-19 2001-07-17 International Business Machines Corporation Encapsulated MEMS brand-pass filter for integrated circuits
US6462818B1 (en) 2000-06-22 2002-10-08 Kla-Tencor Corporation Overlay alignment mark design
US20020159918A1 (en) 2000-06-25 2002-10-31 Fan-Gang Tseng Micro-fabricated stamp array for depositing biologic diagnostic testing samples on bio-bindable surface
US7635262B2 (en) 2000-07-18 2009-12-22 Princeton University Lithographic apparatus for fluid pressure imprint lithography
US7211214B2 (en) 2000-07-18 2007-05-01 Princeton University Laser assisted direct imprint lithography
US20050037143A1 (en) * 2000-07-18 2005-02-17 Chou Stephen Y. Imprint lithography with improved monitoring and control and apparatus therefor
AU2001280980A1 (en) * 2000-08-01 2002-02-13 Board Of Regents, The University Of Texas System Methods for high-precision gap and orientation sensing between a transparent template and substrate for imprint lithography
US6326627B1 (en) 2000-08-02 2001-12-04 Archimedes Technology Group, Inc. Mass filtering sputtered ion source
US8016277B2 (en) 2000-08-21 2011-09-13 Board Of Regents, The University Of Texas System Flexure based macro motion translation stage
US6451705B1 (en) 2000-08-31 2002-09-17 Micron Technology, Inc. Self-aligned PECVD etch mask
US6718630B2 (en) 2000-09-18 2004-04-13 Matsushita Electric Industrial Co., Ltd. Apparatus and method for mounting components on substrate
US6950623B2 (en) * 2000-09-19 2005-09-27 Loudeye Corporation Methods and systems for dynamically serving in-stream advertisements
US20050274219A1 (en) 2004-06-01 2005-12-15 Molecular Imprints, Inc. Method and system to control movement of a body for nano-scale manufacturing
US7387508B2 (en) 2004-06-01 2008-06-17 Molecular Imprints Inc. Compliant device for nano-scale manufacturing
US20060005657A1 (en) 2004-06-01 2006-01-12 Molecular Imprints, Inc. Method and system to control movement of a body for nano-scale manufacturing
JP2004523906A (en) 2000-10-12 2004-08-05 ボード・オブ・リージエンツ，ザ・ユニバーシテイ・オブ・テキサス・システム Templates for room-temperature and low-pressure micro and nano-transfer lithography
US6633391B1 (en) 2000-11-07 2003-10-14 Applied Materials, Inc Monitoring of film characteristics during plasma-based semi-conductor processing using optical emission spectroscopy
US6603538B1 (en) 2000-11-21 2003-08-05 Applied Materials, Inc. Method and apparatus employing optical emission spectroscopy to detect a fault in process conditions of a semiconductor processing system
EP1405336A2 (en) 2000-12-04 2004-04-07 Ebara Corporation Substrate processing method
US6783719B2 (en) 2001-01-19 2004-08-31 Korry Electronics, Co. Mold with metal oxide surface compatible with ionic release agents
US6819426B2 (en) 2001-02-12 2004-11-16 Therma-Wave, Inc. Overlay alignment metrology using diffraction gratings
US6489068B1 (en) * 2001-02-21 2002-12-03 Advanced Micro Devices, Inc. Process for observing overlay errors on lithographic masks
US6387787B1 (en) * 2001-03-02 2002-05-14 Motorola, Inc. Lithographic template and method of formation and use
JP2002299226A (en) 2001-04-03 2002-10-11 Nikon Corp Electron beam exposing stencil mask and manufacturing method therefor
US6955767B2 (en) 2001-03-22 2005-10-18 Hewlett-Packard Development Company, Lp. Scanning probe based lithographic alignment
US6664026B2 (en) 2001-03-22 2003-12-16 International Business Machines Corporation Method of manufacturing high aspect ratio photolithographic features
US6517977B2 (en) * 2001-03-28 2003-02-11 Motorola, Inc. Lithographic template and method of formation and use
US6791669B2 (en) 2001-04-12 2004-09-14 Nikon Corporation Positioning device and exposure apparatus including the same
US6383888B1 (en) 2001-04-18 2002-05-07 Advanced Micro Devices, Inc. Method and apparatus for selecting wafer alignment marks based on film thickness variation
US6964793B2 (en) 2002-05-16 2005-11-15 Board Of Regents, The University Of Texas System Method for fabricating nanoscale patterns in light curable compositions using an electric field
JP2002353102A (en) 2001-05-23 2002-12-06 Hitachi Ltd Method of manufacturing semiconductor device
US6847433B2 (en) 2001-06-01 2005-01-25 Agere Systems, Inc. Holder, system, and process for improving overlay in lithography
US7049049B2 (en) 2001-06-27 2006-05-23 University Of South Florida Maskless photolithography for using photoreactive agents
US6561706B2 (en) 2001-06-28 2003-05-13 Advanced Micro Devices, Inc. Critical dimension monitoring from latent image
US20050064344A1 (en) 2003-09-18 2005-03-24 University Of Texas System Board Of Regents Imprint lithography templates having alignment marks
CA2454570C (en) 2001-07-25 2016-12-20 The Trustees Of Princeton University Nanochannel arrays and their preparation and use for high throughput macromolecular analysis
US6678038B2 (en) 2001-08-03 2004-01-13 Nikon Corporation Apparatus and methods for detecting tool-induced shift in microlithography apparatus
JP2003057027A (en) 2001-08-10 2003-02-26 Ebara Corp Measuring instrument
CN100347608C (en) * 2001-09-25 2007-11-07 米卢塔技术株式会社 Method for forming a micro-pattern on a substrate by using capillary force
US20030080472A1 (en) 2001-10-29 2003-05-01 Chou Stephen Y. Lithographic method with bonded release layer for molding small patterns
US6890688B2 (en) * 2001-12-18 2005-05-10 Freescale Semiconductor, Inc. Lithographic template and method of formation and use
US6771374B1 (en) 2002-01-16 2004-08-03 Advanced Micro Devices, Inc. Scatterometry based measurements of a rotating substrate
US20030133126A1 (en) 2002-01-17 2003-07-17 Applied Materials, Inc. Spectral reflectance for in-situ film characteristic measurements
US6621960B2 (en) 2002-01-24 2003-09-16 Oplink Communications, Inc. Method of fabricating multiple superimposed fiber Bragg gratings
US6743368B2 (en) 2002-01-31 2004-06-01 Hewlett-Packard Development Company, L.P. Nano-size imprinting stamp using spacer technique
US6605849B1 (en) 2002-02-14 2003-08-12 Symmetricom, Inc. MEMS analog frequency divider
DE10307518B4 (en) 2002-02-22 2011-04-14 Hoya Corp. Halftone phase shift mask blank, halftone phase shift mask and method of making the same
TW594431B (en) 2002-03-01 2004-06-21 Asml Netherlands Bv Calibration methods, calibration substrates, lithographic apparatus and device manufacturing methods
US6716754B2 (en) 2002-03-12 2004-04-06 Micron Technology, Inc. Methods of forming patterns and molds for semiconductor constructions
US7117583B2 (en) 2002-03-18 2006-10-10 International Business Machines Corporation Method and apparatus using a pre-patterned seed layer for providing an aligned coil for an inductive head structure
EP2484751B1 (en) 2002-04-16 2018-11-28 Princeton University Method of analysing polynucleotides
US6881366B2 (en) 2002-04-22 2005-04-19 International Business Machines Corporation Process of fabricating a precision microcontact printing stamp
US7037639B2 (en) 2002-05-01 2006-05-02 Molecular Imprints, Inc. Methods of manufacturing a lithography template
US6849558B2 (en) 2002-05-22 2005-02-01 The Board Of Trustees Of The Leland Stanford Junior University Replication and transfer of microstructures and nanostructures
US6852454B2 (en) * 2002-06-18 2005-02-08 Freescale Semiconductor, Inc. Multi-tiered lithographic template and method of formation and use
US7179079B2 (en) 2002-07-08 2007-02-20 Molecular Imprints, Inc. Conforming template for patterning liquids disposed on substrates
US7077992B2 (en) 2002-07-11 2006-07-18 Molecular Imprints, Inc. Step and repeat imprint lithography processes
US6932934B2 (en) * 2002-07-11 2005-08-23 Molecular Imprints, Inc. Formation of discontinuous films during an imprint lithography process
US6900881B2 (en) * 2002-07-11 2005-05-31 Molecular Imprints, Inc. Step and repeat imprint lithography systems
US7019819B2 (en) 2002-11-13 2006-03-28 Molecular Imprints, Inc. Chucking system for modulating shapes of substrates
US6908861B2 (en) * 2002-07-11 2005-06-21 Molecular Imprints, Inc. Method for imprint lithography using an electric field
US6916584B2 (en) * 2002-08-01 2005-07-12 Molecular Imprints, Inc. Alignment methods for imprint lithography
US7027156B2 (en) * 2002-08-01 2006-04-11 Molecular Imprints, Inc. Scatterometry alignment for imprint lithography
US7070405B2 (en) * 2002-08-01 2006-07-04 Molecular Imprints, Inc. Alignment systems for imprint lithography
US6665119B1 (en) 2002-10-15 2003-12-16 Eastman Kodak Company Wire grid polarizer
US6929762B2 (en) 2002-11-13 2005-08-16 Molecular Imprints, Inc. Method of reducing pattern distortions during imprint lithography processes
US6980282B2 (en) 2002-12-11 2005-12-27 Molecular Imprints, Inc. Method for modulating shapes of substrates
JP3914142B2 (en) 2002-11-29 2007-05-16 株式会社東芝 Nonvolatile semiconductor memory device and manufacturing method thereof
US7750059B2 (en) 2002-12-04 2010-07-06 Hewlett-Packard Development Company, L.P. Polymer solution for nanoimprint lithography to reduce imprint temperature and pressure
US6871558B2 (en) 2002-12-12 2005-03-29 Molecular Imprints, Inc. Method for determining characteristics of substrate employing fluid geometries
TW200500811A (en) 2002-12-13 2005-01-01 Molecular Imprints Inc Magnification correction employing out-of-plane distortion of a substrate
US6808344B2 (en) 2002-12-27 2004-10-26 Jeng-Shyong Chen Multi-axis cartesian guided parallel kinematic machine
US6770852B1 (en) 2003-02-27 2004-08-03 Lam Research Corporation Critical dimension variation compensation across a wafer by means of local wafer temperature control
EP1460738A3 (en) 2003-03-21 2004-09-29 Avalon Photonics AG Wafer-scale replication-technique for opto-mechanical structures on opto-electronic devices
EP1606834B1 (en) 2003-03-27 2013-06-05 Korea Institute Of Machinery & Materials Uv nanoimprint lithography process using elementwise embossed stamp
US20040202865A1 (en) 2003-04-08 2004-10-14 Andrew Homola Release coating for stamper
US7070406B2 (en) 2003-04-29 2006-07-04 Hewlett-Packard Development Company, L.P. Apparatus for embossing a flexible substrate with a pattern carried by an optically transparent compliant media
US6808646B1 (en) 2003-04-29 2004-10-26 Hewlett-Packard Development Company, L.P. Method of replicating a high resolution three-dimensional imprint pattern on a compliant media of arbitrary size
TWI228638B (en) * 2003-06-10 2005-03-01 Ind Tech Res Inst Method for and apparatus for bonding patterned imprint to a substrate by adhering means
US7150622B2 (en) 2003-07-09 2006-12-19 Molecular Imprints, Inc. Systems for magnification and distortion correction for imprint lithography processes
US6852358B1 (en) 2003-08-28 2005-02-08 Chang Chun Plastics Co., Ltd. Process for preparing an optical waveguide component from acrylate/titanium alkoxide composite material and the prepared optical waveguide component
US7136150B2 (en) 2003-09-25 2006-11-14 Molecular Imprints, Inc. Imprint lithography template having opaque alignment marks
US20050084804A1 (en) * 2003-10-16 2005-04-21 Molecular Imprints, Inc. Low surface energy templates
US7122482B2 (en) * 2003-10-27 2006-10-17 Molecular Imprints, Inc. Methods for fabricating patterned features utilizing imprint lithography
US20050098534A1 (en) * 2003-11-12 2005-05-12 Molecular Imprints, Inc. Formation of conductive templates employing indium tin oxide
KR100566700B1 (en) 2004-01-15 2006-04-03 삼성전자주식회사 Method for forming mask pattern, template for forming mask pattern and method for forming template
KR100558754B1 (en) 2004-02-24 2006-03-10 한국기계연구원 Uv nanoimprint lithography process and apparatus for performing the same
US20050230882A1 (en) 2004-04-19 2005-10-20 Molecular Imprints, Inc. Method of forming a deep-featured template employed in imprint lithography
US7140861B2 (en) 2004-04-27 2006-11-28 Molecular Imprints, Inc. Compliant hard template for UV imprinting
US20050275311A1 (en) 2004-06-01 2005-12-15 Molecular Imprints, Inc. Compliant device for nano-scale manufacturing
CN101379435A (en) 2004-06-03 2009-03-04 得克萨斯州大学系统董事会 System and method for improvement of alignment and overlay for microlithography
US7309225B2 (en) 2004-08-13 2007-12-18 Molecular Imprints, Inc. Moat system for an imprint lithography template
US7630067B2 (en) 2004-11-30 2009-12-08 Molecular Imprints, Inc. Interferometric analysis method for the manufacture of nano-scale devices
US7292326B2 (en) 2004-11-30 2007-11-06 Molecular Imprints, Inc. Interferometric analysis for the manufacture of nano-scale devices
KR20070086766A (en) 2004-12-01 2007-08-27 몰레큘러 임프린츠 인코퍼레이티드 Methods of exposure for the purpose of thermal management for imprint lithography processes
US20060177535A1 (en) 2005-02-04 2006-08-10 Molecular Imprints, Inc. Imprint lithography template to facilitate control of liquid movement
US7798801B2 (en) 2005-01-31 2010-09-21 Molecular Imprints, Inc. Chucking system for nano-manufacturing
JP2006315207A (en) 2005-05-10 2006-11-24 Pital Internatl Machinery Co Ltd Common extrusion manufacturing method of hollow profile template having internally filled foam and product manufactured thereby
US20060266916A1 (en) 2005-05-25 2006-11-30 Molecular Imprints, Inc. Imprint lithography template having a coating to reflect and/or absorb actinic energy

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6919152B2 (en) * 2000-07-16 2005-07-19 Board Of Regents, The University Of Texas System High resolution overlay alignment systems for imprint lithography

Also Published As

Publication number Publication date
WO2006020194A2 (en) 2006-02-23
US20060019183A1 (en) 2006-01-26
US8366434B2 (en) 2013-02-05
US20100278955A1 (en) 2010-11-04
US7785526B2 (en) 2010-08-31
TWI283339B (en) 2007-07-01
TW200609692A (en) 2006-03-16

Similar Documents

Publication Publication Date Title
WO2006020194A3 (en) Imprint alignment method, system, and template
WO2004027460A3 (en) Replication and transfer of microstructures and nanostructures
WO2010047769A8 (en) Reduction of stress during template separation from substrate
EP1688790A3 (en) Imprint lithography
TWI268543B (en) Composite optical lithography method for patterning lines of substantially equal width
WO2005038523A3 (en) Imprint lithography templates having alignment marks
TW200611062A (en) Apparatus, system and method to vary dimensions of a substrate during nano-scale manufacturing
WO2004097518A3 (en) A method of forming stepped structures employing imprint lithography
WO2002008835A3 (en) High-resolution overlay alignment methods and systems for imprint lithography
WO2008068701A3 (en) Method and apparatus for applying a sheet to a substrate
WO2005121903A3 (en) System and method for improvement of alignment and overlay for microlithography
WO2005045524A3 (en) A method of forming a patterned layer on a substrate
WO2005030978A3 (en) Self-assembled circuits and circuit patterns
DE602004013338D1 (en) Stamp for soft lithography, in particular for the micro-contact printing method and method for its production
WO2009083146A3 (en) Method for producing a microstructure
TW200707083A (en) Method for forming a lithograohy pattern
DE50102760D1 (en) DATA CARRIER, METHOD FOR ITS PRODUCTION AND PRINTING PRINT PLATE
AU2001276924A1 (en) Note-specific currency processing
WO2010015333A3 (en) High aspect ratio template for lithography, method of making the same template and use of the template for perforating a substrate at nanoscale
WO2007040574A3 (en) Biomimetic nanocomposite
WO2006057745A3 (en) Direct imprinting of etch barriers using step and flash imprint lithography
WO2008016651A3 (en) Method of performing lithography and lithography system
DE60013901D1 (en) PHOTOLITHOGRAPHIC METHOD, MASK BLanks AND METHOD FOR THE PRODUCTION THEREOF
WO2009035087A1 (en) Composition for forming silicon-containing fine pattern and method for forming fine pattern using the same
WO2006088689A3 (en) Method for patterning submicron pillars

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KM KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NG NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU LV MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase