WO2006026460A3 - Pumped fluid cooling system and method - Google Patents

Pumped fluid cooling system and method Download PDF

Info

Publication number
WO2006026460A3
WO2006026460A3 PCT/US2005/030465 US2005030465W WO2006026460A3 WO 2006026460 A3 WO2006026460 A3 WO 2006026460A3 US 2005030465 W US2005030465 W US 2005030465W WO 2006026460 A3 WO2006026460 A3 WO 2006026460A3
Authority
WO
WIPO (PCT)
Prior art keywords
cooling system
pumped fluid
fluid cooling
pumped
fluid
Prior art date
Application number
PCT/US2005/030465
Other languages
French (fr)
Other versions
WO2006026460A2 (en
Inventor
Douglas Werner
Kenneth Goodson
Mark Munch
Girish Upadhya
Original Assignee
Cooligy Inc
Douglas Werner
Kenneth Goodson
Mark Munch
Girish Upadhya
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cooligy Inc, Douglas Werner, Kenneth Goodson, Mark Munch, Girish Upadhya filed Critical Cooligy Inc
Priority to DE112005002015T priority Critical patent/DE112005002015T5/en
Priority to JP2007530175A priority patent/JP2008511995A/en
Publication of WO2006026460A2 publication Critical patent/WO2006026460A2/en
Publication of WO2006026460A3 publication Critical patent/WO2006026460A3/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • F28F9/026—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
    • F28F9/0263—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by varying the geometry or cross-section of header box
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
    • F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels

Abstract

The present invention is a pumped fluid cooling system and method. The pumped fluid cooling system and method includes new relative magnitudes of advection, convection and spreading components of the resistance for a pumped fluid system. The pumped fluid cooling system and method also includes adjusting the chemical composition of the working fluid, specifically adjusting the composition and viscosity as the sensitivity to the fluid heat capacity per unit mas increases.
PCT/US2005/030465 2004-08-27 2005-08-24 Pumped fluid cooling system and method WO2006026460A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE112005002015T DE112005002015T5 (en) 2004-08-27 2005-08-24 Cooling system with a pumped fluid and method
JP2007530175A JP2008511995A (en) 2004-08-27 2005-08-24 Fluid pumping cooling system and cooling method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/927,800 2004-08-27
US10/927,800 US20060042785A1 (en) 2004-08-27 2004-08-27 Pumped fluid cooling system and method

Publications (2)

Publication Number Publication Date
WO2006026460A2 WO2006026460A2 (en) 2006-03-09
WO2006026460A3 true WO2006026460A3 (en) 2007-11-29

Family

ID=35941406

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/030465 WO2006026460A2 (en) 2004-08-27 2005-08-24 Pumped fluid cooling system and method

Country Status (5)

Country Link
US (1) US20060042785A1 (en)
JP (1) JP2008511995A (en)
DE (1) DE112005002015T5 (en)
TW (1) TW200610483A (en)
WO (1) WO2006026460A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9170060B2 (en) * 2008-01-22 2015-10-27 Lawrence Livermore National Security, Llc Rapid microfluidic thermal cycler for nucleic acid amplification
US9170028B1 (en) 2010-10-06 2015-10-27 Lawrence Livermore National Security, Llc Methods and compositions for rapid thermal cycling
US20160167624A1 (en) * 2014-12-16 2016-06-16 Jere Rask Lansinger Electrically heating windshield washer fluid system
EP3551511A1 (en) 2016-12-09 2019-10-16 SEEVA Technologies, Inc. Washer fluid heating system and apparatus
US20200001832A1 (en) 2018-06-27 2020-01-02 Seeva Technologies, Inc. Systems and methods for perception surface cleaning, drying, and/or thermal management with manifolds
US11440015B2 (en) 2018-08-08 2022-09-13 Lawrence Livermore National Security, Llc Integrated solid-state rapid thermo-cycling system

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3524497A (en) * 1968-04-04 1970-08-18 Ibm Heat transfer in a liquid cooling system
US6578626B1 (en) * 2000-11-21 2003-06-17 Thermal Corp. Liquid cooled heat exchanger with enhanced flow
US6675875B1 (en) * 1999-08-06 2004-01-13 The Ohio State University Multi-layered micro-channel heat sink, devices and systems incorporating same
US6729383B1 (en) * 1999-12-16 2004-05-04 The United States Of America As Represented By The Secretary Of The Navy Fluid-cooled heat sink with turbulence-enhancing support pins
US6865081B2 (en) * 2002-10-02 2005-03-08 Atotech Deutschland Gmbh Microstructure cooler and use thereof
US6934154B2 (en) * 2003-03-31 2005-08-23 Intel Corporation Micro-channel heat exchangers and spreaders

Family Cites Families (94)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3554669A (en) * 1968-12-04 1971-01-12 Gen Electric Electric-fluid energy converter
US3654988A (en) * 1970-02-24 1972-04-11 American Standard Inc Freeze protection for outdoor cooler
DE2102254B2 (en) * 1971-01-19 1973-05-30 Robert Bosch Gmbh, 7000 Stuttgart COOLING DEVICE FOR POWER SEMICONDUCTOR COMPONENTS
FR2216537B1 (en) * 1973-02-06 1975-03-07 Gaz De France
US4138996A (en) * 1977-07-28 1979-02-13 Rheem Manufacturing Company Solar heater freeze protection system
US4312012A (en) * 1977-11-25 1982-01-19 International Business Machines Corp. Nucleate boiling surface for increasing the heat transfer from a silicon device to a liquid coolant
US4194559A (en) * 1978-11-01 1980-03-25 Thermacore, Inc. Freeze accommodating heat pipe
US4248295A (en) * 1980-01-17 1981-02-03 Thermacore, Inc. Freezable heat pipe
US4573067A (en) * 1981-03-02 1986-02-25 The Board Of Trustees Of The Leland Stanford Junior University Method and means for improved heat removal in compact semiconductor integrated circuits
US4450472A (en) * 1981-03-02 1984-05-22 The Board Of Trustees Of The Leland Stanford Junior University Method and means for improved heat removal in compact semiconductor integrated circuits and similar devices utilizing coolant chambers and microscopic channels
US4494171A (en) * 1982-08-24 1985-01-15 Sundstrand Corporation Impingement cooling apparatus for heat liberating device
US4516632A (en) * 1982-08-31 1985-05-14 The United States Of America As Represented By The United States Deparment Of Energy Microchannel crossflow fluid heat exchanger and method for its fabrication
US4567505A (en) * 1983-10-27 1986-01-28 The Board Of Trustees Of The Leland Stanford Junior University Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like
US4664181A (en) * 1984-03-05 1987-05-12 Thermo Electron Corporation Protection of heat pipes from freeze damage
US4568431A (en) * 1984-11-13 1986-02-04 Olin Corporation Process for producing electroplated and/or treated metal foil
US4903761A (en) * 1987-06-03 1990-02-27 Lockheed Missiles & Space Company, Inc. Wick assembly for self-regulated fluid management in a pumped two-phase heat transfer system
US5016138A (en) * 1987-10-27 1991-05-14 Woodman John K Three dimensional integrated circuit package
US4894709A (en) * 1988-03-09 1990-01-16 Massachusetts Institute Of Technology Forced-convection, liquid-cooled, microchannel heat sinks
US4896719A (en) * 1988-05-11 1990-01-30 Mcdonnell Douglas Corporation Isothermal panel and plenum
US4908112A (en) * 1988-06-16 1990-03-13 E. I. Du Pont De Nemours & Co. Silicon semiconductor wafer for analyzing micronic biological samples
US5009760A (en) * 1989-07-28 1991-04-23 Board Of Trustees Of The Leland Stanford Junior University System for measuring electrokinetic properties and for characterizing electrokinetic separations by monitoring current in electrophoresis
US5083194A (en) * 1990-01-16 1992-01-21 Cray Research, Inc. Air jet impingement on miniature pin-fin heat sinks for cooling electronic components
US6176962B1 (en) * 1990-02-28 2001-01-23 Aclara Biosciences, Inc. Methods for fabricating enclosed microchannel structures
US6054034A (en) * 1990-02-28 2000-04-25 Aclara Biosciences, Inc. Acrylic microchannels and their use in electrophoretic applications
US5858188A (en) * 1990-02-28 1999-01-12 Aclara Biosciences, Inc. Acrylic microchannels and their use in electrophoretic applications
US5016090A (en) * 1990-03-21 1991-05-14 International Business Machines Corporation Cross-hatch flow distribution and applications thereof
US5096388A (en) * 1990-03-22 1992-03-17 The Charles Stark Draper Laboratory, Inc. Microfabricated pump
US5265670A (en) * 1990-04-27 1993-11-30 International Business Machines Corporation Convection transfer system
JPH07114250B2 (en) * 1990-04-27 1995-12-06 インターナショナル・ビジネス・マシーンズ・コーポレイション Heat transfer system
US5088005A (en) * 1990-05-08 1992-02-11 Sundstrand Corporation Cold plate for cooling electronics
US5203401A (en) * 1990-06-29 1993-04-20 Digital Equipment Corporation Wet micro-channel wafer chuck and cooling method
US5099910A (en) * 1991-01-15 1992-03-31 Massachusetts Institute Of Technology Microchannel heat sink with alternating flow directions
US5099311A (en) * 1991-01-17 1992-03-24 The United States Of America As Represented By The United States Department Of Energy Microchannel heat sink assembly
JPH06342990A (en) * 1991-02-04 1994-12-13 Internatl Business Mach Corp <Ibm> Integrated cooling system
US5125451A (en) * 1991-04-02 1992-06-30 Microunity Systems Engineering, Inc. Heat exchanger for solid-state electronic devices
US5275237A (en) * 1992-06-12 1994-01-04 Micron Technology, Inc. Liquid filled hot plate for precise temperature control
US5308429A (en) * 1992-09-29 1994-05-03 Digital Equipment Corporation System for bonding a heatsink to a semiconductor chip package
US5380956A (en) * 1993-07-06 1995-01-10 Sun Microsystems, Inc. Multi-chip cooling module and method
US5727618A (en) * 1993-08-23 1998-03-17 Sdl Inc Modular microchannel heat exchanger
US5704416A (en) * 1993-09-10 1998-01-06 Aavid Laboratories, Inc. Two phase component cooler
US5514906A (en) * 1993-11-10 1996-05-07 Fujitsu Limited Apparatus for cooling semiconductor chips in multichip modules
US5383340A (en) * 1994-03-24 1995-01-24 Aavid Laboratories, Inc. Two-phase cooling system for laptop computers
US5539153A (en) * 1994-08-08 1996-07-23 Hewlett-Packard Company Method of bumping substrates by contained paste deposition
US5508234A (en) * 1994-10-31 1996-04-16 International Business Machines Corporation Microcavity structures, fabrication processes, and applications thereof
US5632876A (en) * 1995-06-06 1997-05-27 David Sarnoff Research Center, Inc. Apparatus and methods for controlling fluid flow in microchannels
US5585069A (en) * 1994-11-10 1996-12-17 David Sarnoff Research Center, Inc. Partitioned microelectronic and fluidic device array for clinical diagnostics and chemical synthesis
US5876655A (en) * 1995-02-21 1999-03-02 E. I. Du Pont De Nemours And Company Method for eliminating flow wrinkles in compression molded panels
US6227809B1 (en) * 1995-03-09 2001-05-08 University Of Washington Method for making micropumps
JP3029792B2 (en) * 1995-12-28 2000-04-04 日本サーボ株式会社 Multi-phase permanent magnet type rotating electric machine
WO1997025741A1 (en) * 1996-01-04 1997-07-17 Daimler-Benz Aktiengesellschaft Cooling unit with pin elements
US6010316A (en) * 1996-01-16 2000-01-04 The Board Of Trustees Of The Leland Stanford Junior University Acoustic micropump
US5885470A (en) * 1997-04-14 1999-03-23 Caliper Technologies Corporation Controlled fluid transport in microfabricated polymeric substrates
US5870823A (en) * 1996-11-27 1999-02-16 International Business Machines Corporation Method of forming a multilayer electronic packaging substrate with integral cooling channels
CN1105914C (en) * 1997-04-25 2003-04-16 卡钳技术有限公司 Microfluidic devices incorporating improved channel geometries
US5880524A (en) * 1997-05-05 1999-03-09 Intel Corporation Heat pipe lid for electronic packages
US5869004A (en) * 1997-06-09 1999-02-09 Caliper Technologies Corp. Methods and apparatus for in situ concentration and/or dilution of materials in microfluidic systems
US5901037A (en) * 1997-06-18 1999-05-04 Northrop Grumman Corporation Closed loop liquid cooling for semiconductor RF amplifier modules
US6013164A (en) * 1997-06-25 2000-01-11 Sandia Corporation Electokinetic high pressure hydraulic system
US6019882A (en) * 1997-06-25 2000-02-01 Sandia Corporation Electrokinetic high pressure hydraulic system
US6001231A (en) * 1997-07-15 1999-12-14 Caliper Technologies Corp. Methods and systems for monitoring and controlling fluid flow rates in microfluidic systems
US6034872A (en) * 1997-07-16 2000-03-07 International Business Machines Corporation Cooling computer systems
US6907921B2 (en) * 1998-06-18 2005-06-21 3M Innovative Properties Company Microchanneled active fluid heat exchanger
US6012902A (en) * 1997-09-25 2000-01-11 Caliper Technologies Corp. Micropump
US5842787A (en) * 1997-10-09 1998-12-01 Caliper Technologies Corporation Microfluidic systems incorporating varied channel dimensions
US6174675B1 (en) * 1997-11-25 2001-01-16 Caliper Technologies Corp. Electrical current for controlling fluid parameters in microchannels
US6019165A (en) * 1998-05-18 2000-02-01 Batchelder; John Samuel Heat exchange apparatus
US6196307B1 (en) * 1998-06-17 2001-03-06 Intersil Americas Inc. High performance heat exchanger and method
US6553253B1 (en) * 1999-03-12 2003-04-22 Biophoretic Therapeutic Systems, Llc Method and system for electrokinetic delivery of a substance
US6388385B1 (en) * 1999-03-19 2002-05-14 Fei Company Corrugated style anode element for ion pumps
US6234240B1 (en) * 1999-07-01 2001-05-22 Kioan Cheon Fanless cooling system for computer
US6396706B1 (en) * 1999-07-30 2002-05-28 Credence Systems Corporation Self-heating circuit board
JP3518434B2 (en) * 1999-08-11 2004-04-12 株式会社日立製作所 Multi-chip module cooling system
US6216343B1 (en) * 1999-09-02 2001-04-17 The United States Of America As Represented By The Secretary Of The Air Force Method of making micro channel heat pipe having corrugated fin elements
US6210986B1 (en) * 1999-09-23 2001-04-03 Sandia Corporation Microfluidic channel fabrication method
JP2001110956A (en) * 1999-10-04 2001-04-20 Matsushita Electric Ind Co Ltd Cooling equipment for electronic component
US6337794B1 (en) * 2000-02-11 2002-01-08 International Business Machines Corporation Isothermal heat sink with tiered cooling channels
DE60140837D1 (en) * 2000-04-19 2010-02-04 Thermal Form & Function Inc Cooling plate with cooling fins with a vaporizing coolant
US6366462B1 (en) * 2000-07-18 2002-04-02 International Business Machines Corporation Electronic module with integral refrigerant evaporator assembly and control system therefore
US6388317B1 (en) * 2000-09-25 2002-05-14 Lockheed Martin Corporation Solid-state chip cooling by use of microchannel coolant flow
US6537437B1 (en) * 2000-11-13 2003-03-25 Sandia Corporation Surface-micromachined microfluidic devices
US6367544B1 (en) * 2000-11-21 2002-04-09 Thermal Corp. Thermal jacket for reducing condensation and method for making same
US6336497B1 (en) * 2000-11-24 2002-01-08 Ching-Bin Lin Self-recirculated heat dissipating means for cooling central processing unit
CA2329408C (en) * 2000-12-21 2007-12-04 Long Manufacturing Ltd. Finned plate heat exchanger
US6519151B2 (en) * 2001-06-27 2003-02-11 International Business Machines Corporation Conic-sectioned plate and jet nozzle assembly for use in cooling an electronic module, and methods of fabrication thereof
US6825127B2 (en) * 2001-07-24 2004-11-30 Zarlink Semiconductor Inc. Micro-fluidic devices
US6385044B1 (en) * 2001-07-27 2002-05-07 International Business Machines Corporation Heat pipe heat sink assembly for cooling semiconductor chips
US6533029B1 (en) * 2001-09-04 2003-03-18 Thermal Corp. Non-inverted meniscus loop heat pipe/capillary pumped loop evaporator
US6942018B2 (en) * 2001-09-28 2005-09-13 The Board Of Trustees Of The Leland Stanford Junior University Electroosmotic microchannel cooling system
US6719535B2 (en) * 2002-01-31 2004-04-13 Eksigent Technologies, Llc Variable potential electrokinetic device
US6881039B2 (en) * 2002-09-23 2005-04-19 Cooligy, Inc. Micro-fabricated electrokinetic pump
US7000684B2 (en) * 2002-11-01 2006-02-21 Cooligy, Inc. Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
US7210227B2 (en) * 2002-11-26 2007-05-01 Intel Corporation Decreasing thermal contact resistance at a material interface
US6992891B2 (en) * 2003-04-02 2006-01-31 Intel Corporation Metal ball attachment of heat dissipation devices
TWM248227U (en) * 2003-10-17 2004-10-21 Hon Hai Prec Ind Co Ltd Liquid cooling apparatus

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3524497A (en) * 1968-04-04 1970-08-18 Ibm Heat transfer in a liquid cooling system
US6675875B1 (en) * 1999-08-06 2004-01-13 The Ohio State University Multi-layered micro-channel heat sink, devices and systems incorporating same
US6729383B1 (en) * 1999-12-16 2004-05-04 The United States Of America As Represented By The Secretary Of The Navy Fluid-cooled heat sink with turbulence-enhancing support pins
US6578626B1 (en) * 2000-11-21 2003-06-17 Thermal Corp. Liquid cooled heat exchanger with enhanced flow
US6865081B2 (en) * 2002-10-02 2005-03-08 Atotech Deutschland Gmbh Microstructure cooler and use thereof
US6934154B2 (en) * 2003-03-31 2005-08-23 Intel Corporation Micro-channel heat exchangers and spreaders

Also Published As

Publication number Publication date
US20060042785A1 (en) 2006-03-02
TW200610483A (en) 2006-03-16
JP2008511995A (en) 2008-04-17
WO2006026460A2 (en) 2006-03-09
DE112005002015T5 (en) 2007-08-16

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