WO2006030352A3 - Electronic device comprising a flexible printed circuit board conductively connected to a metallic stiffener by means of solder - Google Patents

Electronic device comprising a flexible printed circuit board conductively connected to a metallic stiffener by means of solder Download PDF

Info

Publication number
WO2006030352A3
WO2006030352A3 PCT/IB2005/052936 IB2005052936W WO2006030352A3 WO 2006030352 A3 WO2006030352 A3 WO 2006030352A3 IB 2005052936 W IB2005052936 W IB 2005052936W WO 2006030352 A3 WO2006030352 A3 WO 2006030352A3
Authority
WO
WIPO (PCT)
Prior art keywords
solder
electronic device
printed circuit
circuit board
conductively connected
Prior art date
Application number
PCT/IB2005/052936
Other languages
French (fr)
Other versions
WO2006030352A2 (en
Inventor
Wouter Maes
Original Assignee
Koninkl Philips Electronics Nv
Wouter Maes
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv, Wouter Maes filed Critical Koninkl Philips Electronics Nv
Publication of WO2006030352A2 publication Critical patent/WO2006030352A2/en
Publication of WO2006030352A3 publication Critical patent/WO2006030352A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09554—Via connected to metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections

Abstract

An electronic device comprises a flexible, printed circuit board having an electrically conductive layer (2) on one side of the flexible board, and a conductive metallic stiffener (8) which is attached to the flexible board. Said conductive layer (2) is conductively connected to the metallic stiffener (8) by means of solder. The flexible board is provided with a through-hole (10), the solder connecting the metallic stiffener (8) with the conductive layer (2) being present in said through-hole (10).
PCT/IB2005/052936 2004-09-13 2005-09-08 Electronic device comprising a flexible printed circuit board conductively connected to a metallic stiffener by means of solder WO2006030352A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP04104416 2004-09-13
EP04104416.5 2004-09-13

Publications (2)

Publication Number Publication Date
WO2006030352A2 WO2006030352A2 (en) 2006-03-23
WO2006030352A3 true WO2006030352A3 (en) 2006-07-27

Family

ID=36060404

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2005/052936 WO2006030352A2 (en) 2004-09-13 2005-09-08 Electronic device comprising a flexible printed circuit board conductively connected to a metallic stiffener by means of solder

Country Status (2)

Country Link
TW (1) TW200623996A (en)
WO (1) WO2006030352A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI401450B (en) * 2010-01-11 2013-07-11 Zhen Ding Technology Co Ltd Method for testing flexible printed circuit board
TWI507119B (en) * 2010-07-16 2015-11-01 Zhen Ding Technology Co Ltd Flexible printed circuit board and method for manufacturing the same
US9474154B2 (en) 2014-07-18 2016-10-18 Starkey Laboratories, Inc. Reflow solderable flexible circuit board — to — flexible circuit board connector reinforcement

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6172307B1 (en) * 1993-03-01 2001-01-09 Motorola, Inc. Feedthrough via connection on solder resistant layer
US20030034174A1 (en) * 2000-05-26 2003-02-20 Zhong-You Shi Circuit board and a method for making the same
US6534848B1 (en) * 2000-09-07 2003-03-18 International Business Machines Corporation Electrical coupling of a stiffener to a chip carrier
EP1376778A2 (en) * 2002-06-25 2004-01-02 Motorola, Inc. Ground connector assembly with substrate strain relief and method of making the same
US6700748B1 (en) * 2000-04-28 2004-03-02 International Business Machines Corporation Methods for creating ground paths for ILS
DE10335805A1 (en) * 2003-08-05 2005-03-17 Schweizer Electronic Ag Circuit board with metal base forming potential reference plane and heat sink for power-dissipating components, includes both electrical and thermal vias for heat dissipation

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6172307B1 (en) * 1993-03-01 2001-01-09 Motorola, Inc. Feedthrough via connection on solder resistant layer
US6700748B1 (en) * 2000-04-28 2004-03-02 International Business Machines Corporation Methods for creating ground paths for ILS
US20030034174A1 (en) * 2000-05-26 2003-02-20 Zhong-You Shi Circuit board and a method for making the same
US6534848B1 (en) * 2000-09-07 2003-03-18 International Business Machines Corporation Electrical coupling of a stiffener to a chip carrier
EP1376778A2 (en) * 2002-06-25 2004-01-02 Motorola, Inc. Ground connector assembly with substrate strain relief and method of making the same
DE10335805A1 (en) * 2003-08-05 2005-03-17 Schweizer Electronic Ag Circuit board with metal base forming potential reference plane and heat sink for power-dissipating components, includes both electrical and thermal vias for heat dissipation

Also Published As

Publication number Publication date
WO2006030352A2 (en) 2006-03-23
TW200623996A (en) 2006-07-01

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