WO2006041542A3 - Method and system for dynamically controlling metrology work in progress - Google Patents

Method and system for dynamically controlling metrology work in progress Download PDF

Info

Publication number
WO2006041542A3
WO2006041542A3 PCT/US2005/022191 US2005022191W WO2006041542A3 WO 2006041542 A3 WO2006041542 A3 WO 2006041542A3 US 2005022191 W US2005022191 W US 2005022191W WO 2006041542 A3 WO2006041542 A3 WO 2006041542A3
Authority
WO
WIPO (PCT)
Prior art keywords
metrology
progress
dynamically controlling
tool
wafer lots
Prior art date
Application number
PCT/US2005/022191
Other languages
French (fr)
Other versions
WO2006041542A2 (en
Inventor
Matthew A Purdy
Cabe W Nicksic
Original Assignee
Advanced Micro Devices Inc
Matthew A Purdy
Cabe W Nicksic
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc, Matthew A Purdy, Cabe W Nicksic filed Critical Advanced Micro Devices Inc
Priority to KR1020077008345A priority Critical patent/KR101129715B1/en
Priority to CN2005800340498A priority patent/CN101036092B/en
Priority to EP05771492A priority patent/EP1797486A2/en
Priority to JP2007535668A priority patent/JP2008523458A/en
Publication of WO2006041542A2 publication Critical patent/WO2006041542A2/en
Publication of WO2006041542A3 publication Critical patent/WO2006041542A3/en

Links

Classifications

    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • G05B19/41865Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/32Operator till task planning
    • G05B2219/32247Real time scheduler
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/32Operator till task planning
    • G05B2219/32306Rules to make scheduling decisions
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/45Nc applications
    • G05B2219/45031Manufacturing semiconductor wafers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/80Management or planning

Abstract

The present invention is generally directed to various methods and systems for dynamically controlling metrology work in progress. In one illustrative embodiment, the method comprises providing a metrology control unit (12) that is adapted to control metrology work flow to at least one metrology tool (14), identifying a plurality of wafer lots (23) that are in a metrology queue wherein the wafer lots (23) are intended to be processed in at least one metrology tool (14), and wherein the metrology control unit (12) selects at least one of the wafer lots (23) for metrology processing in the at least one metrology tool (14) and selects at least one other of the plurality of wafer lots (23) to be removed from the metrology queue based upon the metrology processing of the selected at least one wafer lot (23) in the at least one metrology tool (14).
PCT/US2005/022191 2004-10-05 2005-06-23 Method and system for dynamically controlling metrology work in progress WO2006041542A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020077008345A KR101129715B1 (en) 2004-10-05 2005-06-23 Method and system for dynamically controlling metrology work in progress
CN2005800340498A CN101036092B (en) 2004-10-05 2005-06-23 Method and system for dynamically controlling metrology work in progress
EP05771492A EP1797486A2 (en) 2004-10-05 2005-06-23 Method and system for dynamically controlling metrology work in progress
JP2007535668A JP2008523458A (en) 2004-10-05 2005-06-23 Method and system for dynamically controlling in-process metrology work

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/958,834 US7296103B1 (en) 2004-10-05 2004-10-05 Method and system for dynamically selecting wafer lots for metrology processing
US10/958,834 2004-10-05

Publications (2)

Publication Number Publication Date
WO2006041542A2 WO2006041542A2 (en) 2006-04-20
WO2006041542A3 true WO2006041542A3 (en) 2006-06-01

Family

ID=35311834

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/022191 WO2006041542A2 (en) 2004-10-05 2005-06-23 Method and system for dynamically controlling metrology work in progress

Country Status (7)

Country Link
US (1) US7296103B1 (en)
EP (1) EP1797486A2 (en)
JP (1) JP2008523458A (en)
KR (1) KR101129715B1 (en)
CN (1) CN101036092B (en)
TW (1) TWI374345B (en)
WO (1) WO2006041542A2 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7836168B1 (en) 2002-06-04 2010-11-16 Rockwell Automation Technologies, Inc. System and methodology providing flexible and distributed processing in an industrial controller environment
US9235413B1 (en) * 2005-08-03 2016-01-12 National Semiconductor Corporation Automated control of semiconductor wafer manufacturing based on electrical test results
JP4957226B2 (en) * 2005-12-15 2012-06-20 富士通セミコンダクター株式会社 Information processing terminal and quality improvement support server for supporting quality improvement related to product manufacturing
TWI367402B (en) * 2006-10-12 2012-07-01 Tokyo Electron Ltd Substrate measurement method, program, computer-readabel recording medium recorded with program, and substrate processing system
US7937177B2 (en) * 2007-06-27 2011-05-03 International Business Machines Corporation Manufacturing work in process management system
US7668615B2 (en) * 2007-10-02 2010-02-23 GlobalFoundries, Inc. Method and apparatus for randomizing dispatch order for single wafer processing
US8565910B2 (en) 2011-02-04 2013-10-22 International Business Machines Corporation Manufacturing execution system (MES) including a wafer sampling engine (WSE) for a semiconductor manufacturing process
US9027035B2 (en) * 2012-12-17 2015-05-05 Itron, Inc. Non real-time metrology data management
US10133263B1 (en) 2014-08-18 2018-11-20 Kla-Tencor Corporation Process condition based dynamic defect inspection
CN105470156B (en) * 2014-09-09 2018-09-04 中芯国际集成电路制造(上海)有限公司 A kind of measurement technique based on RTD
US10295979B2 (en) * 2015-09-15 2019-05-21 Applied Materials, Inc. Scheduling in manufacturing environments
US10763144B2 (en) * 2018-03-01 2020-09-01 Verity Instruments, Inc. Adaptable-modular optical sensor based process control system, and method of operation thereof
US11887862B2 (en) * 2021-09-14 2024-01-30 Deca Technologies Usa, Inc. Method for redistribution layer (RDL) repair by mitigating at least one defect with a custom RDL

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020193899A1 (en) * 2001-06-19 2002-12-19 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
US20040038454A1 (en) * 2002-08-23 2004-02-26 Kla-Tencor Technologies Corporation Inspection system setup techniques
EP1420310A2 (en) * 2002-11-12 2004-05-19 Infineon Technologies AG Method, apparatus, data carrier and computer program module for monitoring a production process
US20040173464A1 (en) * 2001-08-24 2004-09-09 Applied Materials, Inc. Method and apparatus for providing intra-tool monitoring and control

Family Cites Families (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5425839A (en) 1992-05-14 1995-06-20 Texas Instruments Incorporated Method for rapidly etching material on a semiconductor device
US5770098A (en) 1993-03-19 1998-06-23 Tokyo Electron Kabushiki Kaisha Etching process
US5586039A (en) 1993-03-29 1996-12-17 Texas Instruments Incorporated Computer-aided manufacturing support method and system for specifying relationships and dependencies between process type components
US5402367A (en) 1993-07-19 1995-03-28 Texas Instruments, Incorporated Apparatus and method for model based process control
US5526293A (en) 1993-12-17 1996-06-11 Texas Instruments Inc. System and method for controlling semiconductor wafer processing
US5657252A (en) 1995-09-29 1997-08-12 Motorola, Inc. Dynamically configurable equipment integration architecture
JP3699776B2 (en) 1996-04-02 2005-09-28 株式会社日立製作所 Manufacturing method of electronic parts
US5822218A (en) 1996-08-27 1998-10-13 Clemson University Systems, methods and computer program products for prediction of defect-related failures in integrated circuits
US5982920A (en) 1997-01-08 1999-11-09 Lockheed Martin Energy Research Corp. Oak Ridge National Laboratory Automated defect spatial signature analysis for semiconductor manufacturing process
US5896294A (en) 1997-03-11 1999-04-20 Advanced Micro Devices, Inc. Method and apparatus for inspecting manufactured products for defects in response to in-situ monitoring
US5976740A (en) * 1997-08-28 1999-11-02 International Business Machines Corporation Process for controlling exposure dose or focus parameters using tone reversing pattern
US5999003A (en) 1997-12-12 1999-12-07 Advanced Micro Devices, Inc. Intelligent usage of first pass defect data for improved statistical accuracy of wafer level classification
JP3055516B2 (en) 1997-12-25 2000-06-26 日本電気株式会社 Apparatus and method for inspecting and analyzing semiconductor integrated circuit, and recording medium recording control program therefor
US6403385B1 (en) 1998-01-27 2002-06-11 Advanced Micro Devices, Inc. Method of inspecting a semiconductor wafer for defects
US6408219B2 (en) 1998-05-11 2002-06-18 Applied Materials, Inc. FAB yield enhancement system
US6263255B1 (en) 1998-05-18 2001-07-17 Advanced Micro Devices, Inc. Advanced process control for semiconductor manufacturing
US6171174B1 (en) * 1998-06-26 2001-01-09 Advanced Micro Devices System and method for controlling a multi-arm polishing tool
IL125337A0 (en) 1998-07-14 1999-03-12 Nova Measuring Instr Ltd Method and apparatus for lithography monitoring and process control
US6136712A (en) 1998-09-30 2000-10-24 Lam Research Corporation Method and apparatus for improving accuracy of plasma etching process
US6281962B1 (en) 1998-12-17 2001-08-28 Tokyo Electron Limited Processing apparatus for coating substrate with resist and developing exposed resist including inspection equipment for inspecting substrate and processing method thereof
US20020158197A1 (en) * 1999-01-12 2002-10-31 Applied Materials, Inc AFM-based lithography metrology tool
US6662076B1 (en) * 1999-02-10 2003-12-09 Advanced Micro Devices, Inc. Management of move requests from a factory system to an automated material handling system
US6298470B1 (en) 1999-04-15 2001-10-02 Micron Technology, Inc. Method for efficient manufacturing of integrated circuits
US6303395B1 (en) 1999-06-01 2001-10-16 Applied Materials, Inc. Semiconductor processing techniques
KR100649387B1 (en) * 1999-06-22 2006-11-27 브룩스 오토메이션 인코퍼레이티드 Run-to-run controller for use in microelectronic fabrication
US6421574B1 (en) 1999-09-23 2002-07-16 Advanced Micro Devices, Inc. Automatic defect classification system based variable sampling plan
US6248602B1 (en) 1999-11-01 2001-06-19 Amd, Inc. Method and apparatus for automated rework within run-to-run control semiconductor manufacturing
US6469518B1 (en) 2000-01-07 2002-10-22 Advanced Micro Devices, Inc. Method and apparatus for determining measurement frequency based on hardware age and usage
US6477432B1 (en) 2000-01-11 2002-11-05 Taiwan Semiconductor Manufacturing Company Statistical in-process quality control sampling based on product stability through a systematic operation system and method
US6337217B1 (en) 2000-02-14 2002-01-08 Advanced Micro Devices, Inc. Method and apparatus for improved focus in optical processing
US6245581B1 (en) 2000-04-19 2001-06-12 Advanced Micro Devices, Inc. Method and apparatus for control of critical dimension using feedback etch control
WO2002004887A1 (en) * 2000-07-08 2002-01-17 Semitool, Inc. Methods and apparatus for processing microelectronic workpieces using metrology
US6461878B1 (en) 2000-07-12 2002-10-08 Advanced Micro Devices, Inc. Feedback control of strip time to reduce post strip critical dimension variation in a transistor gate electrode
US6442496B1 (en) 2000-08-08 2002-08-27 Advanced Micro Devices, Inc. Method and apparatus for dynamic sampling of a production line
JP2002076087A (en) 2000-08-31 2002-03-15 Mitsubishi Electric Corp Managing system for sampling inspection
US6746616B1 (en) * 2001-03-27 2004-06-08 Advanced Micro Devices, Inc. Method and apparatus for providing etch uniformity using zoned temperature control
JP3909223B2 (en) * 2001-06-15 2007-04-25 株式会社デンソー Electronic device manufacturing process management system
US6444481B1 (en) * 2001-07-02 2002-09-03 Advanced Micro Devices, Inc. Method and apparatus for controlling a plating process
US6708129B1 (en) * 2001-12-13 2004-03-16 Advanced Micro Devices, Inc. Method and apparatus for wafer-to-wafer control with partial measurement data
US6650955B1 (en) 2001-12-18 2003-11-18 Advanced Micro Devices, Inc. Method and apparatus for determining a sampling plan based on process and equipment fingerprinting
US6821792B1 (en) 2001-12-18 2004-11-23 Advanced Micro Devices, Inc. Method and apparatus for determining a sampling plan based on process and equipment state information
CN1182572C (en) * 2002-04-03 2004-12-29 华邦电子股份有限公司 Abrasion method using dynamic calculation processing parameter
US6687561B1 (en) 2002-04-03 2004-02-03 Advanced Micro Devices, Inc. Method and apparatus for determining a sampling plan based on defectivity
US7069103B1 (en) * 2002-06-28 2006-06-27 Advanced Micro Devices, Inc. Controlling cumulative wafer effects
US7067333B1 (en) * 2002-06-28 2006-06-27 Advanced Micro Devices, Inc. Method and apparatus for implementing competing control models
US6810296B2 (en) * 2002-09-25 2004-10-26 Advanced Micro Devices, Inc. Correlating an inline parameter to a device operation parameter
AU2003270866A1 (en) * 2002-09-30 2004-04-23 Tokyo Electron Limited Method and apparatus for the monitoring and control of a semiconductor manufacturing process
US6907369B1 (en) * 2003-05-02 2005-06-14 Advanced Micro Devices, Inc. Method and apparatus for modifying design constraints based on observed performance
US20050021272A1 (en) * 2003-07-07 2005-01-27 Jenkins Naomi M. Method and apparatus for performing metrology dispatching based upon fault detection
US6988045B2 (en) * 2003-08-04 2006-01-17 Advanced Micro Devices, Inc. Dynamic metrology sampling methods, and system for performing same
US6999848B2 (en) * 2003-12-19 2006-02-14 Intel Corporation Process control apparatus, systems, and methods
US7076321B2 (en) * 2004-10-05 2006-07-11 Advanced Micro Devices, Inc. Method and system for dynamically adjusting metrology sampling based upon available metrology capacity
US20060178767A1 (en) * 2005-02-04 2006-08-10 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for inspection control

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020193899A1 (en) * 2001-06-19 2002-12-19 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
US20040173464A1 (en) * 2001-08-24 2004-09-09 Applied Materials, Inc. Method and apparatus for providing intra-tool monitoring and control
US20040038454A1 (en) * 2002-08-23 2004-02-26 Kla-Tencor Technologies Corporation Inspection system setup techniques
EP1420310A2 (en) * 2002-11-12 2004-05-19 Infineon Technologies AG Method, apparatus, data carrier and computer program module for monitoring a production process

Also Published As

Publication number Publication date
CN101036092B (en) 2010-11-03
KR20070051939A (en) 2007-05-18
EP1797486A2 (en) 2007-06-20
CN101036092A (en) 2007-09-12
JP2008523458A (en) 2008-07-03
US7296103B1 (en) 2007-11-13
TW200627105A (en) 2006-08-01
TWI374345B (en) 2012-10-11
WO2006041542A2 (en) 2006-04-20
KR101129715B1 (en) 2012-03-28

Similar Documents

Publication Publication Date Title
WO2006041542A3 (en) Method and system for dynamically controlling metrology work in progress
EP1604791A4 (en) Control system using working robot, and work processing method using this system
TW200629025A (en) A method and system for intelligent automated reticle management
EP2562956A3 (en) Device and method for controlling features on a device
TW200739381A (en) Integrated configuration, flow and execution system for semiconductor device experimental flows and production flows
WO2005101280A3 (en) Controller and method to mediate data collection from smart sensors for fab applications
NL1019692A1 (en) Cleaning robot, cleaning robot system and method for controlling it.
EP1508856A4 (en) Processor system, task control method on computer system, computer program
ATE524771T1 (en) METHOD AND DEVICE FOR SETTING UP A PATH CURVE OF A ROBOTIC DEVICE
AU2003273844A8 (en) Method and system for controlling ergonomic settings at a worksite
WO2005011471A3 (en) System and method for utilizing shape analysis to assess fetal abnormality
AU2003301333A1 (en) Apparatus and process for sensing fluoro species in semiconductor processing systems
WO2008095500A3 (en) Method and system for processing of items
DE50114131D1 (en) DEVICE AND METHOD FOR CONTROLLING A TOOL MACHINE
EP1732004A4 (en) Computer system, server constituting the same, job execution control method thereof, and program
HK1069491A1 (en) System and method for controlling the information processing device
AU2001247499A1 (en) Cluster tool systems and methods for processing wafers
EP1394849A4 (en) Cluster tool and method for controlling transport
EP1429375A4 (en) System and method for performing semiconductor processing on substrate being processed
GB0412623D0 (en) Method controlling operation of a semiconductor processing system
WO2002083361A1 (en) Machining cell in automatic machining system, and automatic honing system
EP1489506A4 (en) Decentralized processing system, job decentralized processing method, and program
TW200618153A (en) Method and system for calibrating integrated metrology systems and stand-alone metrology systems that acquire wafer state data
WO2002066923A3 (en) Method and apparatus for integrating multiple process controllers
WO2007078791A3 (en) Enhanced state estimation based upon information credibility

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KM KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NG NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2005771492

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 200580034049.8

Country of ref document: CN

Ref document number: 2007535668

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 1020077008345

Country of ref document: KR

WWP Wipo information: published in national office

Ref document number: 2005771492

Country of ref document: EP