WO2006041542A3 - Method and system for dynamically controlling metrology work in progress - Google Patents
Method and system for dynamically controlling metrology work in progress Download PDFInfo
- Publication number
- WO2006041542A3 WO2006041542A3 PCT/US2005/022191 US2005022191W WO2006041542A3 WO 2006041542 A3 WO2006041542 A3 WO 2006041542A3 US 2005022191 W US2005022191 W US 2005022191W WO 2006041542 A3 WO2006041542 A3 WO 2006041542A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- metrology
- progress
- dynamically controlling
- tool
- wafer lots
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
- G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32247—Real time scheduler
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32306—Rules to make scheduling decisions
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/80—Management or planning
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020077008345A KR101129715B1 (en) | 2004-10-05 | 2005-06-23 | Method and system for dynamically controlling metrology work in progress |
CN2005800340498A CN101036092B (en) | 2004-10-05 | 2005-06-23 | Method and system for dynamically controlling metrology work in progress |
EP05771492A EP1797486A2 (en) | 2004-10-05 | 2005-06-23 | Method and system for dynamically controlling metrology work in progress |
JP2007535668A JP2008523458A (en) | 2004-10-05 | 2005-06-23 | Method and system for dynamically controlling in-process metrology work |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/958,834 US7296103B1 (en) | 2004-10-05 | 2004-10-05 | Method and system for dynamically selecting wafer lots for metrology processing |
US10/958,834 | 2004-10-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006041542A2 WO2006041542A2 (en) | 2006-04-20 |
WO2006041542A3 true WO2006041542A3 (en) | 2006-06-01 |
Family
ID=35311834
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/022191 WO2006041542A2 (en) | 2004-10-05 | 2005-06-23 | Method and system for dynamically controlling metrology work in progress |
Country Status (7)
Country | Link |
---|---|
US (1) | US7296103B1 (en) |
EP (1) | EP1797486A2 (en) |
JP (1) | JP2008523458A (en) |
KR (1) | KR101129715B1 (en) |
CN (1) | CN101036092B (en) |
TW (1) | TWI374345B (en) |
WO (1) | WO2006041542A2 (en) |
Families Citing this family (13)
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US7836168B1 (en) | 2002-06-04 | 2010-11-16 | Rockwell Automation Technologies, Inc. | System and methodology providing flexible and distributed processing in an industrial controller environment |
US9235413B1 (en) * | 2005-08-03 | 2016-01-12 | National Semiconductor Corporation | Automated control of semiconductor wafer manufacturing based on electrical test results |
JP4957226B2 (en) * | 2005-12-15 | 2012-06-20 | 富士通セミコンダクター株式会社 | Information processing terminal and quality improvement support server for supporting quality improvement related to product manufacturing |
TWI367402B (en) * | 2006-10-12 | 2012-07-01 | Tokyo Electron Ltd | Substrate measurement method, program, computer-readabel recording medium recorded with program, and substrate processing system |
US7937177B2 (en) * | 2007-06-27 | 2011-05-03 | International Business Machines Corporation | Manufacturing work in process management system |
US7668615B2 (en) * | 2007-10-02 | 2010-02-23 | GlobalFoundries, Inc. | Method and apparatus for randomizing dispatch order for single wafer processing |
US8565910B2 (en) | 2011-02-04 | 2013-10-22 | International Business Machines Corporation | Manufacturing execution system (MES) including a wafer sampling engine (WSE) for a semiconductor manufacturing process |
US9027035B2 (en) * | 2012-12-17 | 2015-05-05 | Itron, Inc. | Non real-time metrology data management |
US10133263B1 (en) | 2014-08-18 | 2018-11-20 | Kla-Tencor Corporation | Process condition based dynamic defect inspection |
CN105470156B (en) * | 2014-09-09 | 2018-09-04 | 中芯国际集成电路制造(上海)有限公司 | A kind of measurement technique based on RTD |
US10295979B2 (en) * | 2015-09-15 | 2019-05-21 | Applied Materials, Inc. | Scheduling in manufacturing environments |
US10763144B2 (en) * | 2018-03-01 | 2020-09-01 | Verity Instruments, Inc. | Adaptable-modular optical sensor based process control system, and method of operation thereof |
US11887862B2 (en) * | 2021-09-14 | 2024-01-30 | Deca Technologies Usa, Inc. | Method for redistribution layer (RDL) repair by mitigating at least one defect with a custom RDL |
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EP1420310A2 (en) * | 2002-11-12 | 2004-05-19 | Infineon Technologies AG | Method, apparatus, data carrier and computer program module for monitoring a production process |
US20040173464A1 (en) * | 2001-08-24 | 2004-09-09 | Applied Materials, Inc. | Method and apparatus for providing intra-tool monitoring and control |
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-
2004
- 2004-10-05 US US10/958,834 patent/US7296103B1/en not_active Expired - Fee Related
-
2005
- 2005-06-23 EP EP05771492A patent/EP1797486A2/en not_active Withdrawn
- 2005-06-23 WO PCT/US2005/022191 patent/WO2006041542A2/en active Application Filing
- 2005-06-23 JP JP2007535668A patent/JP2008523458A/en active Pending
- 2005-06-23 KR KR1020077008345A patent/KR101129715B1/en not_active IP Right Cessation
- 2005-06-23 CN CN2005800340498A patent/CN101036092B/en not_active Expired - Fee Related
- 2005-09-14 TW TW094131591A patent/TWI374345B/en not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020193899A1 (en) * | 2001-06-19 | 2002-12-19 | Applied Materials, Inc. | Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing |
US20040173464A1 (en) * | 2001-08-24 | 2004-09-09 | Applied Materials, Inc. | Method and apparatus for providing intra-tool monitoring and control |
US20040038454A1 (en) * | 2002-08-23 | 2004-02-26 | Kla-Tencor Technologies Corporation | Inspection system setup techniques |
EP1420310A2 (en) * | 2002-11-12 | 2004-05-19 | Infineon Technologies AG | Method, apparatus, data carrier and computer program module for monitoring a production process |
Also Published As
Publication number | Publication date |
---|---|
CN101036092B (en) | 2010-11-03 |
KR20070051939A (en) | 2007-05-18 |
EP1797486A2 (en) | 2007-06-20 |
CN101036092A (en) | 2007-09-12 |
JP2008523458A (en) | 2008-07-03 |
US7296103B1 (en) | 2007-11-13 |
TW200627105A (en) | 2006-08-01 |
TWI374345B (en) | 2012-10-11 |
WO2006041542A2 (en) | 2006-04-20 |
KR101129715B1 (en) | 2012-03-28 |
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