WO2006046058A3 - Optical microstructures and methods manufacturing the same - Google Patents

Optical microstructures and methods manufacturing the same Download PDF

Info

Publication number
WO2006046058A3
WO2006046058A3 PCT/GB2005/004175 GB2005004175W WO2006046058A3 WO 2006046058 A3 WO2006046058 A3 WO 2006046058A3 GB 2005004175 W GB2005004175 W GB 2005004175W WO 2006046058 A3 WO2006046058 A3 WO 2006046058A3
Authority
WO
WIPO (PCT)
Prior art keywords
optical microstructures
same
methods manufacturing
laser machining
holes
Prior art date
Application number
PCT/GB2005/004175
Other languages
French (fr)
Other versions
WO2006046058A2 (en
Inventor
Samuel Charles William Hyde
Neil Griffin
Roger Clarke
Original Assignee
The Technology Partnership Plc
Samuel Charles William Hyde
Neil Griffin
Roger Clarke
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by The Technology Partnership Plc, Samuel Charles William Hyde, Neil Griffin, Roger Clarke filed Critical The Technology Partnership Plc
Publication of WO2006046058A2 publication Critical patent/WO2006046058A2/en
Publication of WO2006046058A3 publication Critical patent/WO2006046058A3/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0012—Arrays characterised by the manufacturing method
    • G02B3/0025—Machining, e.g. grinding, polishing, diamond turning, manufacturing of mould parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/16—Polishing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys
    • B23K2103/05—Stainless steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

A method of forming a plurality of optical microstructures is disclosed. The method includes laser machining a plurality of holes onto a surface and electrolytically polishing at least the holes to remove debris created during the laser machining. Each hole at least partially defines a respective one of the optical microstructures.
PCT/GB2005/004175 2004-10-28 2005-10-28 Optical microstructures and methods manufacturing the same WO2006046058A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0423963.8A GB0423963D0 (en) 2004-10-28 2004-10-28 Microstructures and methods of manufacturing the same
GB0423963.8 2004-10-28

Publications (2)

Publication Number Publication Date
WO2006046058A2 WO2006046058A2 (en) 2006-05-04
WO2006046058A3 true WO2006046058A3 (en) 2006-08-17

Family

ID=33515715

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2005/004175 WO2006046058A2 (en) 2004-10-28 2005-10-28 Optical microstructures and methods manufacturing the same

Country Status (2)

Country Link
GB (1) GB0423963D0 (en)
WO (1) WO2006046058A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014210798A1 (en) * 2014-06-05 2015-12-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mold, process for its manufacture and use, and plastic film and plastic component
KR101833876B1 (en) 2015-12-02 2018-03-02 이길령 Surface finishing device for the products of 3d-printer
CN114371184B (en) * 2022-01-14 2022-11-08 北京工业大学 Method for representing microstructure evolution of IGBT chip bonding region

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5378330A (en) * 1993-05-07 1995-01-03 Panasonic Technologies, Inc. Method for polishing micro-sized structures

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5378330A (en) * 1993-05-07 1995-01-03 Panasonic Technologies, Inc. Method for polishing micro-sized structures

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
COLEMAN W E ET AL: "Special coatings for stencil applications", PROCEEDINGS OF THE TECHNICAL PROGRAM. NEPCON WEST '98. CONFERENCE REED EXHIBITION NORWALK, CT, USA, vol. 1, 1 March 1998 (1998-03-01) - 5 March 1998 (1998-03-05), NORWALK, CT; USA, pages 126 - 133 vol.1, XP008060290 *
TONSHOFF H K ET AL: "Production possibilities of microoptics with excimer laser radiation", MICRO SYSTEM TECHNOLOGIES 98. 6TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO, OPTO, MECHANICAL SYSTEMS AND COMPONENTS VDE VERLAG BERLIN, GERMANY, 1 December 1998 (1998-12-01) - 3 December 1998 (1998-12-03), BERLIN, GERMANY, pages 183 - 188, XP008060277, ISBN: 3-8007-2421-9 *

Also Published As

Publication number Publication date
WO2006046058A2 (en) 2006-05-04
GB0423963D0 (en) 2004-12-01

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