WO2006055145A3 - Current collimation for thin seed and direct plating - Google Patents

Current collimation for thin seed and direct plating Download PDF

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Publication number
WO2006055145A3
WO2006055145A3 PCT/US2005/037149 US2005037149W WO2006055145A3 WO 2006055145 A3 WO2006055145 A3 WO 2006055145A3 US 2005037149 W US2005037149 W US 2005037149W WO 2006055145 A3 WO2006055145 A3 WO 2006055145A3
Authority
WO
WIPO (PCT)
Prior art keywords
direct plating
thin seed
fluid
current collimation
collimation
Prior art date
Application number
PCT/US2005/037149
Other languages
French (fr)
Other versions
WO2006055145A2 (en
Inventor
Harald Herchen
John O Dukovic
Lily Pang
Original Assignee
Applied Materials Inc
Harald Herchen
John O Dukovic
Lily Pang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc, Harald Herchen, John O Dukovic, Lily Pang filed Critical Applied Materials Inc
Publication of WO2006055145A2 publication Critical patent/WO2006055145A2/en
Publication of WO2006055145A3 publication Critical patent/WO2006055145A3/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Abstract

A method and apparatus for plating a conductive material onto a substrate is provided. The apparatus includes a fluid processing cell having a fluid basin configured to contain an electrolyte solution and having an opening configured to receive a substrate for processing, an anode assembly positioned in the fluid basin, and a collimator positioned in the fluid basin between the anode assembly and the opening.
PCT/US2005/037149 2004-11-15 2005-10-14 Current collimation for thin seed and direct plating WO2006055145A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/988,646 US20060102467A1 (en) 2004-11-15 2004-11-15 Current collimation for thin seed and direct plating
US10/988,646 2004-11-15

Publications (2)

Publication Number Publication Date
WO2006055145A2 WO2006055145A2 (en) 2006-05-26
WO2006055145A3 true WO2006055145A3 (en) 2007-06-28

Family

ID=36051497

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/037149 WO2006055145A2 (en) 2004-11-15 2005-10-14 Current collimation for thin seed and direct plating

Country Status (3)

Country Link
US (1) US20060102467A1 (en)
TW (1) TW200617218A (en)
WO (1) WO2006055145A2 (en)

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US9005409B2 (en) 2011-04-14 2015-04-14 Tel Nexx, Inc. Electro chemical deposition and replenishment apparatus
US9017528B2 (en) 2011-04-14 2015-04-28 Tel Nexx, Inc. Electro chemical deposition and replenishment apparatus
US9303329B2 (en) 2013-11-11 2016-04-05 Tel Nexx, Inc. Electrochemical deposition apparatus with remote catholyte fluid management
US9953813B2 (en) * 2014-06-06 2018-04-24 Applied Materials, Inc. Methods and apparatus for improved metal ion filtering

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Also Published As

Publication number Publication date
TW200617218A (en) 2006-06-01
WO2006055145A2 (en) 2006-05-26
US20060102467A1 (en) 2006-05-18

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