WO2006055996A3 - Process for through hole plating an electrically insulating substrate material - Google Patents

Process for through hole plating an electrically insulating substrate material Download PDF

Info

Publication number
WO2006055996A3
WO2006055996A3 PCT/AT2005/000470 AT2005000470W WO2006055996A3 WO 2006055996 A3 WO2006055996 A3 WO 2006055996A3 AT 2005000470 W AT2005000470 W AT 2005000470W WO 2006055996 A3 WO2006055996 A3 WO 2006055996A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate material
electrically insulating
insulating substrate
hole plating
sides
Prior art date
Application number
PCT/AT2005/000470
Other languages
German (de)
French (fr)
Other versions
WO2006055996A2 (en
Inventor
Bernhard Nessler
Stephan Erbse
Original Assignee
Nessler Medizintechnik Gmbh
Bernhard Nessler
Stephan Erbse
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from AT19722004A external-priority patent/AT501429B1/en
Application filed by Nessler Medizintechnik Gmbh, Bernhard Nessler, Stephan Erbse filed Critical Nessler Medizintechnik Gmbh
Priority to EP05804654A priority Critical patent/EP1814447A2/en
Publication of WO2006055996A2 publication Critical patent/WO2006055996A2/en
Publication of WO2006055996A3 publication Critical patent/WO2006055996A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
    • A61B5/25—Bioelectric electrodes therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/12—Manufacturing methods specially adapted for producing sensors for in-vivo measurements
    • A61B2562/125—Manufacturing methods specially adapted for producing sensors for in-vivo measurements characterised by the manufacture of electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

Abstract

In a process for through hole plating an electrically insulating substrate material (1), such as a substrate film for a medical electrode, a galvanic contact between the two sides (3, 4) of the substrate material (1) is produced by printing both sides of the substrate material (1) beyond their contour or by spraying an electroconductive material (2) on both sides of the substrate material (1).
PCT/AT2005/000470 2004-11-23 2005-11-23 Process for through hole plating an electrically insulating substrate material WO2006055996A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP05804654A EP1814447A2 (en) 2004-11-23 2005-11-23 Process for through hole plating an electrically insulating substrate material

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
AT19712004 2004-11-23
AT19722004A AT501429B1 (en) 2004-11-23 2004-11-23 Medical electrode, e.g. for connection to an electrocardiogram, has passage holes through a flexible plastics insulating film with an electrically conductive material on both sides passing through the openings
ATA1971/04 2004-11-23
ATA1972/04 2004-11-23

Publications (2)

Publication Number Publication Date
WO2006055996A2 WO2006055996A2 (en) 2006-06-01
WO2006055996A3 true WO2006055996A3 (en) 2006-11-30

Family

ID=35871148

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/AT2005/000470 WO2006055996A2 (en) 2004-11-23 2005-11-23 Process for through hole plating an electrically insulating substrate material

Country Status (2)

Country Link
EP (1) EP1814447A2 (en)
WO (1) WO2006055996A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2676602A1 (en) * 2012-06-20 2013-12-25 King's Metal Fiber Technologies Co., Ltd. Physiological signal detection device

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4563543A (en) * 1981-04-29 1986-01-07 U.S. Philips Corporation Ultra high-frequency circuit with metallized through hole
GB2163007A (en) * 1984-08-08 1986-02-12 Krone Gmbh Sheet with printed conductors on both sides and method of forming interconnections between the conductors
DE3527332A1 (en) * 1984-08-08 1987-02-12 Krone Ag Film having conductor tracks printed on both sides
JPH0258888A (en) * 1988-08-25 1990-02-28 Murata Mfg Co Ltd Thick film wiring board
US5265579A (en) * 1992-09-21 1993-11-30 Ferrari R Keith X-ray transparent monitoring electrode and method for making
EP0951864A1 (en) * 1998-04-20 1999-10-27 Nessler Medizintechnik GmbH & Co KG ECG electrode with rounded corners
WO2001084575A1 (en) * 2000-05-04 2001-11-08 Bae Systems Information And Electronic Systems Integration, Inc. Printed circuit variable impedance transmission line antenna
US6488199B1 (en) * 1999-03-08 2002-12-03 Robert Bosch Gmbh Method for improving the manufacturing safety of weld joints
US20040212085A1 (en) * 2003-04-25 2004-10-28 Denso Corporation Thick film circuit board, method of producing the same and integrated circuit device

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4563543A (en) * 1981-04-29 1986-01-07 U.S. Philips Corporation Ultra high-frequency circuit with metallized through hole
GB2163007A (en) * 1984-08-08 1986-02-12 Krone Gmbh Sheet with printed conductors on both sides and method of forming interconnections between the conductors
DE3527332A1 (en) * 1984-08-08 1987-02-12 Krone Ag Film having conductor tracks printed on both sides
JPH0258888A (en) * 1988-08-25 1990-02-28 Murata Mfg Co Ltd Thick film wiring board
US5265579A (en) * 1992-09-21 1993-11-30 Ferrari R Keith X-ray transparent monitoring electrode and method for making
EP0951864A1 (en) * 1998-04-20 1999-10-27 Nessler Medizintechnik GmbH & Co KG ECG electrode with rounded corners
US6488199B1 (en) * 1999-03-08 2002-12-03 Robert Bosch Gmbh Method for improving the manufacturing safety of weld joints
WO2001084575A1 (en) * 2000-05-04 2001-11-08 Bae Systems Information And Electronic Systems Integration, Inc. Printed circuit variable impedance transmission line antenna
US20040212085A1 (en) * 2003-04-25 2004-10-28 Denso Corporation Thick film circuit board, method of producing the same and integrated circuit device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 014, no. 229 (E - 0928) 15 May 1990 (1990-05-15) *

Also Published As

Publication number Publication date
EP1814447A2 (en) 2007-08-08
WO2006055996A2 (en) 2006-06-01

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