WO2006056648A3 - Electronics module and method for manufacturing the same - Google Patents

Electronics module and method for manufacturing the same Download PDF

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Publication number
WO2006056648A3
WO2006056648A3 PCT/FI2005/000506 FI2005000506W WO2006056648A3 WO 2006056648 A3 WO2006056648 A3 WO 2006056648A3 FI 2005000506 W FI2005000506 W FI 2005000506W WO 2006056648 A3 WO2006056648 A3 WO 2006056648A3
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WO
WIPO (PCT)
Prior art keywords
contact terminals
electronic module
insulating
material layer
manufacturing
Prior art date
Application number
PCT/FI2005/000506
Other languages
French (fr)
Other versions
WO2006056648A2 (en
Inventor
Risto Tuominen
Antti Iihola
Original Assignee
Imbera Electronics Oy
Risto Tuominen
Antti Iihola
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imbera Electronics Oy, Risto Tuominen, Antti Iihola filed Critical Imbera Electronics Oy
Priority to JP2007542020A priority Critical patent/JP2008522397A/en
Priority to US11/791,547 priority patent/US8547701B2/en
Publication of WO2006056648A2 publication Critical patent/WO2006056648A2/en
Publication of WO2006056648A3 publication Critical patent/WO2006056648A3/en

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    • H—ELECTRICITY
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    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2804—Next to metal

Abstract

This publication discloses an electronic module and a method for manufacturing it. The electronic module includes at least one first embedded component (6), the contact terminals (7) of which face essentially towards the first surface of the insulating-material layer (1) and which is connected electrically by its contact terminals (7) to the conductor structures contained in the electronic module. According to the invention, a second embedded component (6'), the contact terminals (7') of which face essentially towards the second surface of the insulating-material layer and which is connected electrically by its contact terminals (7') to the conductor structures contained in the electronic module, is attached to the first component (6), and the contact terminals (7, 7') are connected to the conductor structures with the aid of a conductive material, which is arranged in the insulating-material layer in holes (17) at the locations of the contact terminals (7, 7'). By means of the invention, it is possible to achieve a simple module construction comprising two component layers, which permits the manufacture of smaller electronic devices than previously.
PCT/FI2005/000506 2004-11-26 2005-11-24 Electronics module and method for manufacturing the same WO2006056648A2 (en)

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FI20041525A FI20041525A (en) 2004-11-26 2004-11-26 Electronics module and manufacturing process

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WO2006056648A3 true WO2006056648A3 (en) 2006-08-31

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Also Published As

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US20080094805A1 (en) 2008-04-24
FI20041525A0 (en) 2004-11-26
US8547701B2 (en) 2013-10-01
JP2008522397A (en) 2008-06-26
FI20041525A (en) 2006-03-17
WO2006056648A2 (en) 2006-06-01

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