WO2006061404A1 - Cooling system and method - Google Patents
Cooling system and method Download PDFInfo
- Publication number
- WO2006061404A1 WO2006061404A1 PCT/EP2005/056581 EP2005056581W WO2006061404A1 WO 2006061404 A1 WO2006061404 A1 WO 2006061404A1 EP 2005056581 W EP2005056581 W EP 2005056581W WO 2006061404 A1 WO2006061404 A1 WO 2006061404A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- coolant
- cooling
- cooling loop
- heat exchanger
- loop
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/2079—Liquid cooling without phase change within rooms for removing heat from cabinets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
- H01L23/4735—Jet impingement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Motor Or Generator Cooling System (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007544912A JP4511601B2 (en) | 2004-12-09 | 2005-12-07 | Cooling system and method |
EP05817223A EP1829441B1 (en) | 2004-12-09 | 2005-12-07 | Cooling system and method |
DE602005005859T DE602005005859T2 (en) | 2004-12-09 | 2005-12-07 | COOLING SYSTEM AND METHOD |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/008,711 US6973801B1 (en) | 2004-12-09 | 2004-12-09 | Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack |
US11/008,711 | 2004-12-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006061404A1 true WO2006061404A1 (en) | 2006-06-15 |
Family
ID=35452409
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2005/056581 WO2006061404A1 (en) | 2004-12-09 | 2005-12-07 | Cooling system and method |
Country Status (7)
Country | Link |
---|---|
US (1) | US6973801B1 (en) |
EP (1) | EP1829441B1 (en) |
JP (1) | JP4511601B2 (en) |
CN (1) | CN100556260C (en) |
AT (1) | ATE391406T1 (en) |
DE (1) | DE602005005859T2 (en) |
WO (1) | WO2006061404A1 (en) |
Cited By (1)
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---|---|---|---|---|
US10772234B2 (en) | 2017-02-28 | 2020-09-08 | Fujitsu Limited | Cooling device and electronic device system |
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US5903433A (en) * | 1994-12-14 | 1999-05-11 | Telefonaktiebolaget Lm Ericsson | Cooling system for telecommunications equipment arranged in a cabinet or similar |
US20020104646A1 (en) * | 2001-02-08 | 2002-08-08 | Jeong In Kwon | Multi-channel temperature control system for semiconductor processing facilities |
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-
2004
- 2004-12-09 US US11/008,711 patent/US6973801B1/en active Active
-
2005
- 2005-12-07 AT AT05817223T patent/ATE391406T1/en not_active IP Right Cessation
- 2005-12-07 JP JP2007544912A patent/JP4511601B2/en active Active
- 2005-12-07 EP EP05817223A patent/EP1829441B1/en active Active
- 2005-12-07 CN CN200580042255.3A patent/CN100556260C/en active Active
- 2005-12-07 DE DE602005005859T patent/DE602005005859T2/en active Active
- 2005-12-07 WO PCT/EP2005/056581 patent/WO2006061404A1/en active IP Right Grant
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US5903433A (en) * | 1994-12-14 | 1999-05-11 | Telefonaktiebolaget Lm Ericsson | Cooling system for telecommunications equipment arranged in a cabinet or similar |
US20020134544A1 (en) * | 2000-09-07 | 2002-09-26 | Thermotek, Inc. | Passive cooling system and method |
US20020104646A1 (en) * | 2001-02-08 | 2002-08-08 | Jeong In Kwon | Multi-channel temperature control system for semiconductor processing facilities |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10772234B2 (en) | 2017-02-28 | 2020-09-08 | Fujitsu Limited | Cooling device and electronic device system |
US11317534B2 (en) | 2017-02-28 | 2022-04-26 | Fujitsu Limited | Cooling device and electronic device system |
Also Published As
Publication number | Publication date |
---|---|
CN100556260C (en) | 2009-10-28 |
CN101091424A (en) | 2007-12-19 |
DE602005005859D1 (en) | 2008-05-15 |
ATE391406T1 (en) | 2008-04-15 |
US6973801B1 (en) | 2005-12-13 |
EP1829441B1 (en) | 2008-04-02 |
EP1829441A1 (en) | 2007-09-05 |
JP2008523599A (en) | 2008-07-03 |
JP4511601B2 (en) | 2010-07-28 |
DE602005005859T2 (en) | 2009-05-20 |
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