WO2006065523A3 - Apparatus and method for memory operations using address-dependent conditions - Google Patents

Apparatus and method for memory operations using address-dependent conditions Download PDF

Info

Publication number
WO2006065523A3
WO2006065523A3 PCT/US2005/043074 US2005043074W WO2006065523A3 WO 2006065523 A3 WO2006065523 A3 WO 2006065523A3 US 2005043074 W US2005043074 W US 2005043074W WO 2006065523 A3 WO2006065523 A3 WO 2006065523A3
Authority
WO
WIPO (PCT)
Prior art keywords
address
memory cell
memory operations
bit
lines
Prior art date
Application number
PCT/US2005/043074
Other languages
French (fr)
Other versions
WO2006065523A2 (en
Inventor
Kenneth K So
Luca G Fasoli
Roy E Scheuerlein
Original Assignee
Matrix Semiconductor Inc
Kenneth K So
Luca G Fasoli
Roy E Scheuerlein
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matrix Semiconductor Inc, Kenneth K So, Luca G Fasoli, Roy E Scheuerlein filed Critical Matrix Semiconductor Inc
Priority to AT05852375T priority Critical patent/ATE496372T1/en
Priority to KR1020077013751A priority patent/KR101100805B1/en
Priority to JP2007546708A priority patent/JP5285277B2/en
Priority to CN200580042742XA priority patent/CN101208751B/en
Priority to EP05852375A priority patent/EP1825475B1/en
Priority to DE602005026052T priority patent/DE602005026052D1/en
Publication of WO2006065523A2 publication Critical patent/WO2006065523A2/en
Publication of WO2006065523A3 publication Critical patent/WO2006065523A3/en

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1078Data input circuits, e.g. write amplifiers, data input buffers, data input registers, data input level conversion circuits
    • G11C7/1096Write circuits, e.g. I/O line write drivers
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • G11C5/06Arrangements for interconnecting storage elements electrically, e.g. by wiring
    • G11C5/063Voltage and signal distribution in integrated semi-conductor memory access lines, e.g. word-line, bit-line, cross-over resistance, propagation delay
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/165Auxiliary circuits
    • G11C11/1653Address circuits or decoders
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/165Auxiliary circuits
    • G11C11/1673Reading or sensing circuits or methods
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/165Auxiliary circuits
    • G11C11/1675Writing or programming circuits or methods
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/165Auxiliary circuits
    • G11C11/1677Verifying circuits or methods
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/12Bit line control circuits, e.g. drivers, boosters, pull-up circuits, pull-down circuits, precharging circuits, equalising circuits, for bit lines
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/18Bit line organisation; Bit line lay-out
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C8/00Arrangements for selecting an address in a digital store
    • G11C8/08Word line control circuits, e.g. drivers, boosters, pull-up circuits, pull-down circuits, precharging circuits, for word lines
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C8/00Arrangements for selecting an address in a digital store
    • G11C8/14Word line organisation; Word line lay-out

Abstract

An apparatus is disclosed comprising a plurality of word lines and word line drivers, a plurality of bit lines and bit line drivers, and a plurality of memory cells coupled between respective word lines and bit lines. The apparatus also comprises circuitry operative to select a writing and/or reading condition to apply to a memory cell based on the memory cell’s location with respect to one or both of a word line driver and a bit line driver. The apparatus can also comprise circuitry that is operative to select a number of memory cells to be programmed in parallel based on memory cell location with respect to a word line and/or bit line driver.
PCT/US2005/043074 2004-12-17 2005-11-29 Apparatus and method for memory operations using address-dependent conditions WO2006065523A2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
AT05852375T ATE496372T1 (en) 2004-12-17 2005-11-29 APPARATUS AND METHOD FOR STORAGE OPERATIONS USING ADDRESS DEPENDENT CONDITIONS
KR1020077013751A KR101100805B1 (en) 2004-12-17 2005-11-29 Apparatus and method for memory operations using address-dependent conditions
JP2007546708A JP5285277B2 (en) 2004-12-17 2005-11-29 Apparatus and method for memory operation using address dependent conditions
CN200580042742XA CN101208751B (en) 2004-12-17 2005-11-29 Apparatus and method for memory operations using address-dependent conditions
EP05852375A EP1825475B1 (en) 2004-12-17 2005-11-29 Apparatus and method for memory operations using address-dependent conditions
DE602005026052T DE602005026052D1 (en) 2004-12-17 2005-11-29 DEVICE AND METHOD FOR MEMORY OPERATIONS USING ADDRESS-RELATED CONDITIONS

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/015,440 2004-12-17
US11/015,440 US7218570B2 (en) 2004-12-17 2004-12-17 Apparatus and method for memory operations using address-dependent conditions

Publications (2)

Publication Number Publication Date
WO2006065523A2 WO2006065523A2 (en) 2006-06-22
WO2006065523A3 true WO2006065523A3 (en) 2006-10-05

Family

ID=36588354

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/043074 WO2006065523A2 (en) 2004-12-17 2005-11-29 Apparatus and method for memory operations using address-dependent conditions

Country Status (8)

Country Link
US (1) US7218570B2 (en)
EP (1) EP1825475B1 (en)
JP (1) JP5285277B2 (en)
KR (1) KR101100805B1 (en)
CN (1) CN101208751B (en)
AT (1) ATE496372T1 (en)
DE (1) DE602005026052D1 (en)
WO (1) WO2006065523A2 (en)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7613043B2 (en) * 2006-05-15 2009-11-03 Apple Inc. Shifting reference values to account for voltage sag
US7511646B2 (en) * 2006-05-15 2009-03-31 Apple Inc. Use of 8-bit or higher A/D for NAND cell value
US7701797B2 (en) * 2006-05-15 2010-04-20 Apple Inc. Two levels of voltage regulation supplied for logic and data programming voltage of a memory device
US7639542B2 (en) * 2006-05-15 2009-12-29 Apple Inc. Maintenance operations for multi-level data storage cells
US7551486B2 (en) * 2006-05-15 2009-06-23 Apple Inc. Iterative memory cell charging based on reference cell value
US8000134B2 (en) 2006-05-15 2011-08-16 Apple Inc. Off-die charge pump that supplies multiple flash devices
US7639531B2 (en) * 2006-05-15 2009-12-29 Apple Inc. Dynamic cell bit resolution
US7568135B2 (en) 2006-05-15 2009-07-28 Apple Inc. Use of alternative value in cell detection
US7852690B2 (en) * 2006-05-15 2010-12-14 Apple Inc. Multi-chip package for a flash memory
US7911834B2 (en) * 2006-05-15 2011-03-22 Apple Inc. Analog interface for a flash memory die
US7283414B1 (en) 2006-05-24 2007-10-16 Sandisk 3D Llc Method for improving the precision of a temperature-sensor circuit
US20080135087A1 (en) 2007-05-10 2008-06-12 Rangappan Anikara Thin solar concentrator
US8358526B2 (en) * 2008-02-28 2013-01-22 Contour Semiconductor, Inc. Diagonal connection storage array
US20090225621A1 (en) * 2008-03-05 2009-09-10 Shepard Daniel R Split decoder storage array and methods of forming the same
KR101424139B1 (en) * 2008-08-01 2014-08-04 삼성전자주식회사 Non-volatile memory device and method of operating the same
KR101029654B1 (en) * 2008-09-03 2011-04-15 주식회사 하이닉스반도체 Method of operating a non volatile memory device
JP5193796B2 (en) * 2008-10-21 2013-05-08 株式会社東芝 Three-dimensional stacked nonvolatile semiconductor memory
US8446787B2 (en) * 2008-11-20 2013-05-21 Micron Technology, Inc. Replacing defective memory blocks in response to external addresses
KR101551449B1 (en) * 2009-02-25 2015-09-08 삼성전자주식회사 Nonvalatile memory device and memory system having its
US8154904B2 (en) 2009-06-19 2012-04-10 Sandisk 3D Llc Programming reversible resistance switching elements
JP5259552B2 (en) * 2009-11-02 2013-08-07 株式会社東芝 Nonvolatile semiconductor memory device and driving method thereof
US8089815B2 (en) * 2009-11-24 2012-01-03 Sandisk Technologies Inc. Programming memory with bit line floating to reduce channel-to-floating gate coupling
TWI497496B (en) * 2011-01-19 2015-08-21 Macronix Int Co Ltd Architecture for 3d memory array
CN103229244B (en) 2011-11-29 2016-08-03 松下知识产权经营株式会社 Resistance change nonvolatile memory device and wiring method thereof
KR20130070928A (en) * 2011-12-20 2013-06-28 에스케이하이닉스 주식회사 Semiconductor memory device and method of operating thesame
KR20140025164A (en) * 2012-08-21 2014-03-04 삼성전자주식회사 Nonvolitile memory device and data processing methods thereof
US8885400B2 (en) * 2013-02-21 2014-11-11 Sandisk 3D Llc Compensation scheme for non-volatile memory
US10175906B2 (en) * 2014-07-31 2019-01-08 Hewlett Packard Enterprise Development Lp Encoding data within a crossbar memory array
US9406377B2 (en) 2014-12-08 2016-08-02 Sandisk Technologies Llc Rewritable multibit non-volatile memory with soft decode optimization
US20160379707A1 (en) * 2015-06-25 2016-12-29 Research & Business Foundation Sungkyunkwan University Cross point memory device
JP6457364B2 (en) * 2015-09-11 2019-01-23 東芝メモリ株式会社 Memory system
US10176881B2 (en) * 2016-08-26 2019-01-08 Samsung Electronics Co., Ltd. Non-volatile memory devices having temperature and location dependent word line operating voltages
JP2018160295A (en) 2017-03-22 2018-10-11 東芝メモリ株式会社 Semiconductor memory
CN108492844B (en) * 2018-03-26 2020-10-16 上海华虹宏力半导体制造有限公司 Double-split gate flash memory array and programming method thereof
US11081151B2 (en) * 2019-09-26 2021-08-03 Intel Corporation Techniques to improve a read operation to a memory array
US11342019B2 (en) * 2019-09-27 2022-05-24 Taiwan Semiconductor Manufacturing Co., Ltd. Compensation word line driver

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5745410A (en) * 1995-11-17 1998-04-28 Macronix International Co., Ltd. Method and system for soft programming algorithm
US6191980B1 (en) * 2000-03-07 2001-02-20 Lucent Technologies, Inc. Single-poly non-volatile memory cell having low-capacitance erase gate
US6791875B2 (en) * 2001-08-09 2004-09-14 Mitsubishi Denki Kabushiki Kaisha Thin film magnetic memory device realizing both high-speed data reading operation and stable operation
US6925007B2 (en) * 2001-10-31 2005-08-02 Sandisk Corporation Multi-state non-volatile integrated circuit memory systems that employ dielectric storage elements
US6980465B2 (en) * 2003-12-19 2005-12-27 Hewlett-Packard Development Company, L.P. Addressing circuit for a cross-point memory array including cross-point resistive elements

Family Cites Families (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3796998A (en) 1971-09-07 1974-03-12 Texas Instruments Inc Mos dynamic memory
JPS59151396A (en) 1983-02-15 1984-08-29 Sharp Corp Semiconductor read only memory circuit
JPS60115099A (en) 1983-11-25 1985-06-21 Fujitsu Ltd Semiconductor storage device
US4646269A (en) 1984-09-18 1987-02-24 Monolithic Memories, Inc. Multiple programmable initialize words in a programmable read only memory
US4646266A (en) 1984-09-28 1987-02-24 Energy Conversion Devices, Inc. Programmable semiconductor structures and methods for using the same
US4698788A (en) 1985-07-01 1987-10-06 Motorola, Inc. Memory architecture with sub-arrays
JPS6337894A (en) 1986-07-30 1988-02-18 Mitsubishi Electric Corp Random access memory
US5276649A (en) 1989-03-16 1994-01-04 Mitsubishi Denki Kabushiki Kaisha Dynamic-type semiconductor memory device having staggered activation of column groups
US5107139A (en) 1990-03-30 1992-04-21 Texas Instruments Incorporated On-chip transient event detector
IL96808A (en) 1990-04-18 1996-03-31 Rambus Inc Integrated circuit i/o using a high performance bus interface
JP2598154B2 (en) 1990-05-24 1997-04-09 株式会社東芝 Temperature detection circuit
EP0486743B1 (en) 1990-11-19 1996-05-08 STMicroelectronics S.r.l. Improved sense circuit for storage devices such as non-volatile memories, with compensated offset current
US5278796A (en) 1991-04-12 1994-01-11 Micron Technology, Inc. Temperature-dependent DRAM refresh circuit
JP2892216B2 (en) 1992-05-22 1999-05-17 株式会社東芝 Semiconductor memory
US5359571A (en) 1993-01-27 1994-10-25 Yu Shih Chiang Memory array having a plurality of address partitions
AU7049694A (en) 1993-06-14 1995-01-03 Rambus Inc. Method and apparatus for writing to memory components
US5383157A (en) 1993-08-06 1995-01-17 Cypress Semiconductor Corporation Parallel TESTMODE
JP3462894B2 (en) 1993-08-27 2003-11-05 株式会社東芝 Nonvolatile semiconductor memory and data programming method thereof
GB9417264D0 (en) 1994-08-26 1994-10-19 Inmos Ltd Memory device
US5818748A (en) 1995-11-21 1998-10-06 International Business Machines Corporation Chip function separation onto separate stacked chips
US5835396A (en) 1996-10-17 1998-11-10 Zhang; Guobiao Three-dimensional read-only memory
US5784328A (en) 1996-12-23 1998-07-21 Lsi Logic Corporation Memory system including an on-chip temperature sensor for regulating the refresh rate of a DRAM array
US5798966A (en) * 1997-03-31 1998-08-25 Intel Corporation Flash memory VDS compensation techiques to reduce programming variability
US5915167A (en) 1997-04-04 1999-06-22 Elm Technology Corporation Three dimensional structure memory
NO972803D0 (en) 1997-06-17 1997-06-17 Opticom As Electrically addressable logic device, method of electrically addressing the same and use of device and method
US5890100A (en) 1997-08-19 1999-03-30 Advanced Micro Devices, Inc. Chip temperature monitor using delay lines
NO973993L (en) 1997-09-01 1999-03-02 Opticom As Reading memory and reading memory devices
US5961215A (en) 1997-09-26 1999-10-05 Advanced Micro Devices, Inc. Temperature sensor integral with microprocessor and methods of using same
US5925996A (en) 1997-10-10 1999-07-20 Whistler Corporation Of Massachusetts Garage door operator motor secondary thermal overload
US6185121B1 (en) 1998-02-26 2001-02-06 Lucent Technologies Inc. Access structure for high density read only memory
US6185712B1 (en) 1998-07-02 2001-02-06 International Business Machines Corporation Chip performance optimization with self programmed built in self test
US6021076A (en) 1998-07-16 2000-02-01 Rambus Inc Apparatus and method for thermal regulation in memory subsystems
US5977746A (en) 1998-07-21 1999-11-02 Stryker Corporation Rechargeable battery pack and method for manufacturing same
US6157244A (en) 1998-10-13 2000-12-05 Advanced Micro Devices, Inc. Power supply independent temperature sensor
US6034882A (en) 1998-11-16 2000-03-07 Matrix Semiconductor, Inc. Vertically stacked field programmable nonvolatile memory and method of fabrication
US6385074B1 (en) 1998-11-16 2002-05-07 Matrix Semiconductor, Inc. Integrated circuit structure including three-dimensional memory array
KR100307663B1 (en) 1998-12-02 2001-11-30 윤종용 How to reduce the number of semiconductor memory devices and subarrays with different sizes of subarrays
US6356485B1 (en) 1999-02-13 2002-03-12 Integrated Device Technology, Inc. Merging write cycles by comparing at least a portion of the respective write cycle addresses
US6240046B1 (en) 1999-02-13 2001-05-29 Integrated Device Technology, Inc. Integrated circuit random access memory capable of reading either one or more than one data word in a single clock cycle
JP2001102552A (en) * 1999-09-29 2001-04-13 Sony Corp Semiconductor storage device and reading method therefor
JP3376976B2 (en) 1999-10-18 2003-02-17 日本電気株式会社 Semiconductor storage device
US6246610B1 (en) 2000-02-22 2001-06-12 Advanced Micro Devices, Inc. Symmetrical program and erase scheme to improve erase time degradation in NAND devices
US6205074B1 (en) 2000-02-29 2001-03-20 Advanced Micro Devices, Inc. Temperature-compensated bias generator
US6567287B2 (en) 2001-03-21 2003-05-20 Matrix Semiconductor, Inc. Memory device with row and column decoder circuits arranged in a checkerboard pattern under a plurality of memory arrays
US6420215B1 (en) 2000-04-28 2002-07-16 Matrix Semiconductor, Inc. Three-dimensional memory array and method of fabrication
KR100821456B1 (en) 2000-08-14 2008-04-11 샌디스크 쓰리디 엘엘씨 Dense arrays and charge storage devices, and methods for making same
US6661730B1 (en) 2000-12-22 2003-12-09 Matrix Semiconductor, Inc. Partial selection of passive element memory cell sub-arrays for write operation
US6407953B1 (en) 2001-02-02 2002-06-18 Matrix Semiconductor, Inc. Memory array organization and related test method particularly well suited for integrated circuits having write-once memory arrays
US6618295B2 (en) 2001-03-21 2003-09-09 Matrix Semiconductor, Inc. Method and apparatus for biasing selected and unselected array lines when writing a memory array
US6574145B2 (en) 2001-03-21 2003-06-03 Matrix Semiconductor, Inc. Memory device and method for sensing while programming a non-volatile memory cell
US6507238B1 (en) 2001-06-22 2003-01-14 International Business Machines Corporation Temperature-dependent reference generator
US6525953B1 (en) 2001-08-13 2003-02-25 Matrix Semiconductor, Inc. Vertically-stacked, field-programmable, nonvolatile memory and method of fabrication
US6597609B2 (en) * 2001-08-30 2003-07-22 Micron Technology, Inc. Non-volatile memory with test rows for disturb detection
US6724665B2 (en) 2001-08-31 2004-04-20 Matrix Semiconductor, Inc. Memory device and method for selectable sub-array activation
US6735546B2 (en) 2001-08-31 2004-05-11 Matrix Semiconductor, Inc. Memory device and method for temperature-based control over write and/or read operations
JP2003109389A (en) * 2001-09-28 2003-04-11 Fujitsu Ltd Semiconductor memory device
US6560152B1 (en) 2001-11-02 2003-05-06 Sandisk Corporation Non-volatile memory with temperature-compensated data read
US6608790B2 (en) 2001-12-03 2003-08-19 Hewlett-Packard Development Company, L.P. Write current compensation for temperature variations in memory arrays
JP3812498B2 (en) * 2001-12-28 2006-08-23 日本電気株式会社 Semiconductor memory device using tunnel magnetoresistive element
US6754124B2 (en) 2002-06-11 2004-06-22 Micron Technology, Inc. Hybrid MRAM array structure and operation
KR100429891B1 (en) * 2002-07-29 2004-05-03 삼성전자주식회사 Grid clock distribution network for minimizing clock skew
JP2004158119A (en) * 2002-11-06 2004-06-03 Sharp Corp Nonvolatile semiconductor memory device
KR100488544B1 (en) * 2002-11-11 2005-05-11 삼성전자주식회사 Device and method for controlling aivc voltage using block selection information in semiconductor memory
US6954394B2 (en) 2002-11-27 2005-10-11 Matrix Semiconductor, Inc. Integrated circuit and method for selecting a set of memory-cell-layer-dependent or temperature-dependent operating conditions

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5745410A (en) * 1995-11-17 1998-04-28 Macronix International Co., Ltd. Method and system for soft programming algorithm
US6191980B1 (en) * 2000-03-07 2001-02-20 Lucent Technologies, Inc. Single-poly non-volatile memory cell having low-capacitance erase gate
US6791875B2 (en) * 2001-08-09 2004-09-14 Mitsubishi Denki Kabushiki Kaisha Thin film magnetic memory device realizing both high-speed data reading operation and stable operation
US6925007B2 (en) * 2001-10-31 2005-08-02 Sandisk Corporation Multi-state non-volatile integrated circuit memory systems that employ dielectric storage elements
US6980465B2 (en) * 2003-12-19 2005-12-27 Hewlett-Packard Development Company, L.P. Addressing circuit for a cross-point memory array including cross-point resistive elements

Also Published As

Publication number Publication date
EP1825475A4 (en) 2009-01-07
CN101208751A (en) 2008-06-25
ATE496372T1 (en) 2011-02-15
KR20070104526A (en) 2007-10-26
US7218570B2 (en) 2007-05-15
US20060133125A1 (en) 2006-06-22
JP5285277B2 (en) 2013-09-11
EP1825475A2 (en) 2007-08-29
CN101208751B (en) 2010-09-15
DE602005026052D1 (en) 2011-03-03
WO2006065523A2 (en) 2006-06-22
EP1825475B1 (en) 2011-01-19
JP2008524772A (en) 2008-07-10
KR101100805B1 (en) 2012-01-02

Similar Documents

Publication Publication Date Title
WO2006065523A3 (en) Apparatus and method for memory operations using address-dependent conditions
TW200741710A (en) Data writing method
WO2007134247A3 (en) Dynamic cell bit resolution
WO2007005693A3 (en) Memory controller interface for micro-tiled memory access
HK1161415A1 (en) Sram with different supply voltages for memory cells and access logic circuitry
EP1598805A8 (en) SRAM core cell for light-emitting display
SG133534A1 (en) System for improving endurance and data retention in memory devices
TWI265526B (en) Semiconductor memory device and arrangement method thereof
WO2007130615A3 (en) A method for reading a multilevel cell in a non-volatile memory device
TW200723280A (en) Resistive memory devices including selected reference memory cells and methods of operating the same
WO2008098363A8 (en) Non-volatile memory with dynamic multi-mode operation
EP1152429A3 (en) Data storage device
WO2009052371A3 (en) Ground level precharge bit line scheme for read operation in spin transfer torque magnetoresistive random access memory
TW200707189A (en) Memory block erasing in a flash memory device
WO2007005891A3 (en) Micro-tile memory interfaces
WO2004059651A3 (en) Nonvolatile memory unit with specific cache
ATE512441T1 (en) PROVIDING ENERGY REDUCTION WHEN STORING DATA IN A MEMORY
TW200737182A (en) High-bandwidth magnetoresistive random access memory devices and methods of operation thereof
TW200620281A (en) MRAM with staggered cell structure
EP1271542A3 (en) Method and system for fast data access using a memory array
WO2007139901A3 (en) Method and apparatus for improving storage performance using a background erase
TWI371754B (en) Apparatus and method of reducing power consumption during read operations in non-volatile storage
TW200700987A (en) Method and apparatus for performing multi-programmable function with one-time programmable memories
TW200627477A (en) Memory device employing open bit line architecture for providing identical data topology on repaired memory cell block and method thereof
TW200615946A (en) Hybrid MRAM memory array architecture

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200580042742.X

Country of ref document: CN

AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KM KN KP KR KZ LC LK LR LS LT LU LV LY MA MD MG MK MN MW MX MZ NA NG NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU LV MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2005852375

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2007546708

Country of ref document: JP

Ref document number: 1020077013751

Country of ref document: KR

NENP Non-entry into the national phase

Ref country code: DE

WWP Wipo information: published in national office

Ref document number: 2005852375

Country of ref document: EP