WO2006065558A3 - Semiconductor light emitting device mounting substrates and packages including cavities and cover plates, and methods of packaging same - Google Patents

Semiconductor light emitting device mounting substrates and packages including cavities and cover plates, and methods of packaging same Download PDF

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Publication number
WO2006065558A3
WO2006065558A3 PCT/US2005/043719 US2005043719W WO2006065558A3 WO 2006065558 A3 WO2006065558 A3 WO 2006065558A3 US 2005043719 W US2005043719 W US 2005043719W WO 2006065558 A3 WO2006065558 A3 WO 2006065558A3
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
semiconductor light
emitting device
cavity
methods
Prior art date
Application number
PCT/US2005/043719
Other languages
French (fr)
Other versions
WO2006065558A2 (en
Inventor
Gerald H Negley
David B Slater
Original Assignee
Cree Inc
Gerald H Negley
David B Slater
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Inc, Gerald H Negley, David B Slater filed Critical Cree Inc
Priority to JP2007546728A priority Critical patent/JP2008523639A/en
Priority to DE112005003083T priority patent/DE112005003083T5/en
Publication of WO2006065558A2 publication Critical patent/WO2006065558A2/en
Publication of WO2006065558A3 publication Critical patent/WO2006065558A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Abstract

A mounting substrate for a semiconductor light emitting device includes a solid metal block having first and second opposing metal faces. The first metal face includes a cavity that is configured to mount at least one semiconductor light emitting device therein, and to reflect light that is emitted by at least one semiconductor light emitting device that is mounted therein away from the cavity. One or more semiconductor light emitting devices are mounted in the cavity. A cap having an aperture is configured to matingly attach to the solid metal block adjacent the first metal face such that the aperture is aligned to the cavity. Reflective coatings, conductive traces, insulating layers, pedestals, through holes, lenses, flexible films, optical elements, phosphor, integrated circuits, optical coupling media, recesses and/or meniscus control regions also may be provided in the package. Related packaging methods also may be provided.
PCT/US2005/043719 2004-12-14 2005-12-05 Semiconductor light emitting device mounting substrates and packages including cavities and cover plates, and methods of packaging same WO2006065558A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007546728A JP2008523639A (en) 2004-12-14 2005-12-05 Semiconductor light emitting device mounting substrate, package including cavity and cover plate, and mounting method thereof
DE112005003083T DE112005003083T5 (en) 2004-12-14 2005-12-05 Mounting substrates for semiconductor light emitting devices and packages with cavities and cover plates and method of packaging the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/011,748 2004-12-14
US11/011,748 US20060124953A1 (en) 2004-12-14 2004-12-14 Semiconductor light emitting device mounting substrates and packages including cavities and cover plates, and methods of packaging same

Publications (2)

Publication Number Publication Date
WO2006065558A2 WO2006065558A2 (en) 2006-06-22
WO2006065558A3 true WO2006065558A3 (en) 2006-08-03

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/043719 WO2006065558A2 (en) 2004-12-14 2005-12-05 Semiconductor light emitting device mounting substrates and packages including cavities and cover plates, and methods of packaging same

Country Status (6)

Country Link
US (1) US20060124953A1 (en)
JP (1) JP2008523639A (en)
CN (2) CN101599524B (en)
DE (1) DE112005003083T5 (en)
TW (1) TW200633268A (en)
WO (1) WO2006065558A2 (en)

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