WO2006072019A3 - Electronic device and process for forming same - Google Patents

Electronic device and process for forming same Download PDF

Info

Publication number
WO2006072019A3
WO2006072019A3 PCT/US2005/047514 US2005047514W WO2006072019A3 WO 2006072019 A3 WO2006072019 A3 WO 2006072019A3 US 2005047514 W US2005047514 W US 2005047514W WO 2006072019 A3 WO2006072019 A3 WO 2006072019A3
Authority
WO
WIPO (PCT)
Prior art keywords
openings
electronic device
array
opening
width
Prior art date
Application number
PCT/US2005/047514
Other languages
French (fr)
Other versions
WO2006072019A2 (en
Inventor
Stephen Sorich
Matthew Stainer
Original Assignee
Du Pont
Stephen Sorich
Matthew Stainer
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont, Stephen Sorich, Matthew Stainer filed Critical Du Pont
Priority to KR1020077017390A priority Critical patent/KR101433944B1/en
Priority to EP05857255A priority patent/EP1842237A4/en
Priority to JP2007549666A priority patent/JP5590772B2/en
Publication of WO2006072019A2 publication Critical patent/WO2006072019A2/en
Publication of WO2006072019A3 publication Critical patent/WO2006072019A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/26—Light sources with substantially two-dimensional radiating surfaces characterised by the composition or arrangement of the conductive material used as an electrode
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K39/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K39/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
    • H10K39/30—Devices controlled by radiation
    • H10K39/32—Organic image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/173—Passive-matrix OLED displays comprising banks or shadow masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
    • H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
    • H10K85/1135—Polyethylene dioxythiophene [PEDOT]; Derivatives thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
    • H10K85/114—Poly-phenylenevinylene; Derivatives thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/60—Organic compounds having low molecular weight
    • H10K85/649—Aromatic compounds comprising a hetero atom
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/60—Organic compounds having low molecular weight
    • H10K85/649—Aromatic compounds comprising a hetero atom
    • H10K85/656—Aromatic compounds comprising a hetero atom comprising two or more different heteroatoms per ring
    • H10K85/6565—Oxadiazole compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Electroluminescent Light Sources (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Thin Film Transistor (AREA)

Abstract

An electronic device includes a substrate and a well structure overlying the substrate and defining an array of openings. From a cross-sectional view, the well structure, at the openings has a negative slope. From a plan view, each opening corresponds to an organic electronic component. Each opening within the array of openings has a width and two immediately adjacent openings within the array of openings are connected by a channel having a width smaller than the width of each opening.
PCT/US2005/047514 2004-12-30 2005-12-29 Electronic device and process for forming same WO2006072019A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020077017390A KR101433944B1 (en) 2004-12-30 2005-12-29 Electronic device and process for forming same
EP05857255A EP1842237A4 (en) 2004-12-30 2005-12-29 Electronic device and process for forming same
JP2007549666A JP5590772B2 (en) 2004-12-30 2005-12-29 Electronic device and process for forming the same

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US64050204P 2004-12-30 2004-12-30
US60/640,502 2004-12-30
US11/134,100 US7166860B2 (en) 2004-12-30 2005-05-20 Electronic device and process for forming same
US11/134,100 2005-05-20

Publications (2)

Publication Number Publication Date
WO2006072019A2 WO2006072019A2 (en) 2006-07-06
WO2006072019A3 true WO2006072019A3 (en) 2006-11-16

Family

ID=36615545

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/047514 WO2006072019A2 (en) 2004-12-30 2005-12-29 Electronic device and process for forming same

Country Status (5)

Country Link
US (1) US7166860B2 (en)
EP (1) EP1842237A4 (en)
JP (1) JP5590772B2 (en)
KR (1) KR101433944B1 (en)
WO (1) WO2006072019A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008544509A (en) * 2005-06-16 2008-12-04 シーメンス アクチエンゲゼルシヤフト Organic line detector and method for manufacturing organic line detector
US8247824B2 (en) * 2005-12-19 2012-08-21 Matthew Stainer Electronic devices comprising electrodes that connect to conductive members within a substrate and processes for forming the electronic devices
KR101084166B1 (en) * 2006-01-13 2011-11-17 삼성모바일디스플레이주식회사 Pixel structure and organic light emitting device comprising the same
JP4946476B2 (en) * 2007-02-05 2012-06-06 セイコーエプソン株式会社 Organic EL device and manufacturing method thereof
TWI377880B (en) * 2007-08-20 2012-11-21 Ind Tech Res Inst Fabrication methods for flexible electronic devices
KR101084190B1 (en) * 2010-02-16 2011-11-17 삼성모바일디스플레이주식회사 Organic light emitting display and manufacturing method thereof
US9131245B2 (en) 2011-09-23 2015-09-08 Qualcomm Incorporated Reference picture list construction for video coding
CN104299968B (en) * 2014-09-22 2017-04-26 京东方科技集团股份有限公司 Electroluminescent device, manufacturing method of electroluminescent device, display substrate and display device
KR20200069692A (en) 2018-12-07 2020-06-17 엘지디스플레이 주식회사 Organic light emitting display device
CN111146256B (en) * 2019-12-13 2023-08-22 固安翌光科技有限公司 High-stability organic light-emitting diode

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6306559B1 (en) * 1999-01-26 2001-10-23 Mitsubishi Chemical Corporation Organic electroluminescent device comprising a patterned photosensitive composition and a method for producing same
US20040101988A1 (en) * 2000-06-06 2004-05-27 Roman Paul J. Deposition of permanent polymer structures for OLED fabrication

Family Cites Families (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3576900D1 (en) 1985-12-30 1990-05-03 Ibm Deutschland METHOD FOR PRODUCING PRINTED CIRCUITS.
US4735676A (en) 1986-01-14 1988-04-05 Asahi Chemical Research Laboratory Co., Ltd. Method for forming electric circuits on a base board
JPS63160352A (en) 1986-12-24 1988-07-04 Semiconductor Energy Lab Co Ltd Method for packaging semiconductor device
US4914742A (en) 1987-12-07 1990-04-03 Honeywell Inc. Thin film orthogonal microsensor for air flow and method
US4784721A (en) 1988-02-22 1988-11-15 Honeywell Inc. Integrated thin-film diaphragm; backside etch
NL9000545A (en) 1990-03-09 1991-10-01 Philips Nv METHOD FOR PRODUCING CONDUCTOR RAILS
FI84869C (en) 1990-06-11 1992-01-27 Planar Int Oy MATRISFILMSTRUKTUR I SYNNERHET FOER ELEKTROLUMINECENS DISPLAYENHET.
US5158645A (en) 1991-09-03 1992-10-27 International Business Machines, Inc. Method of external circuitization of a circuit panel
JPH0625963U (en) 1991-09-11 1994-04-08 旭精工株式会社 Shoot type coin selector
JP2823725B2 (en) 1992-01-18 1998-11-11 シャープ株式会社 Color thin film EL panel
US5244817A (en) 1992-08-03 1993-09-14 Eastman Kodak Company Method of making backside illuminated image sensors
US5364742A (en) 1992-09-21 1994-11-15 International Business Machines Corporation Micro-miniature structures and method of fabrication thereof
US5284548A (en) 1993-03-03 1994-02-08 Microelectronics And Computer Technology Corporation Process for producing electrical circuits with precision surface features
JPH06325873A (en) 1993-05-13 1994-11-25 Denki Kagaku Kogyo Kk Organic thin-film electroluminescent element
US5616514A (en) 1993-06-03 1997-04-01 Robert Bosch Gmbh Method of fabricating a micromechanical sensor
US5701055A (en) 1994-03-13 1997-12-23 Pioneer Electronic Corporation Organic electoluminescent display panel and method for manufacturing the same
JP3813217B2 (en) * 1995-03-13 2006-08-23 パイオニア株式会社 Method for manufacturing organic electroluminescence display panel
US5532174A (en) 1994-04-22 1996-07-02 Lsi Logic Corporation Wafer level integrated circuit testing with a sacrificial metal layer
US5559345A (en) 1994-12-20 1996-09-24 Goldstar Co., Ltd. Thin film transistor having redundant metal patterns
US5714840A (en) 1995-03-07 1998-02-03 Asahi Glass Company Ltd. Plasma display panel
KR19980065367A (en) 1996-06-02 1998-10-15 오평희 Backlight for LCD
US6547973B2 (en) 1996-07-30 2003-04-15 Agilent Technologies, Inc. Fabrication of suspended structures using a sacrificial layer
US6169357B1 (en) 1997-07-28 2001-01-02 Advanced Vision Technologies, Inc. Electron field-emission display cell device having opening depth defined by etch stop
JP3858810B2 (en) * 1996-09-19 2006-12-20 セイコーエプソン株式会社 Method for manufacturing light emitting device
JPH10172762A (en) * 1996-12-11 1998-06-26 Sanyo Electric Co Ltd Manufacture of display device using electroluminescent element and display device therefor
US5851732A (en) 1997-03-06 1998-12-22 E. I. Du Pont De Nemours And Company Plasma display panel device fabrication utilizing black electrode between substrate and conductor electrode
JP3849735B2 (en) 1997-04-10 2006-11-22 株式会社日立プラズマパテントライセンシング Plasma display panel and manufacturing method thereof
JP3646510B2 (en) 1998-03-18 2005-05-11 セイコーエプソン株式会社 Thin film forming method, display device, and color filter
GB9903110D0 (en) 1999-02-11 1999-04-07 Univ Bristol Method of fabricating etched structures
JP4854840B2 (en) * 1999-10-12 2012-01-18 株式会社半導体エネルギー研究所 Method for manufacturing light emitting device
US6309501B1 (en) 1999-11-19 2001-10-30 Basil T. Kelley Method for making a beveled laminate corner on a laminate countertop edge piece
JP2001319778A (en) * 2000-05-02 2001-11-16 Toyota Motor Corp Organic el element
US6906458B2 (en) 2000-08-11 2005-06-14 Seiko Epson Corporation Method for manufacturing organic EL device, organic EL device and electronic apparatus
US6413852B1 (en) 2000-08-31 2002-07-02 International Business Machines Corporation Method of forming multilevel interconnect structure containing air gaps including utilizing both sacrificial and placeholder material
JP2004508691A (en) 2000-09-06 2004-03-18 オスラム　オプト　セミコンダクターズ　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング Electrode patterning in OLED devices
CN1302297C (en) * 2000-10-12 2007-02-28 三洋电机株式会社 Method for forming color filter, method for forming light lkight emitting element layer, method for manufacturing color display device comprising them, or color dispaly device
ATE475198T1 (en) 2000-11-17 2010-08-15 Tpo Displays Corp ORGANIC ELECTROLUMINENCE COMPONENT AND METHOD FOR THE PRODUCTION THEREOF
JP4021177B2 (en) 2000-11-28 2007-12-12 セイコーエプソン株式会社 Organic electroluminescence device manufacturing method, organic electroluminescence device, and electronic apparatus
US6465286B2 (en) 2000-12-20 2002-10-15 General Electric Company Method of fabricating an imager array
KR100379824B1 (en) 2000-12-20 2003-04-11 엘지.필립스 엘시디 주식회사 Etchant and array substrate for electric device with Cu lines patterend on the array substrate using the etchant
JP4030722B2 (en) 2001-02-15 2008-01-09 三星エスディアイ株式会社 Organic electroluminescence device and method of manufacturing the same
US6596443B2 (en) 2001-03-12 2003-07-22 Universal Display Corporation Mask for patterning devices
JP2004531859A (en) 2001-04-26 2004-10-14 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ Organic electroluminescent device and manufacturing method thereof
KR100883341B1 (en) 2001-04-26 2009-02-11 코닌클리케 필립스 일렉트로닉스 엔.브이. Electroluminescent device and method for manufacturing thereof
US6905613B2 (en) 2001-07-10 2005-06-14 Honeywell International Inc. Use of an organic dielectric as a sacrificial layer
JP2003082042A (en) 2001-09-07 2003-03-19 Jsr Corp Radiation-sensitive resin composition for barrier plate formation, barrier plate, and display device
WO2003026360A1 (en) * 2001-09-15 2003-03-27 Cld, Inc. Organic electroluminescence display and fabricating mehtod thereof
EP1446835A2 (en) * 2001-09-24 2004-08-18 Koninklijke Philips Electronics N.V. Assembly for a thin-film optical device, organic electroluminescent display device and method of manufaturing same
JP4239560B2 (en) * 2002-08-02 2009-03-18 セイコーエプソン株式会社 Composition and method for producing organic conductive film using the same
KR100528910B1 (en) * 2003-01-22 2005-11-15 삼성에스디아이 주식회사 Polymer organic light emitting diode
JP4255724B2 (en) * 2003-03-19 2009-04-15 オプトレックス株式会社 Manufacturing method of organic EL display and organic EL display
US6992326B1 (en) * 2004-08-03 2006-01-31 Dupont Displays, Inc. Electronic device and process for forming same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6306559B1 (en) * 1999-01-26 2001-10-23 Mitsubishi Chemical Corporation Organic electroluminescent device comprising a patterned photosensitive composition and a method for producing same
US20040101988A1 (en) * 2000-06-06 2004-05-27 Roman Paul J. Deposition of permanent polymer structures for OLED fabrication

Also Published As

Publication number Publication date
JP2008527635A (en) 2008-07-24
EP1842237A2 (en) 2007-10-10
KR101433944B1 (en) 2014-08-25
EP1842237A4 (en) 2010-10-27
US20060145143A1 (en) 2006-07-06
JP5590772B2 (en) 2014-09-17
WO2006072019A2 (en) 2006-07-06
US7166860B2 (en) 2007-01-23
KR20070094814A (en) 2007-09-21

Similar Documents

Publication Publication Date Title
WO2006072019A3 (en) Electronic device and process for forming same
AU2004210166A8 (en) Microfluidic device with thin-film electronic devices
TW200629618A (en) Electronic devices and processes for forming electronic devices
WO2006104562A3 (en) Method of forming a semiconductor device having asymmetric dielectric regions and structure thereof
TW200627535A (en) Semiconductor wafer, manufacturing method of semiconductor device, and semiconductor device
WO2008016818A3 (en) System and method for manufacturing a thin-film device
WO2008146243A3 (en) An electronic device comprising a convertible structure, and a method of manufacturing an electronic device
TW200644104A (en) Manufacturing method for electronic component, electronic component, and electronic equipment
WO2008120418A1 (en) Semiconductor device, and its manufacturing method
WO2008057671A3 (en) Electronic device including a conductive structure extending through a buried insulating layer
TW200715708A (en) Electronic substrate, manufacturing method for electronic substrate, and electronic device
WO2008051503A3 (en) Light-emitter-based devices with lattice-mismatched semiconductor structures
WO2007124209A3 (en) Stressor integration and method thereof
WO2004086458A3 (en) Electronic device including a self-assembled monolayer, and a method of fabricating the same
WO2006047602A3 (en) Methods of making energy conversion devices with substantially contiguous depletion regions
WO2007076100A3 (en) Microelectronic component with photo-imageable substrate
WO2008063337A3 (en) Semiconductor-on-diamond devices and associated methods
WO2007014116A3 (en) Electronic device including discontinuous storage elements
WO2007079157A3 (en) Electronic device having black layers
WO2011139417A3 (en) Structure and method for manufacturing interconnect structures having self-aligned dielectric caps
TW200723441A (en) Method and circuit for reducing device performance mismatch
WO2008005377A3 (en) Selective spacer formation on transistors of different classes on the same device
TW200802743A (en) High frequency device module and method for manufacturing the same
TW200716262A (en) Method of forming film, patterning and method of manufacturing electronic device using thereof
TW200725909A (en) Display device and manufacturing method

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200580045257.8

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2007549666

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2005857255

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 1020077017390

Country of ref document: KR