WO2006072598A8 - Verfahren und vorrichtung zum testen von halbleiterwafern mittels einer temperierbaren aufspanneinrichtung - Google Patents
Verfahren und vorrichtung zum testen von halbleiterwafern mittels einer temperierbaren aufspanneinrichtungInfo
- Publication number
- WO2006072598A8 WO2006072598A8 PCT/EP2006/000142 EP2006000142W WO2006072598A8 WO 2006072598 A8 WO2006072598 A8 WO 2006072598A8 EP 2006000142 W EP2006000142 W EP 2006000142W WO 2006072598 A8 WO2006072598 A8 WO 2006072598A8
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- output
- temperature
- test
- semiconductor wafer
- regulated
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES06700504T ES2821736T3 (es) | 2005-01-10 | 2006-01-10 | Procedimiento y dispositivo para la realización del test de obleas de semiconductor por medio de un dispositivo de fijación atemperable |
EP06700504.1A EP1844342B1 (de) | 2005-01-10 | 2006-01-10 | Verfahren und vorrichtung zum testen von halbleiterwafern mittels einer temperierbaren aufspanneinrichtung |
CN2006800019567A CN101137911B (zh) | 2005-01-10 | 2006-01-10 | 使用温度可调的卡盘设备来测试半导体晶片的方法和装置 |
KR1020077017504A KR101185536B1 (ko) | 2005-01-10 | 2006-01-10 | 온도가 조절될 수 있는 척 장치를 이용한 반도체 웨이퍼테스트 장치 및 방법 |
JP2007549867A JP4825812B2 (ja) | 2005-01-10 | 2006-01-10 | 温度を調整可能なチャック装置を用いた半導体ウエハ検査方法および装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005001163A DE102005001163B3 (de) | 2005-01-10 | 2005-01-10 | Verfahren und Vorrichtung zum Testen von Halbleiterwafern mittels einer temperierbaren Aufspanneinrichtung |
DE102005001163.2 | 2005-01-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006072598A1 WO2006072598A1 (de) | 2006-07-13 |
WO2006072598A8 true WO2006072598A8 (de) | 2007-09-07 |
Family
ID=36274039
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2006/000142 WO2006072598A1 (de) | 2005-01-10 | 2006-01-10 | Verfahren und vorrichtung zum testen von halbleiterwafern mittels einer temperierbaren aufspanneinrichtung |
Country Status (10)
Country | Link |
---|---|
US (1) | US7271604B2 (de) |
EP (1) | EP1844342B1 (de) |
JP (1) | JP4825812B2 (de) |
KR (1) | KR101185536B1 (de) |
CN (1) | CN101137911B (de) |
DE (1) | DE102005001163B3 (de) |
ES (1) | ES2821736T3 (de) |
RU (1) | RU2407023C2 (de) |
TW (1) | TWI371590B (de) |
WO (1) | WO2006072598A1 (de) |
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CN113075429A (zh) * | 2020-01-03 | 2021-07-06 | 迪科特测试科技(苏州)有限公司 | 探测卡、探测系统及探测方法 |
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CN112345119B (zh) * | 2020-09-25 | 2023-07-21 | 华东光电集成器件研究所 | 一种半导体晶圆温度标定系统 |
US11549981B2 (en) | 2020-10-01 | 2023-01-10 | Advantest Test Solutions, Inc. | Thermal solution for massively parallel testing |
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-
2005
- 2005-01-10 DE DE102005001163A patent/DE102005001163B3/de active Active
- 2005-01-18 US US11/037,870 patent/US7271604B2/en active Active
-
2006
- 2006-01-03 TW TW095100240A patent/TWI371590B/zh active
- 2006-01-10 CN CN2006800019567A patent/CN101137911B/zh active Active
- 2006-01-10 KR KR1020077017504A patent/KR101185536B1/ko active IP Right Grant
- 2006-01-10 JP JP2007549867A patent/JP4825812B2/ja active Active
- 2006-01-10 EP EP06700504.1A patent/EP1844342B1/de active Active
- 2006-01-10 ES ES06700504T patent/ES2821736T3/es active Active
- 2006-01-10 WO PCT/EP2006/000142 patent/WO2006072598A1/de active Application Filing
- 2006-01-10 RU RU2007125378/28A patent/RU2407023C2/ru active
Also Published As
Publication number | Publication date |
---|---|
EP1844342B1 (de) | 2020-07-01 |
KR101185536B1 (ko) | 2012-09-24 |
US7271604B2 (en) | 2007-09-18 |
TW200628818A (en) | 2006-08-16 |
JP4825812B2 (ja) | 2011-11-30 |
CN101137911A (zh) | 2008-03-05 |
RU2007125378A (ru) | 2009-02-20 |
ES2821736T3 (es) | 2021-04-27 |
KR20070110840A (ko) | 2007-11-20 |
WO2006072598A1 (de) | 2006-07-13 |
TWI371590B (en) | 2012-09-01 |
US20060158207A1 (en) | 2006-07-20 |
CN101137911B (zh) | 2011-06-08 |
EP1844342A1 (de) | 2007-10-17 |
DE102005001163B3 (de) | 2006-05-18 |
JP2008527701A (ja) | 2008-07-24 |
RU2407023C2 (ru) | 2010-12-20 |
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