WO2006076210A3 - Systems and methods for producing white-light light emitting diodes - Google Patents

Systems and methods for producing white-light light emitting diodes Download PDF

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Publication number
WO2006076210A3
WO2006076210A3 PCT/US2006/000357 US2006000357W WO2006076210A3 WO 2006076210 A3 WO2006076210 A3 WO 2006076210A3 US 2006000357 W US2006000357 W US 2006000357W WO 2006076210 A3 WO2006076210 A3 WO 2006076210A3
Authority
WO
WIPO (PCT)
Prior art keywords
light
coupled
systems
methods
light emitting
Prior art date
Application number
PCT/US2006/000357
Other languages
French (fr)
Other versions
WO2006076210A2 (en
Inventor
Trung Tri Doan
Chuong Anh Tran
Original Assignee
Semileds Corp
Trung Tri Doan
Chuong Anh Tran
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semileds Corp, Trung Tri Doan, Chuong Anh Tran filed Critical Semileds Corp
Priority to KR1020077015478A priority Critical patent/KR101218247B1/en
Priority to CN2006800021251A priority patent/CN101228640B/en
Priority to JP2007550474A priority patent/JP2008527720A/en
Priority to EP06717541A priority patent/EP1856745A4/en
Publication of WO2006076210A2 publication Critical patent/WO2006076210A2/en
Publication of WO2006076210A3 publication Critical patent/WO2006076210A3/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/505Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • H01L33/0093Wafer bonding; Removal of the growth substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4918Disposition being disposed on at least two different sides of the body, e.g. dual array
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01019Potassium [K]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01021Scandium [Sc]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12041LED
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64Heat extraction or cooling elements
    • H01L33/641Heat extraction or cooling elements characterized by the materials

Abstract

A vertical light emitting diode (LED) includes a metal substrate (70); a p-electrode (72)coupled to the metal substrate; a p-contact (74) coupled to the p-electrode; a p-GaN (76)portion coupled to the p electrode; an active region (78) coupled to the p-GaN portion; an n- GaN portion (82) coupled to the active region; a phospher layer (96) coupled to the n-GaN
PCT/US2006/000357 2005-01-11 2006-01-09 Systems and methods for producing white-light light emitting diodes WO2006076210A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020077015478A KR101218247B1 (en) 2005-01-11 2006-01-09 Systems and methods for producing white-light light emitting diodes
CN2006800021251A CN101228640B (en) 2005-01-11 2006-01-09 Systems and methods for producing white-light light emitting diodes
JP2007550474A JP2008527720A (en) 2005-01-11 2006-01-09 System and method for manufacturing a white light emitting diode
EP06717541A EP1856745A4 (en) 2005-01-11 2006-01-09 Systems and methods for producing white-light light emitting diodes

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/032,853 US7195944B2 (en) 2005-01-11 2005-01-11 Systems and methods for producing white-light emitting diodes
US11/032,853 2005-01-11

Publications (2)

Publication Number Publication Date
WO2006076210A2 WO2006076210A2 (en) 2006-07-20
WO2006076210A3 true WO2006076210A3 (en) 2007-11-22

Family

ID=36678086

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/000357 WO2006076210A2 (en) 2005-01-11 2006-01-09 Systems and methods for producing white-light light emitting diodes

Country Status (7)

Country Link
US (1) US7195944B2 (en)
EP (1) EP1856745A4 (en)
JP (1) JP2008527720A (en)
KR (1) KR101218247B1 (en)
CN (1) CN101228640B (en)
TW (1) TWI382562B (en)
WO (1) WO2006076210A2 (en)

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