WO2006081589A3 - Tungsten electroprocessing - Google Patents

Tungsten electroprocessing Download PDF

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Publication number
WO2006081589A3
WO2006081589A3 PCT/US2006/004873 US2006004873W WO2006081589A3 WO 2006081589 A3 WO2006081589 A3 WO 2006081589A3 US 2006004873 W US2006004873 W US 2006004873W WO 2006081589 A3 WO2006081589 A3 WO 2006081589A3
Authority
WO
WIPO (PCT)
Prior art keywords
tungsten
polishing
increasing
pad
electroprocessing
Prior art date
Application number
PCT/US2006/004873
Other languages
French (fr)
Other versions
WO2006081589A2 (en
Inventor
Renhe Jia
Zhihong Wang
Yuan Tian
Huyen Karen Tran
Daxin Mao
Stan D Tsai
Laksh Karuppiah
Liang-Yuh Chen
Original Assignee
Applied Materials Inc
Renhe Jia
Zhihong Wang
Yuan Tian
Huyen Karen Tran
Daxin Mao
Stan D Tsai
Laksh Karuppiah
Liang-Yuh Chen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc, Renhe Jia, Zhihong Wang, Yuan Tian, Huyen Karen Tran, Daxin Mao, Stan D Tsai, Laksh Karuppiah, Liang-Yuh Chen filed Critical Applied Materials Inc
Publication of WO2006081589A2 publication Critical patent/WO2006081589A2/en
Publication of WO2006081589A3 publication Critical patent/WO2006081589A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H5/00—Combined machining
    • B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
    • B23H5/08—Electrolytic grinding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/08—Etching of refractory metals

Abstract

Methods for polishing tungsten are provided. During ECMP, increasing the voltage to the pad is not always enough to increase the polishing rate. When polishing tungsten, simply increasing the applied voltage will, in some cases, actually decrease the removal rate. By increasing the down force pressure between the polishing pad and the substrate, the applied voltage, and the rotation speed of the substrate and the polishing pad, the tungsten removal rate will also increase.
PCT/US2006/004873 2005-01-28 2006-01-27 Tungsten electroprocessing WO2006081589A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US64794405P 2005-01-28 2005-01-28
US60/647,944 2005-01-28

Publications (2)

Publication Number Publication Date
WO2006081589A2 WO2006081589A2 (en) 2006-08-03
WO2006081589A3 true WO2006081589A3 (en) 2006-11-23

Family

ID=36741163

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/004873 WO2006081589A2 (en) 2005-01-28 2006-01-27 Tungsten electroprocessing

Country Status (3)

Country Link
US (1) US20060196778A1 (en)
TW (1) TW200727356A (en)
WO (1) WO2006081589A2 (en)

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US7879255B2 (en) 2005-11-04 2011-02-01 Applied Materials, Inc. Method and composition for electrochemically polishing a conductive material on a substrate
US20070144915A1 (en) * 2005-12-22 2007-06-28 Applied Materials, Inc. Process and composition for passivating a substrate during electrochemical mechanical polishing
US20090095637A1 (en) * 2007-10-10 2009-04-16 Yasushi Toma Electrochemical polishing method and polishing method
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US20130338227A1 (en) 2012-06-13 2013-12-19 Marie-Esther Saint Victor Green Glycine Betaine Derivative Compounds And Compositions Containing Same
CN112442374A (en) * 2013-07-31 2021-03-05 恩特格里斯公司 Aqueous formulations with Cu/W compatibility for removal of metal hardmask and post-etch residues

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Also Published As

Publication number Publication date
WO2006081589A2 (en) 2006-08-03
US20060196778A1 (en) 2006-09-07
TW200727356A (en) 2007-07-16

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