WO2006094487A3 - Verfahren zum herstellen eines bauelements - Google Patents
Verfahren zum herstellen eines bauelements Download PDFInfo
- Publication number
- WO2006094487A3 WO2006094487A3 PCT/DE2006/000399 DE2006000399W WO2006094487A3 WO 2006094487 A3 WO2006094487 A3 WO 2006094487A3 DE 2006000399 W DE2006000399 W DE 2006000399W WO 2006094487 A3 WO2006094487 A3 WO 2006094487A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- component
- semiconductor layer
- trench
- producing
- cavity
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34333—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer based on Ga(In)N or Ga(In)P, e.g. blue laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/02433—Crystal orientation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02458—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
- H01L21/02639—Preparation of substrate for selective deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
- H01L21/02639—Preparation of substrate for selective deposition
- H01L21/02642—Mask materials other than SiO2 or SiN
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
- H01L21/02647—Lateral overgrowth
- H01L21/0265—Pendeoepitaxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2301/00—Functional characteristics
- H01S2301/17—Semiconductor lasers comprising special layers
- H01S2301/176—Specific passivation layers on surfaces other than the emission facet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2304/00—Special growth methods for semiconductor lasers
- H01S2304/12—Pendeo epitaxial lateral overgrowth [ELOG], e.g. for growing GaN based blue laser diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
- H01S5/0207—Substrates having a special shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
- H01S5/021—Silicon based substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/1003—Waveguide having a modified shape along the axis, e.g. branched, curved, tapered, voids
- H01S5/1017—Waveguide having a void for insertion of materials to change optical properties
Abstract
Die Erfindung bezieht sich auf ein Verfahren zum Herstellen eines elektrischen und/oder optischen Bauelements. Um zu erreichen, dass eine besonders gute Qualität des Bauelements erreicht wird und insbesondere Kristallversetzungen in den Materialschichten des Bauelements zuverlässig vermieden werden, ist erfindungsgemäß ein Verfahren zum Herstellen eines Bauelements (70, 300, 405) vorgesehen, bei dem in ein Substrat (10) zumindest ein Graben (30) geätzt wird, der Graben mit mindestens einer Halbleiterschicht (50) lateral derart überwachsen wird, dass der Graben durch die Halbleiterschicht unter Bildung eines gasgefüllten, insbesondere luftgefüllten Hohlraums (60) vollständig abgedeckt wird und das Bauelement in der Halbleiterschicht oder in einer auf der Halbleiterschicht aufgebrachten weiteren Halbleiterschicht integriert wird, wobei der aktive Bereich des Bauelements oberhalb des Hohlraumes angeordnet wird.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06722565A EP1856720A2 (de) | 2005-03-07 | 2006-03-01 | Verfahren zum herstellen eines bauelements |
US11/851,909 US20080048196A1 (en) | 2005-03-07 | 2007-09-07 | Component and Process for Manufacturing the Same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005010821.0 | 2005-03-07 | ||
DE102005010821A DE102005010821B4 (de) | 2005-03-07 | 2005-03-07 | Verfahren zum Herstellen eines Bauelements |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/851,909 Continuation US20080048196A1 (en) | 2005-03-07 | 2007-09-07 | Component and Process for Manufacturing the Same |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006094487A2 WO2006094487A2 (de) | 2006-09-14 |
WO2006094487A3 true WO2006094487A3 (de) | 2006-12-28 |
Family
ID=36914654
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2006/000399 WO2006094487A2 (de) | 2005-03-07 | 2006-03-01 | Verfahren zum herstellen eines bauelements |
Country Status (4)
Country | Link |
---|---|
US (1) | US20080048196A1 (de) |
EP (1) | EP1856720A2 (de) |
DE (1) | DE102005010821B4 (de) |
WO (1) | WO2006094487A2 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7557002B2 (en) | 2006-08-18 | 2009-07-07 | Micron Technology, Inc. | Methods of forming transistor devices |
US7989322B2 (en) | 2007-02-07 | 2011-08-02 | Micron Technology, Inc. | Methods of forming transistors |
KR101640830B1 (ko) * | 2009-08-17 | 2016-07-22 | 삼성전자주식회사 | 기판 구조체 및 그 제조 방법 |
FR2976120A1 (fr) | 2011-06-01 | 2012-12-07 | St Microelectronics Sa | Procede de fabrication d'un circuit integre comprenant au moins un guide d'ondes coplanaire |
GB201112327D0 (en) | 2011-07-18 | 2011-08-31 | Epigan Nv | Method for growing III-V epitaxial layers |
CN103117294B (zh) | 2013-02-07 | 2015-11-25 | 苏州晶湛半导体有限公司 | 氮化物高压器件及其制造方法 |
US9048091B2 (en) * | 2013-03-25 | 2015-06-02 | Infineon Technologies Austria Ag | Method and substrate for thick III-N epitaxy |
US9018754B2 (en) | 2013-09-30 | 2015-04-28 | International Business Machines Corporation | Heat dissipative electrical isolation/insulation structure for semiconductor devices and method of making |
JP2016100471A (ja) * | 2014-11-21 | 2016-05-30 | 住友電気工業株式会社 | 半導体装置及び半導体装置の製造方法 |
US9793389B1 (en) * | 2016-06-15 | 2017-10-17 | Taiwan Semiconductor Manufacturing Company Limited | Apparatus and method of fabrication for GaN/Si transistors isolation |
DE102017108435A1 (de) * | 2017-04-20 | 2018-10-25 | Osram Opto Semiconductors Gmbh | Halbleiterlaserdiode und Verfahren zur Herstellung einer Halbleiterlaserdiode |
US11749790B2 (en) * | 2017-12-20 | 2023-09-05 | Lumileds Llc | Segmented LED with embedded transistors |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1104031A2 (de) * | 1999-11-15 | 2001-05-30 | Matsushita Electric Industrial Co., Ltd. | Nitrid-Halbleiter, Nitrid-Halbleiterbauelement, lichtemittierendes Halbleiterbauelement und deren Herstellungsverfahren |
US20030111008A1 (en) * | 2000-08-22 | 2003-06-19 | Andre Strittmatter | Method for the epitaxy of (indium, aluminum, gallium) nitride on foreign substrates |
US20040007786A1 (en) * | 2000-09-04 | 2004-01-15 | Chang-Tae Kim | Semiconductor led device and producing method |
US20040021147A1 (en) * | 2002-05-15 | 2004-02-05 | Akihiko Ishibashi | Semiconductor light emitting device and fabrication method thereof |
US20040251519A1 (en) * | 2003-01-14 | 2004-12-16 | Matsushita Electric Industrial Co., Ltd. | Nitride semiconductor device and fabrication method thereof, and method for forming nitride semiconductor substrate |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3352712B2 (ja) * | 1991-12-18 | 2002-12-03 | 浩 天野 | 窒化ガリウム系半導体素子及びその製造方法 |
US7052979B2 (en) * | 2001-02-14 | 2006-05-30 | Toyoda Gosei Co., Ltd. | Production method for semiconductor crystal and semiconductor luminous element |
US7514045B2 (en) * | 2002-01-18 | 2009-04-07 | Avery Dennison Corporation | Covered microchamber structures |
US7115896B2 (en) * | 2002-12-04 | 2006-10-03 | Emcore Corporation | Semiconductor structures for gallium nitride-based devices |
US7009272B2 (en) * | 2002-12-28 | 2006-03-07 | Intel Corporation | PECVD air gap integration |
US7045849B2 (en) * | 2003-05-21 | 2006-05-16 | Sandisk Corporation | Use of voids between elements in semiconductor structures for isolation |
US20060017064A1 (en) * | 2004-07-26 | 2006-01-26 | Saxler Adam W | Nitride-based transistors having laterally grown active region and methods of fabricating same |
-
2005
- 2005-03-07 DE DE102005010821A patent/DE102005010821B4/de not_active Expired - Fee Related
-
2006
- 2006-03-01 WO PCT/DE2006/000399 patent/WO2006094487A2/de not_active Application Discontinuation
- 2006-03-01 EP EP06722565A patent/EP1856720A2/de not_active Withdrawn
-
2007
- 2007-09-07 US US11/851,909 patent/US20080048196A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1104031A2 (de) * | 1999-11-15 | 2001-05-30 | Matsushita Electric Industrial Co., Ltd. | Nitrid-Halbleiter, Nitrid-Halbleiterbauelement, lichtemittierendes Halbleiterbauelement und deren Herstellungsverfahren |
US20030111008A1 (en) * | 2000-08-22 | 2003-06-19 | Andre Strittmatter | Method for the epitaxy of (indium, aluminum, gallium) nitride on foreign substrates |
US20040007786A1 (en) * | 2000-09-04 | 2004-01-15 | Chang-Tae Kim | Semiconductor led device and producing method |
US20040021147A1 (en) * | 2002-05-15 | 2004-02-05 | Akihiko Ishibashi | Semiconductor light emitting device and fabrication method thereof |
US20040251519A1 (en) * | 2003-01-14 | 2004-12-16 | Matsushita Electric Industrial Co., Ltd. | Nitride semiconductor device and fabrication method thereof, and method for forming nitride semiconductor substrate |
Also Published As
Publication number | Publication date |
---|---|
WO2006094487A2 (de) | 2006-09-14 |
DE102005010821A1 (de) | 2006-09-14 |
DE102005010821B4 (de) | 2007-01-25 |
EP1856720A2 (de) | 2007-11-21 |
US20080048196A1 (en) | 2008-02-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2006094487A3 (de) | Verfahren zum herstellen eines bauelements | |
WO2007049939A8 (en) | Semiconductor device and method of fabricating the same | |
WO2009019837A1 (ja) | 炭化珪素半導体素子およびその製造方法 | |
WO2004061911A8 (en) | Semiconductor devices with reduced active region defects and unique contacting schemes | |
WO2003038957A1 (en) | Nitride semiconductor device, its manufacturing method, and semiconductor optical apparatus | |
SG122908A1 (en) | Method for fabricating a germanium on insulator (geoi) type wafer | |
WO2005043614A3 (en) | METHOD FOR FABRICATING SiGe-ON-INSULATOR (SGOI) AND Ge-ON-INSULATOR (GOI) SUBSTRATES | |
TW200625468A (en) | A method for making a semiconductor device having a high-k gate dielectric layer and a metal gate electrode | |
WO2006135505A3 (en) | Capacitorless dram over localized soi | |
WO2008063444A3 (en) | Gallium nitride crystals and wafers | |
WO2009050871A1 (ja) | 半導体装置およびその製造方法 | |
WO2008051503A3 (en) | Light-emitter-based devices with lattice-mismatched semiconductor structures | |
TW200707637A (en) | Method of manufacturing a semiconductor device and semiconductor device obtained by means of said method | |
TW200633149A (en) | Semiconductor die package including universal footprint and method for manufacturing the same | |
WO2006110511A3 (en) | GaN-BASED HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR MAKING THE SAME | |
TW200607047A (en) | Technique for forming a substrate having crystalline semiconductor regions of different characteristics | |
SG150571A1 (en) | Semiconductor heterostructure and method for forming a semiconductor heterostructure | |
WO2007003826A3 (fr) | Procede de realisation de nanostructures | |
TW200603026A (en) | Method for electro-luminescent display fabrication | |
SG144121A1 (en) | Nitride semiconductor substrate and manufacturing method thereof | |
WO2008148882A3 (en) | Method for producing hybrid components | |
WO2007109487A3 (en) | Semiconductor device incorporating fluorine into gate dielectric | |
WO2005055290A3 (en) | Method of fabricating a strained semiconductor-on-insulator substrate | |
EP1638149A2 (de) | Verfahren zur Herstellung eines Feldefekttransistors mit isoliertem Gatter und Heterostruktur-Kanal und entsprechender Transistor | |
TW200710946A (en) | Method for manufacturing semiconductor apparatus and the semiconductor apparatus |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 11851909 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2006722565 Country of ref document: EP |
|
NENP | Non-entry into the national phase |
Ref country code: RU |
|
WWW | Wipo information: withdrawn in national office |
Country of ref document: RU |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWP | Wipo information: published in national office |
Ref document number: 2006722565 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 11851909 Country of ref document: US |