WO2006104886A3 - Resilient probes for electrical testing - Google Patents
Resilient probes for electrical testing Download PDFInfo
- Publication number
- WO2006104886A3 WO2006104886A3 PCT/US2006/010779 US2006010779W WO2006104886A3 WO 2006104886 A3 WO2006104886 A3 WO 2006104886A3 US 2006010779 W US2006010779 W US 2006010779W WO 2006104886 A3 WO2006104886 A3 WO 2006104886A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- holder
- contact pads
- probes
- attached
- sheet
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06744—Microprobes, i.e. having dimensions as IC details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
- G01R1/07321—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support the probes being of different lengths
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
Abstract
An apparatus for electrical testing having probes (201) constructed of metal elements (201a) of about equal size bonded together in substantially linear sequence. Further an insulating holder (202) having first and second surfaces and a plurality of metal-filled vias (210) traversing the holder from the first to the second surface; the vias form contact pads on the first and second surfaces. The contact pads (210a) of the first holder surface have a probe attached so that the probe is positioned about normal to the surface. A sheet (203) of resilient insulating material, which has first and second surfaces and a thickness traversed by a plurality of conducting traces (220), has its first sheet surface attached to the second holder surface so that at least one of the traces contacts one of the contact pads, respectively, to provide an electrical path to the second sheet surface. A printed circuit board, suitable for insertion into an electrical test apparatus, is attached to the second sheet surface so that a continuous electrical path is established from the apparatus to each of the probes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06739525.1A EP2569646A4 (en) | 2005-03-28 | 2006-03-23 | Resilient probes for electrical testing |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US66567605P | 2005-03-28 | 2005-03-28 | |
US60/665,676 | 2005-03-28 | ||
US11/116,884 | 2005-04-27 | ||
US11/116,884 US8438645B2 (en) | 2005-04-27 | 2005-04-27 | Secure clock with grace periods |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006104886A2 WO2006104886A2 (en) | 2006-10-05 |
WO2006104886A3 true WO2006104886A3 (en) | 2007-03-01 |
Family
ID=37053934
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2006/010779 WO2006104886A2 (en) | 2005-03-28 | 2006-03-23 | Resilient probes for electrical testing |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP2569646A4 (en) |
WO (1) | WO2006104886A2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022528123A (en) * | 2019-04-04 | 2022-06-08 | ケーエルエー コーポレイション | How to measure the electrical characteristics of the specimen |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5998228A (en) * | 1993-11-16 | 1999-12-07 | Form Factor, Inc. | Method of testing semiconductor |
US7109731B2 (en) * | 1996-08-08 | 2006-09-19 | Cascade Microtech, Inc. | Membrane probing system with local contact scrub |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08139142A (en) * | 1994-11-09 | 1996-05-31 | Tokyo Electron Ltd | Probe unit |
US6483328B1 (en) * | 1995-11-09 | 2002-11-19 | Formfactor, Inc. | Probe card for probing wafers with raised contact elements |
US5828226A (en) * | 1996-11-06 | 1998-10-27 | Cerprobe Corporation | Probe card assembly for high density integrated circuits |
JPH11160356A (en) * | 1997-11-25 | 1999-06-18 | Matsushita Electric Ind Co Ltd | Probe card for wafer collective measurement and inspection and ceramic multilayer interconnection board as well as their manufacture |
JP3557887B2 (en) * | 1998-01-14 | 2004-08-25 | 日立ハイテク電子エンジニアリング株式会社 | Contact device for IC device |
US6812718B1 (en) * | 1999-05-27 | 2004-11-02 | Nanonexus, Inc. | Massively parallel interface for electronic circuits |
US6970005B2 (en) * | 2000-08-24 | 2005-11-29 | Texas Instruments Incorporated | Multiple-chip probe and universal tester contact assemblage |
US6917102B2 (en) * | 2002-10-10 | 2005-07-12 | Advantest Corp. | Contact structure and production method thereof and probe contact assembly using same |
-
2006
- 2006-03-23 WO PCT/US2006/010779 patent/WO2006104886A2/en active Application Filing
- 2006-03-23 EP EP06739525.1A patent/EP2569646A4/en not_active Ceased
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5998228A (en) * | 1993-11-16 | 1999-12-07 | Form Factor, Inc. | Method of testing semiconductor |
US7109731B2 (en) * | 1996-08-08 | 2006-09-19 | Cascade Microtech, Inc. | Membrane probing system with local contact scrub |
Non-Patent Citations (1)
Title |
---|
See also references of EP2569646A4 * |
Also Published As
Publication number | Publication date |
---|---|
EP2569646A2 (en) | 2013-03-20 |
EP2569646A4 (en) | 2014-01-22 |
WO2006104886A2 (en) | 2006-10-05 |
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