WO2006105782A2 - Method and device for transferring a chip to a contact substrate - Google Patents

Method and device for transferring a chip to a contact substrate Download PDF

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Publication number
WO2006105782A2
WO2006105782A2 PCT/DE2006/000628 DE2006000628W WO2006105782A2 WO 2006105782 A2 WO2006105782 A2 WO 2006105782A2 DE 2006000628 W DE2006000628 W DE 2006000628W WO 2006105782 A2 WO2006105782 A2 WO 2006105782A2
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WO
WIPO (PCT)
Prior art keywords
substrate
chip
contact
transfer
chips
Prior art date
Application number
PCT/DE2006/000628
Other languages
German (de)
French (fr)
Other versions
WO2006105782A3 (en
Inventor
Elke Zakel
Ghassem Azdasht
Original Assignee
Pac Tech-Packaging Technologies Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pac Tech-Packaging Technologies Gmbh filed Critical Pac Tech-Packaging Technologies Gmbh
Priority to EP06742229.5A priority Critical patent/EP1869701B1/en
Priority to JP2008504617A priority patent/JP5964005B2/en
Priority to DE112006001493T priority patent/DE112006001493A5/en
Priority to US11/910,771 priority patent/US9401298B2/en
Priority to KR1020077025897A priority patent/KR101250186B1/en
Priority to CN2006800111703A priority patent/CN101164150B/en
Publication of WO2006105782A2 publication Critical patent/WO2006105782A2/en
Publication of WO2006105782A3 publication Critical patent/WO2006105782A3/en

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Definitions

  • the present invention relates to a method for transferring a chip arranged on a transfer substrate to a contact substrate and contacting the chip with the contact substrate, in which the chip adhesively attached on a contact surface of the transfer substrate facing towards the contact substrate applies laser energy backwards through the transfer substrate and the chip is brought backward through the transfer substrate by means of a pressure device with its one contact surface of the contact substrate oppositely arranged chip contacts in contact with arranged on the contact surface substrate contacts and a thermal connection between the chip contacts and the substrate contacts is made. Furthermore, the invention relates to a device for carrying out the aforementioned method.
  • the contacting of chips on a substrate regularly requires a handling of the chips, such that, before the actual contacting operation is carried out, a positioning of the chip relative to the substrate takes place, which is intended to ensure that the one that is successful Contacting necessary relative orientation of the chip contacts is given to the substrate contacts.
  • This handling of the individual chips requires a correspondingly high expenditure on equipment, often associated with additional process steps for positioning the individual chips, which require correspondingly long process times for carrying out the entire contacting process.
  • the present invention has for its object to provide a method for contacting chips on substrates, which manages with a relatively low handling costs and allows a shortening of the contacting times.
  • the contacting of the chip with a substrate is not based on an immediate handling of the chip, but rather by mechanical and thermal loading of a transfer substrate, so that the orientation of the chip, as a prerequisite for a subsequent contacting process, by the arrangement the chip is defined on the transfer substrate and can avoid immediate handling of the chip having the comparatively smallest dimensions.
  • the backside adhesive attachment of the chip to the transfer substrate allows for parallel backpressure of the chip with pressure and temperature simultaneously with execution of the delivery motion to establish an initial mechanical contact between the chip contacts and the substrate contacts and release the adhesive bond of the chip to the transfer substrate , Simultaneously with the release of the adhesive connection, the medium-term thermal application of the chip makes it possible to heat the chip contacts with the transfer of the heat into the substrate contacts, so that it is possible to produce a thermal connection to the mechanically permanent, electrically conductive connection between the chip contacts and the substrate contacts is.
  • an adhesive application which can be set exactly to the desired release temperature, ie the temperature at which the chip separates from the film, is suitable in a particular manner with regard to the choice of the adhesive material.
  • the adhesive application is designed as a pressure-sensitive adhesive applied to the film, it is particularly easy to apply the chip to the film.
  • an adhesive coating applied to the chip is provided for connecting the chip to the transfer substrate.
  • an adhesive application arranged between the chip and the contact substrate can be used, which is protected by the temperature loading. is curable and is designed to be electrically conductive in the connection region between the chip contacts and the substrate contacts. This is the case, for example, in the case of an anisotropic adhesive which, as a result of pressurization, experiences alignment of electrically conductive adhesive particles in the region of pressure peaks.
  • solder material arranged on the chip contacts and / or the substrate contacts for connecting the chip to the contact substrate, so that a solder connection is produced for the mechanical and electrical connection of the chip to the contact substrate.
  • connections between the chip and the contact substrate are also possible, such that, for example, between the chip contacts and the substrate contacts a solder connection is produced, which serves primarily for the production of the electrical contact, and, moreover, between the chip and the contact substrate Temperaturbeetzschung hardenable adhesive application is provided in the manner of an underfillers.
  • the chips are arranged on the foil in a wafer arrangement formed by the singulation of chips from a wafer composite. This makes it possible to transfer the chips in exactly the same arrangement on the transfer substrate, which is based on a separation of the chips from a wafer, ie by a corresponding sawing of the wafer adjusts.
  • the wafer can be provided with an adhesive application prior to dicing for dicing the chips, so that they are transferred in wafer arrangement to the transfer substrate immediately after dicing in their entirety can, without the individual chips have to be handled individually.
  • wafer arrangement on the transfer substrate it may also be advantageous to choose an arrangement of the chips on the transfer substrate, which corresponds to a contact substrate arrangement, so for example when a single contact substrate with a plurality of chips of the arrangement of the respective chips associated substrate contacts.
  • the device according to the invention has the features of claim 11 and is particularly suitable for carrying out the method according to the invention.
  • the device according to the invention comprises a transfer tool which comprises a laser device and a pressure device and thus both the implementation of the feed movement for the production of the mechanical contact and the thermal loading for the production of the permanent mechanical see and electrical connection between the chip and the contact substrate allows.
  • the transfer tool has a tool body for connecting an optical fiber for transmitting laser energy and provided with a laser transmission means contact mouth, so that both of the above functions, so both the implementation of the delivery movement as well as the application of laser energy, with a particular compact design of the transfer tool are possible.
  • the advantageous embodiment of the contact mouthpiece as a pressure capillary allows a particularly discrete pressurization with simultaneous direct laser application by the capillary bore.
  • a force-transmitting element which deflects under a defined load in particular a spring-supported force transmission element, is arranged between the tool body and the contact mouthpiece.
  • a corresponding plurality of transfer tools is arranged in a transfer head, so that the transfer and contacting can take place either simultaneously or in a defined sequence.
  • the matrix arrangement can be selected in a particularly advantageous manner, for example in accordance with a wafer arrangement of chips.
  • the device for arranging the transfer substrate comprises a receiving device for Arrangement of a separating foil as a transfer substrate with a plurality of chips in wafer arrangement and is provided with a positioning device for positioning the individual chips of the wafer arrangement according to the arrangement of the chips on the contact substrate, it is possible, regardless of the formation of the contact substrates or the distribution of Chips on the contact substrates based on a defined wafer arrangement of the chips to produce any distribution of chips on the contact substrates in the contacting.
  • the device for receiving the transfer substrate comprises a web guide device for guiding a transfer substrate designed as a film web and is provided with a feed device for positioning the individual chips in accordance with the arrangement of the chips on the contact substrate.
  • a web guide device for guiding a transfer substrate designed as a film web and is provided with a feed device for positioning the individual chips in accordance with the arrangement of the chips on the contact substrate.
  • Fig. Ia and Ib a basic representation of the method principle
  • FIG. 2 shows a method variant relating to the implementation of the method based on a transfer substrate designed as a "sawing foil"
  • FIG. Fig. 3 shows a variant of the method for carrying out the
  • Fig. 4 is an enlarged view of the processes in carrying out the method directly in
  • FIG. 6 shows the implementation of the method based on a transfer substrate designed as a "sawing film” with a schematic representation of a transfer head in plan view.
  • a transfer tool 10 comprising a laser device designed as an optical fiber 11, which simultaneously serves as a pressure device 12 in the present case.
  • the optical fiber 1 1 is guided in a channel 14 of a tool body 13.
  • the lower end face of the tool body 13 serves to form a contact substrate receiving means 15, on which by means of vacuum openings 16, a film 17 is held.
  • the film 17 is equipped with a plurality of chips 18, which are adhesively held on the film 17 by means of a not shown here, between a back side 19 of the chip 18 and the film 17 formed adhesive layer.
  • 1 b shows the transfer tool 10 in a position immediately above a contact substrate 20, in a transfer configuration, in which the chip 18 arranged opposite a free contact end 21 of the optical fiber 1 1 bridges one between a contact surface 22 of the chip 18 and a contact surface 23 of the contact substrate 20 formed contact gap 24 to the plant the contact substrate 20 is urged.
  • the serving simultaneously in the present embodiment as a pressure device 12 optical fiber 11 is moved against the back side 19 of the chip 18.
  • the chip 18 is energized with laser energy through the foil 17 which is transparent to laser energy, so that heating takes place of the chip 18 is the result.
  • the adhesive forces acting in the adhesive layer between the back side 19 of the chip 18 and the film 17 are reduced and the adhesive forces of a temperature-curable adhesive material placed between the contact surfaces 22 and 23 are activated. This results in a permanent mechanical connection between the chip 18 and the contact substrate 20 while simultaneously releasing the connection between the film 17 and the back side 19 of the chip 18.
  • FIG. 2 and 3 show two possible variants of the method or devices which can be used in this process, wherein in FIG. 2 a method variant based on a separating foil 25 formed by a "sawing foil", which serves as a transfer substrate, is carried out by means of a first transfer device 87 3 shows a method variant in which the method is carried out by means of a second transfer device 88 based on a transfer substrate designed as a film web 26.
  • FIG. 2 In order to simplify the illustration, only one transfer tool 27 is shown in FIG. 2, which acts on the separating film 25 at the rear.
  • a front side 28 of the separating film 25 On a front side 28 of the separating film 25 is a plurality of chips 18 in so-called wafer assembly 29, ie the chips 18 are located exactly in the relative arrangement, which adjusts as a result of a singulation process for producing individual chips 18 from a wafer.
  • a circumferential support frame 31 which is provided at defined intervals with vacuum openings 16 which allow holding the film 25 in the position shown in Fig. 2.
  • a contact gap 32 Below the wafer 18 arranged on the separating film 25 chips 18 is spaced by a contact gap 32, a contact substrate 33 which is disposed on a contact substrate receiving means 34.
  • the transfer substrate is not formed as a separating film 25 but as a film web 26, which is moved over a web guide device 36 past a film web system 37.
  • the arrangement of chips 18 on the film web 26 can take place in such a way that the entire wafer surface of the wafer is provided with an adhesive application prior to singulation. After separation has taken place, the chips 18 disposed in wafer arrangement 29 can then be applied to the film web 26 by means of the adhesive application arranged on their rear side 19.
  • the web guiding device 36 For transporting the film web 26, the web guiding device 36 has a film web supply reel 38, a film web take-up reel 39 and two deflecting rollers 40, 41, which allow the film web 26 to be guided parallel to the film web installation device 37.
  • the Folienbahnstromein- device 37 includes a plurality of vacuum openings not shown here, which is an investment of the film web 26 for setting a defined contact gap 35 between the film web 26 and a
  • the contact substrate web installation device 43 is likewise provided with a multiplicity of vacuum openings 16 which serve for the defined contact of the contact substrate web 42 with the contact substrate web installation device 43.
  • a transfer head 44 comprising a plurality of transfer tools 45, 46, which are received via a head rail 51, in the tool housing 47 of the transfer tools 45, 46 are defined, arranged in a composite arrangement for forming the transfer head 44 , In the
  • Tool bodies 47 of the transfer tools 45, 46 each receive a longitudinally guided feed element 48, which in each case protrudes into feed recesses 49 of the film web installation device 37.
  • FIG. 4 shows a transfer tool 45, 46 during the execution of the feed movement in the direction of a contact substrate 50 arranged on the contact substrate web 42.
  • the feed movement is carried out by the movement of the tool body 47 of the transfer tool 45, 46.
  • the feed element 48 guided longitudinally displaceably in the tool body 47 is supported on the tool body via a spring device 54 arranged in the tool body 47. off at 47.
  • the contact substrate 50 is provided with an anisotropic adhesive material 61 in the region of its contact surface 58 having two substrate contacts 56, 57, in which pressure contacts are formed between chip contacts 59, 60 and the substrate contacts 56 , 57 train senior contact bridges.
  • the adhesive material 61 is cured with permanent fixation of the abovementioned contact bridges.
  • the adhesive bond formed by the adhesive layer 55 between the back 19 of the chip 18 and the film web 26 has been released, so that after a return movement of the transfer tool 45, 46 in the direction of the arrow 89, the contact between the chip 18 and the contact substrate 50 is maintained and an advancing movement of the film web 26 and the contact substrate web 42 for carrying out a subsequent transmission and contacting operation can take place.
  • FIG. 5 shows a plurality of transfer tools 62 to 67, which are combined to form a series arrangement 69 by means of a common headrail 68.
  • the individual transfer tools 62 to 67 correspond in their construction and in their function to the transfer tools 45, 46 already explained above with reference to FIGS. 3 and 4.
  • a total of six transfer tools 62 to 67 are combined to form the row arrangement 69.
  • adjusting devices 76 are provided, both the relative orientation of the longitudinal axes of the transfer tools 62 to 67 with each other and a uniform height adjustment of the transfer tools 62 to 67 for Forming a uniform distance a between a contact tip 92 of the transfer tools 62 to 67 and a reference surface F allow.
  • the separating film 25 consists of a so-called "sawing film.”
  • the separating film 25 is one and the same film used to produce a plurality of individual chips by sawing a wafer
  • the singulated chips are located in a so-called wafer arrangement on the sawing foil.
  • Separation film 25 to use as a transfer substrate for performing the method.
  • a transfer head 78 is used for the simultaneous transfer of the plurality of chips in wafer arrangement, which is indicated in Fig. 6 only by schematic representation of the individual optical fibers 11, which are assigned to the transfer tools arranged in series arrangements 69 to 74.
  • contact substrate web 79 On the contact substrate arrangements 80 with a plurality of contact substrates (not further illustrated here) are arranged, which may correspond with respect to the arrangement of their substrate contacts of the wafer arrangement of the chips predetermined arrangement of the chip contacts or may deviate therefrom.
  • the contact substrate arrangements 80 can be moved by means of suitable transport devices 81, 82 by advancing the contact substrate web 79 in the feed direction 77 under the wafer arrangement on the singling film 25.
  • the entire wafer arrangement of chips in a transfer and contacting can be transferred to the contact substrates of the contact substrate assembly 80, analogous to the representation in Fig. 4.
  • the substrate contacts of the contact substrate assembly and the chip contacts of Chips arranged in a wafer arrangement can also be used to transfer and contact the chips individually or in groups, with the appropriate relative positioning of the chips to the contact substrates being able to take place via a corresponding control device 83 with axes of movement 84 and 85.
  • the control device 83 can be controlled by means of camera devices 86 combined with an image processing device.
  • a thermally activatable adhesive application between the chip and the contact substrate can be provided in the exemplary embodiment illustrated in FIG. 6, as already explained with reference to FIG. 4.
  • a material which contains activated carbon fibers to produce the conductivity is used as the adhesive material.
  • the implementation of a LötWallet ist done, for example, a Lötmaterial Huawei can be provided on the chip contacts and / or the contact substrate contacts. It is also possible to provide the chip contacts with a contact metallization, which consists of a current-deposited nickel-gold coating.

Abstract

The invention relates to a method and device for transferring a chip (18), which is arranged on a transfer substrate (26), to a contact substrate (50) and for contacting the chip to the contact substrate, during which the chip, which is adhesively attached via its rear side (19) to a holding surface of the transfer substrate, said holding surface facing the contact substrate. The rear side of the chip is subjected to the action of laser energy passing through the transfer substrate, and a pressing device (45, 46) acting upon the rear of the chip and through the transfer substrate brings the chip, via its chip contacts (59, 60) located opposite a contact surface (58) of the contact substrate, into contact with substrate contacts (56, 57) located on the contact surface, and a thermal connection is established between the chip contacts and the substrate contacts.

Description

Verfahren und Vorrichtung zur Übertragung eines Chips auf ein KontaktsubstratMethod and device for transferring a chip to a contact substrate
Die vorliegende Erfindung betrifft ein Verfahren zur Übertragung eines auf einem Transfersubstrat angeordneten Chips auf ein Kontaktsubstrat und Kontaktierung des Chips mit dem Kontaktsubstrat, bei dem der auf einer dem Kontaktsubstrat zugewandten Aufnahmefläche des Transfersubstrats mit seiner Rückseite adhäsiv befestigte Chip rückwärtig durch das Transfersubstrat hindurch mit Laserenergie beaufschlagt wird und der Chip rückwärtig durch das Transfersubstrat hindurch mittels einer Andruckeinrichtung mit seinen einer Kontaktfläche des Kontaktsubstrats gegenüberliegend angeordneten Chipkontakten in Kontakt mit auf der Kontaktfläche angeordneten Substratkontakten gebracht wird und eine thermische Verbindung zwischen den Chipkontakten und den Substratkontakten hergestellt wird. Des weiteren betrifft die Erfindung eine Vorrichtung zur Durchführung des vorgenannten Verfahrens.The present invention relates to a method for transferring a chip arranged on a transfer substrate to a contact substrate and contacting the chip with the contact substrate, in which the chip adhesively attached on a contact surface of the transfer substrate facing towards the contact substrate applies laser energy backwards through the transfer substrate and the chip is brought backward through the transfer substrate by means of a pressure device with its one contact surface of the contact substrate oppositely arranged chip contacts in contact with arranged on the contact surface substrate contacts and a thermal connection between the chip contacts and the substrate contacts is made. Furthermore, the invention relates to a device for carrying out the aforementioned method.
Die Kontaktierung von Chips auf einem Substrat erfordert regelmäßig eine Handhabung der Chips, derart, dass vor Durchführung des eigentli- chen Kontaktierungsvorgangs eine Positionierung des Chips gegenüber dem Substrat erfolgt, die sicherstellen soll, dass die für die erfolgreiche Kontaktierung notwendige Relativausrichtung der Chipkontakte gegenüber den Substratkontakten gegeben ist. Diese Handhabung der einzelnen Chips erfordert einen entsprechend hohen apparativen Aufwand, oftmals verbunden mit zusätzlichen Verfahrensschritten zur Positionierung der einzelnen Chips, die entsprechend lange Prozesszeiten für die Durchführung des gesamten Kontaktierungsverfahrens bedingen.The contacting of chips on a substrate regularly requires a handling of the chips, such that, before the actual contacting operation is carried out, a positioning of the chip relative to the substrate takes place, which is intended to ensure that the one that is successful Contacting necessary relative orientation of the chip contacts is given to the substrate contacts. This handling of the individual chips requires a correspondingly high expenditure on equipment, often associated with additional process steps for positioning the individual chips, which require correspondingly long process times for carrying out the entire contacting process.
Der vorliegenden Erfindung liegt die Aufgabe zugrunde, ein Verfahren zur Kontaktierung von Chips auf Substraten vorzuschlagen, das mit einem vergleichsweise geringen Handhabungsaufwand auskommt und eine Verkürzung der Kontaktierungszeiten ermöglicht.The present invention has for its object to provide a method for contacting chips on substrates, which manages with a relatively low handling costs and allows a shortening of the contacting times.
Diese Aufgabe wird durch ein Verfahren mit den Merkmalen des Anspruchs 1 bzw. durch eine Vorrichtung mit den Merkmalen des Anspruchs 1 1 gelöst.This object is achieved by a method having the features of claim 1 and by a device having the features of claim 11.
Bei dem erfindungsgemäßen Verfahren erfolgt die Kontaktierung des Chips mit einem Substrat nicht basierend auf einer unmittelbaren Handhabung des Chips, sondern vielmehr durch mechanische und thermische Beaufschlagung eines Transfersubstrats, so dass die Ausrichtung des Chips, als Voraussetzung für einen nachfolgenden Kontaktierungsvor- gang, durch die Anordnung des Chips auf dem Transfersubstrat definiert ist und eine unmittelbare Handhabung des vergleichsweise geringste Abmessungen aufweisenden Chips unterbleiben kann.In the method according to the invention the contacting of the chip with a substrate is not based on an immediate handling of the chip, but rather by mechanical and thermal loading of a transfer substrate, so that the orientation of the chip, as a prerequisite for a subsequent contacting process, by the arrangement the chip is defined on the transfer substrate and can avoid immediate handling of the chip having the comparatively smallest dimensions.
Als besonders vorteilhaft erweist es sich bei der Durchführung des erfindungsgemäßen Verfahrens, wenn als Transfersubstrat eine Folie verwendet wird, die aufgrund der bei Folien stets sehr geringen Dicke etwa einerseits einen Träger zur definierten Anordnung des Chips bildet, andererseits j edoch einen möglichst geringen mechanischen und thermischen Widerstand darstellt, so dass bereits durch eine geringe Druckbeaufschlagung die für die Kontaktierung erforderliche Zustellbewegung des Chips ausführbar ist und eine schnelle Erwärmung des Chips zur Durchführung der thermischen Verbindung zwischen den Chipkontakten und den Substratkontakten möglich ist.It proves to be particularly advantageous in the implementation of the method according to the invention when a film is used as the transfer substrate, which always forms on the one hand a support for the defined arrangement of the chip due to the film thickness is always very small, on the other hand, however, the lowest possible mechanical and thermal Represents resistance, so that even by a small pressurization required for the contacting feed motion of the chip is executable and rapid heating of the chip to Carrying out the thermal connection between the chip contacts and the substrate contacts is possible.
Die rückwärtige adhäsive Befestigung des Chips am Transfersubstrat ermöglicht, dass eine parallele rückwärtige Beaufschlagung des Chips mit Druck und Temperatur gleichzeitig mit Ausführung der Zustellbewegung zur Herstellung eines zunächst mechanischen Kontakts zwischen den Chipkontakten und den Substratkontakten und ein Lösen der adhäsiven Verbindung des Chips mit dem Transfersubstrat erfolgt. Gleichzeitig mit dem Lösen der adhäsiven Verbindung ermöglicht durch die mittelba- re thermische Beaufschlagung des Chips eine Erwärmung der Chipkontakte mit Überleitung der Wärme in die Substratkontakte, so dass die Herstellung einer thermischen Verbindung zur mechanisch dauerhaften, elektrisch leitfähigen Verbindung zwischen den Chipkontakten und den Substratkontakten möglich ist.The backside adhesive attachment of the chip to the transfer substrate allows for parallel backpressure of the chip with pressure and temperature simultaneously with execution of the delivery motion to establish an initial mechanical contact between the chip contacts and the substrate contacts and release the adhesive bond of the chip to the transfer substrate , Simultaneously with the release of the adhesive connection, the medium-term thermal application of the chip makes it possible to heat the chip contacts with the transfer of the heat into the substrate contacts, so that it is possible to produce a thermal connection to the mechanically permanent, electrically conductive connection between the chip contacts and the substrate contacts is.
Zur adhäsiven Befestigung des Chips auf dem als Folie ausgeführten Transfersubstrat eignet sich in besonderer Weise ein Kleberauftrag, der sich hinsichtlich der Wahl des Klebermaterials exakt auf die gewünschte Ablösetemperatur, also die Temperatur, bei der sich der Chip von der Folie ablöst, einstellen lässt.For adhesive attachment of the chip to the transfer substrate designed as a film, an adhesive application which can be set exactly to the desired release temperature, ie the temperature at which the chip separates from the film, is suitable in a particular manner with regard to the choice of the adhesive material.
Wenn der Kleberauftrag als ein auf die Folie aufgebrachter Haftkleberauftrag ausgebildet ist, ist eine Applikation des Chips auf die Folie besonders einfach möglich.If the adhesive application is designed as a pressure-sensitive adhesive applied to the film, it is particularly easy to apply the chip to the film.
Alternativ ist es j edoch auch möglich, dass zur Verbindung des Chips mit dem Transfersubstrat ein auf dem Chip aufgebrachter Kleberauftrag vorgesehen ist.Alternatively, it is also possible, however, that an adhesive coating applied to the chip is provided for connecting the chip to the transfer substrate.
Zur Verbindung des Chips mit dem Kontaktsubstrat, also zur sowohl mechanischen als auch elektrischen Kontaktierung des Chips auf dem Kontaktsubstrat, kann ein zwischen dem Chip und dem Kontaktsubstrat angeordneter Kleberauftrag dienen, der durch die Temperaturbeaufschla- gung aushärtbar ist und im Verbindungsbereich zwischen den Chipkontakten und den Substratkontakten elektrisch leitfähig ausgestaltet ist. Dies ist beispielsweise bei einem anisotropen Kleber der Fall, der in Folge einer Druckbeaufschlagung eine Ausrichtung von elektrisch leitfähigen Kleberpartikeln im Bereich von Druckspitzen erfährt.In order to connect the chip to the contact substrate, that is to say for both mechanical and electrical contacting of the chip on the contact substrate, an adhesive application arranged between the chip and the contact substrate can be used, which is protected by the temperature loading. is curable and is designed to be electrically conductive in the connection region between the chip contacts and the substrate contacts. This is the case, for example, in the case of an anisotropic adhesive which, as a result of pressurization, experiences alignment of electrically conductive adhesive particles in the region of pressure peaks.
Alternativ ist es auch möglich, zur Verbindung des Chips mit dem Kontaktsubstrat ein auf den Chipkontakten und/oder den Substratkontakten angeordnetes Lotmaterial zu verwenden, so dass zur mechanischen und elektrischen Verbindung des Chips mit dem Kontaktsubstrat eine Lotverbindung hergestellt wird.Alternatively, it is also possible to use a solder material arranged on the chip contacts and / or the substrate contacts for connecting the chip to the contact substrate, so that a solder connection is produced for the mechanical and electrical connection of the chip to the contact substrate.
Darüber hinaus sind auch Verbindungen zwischen dem Chip und dem Kontaktsubstrat möglich, derart, dass beispielsweise zwischen den Chipkontakten und den Substratkontakten eine Lotverbindung hergestellt wird, die in erster Linie zur Herstellung des elektrischen Kontakts dient, und im Übrigen zwischen dem Chip und dem Kontaktsubstrat ein unter Temperaturbeaufschlagung aushärtbarer Kleberauftrag nach Art eines Underfillers vorgesehen ist.In addition, connections between the chip and the contact substrate are also possible, such that, for example, between the chip contacts and the substrate contacts a solder connection is produced, which serves primarily for the production of the electrical contact, and, moreover, between the chip and the contact substrate Temperaturbeaufschlagung hardenable adhesive application is provided in the manner of an underfillers.
Die Vorteile des erfindungsgemäßen Verfahrens werden besonders offenbar, wenn gleichzeitig eine Mehrzahl auf einer gemeinsamen Folie angeordneter Chips auf ein Kontaktsubstrat oder eine Mehrzahl von Kontaktsubstraten übertragen und mit diesem bzw. diesen kontaktiert wird. Damit ist es möglich, vermittels einer einfachen Zustellbewegung, überlagert mit einer Temperaturbeaufschlagung, eine Vielzahl von Kontaktierungsvorgängen zwischen Chip und Kontaktsubstraten herzu- stellen, so dass das Verfahren in kürzester Zeit die Herstellung großer Stückzahlen von Bauteilgruppen, umfassend einen Chip und ein Kontaktsubstrat, ermöglicht. Zu derartigen Bauteilgruppen sind auch sogenannte „Transponder" zu zählen, die aus einem Chip bestehen, der auf einem Kontaktsubstrat angeordnet ist, dessen Substratkontakte die Enden einer Antenneneinrichtung bilden. Eine weitere besonders vorteilhafte Variante des erfindungsgemäßen Verfahrens wird möglich, wenn die Chips in einer durch die Vereinzelung von Chips aus einem Waferverbund gebildeten Waferanordnung auf der Folie angeordnet sind. Hierdurch ist es möglich, die Chips in genau der Anordnung auf das Transfersubstrat zu übertragen, die sich basierend auf einer Vereinzelung der Chips aus einem Wafer, also durch ein entsprechendes Zersägen des Wafers, einstellt.The advantages of the method according to the invention become particularly apparent when simultaneously a plurality of chips arranged on a common foil is transferred to and contacted with a contact substrate or a plurality of contact substrates. This makes it possible, by means of a simple feed movement, superposed with a temperature application, to produce a multiplicity of contacting processes between chip and contact substrates, so that the method enables the production of large numbers of component groups, comprising a chip and a contact substrate, in the shortest possible time. Such component groups also include so-called "transponders" which consist of a chip which is arranged on a contact substrate whose substrate contacts form the ends of an antenna device. Another particularly advantageous variant of the method according to the invention is possible if the chips are arranged on the foil in a wafer arrangement formed by the singulation of chips from a wafer composite. This makes it possible to transfer the chips in exactly the same arrangement on the transfer substrate, which is based on a separation of the chips from a wafer, ie by a corresponding sawing of the wafer adjusts.
Um die Übertragung in Waferanordnung auf das Transfersubstrat in besonders einfacher Art und Weise zu ermöglichen, kann der Wafer vor dem Zersägen zur Vereinzelung der Chips mit einem Kleberauftrag versehen werden, so dass diese unmittelbar nach dem Zersägen in ihrer Gesamtheit in Waferanordnung auf das Transfersubstrat übertragen werden können, ohne dass die vereinzelten Chips hierzu einzeln gehandhabt werden müssten.In order to facilitate the transfer in wafer arrangement on the transfer substrate in a particularly simple manner, the wafer can be provided with an adhesive application prior to dicing for dicing the chips, so that they are transferred in wafer arrangement to the transfer substrate immediately after dicing in their entirety can, without the individual chips have to be handled individually.
Abweichend von der vorstehend erläuterten, l : l -Üb ertragung einerBy way of derogation from the above-described, l: l -transmission of a
Waferanordnung auf das Transfersubstrat kann es jedoch auch vorteilhaft sein, eine Anordnung der Chips auf dem Transfersubstrat zu wählen, die einer Kontaktsubstratanordnung entspricht, also beispielsweise bei einer Bestückung eines einzelnen Kontaktsubstrats mit einer Mehrzahl von Chips der Anordnung der den jeweiligen Chips zugeordneten Substratkontakten. Bei einer derartigen Verfahrensvariante ist es möglich, die Kontaktierung der Gesamtheit der Chips für ein Kontaktsubstrat in einem Kontaktierungs Vorgang durchzuführen.However, wafer arrangement on the transfer substrate, it may also be advantageous to choose an arrangement of the chips on the transfer substrate, which corresponds to a contact substrate arrangement, so for example when a single contact substrate with a plurality of chips of the arrangement of the respective chips associated substrate contacts. In such a variant of the method, it is possible to carry out the contacting of the entirety of the chips for a contact substrate in a contacting process.
Die erfindungsgemäße Vorrichtung weist die Merkmale des Anspruchs 11 auf und ist in besonderer Weise zur Durchführung des erfindungsgemäßen Verfahrens geeignet. Die erfindungsgemäße Vorrichtung umfasst insbesondere ein Transferwerkzeug, das eine Lasereinrichtung und eine Andruckeinrichtung umfasst und somit sowohl die Durchführung der Zustellbewegung zur Herstellung des mechanischen Kontakts als auch die thermische Beaufschlagung zur Herstellung der dauerhaften mechani- sehen und elektrischen Verbindung zwischen dem Chip und dem Kontaktsubstrat ermöglicht.The device according to the invention has the features of claim 11 and is particularly suitable for carrying out the method according to the invention. In particular, the device according to the invention comprises a transfer tool which comprises a laser device and a pressure device and thus both the implementation of the feed movement for the production of the mechanical contact and the thermal loading for the production of the permanent mechanical see and electrical connection between the chip and the contact substrate allows.
In einer besonders vorteilhaften Ausführungsform weist das Transferwerkzeug einen Werkzeugkörper zum Anschluss einer Lichtleitfaser zur Übertragung von Laserenergie und ein mit einer Laserübertragungseinrichtung versehenes Kontaktmundstück auf, so dass beide der vorgenannten Funktionen, also sowohl die Durchführung der Zustellbewegung als auch die Beaufschlagung mit Laserenergie, mit einer besonders kompakten Ausführung des Transferwerkzeugs möglich sind.In a particularly advantageous embodiment, the transfer tool has a tool body for connecting an optical fiber for transmitting laser energy and provided with a laser transmission means contact mouth, so that both of the above functions, so both the implementation of the delivery movement as well as the application of laser energy, with a particular compact design of the transfer tool are possible.
Die vorteilhafte Ausbildung des Kontaktmundstücks als Druckkapillare ermöglicht eine besonders diskrete Druckbeaufschlagung bei gleichzeitig durch die Kapillarenbohrung erfolgender unmittelbarer Laserbeaufschlagung.The advantageous embodiment of the contact mouthpiece as a pressure capillary allows a particularly discrete pressurization with simultaneous direct laser application by the capillary bore.
Um zu verhindern, dass es bei einem Auftreffen des Kontaktmundstücks auf das Transfersubstrat zu Druckspitzen kommt, ist es vorteilhaft, wenn zwischen dem Werkzeugkörper und dem Kontaktmundstück ein unter definierter Belastung ausweichendes, insbesondere federgestütztes Kraftübertragungselement angeordnet ist.In order to prevent pressure peaks occurring when the contact mouthpiece strikes the transfer substrate, it is advantageous if a force-transmitting element which deflects under a defined load, in particular a spring-supported force transmission element, is arranged between the tool body and the contact mouthpiece.
Zur Übertragung und Kontaktierung einer Mehrzahl von Chips ist es besonders vorteilhaft, wenn eine entsprechende Mehrzahl von Transferwerkzeugen in einem Transferkopf angeordnet ist, so dass die Übertragung und Kontaktierung wahlweise simultan oder in definierter Reihenfolge erfolgen kann.For the transmission and contacting of a plurality of chips, it is particularly advantageous if a corresponding plurality of transfer tools is arranged in a transfer head, so that the transfer and contacting can take place either simultaneously or in a defined sequence.
Wenn die Transferwerkzeuge darüber hinaus in einer Matrixanordnung in dem Transferkopf angeordnet sind, kann die Matrixanordnung in besonders vorteilhafter Weise beispielsweise in Übereinstimmung mit einer Waferanordnung von Chips gewählt werden.Moreover, if the transfer tools are arranged in a matrix arrangement in the transfer head, the matrix arrangement can be selected in a particularly advantageous manner, for example in accordance with a wafer arrangement of chips.
Wenn gemäß einer weiteren bevorzugten Ausführungsform die Einrichtung zur Anordnung des Transfersubstrats eine Aufnahmeeinrichtung zur Anordnung einer Vereinzelungsfolie als Transfersubstrat mit einer Mehrzahl von Chips in Waferanordnung umfasst und mit einer Positionierungseinrichtung zur Positionierung der einzelnen Chips der Waferanordnung entsprechend der Anordnung der Chips auf dem Kontaktsubstrat versehen ist, ist es möglich, unabhängig von der Ausbildung der Kontaktsubstrate bzw. der Verteilung der Chips auf den Kontaktsubstraten basierend auf einer definierten Waferanordnung der Chips eine beliebige Verteilung von Chips auf den Kontaktsubstraten bei der Kontaktierung herzustellen.If, according to a further preferred embodiment, the device for arranging the transfer substrate comprises a receiving device for Arrangement of a separating foil as a transfer substrate with a plurality of chips in wafer arrangement and is provided with a positioning device for positioning the individual chips of the wafer arrangement according to the arrangement of the chips on the contact substrate, it is possible, regardless of the formation of the contact substrates or the distribution of Chips on the contact substrates based on a defined wafer arrangement of the chips to produce any distribution of chips on the contact substrates in the contacting.
Auch kann es vorteilhaft sein, wenn die Einrichtung zur Aufnahme des Transfersubstrats eine Bahnführungseinrichtung zur Führung eines als Folienbahn ausgebildeten Transfersubstrats umfasst und mit einer Vorschubeinrichtung zur Positionierung der einzelnen Chips entsprechend der Anordnung der Chips auf dem Kontaktsubstrat versehen ist. Somit ist es möglich, auf dem als Folienbahn ausgeführten Transfersubstrat eine Anordnung der Chips entsprechend der Verteilung der Chips auf dem bzw. den Kontaktsubstrat(en) zu wählen und basierend darauf die Kontaktierung einer Mehrzahl von Chips gleichzeitig auszuführen.It can also be advantageous if the device for receiving the transfer substrate comprises a web guide device for guiding a transfer substrate designed as a film web and is provided with a feed device for positioning the individual chips in accordance with the arrangement of the chips on the contact substrate. Thus, it is possible to select on the transfer substrate embodied as a film web an arrangement of the chips corresponding to the distribution of the chips on the contact substrate (s) and, based thereon, to carry out the contacting of a plurality of chips simultaneously.
Nachfolgend werden bevorzugte Varianten des erfindungsgemäßen Verfahrens sowie Ausführungsformen erfindungsgemäßer Vorrichtungen zur Durchführung des Verfahrens anhand der Zeichnung näher erläutert. Es zeigen:In the following, preferred variants of the method according to the invention and embodiments of devices according to the invention for carrying out the method will be explained in more detail with reference to the drawing. Show it:
Fig. I a und Ib eine grundsätzliche Darstellung des Verfahrensprinzips;Fig. Ia and Ib a basic representation of the method principle;
Fig. 2 eine Verfahrensvariante betreffend die Durchführung des Verfahrens basierend auf einem als „Sägefolie" ausgeführten Transfersubstrat; Fig. 3 eine Verfahrensvariante zur Durchführung desFIG. 2 shows a method variant relating to the implementation of the method based on a transfer substrate designed as a "sawing foil"; FIG. Fig. 3 shows a variant of the method for carrying out the
Verfahrens basierend auf einem als Folienbahn ausgeführten Transfersubstrat;Method based on a designed as a film web transfer substrate;
Fig. 4 eine vergrößerte Darstellung der Vorgänge bei Durchführung des Verfahrens unmittelbar imFig. 4 is an enlarged view of the processes in carrying out the method directly in
Übertragungsbereich eines Chips;Transmission area of a chip;
Fig. 5 eine Reihenanordnung einer Mehrzahl von Transferwerkzeugen;5 shows a series arrangement of a plurality of transfer tools;
Fig. 6 die Durchführung des Verfahrens basierend auf einem als „Sägefolie" ausgeführten Transfersubstrat mit schematischer Darstellung eines Transferkopfs in Draufsicht.6 shows the implementation of the method based on a transfer substrate designed as a "sawing film" with a schematic representation of a transfer head in plan view.
In den Fig. Ia und Ib ist in einer besonders einfachen Aus führungs form ein Transferwerkzeug 10 dargestellt, umfassend eine als Lichtleitfaser 11 ausgebildete Lasereinrichtung, die im vorliegenden Fall gleichzeitig als Andruckeinrichtung 12 dient. Die Lichtleitfaser 1 1 ist in einem Kanal 14 eines Werkzeugkörpers 13 geführt. Die untere Stirnfläche des Werkzeugkörpers 13 dient zur Ausbildung einer Kontaktsubstrataufnahmeeinrichtung 15, an der vermittels Vakuum Öffnungen 16 eine Folie 17 gehalten wird. Die Folie 17 ist mit einer Mehrzahl von Chips 18 bestückt, die vermittels einer hier nicht näher dargestellten, zwischen einer Rückseite 19 der Chips 18 und der Folie 17 ausgebildeten Kleberschicht adhäsiv an der Folie 17 gehalten werden.In FIGS. 1 a and 1 b, in a particularly simple embodiment, a transfer tool 10 is shown, comprising a laser device designed as an optical fiber 11, which simultaneously serves as a pressure device 12 in the present case. The optical fiber 1 1 is guided in a channel 14 of a tool body 13. The lower end face of the tool body 13 serves to form a contact substrate receiving means 15, on which by means of vacuum openings 16, a film 17 is held. The film 17 is equipped with a plurality of chips 18, which are adhesively held on the film 17 by means of a not shown here, between a back side 19 of the chip 18 and the film 17 formed adhesive layer.
Fig. Ib zeigt das Transferwerkzeug 10 in einer Positionierung unmittel- bar oberhalb eines Kontaktsubstrats 20, in einer Übertragungskonfiguration, in der der gegenüberliegend einem freien Kontaktende 21 der Lichtleitfaser 1 1 angeordnete Chip 18 zur Überbrückung eines zwischen einer Kontaktoberfläche 22 des Chips 18 und einer Kontaktoberfläche 23 des Kontaktsubstrats 20 ausgebildeten Kontaktspaltes 24 zur Anlage an das Kontaktsubstrat 20 gedrängt wird. Hierzu wird die in dem vorliegenden Ausführungsbeispiel gleichzeitig als Andruckeinrichtung 12 dienende Lichtleitfaser 11 gegen die Rückseite 19 des Chips 18 bewegt.1 b shows the transfer tool 10 in a position immediately above a contact substrate 20, in a transfer configuration, in which the chip 18 arranged opposite a free contact end 21 of the optical fiber 1 1 bridges one between a contact surface 22 of the chip 18 and a contact surface 23 of the contact substrate 20 formed contact gap 24 to the plant the contact substrate 20 is urged. For this purpose, the serving simultaneously in the present embodiment as a pressure device 12 optical fiber 11 is moved against the back side 19 of the chip 18.
Vorzugsweise gleichzeitig mit Ausführung der vorgenannten Zustellbe- wegung, spätestens j edoch nach Anlage der Kontaktoberfläche 22 des Chips 18 gegen die Kontaktoberfläche 23 des Kontaktsubstrats 20 erfolgt eine rückwärtige Beaufschlagung des Chips 18 mit Laserenergie durch die für Laserenergie transparente Folie 17 hindurch, so dass eine Erwärmung des Chips 18 die Folge ist. In Folge dieser Erwärmung werden die in der Kleberschicht zwischen der Rückseite 19 des Chips 18 und der Folie 17 wirksamen Adhäsionskräfte reduziert und die adhäsiven Kräfte eines unter Temperatur aushärtbaren Klebermaterials, das zwischen den Kontaktoberflächen 22 und 23 angeordnet ist, aktiviert. Hierdurch entsteht eine dauerhafte mechanische Verbindung zwischen dem Chip 18 und dem Kontaktsubstrat 20 bei gleichzeitigem Lösen der Verbindung zwischen der Folie 17 und der Rückseite 19 des Chips 18.Preferably, at the same time as the aforementioned delivery movement is carried out, at the latest, however, after the contact surface 22 of the chip 18 abuts against the contact surface 23 of the contact substrate 20, the chip 18 is energized with laser energy through the foil 17 which is transparent to laser energy, so that heating takes place of the chip 18 is the result. As a result of this heating, the adhesive forces acting in the adhesive layer between the back side 19 of the chip 18 and the film 17 are reduced and the adhesive forces of a temperature-curable adhesive material placed between the contact surfaces 22 and 23 are activated. This results in a permanent mechanical connection between the chip 18 and the contact substrate 20 while simultaneously releasing the connection between the film 17 and the back side 19 of the chip 18.
In den Fig. 2 und 3 sind zwei mögliche Verfahrensvarianten bzw. dabei einsetzbare Vorrichtungen dargestellt, wobei in Fig. 2 mittels einer ersten Übertragungseinrichtung 87 eine Verfahrensvariante basierend auf einer durch eine „Sägefolie" gebildeten Vereinzelungsfolie 25 durchgeführt wird, die als Transfersubstrat dient, und Fig. 3 eine Verfahrensvariante zeigt, bei der mittels einer zweiten Übertragungsvorrichtung 88 das Verfahren basierend auf einem als Folienbahn 26 ausgeführten Transfersubstrat erfolgt.2 and 3 show two possible variants of the method or devices which can be used in this process, wherein in FIG. 2 a method variant based on a separating foil 25 formed by a "sawing foil", which serves as a transfer substrate, is carried out by means of a first transfer device 87 3 shows a method variant in which the method is carried out by means of a second transfer device 88 based on a transfer substrate designed as a film web 26.
Zur Vereinfachung der Darstellung ist in Fig. 2 lediglich ein Transferwerkzeug 27 dargestellt, das die Vereinzelungsfolie 25 rückwärtig beaufschlagt. Auf einer Vorderseite 28 der Vereinzelungsfolie 25 befindet sich eine Vielzahl von Chips 18 in sogenannter Waferanordnung 29, d. h. die Chips 18 befinden sich exakt in der Relativanordnung, die sich als Folge eines Vereinzelungsprozesses zur Herstellung vereinzelter Chips 18 aus einem Wafer einstellt. Als Einrichtung zur Aufnahme der Vereinzelungsfolie 25 dient im vorliegenden Fall ein umlaufender Trägerrahmen 31 , der in definierten Abständen mit Vakuumöffnungen 16 versehen ist, die ein Halten der Folie 25 in der in Fig. 2 dargestellten Position ermöglichen.In order to simplify the illustration, only one transfer tool 27 is shown in FIG. 2, which acts on the separating film 25 at the rear. On a front side 28 of the separating film 25 is a plurality of chips 18 in so-called wafer assembly 29, ie the chips 18 are located exactly in the relative arrangement, which adjusts as a result of a singulation process for producing individual chips 18 from a wafer. As a means of receiving the Separating film 25 is used in the present case, a circumferential support frame 31 which is provided at defined intervals with vacuum openings 16 which allow holding the film 25 in the position shown in Fig. 2.
Unterhalb der in Waferanordnung 29 auf der Vereinzelungsfolie 25 angeordneten Chips 18 befindet sich beabstandet durch einen Kontaktspalt 32 ein Kontaktsubstrat 33, das auf einer Kontaktsubstrataufnahmeeinrichtung 34 angeordnet ist.Below the wafer 18 arranged on the separating film 25 chips 18 is spaced by a contact gap 32, a contact substrate 33 which is disposed on a contact substrate receiving means 34.
Bei der in Fig. 3 dargestellten Übertragungsvorrichtung 88 ist das Transfersubstrat im Gegensatz zu der in Fig. 2 dargestellten Ausführung nicht als Vereinzelungsfolie 25 sondern als eine Folienbahn 26 ausgebildet, die über eine Bahnführungseinrichtung 36 an einer Folienbahnanla- geeinrichtung 37 vorbei bewegt wird. Die Anordnung von Chips 18 auf der Folienbahn 26 kann derart erfolgen, dass die gesamte Waferoberflä- che des Wafers vor der Vereinzelung mit einem Kleberauftrag versehen. Nach erfolgter Vereinzelung können dann die in Waferanordnung 29 angeordneten Chips 18 vermittels des auf ihrer Rückseite 19 angeordneten Kleberauftrags auf die Folienbahn 26 aufgebracht werden. Zum Transport der Folienbahn 26 weist die Bahnführungseinrichtung 36 eine Folienbahnabwickelspule 38, eine Folienbahnaufwickelspule 39 und zwei Umlenkrollen 40, 41 auf, die eine Führung der Folienbahn 26 parallel zur Folienbahnanlageeinrichtung 37 ermöglichen. Die Folienbahnanlageein- richtung 37 umfasst eine Mehrzahl hier nicht näher dargestellter Vakuumöffnungen, die eine Anlage der Folienbahn 26 zur Einstellung eines definierten Kontaktspaltes 35 zwischen der Folienbahn 26 und einerIn the transfer device 88 shown in FIG. 3, in contrast to the embodiment shown in FIG. 2, the transfer substrate is not formed as a separating film 25 but as a film web 26, which is moved over a web guide device 36 past a film web system 37. The arrangement of chips 18 on the film web 26 can take place in such a way that the entire wafer surface of the wafer is provided with an adhesive application prior to singulation. After separation has taken place, the chips 18 disposed in wafer arrangement 29 can then be applied to the film web 26 by means of the adhesive application arranged on their rear side 19. For transporting the film web 26, the web guiding device 36 has a film web supply reel 38, a film web take-up reel 39 and two deflecting rollers 40, 41, which allow the film web 26 to be guided parallel to the film web installation device 37. The Folienbahnanlageein- device 37 includes a plurality of vacuum openings not shown here, which is an investment of the film web 26 for setting a defined contact gap 35 between the film web 26 and a
Kontaktsubstratbahn 42, die über eine Kontaktsubstratbahnanlageeinrich- tung 43 hinweg geführt wird, ermöglichen. Die Kontaktsubstratbahnanla- geeinrichtung 43 ist ebenfalls mit einer Vielzahl von Vakuumöffnungen 16 versehen, die zur definierten Anlage der Kontaktsubstratbahn 42 an die Kontaktsubstratbahnanlageeinrichtung 43 dienen. Oberhalb der Folienbahnanlageeinrichtung 37 befindet sich ein Transferkopf 44, umfassend eine Mehrzahl von Transferwerkzeugen 45, 46, die über eine Kopftraverse 51 , in der Werkzeuggehäuse 47 der Transferwerkzeuge 45, 46 definiert aufgenommen sind, in einer Verbundanord- nung zur Ausbildung des Transferkopfs 44 angeordnet sind. In denContact substrate web 42, which is guided over a contact substrate Bahnanlageeinrich- device 43, allow. The contact substrate web installation device 43 is likewise provided with a multiplicity of vacuum openings 16 which serve for the defined contact of the contact substrate web 42 with the contact substrate web installation device 43. Above the film web installation device 37 is a transfer head 44, comprising a plurality of transfer tools 45, 46, which are received via a head rail 51, in the tool housing 47 of the transfer tools 45, 46 are defined, arranged in a composite arrangement for forming the transfer head 44 , In the
Werkzeugkörpern 47 der Transferwerkzeuge 45, 46 ist jeweils ein längs geführtes Zustellelement 48 aufgenommen, das j eweils in Zustellaus- nehmungen 49 der Folienbahnanlageeinrichtung 37 hinein ragt.Tool bodies 47 of the transfer tools 45, 46 each receive a longitudinally guided feed element 48, which in each case protrudes into feed recesses 49 of the film web installation device 37.
In der in Fig. 3 dargestellten Übertragungskonfiguration der Übertra- gungsvorrichtung 88 durchdringen in Folge einer Zustellbewegung der Kopftraverse 51 die Zustellelemente 48 beider Transferwerkzeuge 45, 46 die Zustellausnehmungen 49 und drängen dabei auf der Folienbahn 26 adhäsiv befestigte Chips 18 gegen in Fig. 3 nicht näher dargestellte, auf der Kontaktsubstratbahn 42 angeordnete Kontaktsubstrate 50 (Fig. 4). Wie durch den Doppelpfeil in Fig. 3 dargestellt, ist vermittels einer entsprechenden Beaufschlagung der Kopftraverse 51 eine gleichzeitige Zustellbewegung sämtlicher Transferwerkzeuge 45, 46 des Transferkopfs 44 möglich. Bei einer entsprechend getakteten Bewegung der Folienbahn 26 längs der Folienbahnanlageeinrichtung 37 und der Kontaktsubstrat- bahn 42 längs der Kontaktsubstratbahnanlageeinrichtung 43 lassen sich jeweils gewünschte Überdeckungen zwischen Chips 18 und darunter liegend, getrennt durch den Kontaktspalt 35, auf der Kontaktsubstratbahn 42 angeordneten Kontaktsubstraten 50 herstellen, so wie aus der vergrößerten Teildarstellung gemäß Fig. 4 ersichtlich.In the transfer configuration of the transfer device 88 shown in FIG. 3, the delivery elements 48 of both transfer tools 45, 46 pass through the feed recesses 49 and push chips 18 adhesively attached to the film web 26 against in FIG illustrated, disposed on the contact substrate web 42 contact substrates 50 (Fig. 4). As shown by the double arrow in Fig. 3, by means of a corresponding action on the head rail 51, a simultaneous feed movement of all transfer tools 45, 46 of the transfer head 44 is possible. With a correspondingly timed movement of the film web 26 along the film web installation device 37 and the contact substrate web 42 along the contact substrate web installation device 43, respectively desired overlaps between chips 18 and underlying contact substrates separated by the contact gap 35 can be produced on the contact substrate web 42 as shown in the enlarged partial view of FIG. 4.
Fig. 4 zeigt ein Transferwerkzeug 45, 46 während der Ausführung der Zustellbewegung in Richtung eines auf der Kontaktsubstratbahn 42 angeordneten Kontaktsubstrats 50. Wie durch den Pfeil 53 angedeutet, wird die Zustellbewegung durch die Bewegung des Werkzeugkörpers 47 des Transferwerkzeugs 45, 46 ausgeführt. Das längsverschieblich im Werkzeugkörper 47 geführte Zustellelement 48 stützt sich über eine im Werkzeugkörper 47 angeordnete Federeinrichtung 54 am Werkzeugkör- per 47 ab. Hierdurch wird im Moment eines Kontakts zwischen dem über seine Rückseite 19 vermittels einer Kleberschicht 55 adhäsiv mit der Folienbahn 26 verbundenen Chip 18 und dem Kontaktsubstrat 50 eine rückfedernde Ausweichbewegung des Zustellelements 48 ermöglicht, so dass Beschädigungen vorgebeugt wird. Bei dem in Fig. 4 dargestellten Ausführungsbeispiel ist das Kontaktsubstrat 50 im Bereich seiner zwei Substratkontakte 56, 57 aufweisenden Kontaktoberfläche 58 mit einem anisotropen Klebermaterial 61 versehen, in dem sich im Bereich von Druckspitzen in Folge des Kontaktvorgangs zwischen Chipkontakten 59, 60 und den Substratkontakten 56, 57 leitende Kontaktbrücken ausbilden. In Folge der gleichzeitig mit dem Kontakt erfolgenden Temperaturbeaufschlagung der Chipkontakte 59, 60 erfolgt ein Aushärten des Klebermaterials 61 mit dauerhafter Fixierung der vorstehend erwähnten Kontaktbrücken. Spätestens zu diesem Zeitpunkt hat sich auch die durch die Kleberschicht 55 gebildete adhäsive Verbindung zwischen der Rückseite 19 des Chips 18 und der Folienbahn 26 gelöst, so dass nach einer Rückstellbewegung des Transferwerkzeugs 45, 46 in Richtung des Pfeils 89 die Kontaktierung zwischen dem Chip 18 und dem Kontaktsubstrat 50 erhalten bleibt und eine Vorschubbewegung der Folienbahn 26 sowie der Kontaktsubstratbahn 42 zur Durchführung eines nachfolgenden Übertra- gungs- und Kontaktierungsvorgangs erfolgen kann.4 shows a transfer tool 45, 46 during the execution of the feed movement in the direction of a contact substrate 50 arranged on the contact substrate web 42. As indicated by the arrow 53, the feed movement is carried out by the movement of the tool body 47 of the transfer tool 45, 46. The feed element 48 guided longitudinally displaceably in the tool body 47 is supported on the tool body via a spring device 54 arranged in the tool body 47. off at 47. As a result, at the moment of contact between the chip 18 adhesively connected to the film web 26 via its rear side 19 by means of an adhesive layer 55 and the contact substrate 50, a spring-back deflection movement of the feed element 48 is made possible so that damage is prevented. In the exemplary embodiment illustrated in FIG. 4, the contact substrate 50 is provided with an anisotropic adhesive material 61 in the region of its contact surface 58 having two substrate contacts 56, 57, in which pressure contacts are formed between chip contacts 59, 60 and the substrate contacts 56 , 57 train senior contact bridges. As a result of the temperature being applied simultaneously to the contact of the chip contacts 59, 60, the adhesive material 61 is cured with permanent fixation of the abovementioned contact bridges. At the latest at this time, the adhesive bond formed by the adhesive layer 55 between the back 19 of the chip 18 and the film web 26 has been released, so that after a return movement of the transfer tool 45, 46 in the direction of the arrow 89, the contact between the chip 18 and the contact substrate 50 is maintained and an advancing movement of the film web 26 and the contact substrate web 42 for carrying out a subsequent transmission and contacting operation can take place.
Fig. 5 zeigt eine Mehrzahl von Transferwerkzeugen 62 bis 67, die vermittels einer gemeinsamen Kopftraverse 68 zu einer Reihenanordnung 69 zusammengefasst sind. Die einzelnen Transferwerkzeuge 62 bis 67 entsprechen dabei in ihrem Aufbau und in ihrer Funktion den vorstehend unter Bezugnahme auf die Fig. 3 und 4 bereits erläuterten Transferwerkzeugen 45, 46.FIG. 5 shows a plurality of transfer tools 62 to 67, which are combined to form a series arrangement 69 by means of a common headrail 68. The individual transfer tools 62 to 67 correspond in their construction and in their function to the transfer tools 45, 46 already explained above with reference to FIGS. 3 and 4.
Bei dem in Fig. 5 dargestellten Ausführungsbeispiel sind insgesamt sechs Transferwerkzeuge 62 bis 67 zu der Reihenanordnung 69 zusam- mengefasst. Natürlich ist es auch möglich, hiervon abweichende Anzahlen von Transferwerkzeugen zu einer Reihenanordnung zusammenzufas- sen und die Reihenanordnung mit weiteren Reihenanordnungen 70 bis 74 zu einer Matrixanordnung 75 (Fig. 6) zu kombinieren. Zur Justierung der Relativausrichtung der einzelnen Transferwerkzeuge 62 bis 67 der Reihenanordnung 69 untereinander sind bei dem in Fig. 5 dargestellten Ausführungsbeispiel Justiereinrichtungen 76 vorgesehen, die sowohl die Relativausrichtung der Längsachsen der Transferwerkzeuge 62 bis 67 untereinander als auch eine einheitliche Höheneinstellung der Transferwerkzeuge 62 bis 67 zur Ausbildung eines gleichmäßigen Abstands a zwischen einem Kontaktmundstück 92 der Transferwerkzeuge 62 bis 67 und einer Bezugsfläche F ermöglichen.In the exemplary embodiment illustrated in FIG. 5, a total of six transfer tools 62 to 67 are combined to form the row arrangement 69. Of course, it is also possible to combine deviating numbers of transfer tools into a series arrangement. and the series arrangement with further row arrangements 70 to 74 to form a matrix arrangement 75 (FIG. 6). For adjusting the relative orientation of the individual transfer tools 62 to 67 of the row assembly 69 with each other in the embodiment shown in FIG. 5 adjusting devices 76 are provided, both the relative orientation of the longitudinal axes of the transfer tools 62 to 67 with each other and a uniform height adjustment of the transfer tools 62 to 67 for Forming a uniform distance a between a contact tip 92 of the transfer tools 62 to 67 and a reference surface F allow.
Bei dem in Fig. 6 dargestellten Ausführungsbeispiel, besteht wie in Fig. 2, die Vereinzelungsfolie 25 aus einer sogenannten „Sägefolie". Damit ist die Vereinzelungsfolie 25 ein und dieselbe Folie, die zur Herstellung einer Mehrzahl von vereinzelten Chips durch ein Zersägen eines Wafers dient. Hierbei ist es Stand der Technik, den Wafer zur Durchführung des Vereinzelungsvorgangs, also zur Handhabung des Wafers beim Sägevor- gang, auf einer Folie, der sogenannten „Sägefolie", anzuordnen. Nach Durchführung des Sägevorgangs befinden sich die vereinzelten Chips in einer sogenannten Waferanordnung auf der Sägefolie. Bei der in Fig. 6 dargestellten Übertragungsvorrichtung 91 dient diese Sägefolie oder6, the separating film 25 consists of a so-called "sawing film." Thus, the separating film 25 is one and the same film used to produce a plurality of individual chips by sawing a wafer In this case, it is prior art to arrange the wafer on a foil, the so-called "sawing foil", in order to carry out the singulation process, that is to say to handle the wafer during the sawing process. After carrying out the sawing process, the singulated chips are located in a so-called wafer arrangement on the sawing foil. In the transmission device 91 shown in FIG. 6, this sawing or
Vereinzelungsfolie 25 als Transfersubstrat zur Durchführung des Verfahrens zu verwenden.Separation film 25 to use as a transfer substrate for performing the method.
Wie Fig. 6 zeigt, wird zur gleichzeitigen Übertragung der Mehrzahl von Chips in Waferanordnung ein Transferkopf 78 verwendet, der in Fig. 6 lediglich durch schematische Darstellung der einzelnen Lichtleitfasern 11 , die den in Reihenanordnungen 69 bis 74 angeordneten Transferwerkzeugen zugeordnet sind, angedeutet ist.As shown in FIG. 6, a transfer head 78 is used for the simultaneous transfer of the plurality of chips in wafer arrangement, which is indicated in Fig. 6 only by schematic representation of the individual optical fibers 11, which are assigned to the transfer tools arranged in series arrangements 69 to 74.
Unterhalb der Vereinzelungsfolie 25 mit den rückseitig darauf, in Fig. 6 nicht dargestellten, in Waferanordnung angeordneten Chips befindet sich eine Kontaktsubstratbahn 79, auf der Kontaktsubstratanordnungen 80 mit einer Mehrzahl von hier nicht näher dargestellten Kontaktsubstraten angeordnet sind, die hinsichtlich der Anordnung ihrer Substratkontakte der durch die Waferanordnung der Chips vorgegebenen Anordnung der Chipkontakte entsprechen können oder auch hiervon abweichen können. Die Kontaktsubstratanordnungen 80 können vermittels geeigneter Trans- porteinrichtungen 81 , 82 durch Vorbewegung der Kontaktsubstratbahn 79 in Vorschubrichtung 77 unter die Waferanordnung auf der Vereinzelungsfolie 25 bewegt werden. Bei einer übereinstimmenden Anordnung der Substratkontakte mit den Chipkontakten kann die gesamte Waferanordnung von Chips in einem Übertragungs- und Kontaktierungsvorgang auf die Kontaktsubstrate der Kontaktsubstratanordnung 80 übertragen werden, analog der Darstellung in Fig. 4. Bei abweichender Anordnung zwischen den Substratkontakten der Kontaktsubstratanordnung und den Chipkontakten der in Waferanordnung angeordneten Chips kann auch eine Übertragung und Kontaktierung der Chips einzeln oder in Gruppen erfolgen, wobei die geeignete Relativpositionierung der Chips zu den Kontaktsubstraten über eine entsprechende Steuereinrichtung 83 mit Bewegungsachsen 84 und 85 erfolgen kann. Die Ansteuerung der Steuereinrichtung 83 kann vermittels Kameraeinrichtungen 86 kombiniert mit einer Bildverarbeitungseinrichtung erfolgen.Below the separating film 25 with the wafers arranged on the back thereon, not shown in FIG. 6, there is a contact substrate web 79, on the contact substrate arrangements 80 with a plurality of contact substrates (not further illustrated here) are arranged, which may correspond with respect to the arrangement of their substrate contacts of the wafer arrangement of the chips predetermined arrangement of the chip contacts or may deviate therefrom. The contact substrate arrangements 80 can be moved by means of suitable transport devices 81, 82 by advancing the contact substrate web 79 in the feed direction 77 under the wafer arrangement on the singling film 25. In a matching arrangement of the substrate contacts with the chip contacts, the entire wafer arrangement of chips in a transfer and contacting can be transferred to the contact substrates of the contact substrate assembly 80, analogous to the representation in Fig. 4. In a different arrangement between the substrate contacts of the contact substrate assembly and the chip contacts of Chips arranged in a wafer arrangement can also be used to transfer and contact the chips individually or in groups, with the appropriate relative positioning of the chips to the contact substrates being able to take place via a corresponding control device 83 with axes of movement 84 and 85. The control device 83 can be controlled by means of camera devices 86 combined with an image processing device.
Zur Herstellung der Kontaktierung zwischen den Chips und den Kontaktsubstraten kann bei dem in Fig. 6 dargestellten Ausführungsbeispiel, ähnlich wie schon unter Bezugnahme auf die Fig. 4 erläutert, ein thermisch aktivierbarer Kleberauftrag zwischen dem Chip und dem Kontaktsubstrat vorgesehen sein. Hierbei hat es sich auch als vorteilhaft heraus- gestellt, wenn als Klebermaterial ein Material verwendet wird, das zur Herstellung der Leitfähigkeit Aktivkohlefasern enthält. Alternativ kann auch die Durchführung einer Lötkontaktierung erfolgen, wobei beispielsweise ein Lötmaterialauftrag auf den Chipkontakten und/oder den Kontaktsubstratkontakten vorgesehen sein kann. Auch ist es möglich, die Chipkontakte mit einer Kontaktmetallisierung zu versehen, die aus einer stromlos abgeschiedenen Nickel-Gold-Beschichtung besteht. In order to produce the contact between the chips and the contact substrates, a thermally activatable adhesive application between the chip and the contact substrate can be provided in the exemplary embodiment illustrated in FIG. 6, as already explained with reference to FIG. 4. In this case, it has also proved to be advantageous if a material which contains activated carbon fibers to produce the conductivity is used as the adhesive material. Alternatively, the implementation of a Lötkontaktierung done, for example, a Lötmaterialauftrag can be provided on the chip contacts and / or the contact substrate contacts. It is also possible to provide the chip contacts with a contact metallization, which consists of a current-deposited nickel-gold coating.

Claims

Patentansprüche claims
1. Verfahren zur Übertragung eines auf einem Transfersubstrat (17, 25, 26) angeordneten Chips (18) auf ein Kontaktsubstrat (20, 33, 50) und Kontaktierung des Chips mit dem Kontaktsubstrat, bei dem der auf einer dem Kontaktsubstrat zugewandten Aufnahmefläche des Transfersubstrats mit seiner Rückseite (19) adhäsiv befestigte Chip rückwärtig durch das Transfersubstrat hindurch mit Laserenergie beaufschlagt wird und der Chip rückwärtig durch das Transfersubstrat hindurch mittels einer Andruckeinrichtung (12,A method for transferring a chip (18) arranged on a transfer substrate (17, 25, 26) onto a contact substrate (20, 33, 50) and contacting the chip with the contact substrate, wherein the receiving surface of the transfer substrate facing towards the contact substrate with its rear side (19) adhesively attached chip is applied backward through the transfer substrate through with laser energy and the chip backward through the transfer substrate by means of a pressure device (12,
45, 46, 62 bis 67) mit seinen einer Kontaktfläche (23, 58) des Kontaktsubstrats gegenüberliegend angeordneten Chipkontakten (59, 60) in Kontakt mit auf der Kontaktoberfläche angeordneten Substratkontakten (56, 57) gebracht wird und eine thermische Verbin- düng zwischen den Chipkontakten und den Substratkontakten hergestellt wird.45, 46, 62 to 67) with its one contact surface (23, 58) of the contact substrate oppositely arranged chip contacts (59, 60) is brought into contact with arranged on the contact surface substrate contacts (56, 57) and a thermal connection between the fertil Chip contacts and the substrate contacts is made.
2. Verfahren nach Anspruch 1, dadurch g ek ennz ei chn et , dass als Transfersubstrat eine Folie (17, 25, 26) verwendet wird.2. The method according to claim 1, characterized g ek ennz ei chn et, that as a transfer substrate, a film (17, 25, 26) is used.
3. Verfahren nach Anspruch 2, dadurch g ekennzei chn et , dass zur adhäsiven Befestigung des Chips (18) auf dem Transfersubstrat die Folie (17, 25, 26) zumindest in dem Kontaktbereich mit der Rückseite (19) des Chips mit einem Kleberauftrag (55) versehen ist.3. The method according to claim 2, characterized ekennzei Chn et, that for adhesive attachment of the chip (18) on the transfer substrate, the film (17, 25, 26) at least in the contact region with the back (19) of the chip with an adhesive application ( 55) is provided.
4. Verfahren nach Anspruch 3, dadurch g ekennz ei chnet , dass die Folie (17, 25, 26) mit einem Haftkleberauftrag versehen ist. 4. The method according to claim 3, characterized ekennz ei chnet, that the film (17, 25, 26) is provided with a pressure-sensitive adhesive.
5. Verfahren nach einem der vorangehenden Ansprüche, dadurch g ekennz ei chnet , dass zur Verbindung des Chips (18) mit dem Kontaktsubstrat (20, 33) ein zwischen dem Chip und dem Kontaktsubstrat angeordneter Kleberauftrag (61) dient.5. The method according to any one of the preceding claims, characterized ekennz ei chnet that for connection of the chip (18) with the contact substrate (20, 33) arranged between the chip and the contact substrate adhesive application (61).
6. Verfahren nach einem der Ansprüche 1 bis 4, dadurch g ek ennz ei chnet , dass zur Verbindung des Chips (18) mit dem Kontaktsubstrat (20, 33) ein auf den Chipkontakten (59, 60) und/oder den Substratkon- takten (56, 57) angeordneter Lotmaterialauftrag dient.6. The method according to any one of claims 1 to 4, characterized ek ennz ei chnet, that for connecting the chip (18) with the contact substrate (20, 33) on the chip contacts (59, 60) and / or the substrate contacts (56, 57) arranged soldering material order is used.
7. Verfahren nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass gleichzeitig eine Mehrzahl auf einer gemeinsamen Folie (25, 26) angeordneter Chips (18) auf das Kontaktsubstrat (20, 33) über- tragen und mit diesem kontaktiert wird.7. The method according to any one of the preceding claims, characterized in that at the same time a plurality on a common film (25, 26) arranged chips (18) on the contact substrate (20, 33) transferred and contacted with this.
8. Verfahren nach Anspruch 7, dadurch g ek ennz ei chnet , dass die Chips (18) in einer durch die Vereinzelung von Chips aus einem Waferverbund gebildeten Waferanordnung (29) auf der Folie (25, 26) angeordnet sind.8. Method according to claim 7, characterized in that the chips (18) are arranged on the foil (25, 26) in a wafer arrangement (29) formed by the singulation of chips from a wafer composite.
9. Verfahren nach Anspruch 8, dadurch g ek ennz ei chnet , dass als Folie die Folie (25) verwendet wird, auf der ein Wafer während der Vereinzelung der Chips (18) aus dem Waferverbund angeordnet ist. 9. The method according to claim 8, characterized ek ennz ei chnet, that is used as a film, the film (25) on which a wafer during the separation of the chips (18) is arranged from the wafer composite.
10. Verfahren nach Anspruch 7, dadurch g ekennz e i chn et , dass die Chips in einer Transferanordnung auf der Folie (26) angeordnet sind, die einer Kontaktsubstratanordnung der Chips (18) auf dem Kontaktsubstrat entspricht.10. The method of claim 7, characterized in that the chips are arranged in a transfer arrangement on the film (26) which corresponds to a contact substrate arrangement of the chips (18) on the contact substrate.
11. Vorrichtung zur Übertragung eines auf einem Transfersubstrat (17, 25, 26) angeordneten Chips (18) auf ein Kontaktsubstrat (20, 33, 50) und Kontaktierung des Chips mit dem Kontaktsubstrat mit einer Einrichtung (31, 36, 37) zur Anordnung eines mit zumindest einem Chip versehenen Transfersubstrats, einem Transferwerkzeug11. Apparatus for transferring a chip (18) arranged on a transfer substrate (17, 25, 26) onto a contact substrate (20, 33, 50) and contacting the chip with the contact substrate with a device (31, 36, 37) for arrangement a transfer substrate provided with at least one chip, a transfer tool
(45, 46, 62 bis 67) umfassend eine Lasereinrichtung (11) und eine Andruckeinrichtung (12, 48) und einer Einrichtung (34, 43) zur Anordnung von zumindest einem Kontaktsubstrat, wobei sowohl die Lasereinrichtung als auch die Andruckeinrichtung derart ange- ordnet sind, dass sie unter zwischenliegender Anordnung des(45, 46, 62 to 67) comprising a laser device (11) and a pressure device (12, 48) and a device (34, 43) for arranging at least one contact substrate, wherein both the laser device and the pressure device arranged in such a way are that they are under interposed arrangement of the
Transfersubstrats eine rückwärtige Beaufschlagung des über seine Rückseite (19) mit dem Transfersubstrat verbundenen Chips mit Druck und Temperatur zur Übertragung des Chips auf das Kontaktsubstrat und Kontaktierung des Chips mit dem Kontaktsubstrat er- möglichen.Transfersubstrats a backward loading of the on its rear side (19) connected to the transfer substrate chips with pressure and temperature to transfer the chip to the contact substrate and contacting the chip with the contact substrate possible.
12. Vorrichtung nach Anspruch 11, dadurch g ek ennz ei chn et , dass das Transferwerkzeug (45, 46, 62 bis 67) einen Werkzeugkörper (47) zum Anschluss einer Lichtleitfaser (11) zur Übertragung von Laserenergie und ein mit einer Laserübertragungseinrichtung versehenes Kontaktmundstück (92) aufweist.12. The apparatus of claim 11, characterized ek ez ennz ei chn et, that the transfer tool (45, 46, 62 to 67) a tool body (47) for connecting an optical fiber (11) for transmitting laser energy and provided with a laser transmission means contact tip (92).
13. Vorrichtung nach Anspruch 12, dadurch g ek ennz ei chnet , dass das Kontaktmundstück (92) als Druckkapillare ausgebildet ist. 13. The apparatus of claim 12, characterized ek ezz ei chnet, that the contact mouthpiece (92) is designed as a pressure capillary.
14. Vorrichtung nach Anspruch 12 oder 13, dadurch g ekennz e i chn et , dass zwischen dem Werkzeugkörper (47) und dem Kontaktmundstück (92) ein federgestütztes Kraftübertragungselement (48) an- geordnet ist.14. The apparatus of claim 12 or 13, characterized ekennz e i chn et that between the tool body (47) and the contact mouthpiece (92) a spring-supported power transmission element (48) is arranged.
15. Vorrichtung nach einem der Ansprüche 11 bis 14, dadurch g ekennz e i chn et , dass zur Übertragung und Kontaktierung einer Mehrzahl von Chips (18) eine Mehrzahl von Transferwerkzeugen (62 bis 67) in einem Transferkopf (78) angeordnet ist.15. Device according to one of claims 11 to 14, characterized ekennz e i chn et that for transmitting and contacting a plurality of chips (18) a plurality of transfer tools (62 to 67) in a transfer head (78) is arranged.
16. Vorrichtung nach Anspruch 15, dadurch gekennzei chnet, dass die Transferwerkzeuge (62 bis 67) in einer Matrixanordnung (75) in dem Transferkopf (78) angeordnet sind.16. The apparatus according to claim 15, characterized gekennzei chnet, that the transfer tools (62 to 67) in a matrix arrangement (75) in the transfer head (78) are arranged.
17. Vorrichtung nach Anspruch 16, dadurch g ekennz e i chn et , dass die Transferwerkzeuge (62 bis 67) in einer oder mehreren17. The apparatus of claim 16, characterized ekennz e i chn et that the transfer tools (62 to 67) in one or more
Reihenanordnungen (69 bis 74) angeordnet sind.Row arrangements (69 to 74) are arranged.
18. Vorrichtung nach einem der Ansprüche 11 bis 17, dadurch g ek ennz e i chn et , dass die Einrichtung (31) zur Anordnung des Transfersubstrats eine Aufnahmeeinrichtung zur Anordnung einer Vereinzelungsfolie (25) als Transfersubstrat mit einer Mehrzahl von Chips (18) in Wa- feranordnung (29) umfasst und mit einer Positionierungseinrich- tung (83, 86) zur Positionierung der einzelnen Chips der Wafera- nordnung entsprechend der Anordnung der Chips auf dem Kontaktsubstrat versehen ist. 18. Device according to one of claims 11 to 17, characterized g ek ennz ei chn et, that the means (31) for arranging the transfer substrate, a receiving device for arranging a separating film (25) as a transfer substrate with a plurality of chips (18) in Wa - Ferheranordnung (29) and with a positioning device (83, 86) for positioning the individual chips of the wafer arrangement is provided according to the arrangement of the chips on the contact substrate.
19. Vorrichtung nach einem der Ansprüche 11 bis 17 dadurch gekennzeichnet, dass die Einrichtung (36, 37) zur Aufnahme des Transfersubstrats eine Bahnführungseinrichtung zur Führung eines als Folienbahn (26) ausgebildeten Transfersubstrats umfasst und mit einer Vorschubeinrichtung (39) zur Positionierung der einzelnen Chips (18) entsprechend der Anordnung der Chips auf dem Kontaktsubstrat versehen ist. 19. The device according to one of claims 11 to 17, characterized in that the means (36, 37) for receiving the transfer substrate comprises a web guide means for guiding a film web (26) formed transfer substrate and with a feed device (39) for positioning the individual chips (18) is provided according to the arrangement of the chips on the contact substrate.
PCT/DE2006/000628 2005-04-08 2006-04-10 Method and device for transferring a chip to a contact substrate WO2006105782A2 (en)

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EP06742229.5A EP1869701B1 (en) 2005-04-08 2006-04-10 Method and device for transferring a chip to a contact substrate
JP2008504617A JP5964005B2 (en) 2005-04-08 2006-04-10 Method and apparatus for transferring a chip to a contact substrate
DE112006001493T DE112006001493A5 (en) 2005-04-08 2006-04-10 Method and device for transferring a chip to a contact substrate
US11/910,771 US9401298B2 (en) 2005-04-08 2006-04-10 Method and device for transferring a chip to a contact substrate
KR1020077025897A KR101250186B1 (en) 2005-04-08 2006-04-10 Method and device for transferring a chip to a contact substrate
CN2006800111703A CN101164150B (en) 2005-04-08 2006-04-10 Method and device for transferring a chip to a contact substrate

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EP1869701A2 (en) 2007-12-26
JP2008535275A (en) 2008-08-28
US20080210368A1 (en) 2008-09-04
EP1869701B1 (en) 2017-02-08
JP5964005B2 (en) 2016-08-03
US9401298B2 (en) 2016-07-26
KR101250186B1 (en) 2013-04-05
WO2006105782A3 (en) 2007-08-30
KR20070120583A (en) 2007-12-24
CN101164150A (en) 2008-04-16
DE112006001493A5 (en) 2008-03-20
CN101164150B (en) 2010-08-18

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