US3372310A
(en)
|
1965-04-30 |
1968-03-05 |
Radiation Inc |
Universal modular packages for integrated circuits
|
US3436604A
(en)
|
1966-04-25 |
1969-04-01 |
Texas Instruments Inc |
Complex integrated circuit array and method for fabricating same
|
US3654394A
(en)
|
1969-07-08 |
1972-04-04 |
Gordon Eng Co |
Field effect transistor switch, particularly for multiplexing
|
US3772776A
(en)
|
1969-12-03 |
1973-11-20 |
Thomas & Betts Corp |
Method of interconnecting memory plane boards
|
US3582865A
(en)
|
1969-12-16 |
1971-06-01 |
Ibm |
Microcircuit module and connector
|
US3704455A
(en)
|
1971-02-01 |
1972-11-28 |
Alfred D Scarbrough |
3d-coaxial memory construction and method of making
|
US3727064A
(en)
|
1971-03-17 |
1973-04-10 |
Monsanto Co |
Opto-isolator devices and method for the fabrication thereof
|
US3746934A
(en)
|
1971-05-06 |
1973-07-17 |
Siemens Ag |
Stack arrangement of semiconductor chips
|
US3766439A
(en)
|
1972-01-12 |
1973-10-16 |
Gen Electric |
Electronic module using flexible printed circuit board with heat sink means
|
US3718842A
(en)
|
1972-04-21 |
1973-02-27 |
Texas Instruments Inc |
Liquid crystal display mounting structure
|
NL7610306A
(en)
|
1976-09-16 |
1978-03-20 |
Du Pont |
CONTACT DEVICE FOR AN INTEGRATED CIRCUIT.
|
US4342069A
(en)
|
1979-07-02 |
1982-07-27 |
Mostek Corporation |
Integrated circuit package
|
US4288841A
(en)
|
1979-09-20 |
1981-09-08 |
Bell Telephone Laboratories, Incorporated |
Double cavity semiconductor chip carrier
|
US4429349A
(en)
|
1980-09-30 |
1984-01-31 |
Burroughs Corporation |
Coil connector
|
US4437235A
(en)
|
1980-12-29 |
1984-03-20 |
Honeywell Information Systems Inc. |
Integrated circuit package
|
US4427235A
(en)
*
|
1981-01-19 |
1984-01-24 |
Ogle Petroleum Inc. Of California |
Method of solution mining subsurface orebodies to reduce restoration activities
|
US4513368A
(en)
|
1981-05-22 |
1985-04-23 |
Data General Corporation |
Digital data processing system having object-based logical memory addressing and self-structuring modular memory
|
JPS58159360A
(en)
|
1982-03-17 |
1983-09-21 |
Fujitsu Ltd |
Semiconductor device
|
FR2538989B1
(en)
|
1982-12-30 |
1985-10-04 |
Thomson Csf |
ASSEMBLY STRUCTURE FOR COMPLEX ELECTRONIC CIRCUITS, AND METHOD FOR IMPROVING THE RELIABILITY OF SUCH AN ASSEMBLY
|
US4567543A
(en)
|
1983-02-15 |
1986-01-28 |
Motorola, Inc. |
Double-sided flexible electronic circuit module
|
US4656605A
(en)
|
1983-09-02 |
1987-04-07 |
Wang Laboratories, Inc. |
Single in-line memory module
|
US4727513A
(en)
|
1983-09-02 |
1988-02-23 |
Wang Laboratories, Inc. |
Signal in-line memory module
|
JPS6055458A
(en)
|
1983-09-05 |
1985-03-30 |
Matsushita Electric Ind Co Ltd |
Cmos transistor circuit
|
US4672421A
(en)
|
1984-04-02 |
1987-06-09 |
Motorola, Inc. |
Semiconductor packaging and method
|
US4587596A
(en)
|
1984-04-09 |
1986-05-06 |
Amp Incorporated |
High density mother/daughter circuit board connector
|
EP0213205B1
(en)
|
1984-12-28 |
1992-12-09 |
Micro Co., Ltd. |
Method of stacking printed circuit boards
|
DE3524978A1
(en)
|
1985-07-12 |
1987-01-22 |
Wacker Chemitronic |
METHOD FOR DOUBLE-SIDED REMOVAL MACHINING OF DISK-SHAPED WORKPIECES, IN PARTICULAR SEMICONDUCTOR DISCS
|
US5014161A
(en)
|
1985-07-22 |
1991-05-07 |
Digital Equipment Corporation |
System for detachably mounting semiconductors on conductor substrate
|
DE3675321D1
(en)
|
1985-08-16 |
1990-12-06 |
Dai Ichi Seiko Co Ltd |
SEMICONDUCTOR ARRANGEMENT WITH PACK OF PIN PLUG TYPE.
|
US4724611A
(en)
|
1985-08-23 |
1988-02-16 |
Nec Corporation |
Method for producing semiconductor module
|
US4696525A
(en)
|
1985-12-13 |
1987-09-29 |
Amp Incorporated |
Socket for stacking integrated circuit packages
|
US4850892A
(en)
|
1985-12-16 |
1989-07-25 |
Wang Laboratories, Inc. |
Connecting apparatus for electrically connecting memory modules to a printed circuit board
|
US4709300A
(en)
|
1986-05-05 |
1987-11-24 |
Itt Gallium Arsenide Technology Center, A Division Of Itt Corporation |
Jumper for a semiconductor assembly
|
US4763188A
(en)
|
1986-08-08 |
1988-08-09 |
Thomas Johnson |
Packaging system for multiple semiconductor devices
|
US4821007A
(en)
|
1987-02-06 |
1989-04-11 |
Tektronix, Inc. |
Strip line circuit component and method of manufacture
|
FR2610952B1
(en)
*
|
1987-02-17 |
1989-05-05 |
Aerospatiale |
METHOD AND MACHINE FOR KNITTING COMPOSITE REINFORCEMENTS
|
US5159535A
(en)
|
1987-03-11 |
1992-10-27 |
International Business Machines Corporation |
Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate
|
US4862249A
(en)
|
1987-04-17 |
1989-08-29 |
Xoc Devices, Inc. |
Packaging system for stacking integrated circuits
|
US4771366A
(en)
|
1987-07-06 |
1988-09-13 |
International Business Machines Corporation |
Ceramic card assembly having enhanced power distribution and cooling
|
IT1214254B
(en)
|
1987-09-23 |
1990-01-10 |
Sgs Microelettonica S P A |
SEMICONDUCTOR DEVICE IN PLASTIC OR CERAMIC CONTAINER WITH "CHIPS" FIXED ON BOTH SIDES OF THE CENTRAL ISLAND OF THE "FRAME".
|
US5016138A
(en)
|
1987-10-27 |
1991-05-14 |
Woodman John K |
Three dimensional integrated circuit package
|
US4983533A
(en)
|
1987-10-28 |
1991-01-08 |
Irvine Sensors Corporation |
High-density electronic modules - process and product
|
US5014115A
(en)
|
1987-11-16 |
1991-05-07 |
Motorola, Inc. |
Coplanar waveguide semiconductor package
|
US4982266A
(en)
|
1987-12-23 |
1991-01-01 |
Texas Instruments Incorporated |
Integrated circuit with metal interconnecting layers above and below active circuitry
|
US4833568A
(en)
|
1988-01-29 |
1989-05-23 |
Berhold G Mark |
Three-dimensional circuit component assembly and method corresponding thereto
|
JP2600753B2
(en)
|
1988-02-03 |
1997-04-16 |
日本電気株式会社 |
Input circuit
|
JPH025375A
(en)
|
1988-06-24 |
1990-01-10 |
Toshiba Corp |
Actual fitting of electronic component
|
US5025306A
(en)
|
1988-08-09 |
1991-06-18 |
Texas Instruments Incorporated |
Assembly of semiconductor chips
|
US5138434A
(en)
|
1991-01-22 |
1992-08-11 |
Micron Technology, Inc. |
Packaging for semiconductor logic devices
|
US4992850A
(en)
|
1989-02-15 |
1991-02-12 |
Micron Technology, Inc. |
Directly bonded simm module
|
US4911643A
(en)
|
1988-10-11 |
1990-03-27 |
Beta Phase, Inc. |
High density and high signal integrity connector
|
US4956694A
(en)
|
1988-11-04 |
1990-09-11 |
Dense-Pac Microsystems, Inc. |
Integrated circuit chip stacking
|
WO1990006609A1
(en)
|
1988-11-16 |
1990-06-14 |
Motorola, Inc. |
Flexible substrate electronic assembly
|
US4992849A
(en)
|
1989-02-15 |
1991-02-12 |
Micron Technology, Inc. |
Directly bonded board multiple integrated circuit module
|
US4953060A
(en)
|
1989-05-05 |
1990-08-28 |
Ncr Corporation |
Stackable integrated circuit chip package with improved heat removal
|
US5104820A
(en)
|
1989-07-07 |
1992-04-14 |
Irvine Sensors Corporation |
Method of fabricating electronic circuitry unit containing stacked IC layers having lead rerouting
|
US5119269A
(en)
|
1989-08-23 |
1992-06-02 |
Seiko Epson Corporation |
Semiconductor with a battery unit
|
US5200362A
(en)
|
1989-09-06 |
1993-04-06 |
Motorola, Inc. |
Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film
|
US5191404A
(en)
|
1989-12-20 |
1993-03-02 |
Digital Equipment Corporation |
High density memory array packaging
|
US5041015A
(en)
|
1990-03-30 |
1991-08-20 |
Cal Flex, Inc. |
Electrical jumper assembly
|
US5109318A
(en)
|
1990-05-07 |
1992-04-28 |
International Business Machines Corporation |
Pluggable electronic circuit package assembly with snap together heat sink housing
|
JP2602343B2
(en)
|
1990-05-07 |
1997-04-23 |
三菱電機株式会社 |
IC card
|
US5053853A
(en)
|
1990-05-08 |
1991-10-01 |
International Business Machines Corporation |
Modular electronic packaging system
|
US5261068A
(en)
|
1990-05-25 |
1993-11-09 |
Dell Usa L.P. |
Dual path memory retrieval system for an interleaved dynamic RAM memory unit
|
US5241456A
(en)
|
1990-07-02 |
1993-08-31 |
General Electric Company |
Compact high density interconnect structure
|
US5065277A
(en)
|
1990-07-13 |
1991-11-12 |
Sun Microsystems, Inc. |
Three dimensional packaging arrangement for computer systems and the like
|
US5140405A
(en)
|
1990-08-30 |
1992-08-18 |
Micron Technology, Inc. |
Semiconductor assembly utilizing elastomeric single axis conductive interconnect
|
US5117282A
(en)
|
1990-10-29 |
1992-05-26 |
Harris Corporation |
Stacked configuration for integrated circuit devices
|
US5289062A
(en)
|
1991-03-18 |
1994-02-22 |
Quality Semiconductor, Inc. |
Fast transmission gate switch
|
US5099393A
(en)
|
1991-03-25 |
1992-03-24 |
International Business Machines Corporation |
Electronic package for high density applications
|
US5138430A
(en)
|
1991-06-06 |
1992-08-11 |
International Business Machines Corporation |
High performance versatile thermally enhanced IC chip mounting
|
US5252857A
(en)
|
1991-08-05 |
1993-10-12 |
International Business Machines Corporation |
Stacked DCA memory chips
|
US5397916A
(en)
|
1991-12-10 |
1995-03-14 |
Normington; Peter J. C. |
Semiconductor device including stacked die
|
US5281852A
(en)
|
1991-12-10 |
1994-01-25 |
Normington Peter J C |
Semiconductor device including stacked die
|
US5219377A
(en)
|
1992-01-17 |
1993-06-15 |
Texas Instruments Incorporated |
High temperature co-fired ceramic integrated phased array package
|
US5241454A
(en)
|
1992-01-22 |
1993-08-31 |
International Business Machines Corporation |
Mutlilayered flexible circuit package
|
US5224023A
(en)
|
1992-02-10 |
1993-06-29 |
Smith Gary W |
Foldable electronic assembly module
|
US5268815A
(en)
|
1992-02-14 |
1993-12-07 |
International Business Machines Corporation |
High density, high performance memory circuit package
|
US5208729A
(en)
|
1992-02-14 |
1993-05-04 |
International Business Machines Corporation |
Multi-chip module
|
US5222014A
(en)
|
1992-03-02 |
1993-06-22 |
Motorola, Inc. |
Three-dimensional multi-chip pad array carrier
|
US5229916A
(en)
|
1992-03-04 |
1993-07-20 |
International Business Machines Corporation |
Chip edge interconnect overlay element
|
US5259770A
(en)
|
1992-03-19 |
1993-11-09 |
Amp Incorporated |
Impedance controlled elastomeric connector
|
US5438224A
(en)
|
1992-04-23 |
1995-08-01 |
Motorola, Inc. |
Integrated circuit package having a face-to-face IC chip arrangement
|
US5214845A
(en)
|
1992-05-11 |
1993-06-01 |
Micron Technology, Inc. |
Method for producing high speed integrated circuits
|
US5247423A
(en)
|
1992-05-26 |
1993-09-21 |
Motorola, Inc. |
Stacking three dimensional leadless multi-chip module and method for making the same
|
US5729894A
(en)
*
|
1992-07-21 |
1998-03-24 |
Lsi Logic Corporation |
Method of assembling ball bump grid array semiconductor packages
|
US5229917A
(en)
|
1992-07-24 |
1993-07-20 |
The United States Of America As Represented By The Secretary Of The Air Force |
VLSI integration into a 3-D WSI dual composite module
|
US5266912A
(en)
|
1992-08-19 |
1993-11-30 |
Micron Technology, Inc. |
Inherently impedance matched multiple integrated circuit module
|
JPH0679990A
(en)
|
1992-09-04 |
1994-03-22 |
Mitsubishi Electric Corp |
Ic memory card
|
US5313097A
(en)
|
1992-11-16 |
1994-05-17 |
International Business Machines, Corp. |
High density memory module
|
US5309986A
(en)
|
1992-11-30 |
1994-05-10 |
Satomi Itoh |
Heat pipe
|
US5375041A
(en)
|
1992-12-02 |
1994-12-20 |
Intel Corporation |
Ra-tab array bump tab tape based I.C. package
|
US5347428A
(en)
|
1992-12-03 |
1994-09-13 |
Irvine Sensors Corporation |
Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip
|
US5484959A
(en)
*
|
1992-12-11 |
1996-01-16 |
Staktek Corporation |
High density lead-on-package fabrication method and apparatus
|
US6205654B1
(en)
*
|
1992-12-11 |
2001-03-27 |
Staktek Group L.P. |
Method of manufacturing a surface mount package
|
US5541812A
(en)
|
1995-05-22 |
1996-07-30 |
Burns; Carmen D. |
Bus communication system for stacked high density integrated circuit packages having an intermediate lead frame
|
US5428190A
(en)
|
1993-07-02 |
1995-06-27 |
Sheldahl, Inc. |
Rigid-flex board with anisotropic interconnect and method of manufacture
|
US5386341A
(en)
|
1993-11-01 |
1995-01-31 |
Motorola, Inc. |
Flexible substrate folded in a U-shape with a rigidizer plate located in the notch of the U-shape
|
US5523619A
(en)
|
1993-11-03 |
1996-06-04 |
International Business Machines Corporation |
High density memory structure
|
US5477082A
(en)
|
1994-01-11 |
1995-12-19 |
Exponential Technology, Inc. |
Bi-planar multi-chip module
|
US5502333A
(en)
|
1994-03-30 |
1996-03-26 |
International Business Machines Corporation |
Semiconductor stack structures and fabrication/sparing methods utilizing programmable spare circuit
|
US5448511A
(en)
|
1994-06-01 |
1995-09-05 |
Storage Technology Corporation |
Memory stack with an integrated interconnect and mounting structure
|
US5523695A
(en)
|
1994-08-26 |
1996-06-04 |
Vlsi Technology, Inc. |
Universal test socket for exposing the active surface of an integrated circuit in a die-down package
|
US5491612A
(en)
|
1995-02-21 |
1996-02-13 |
Fairchild Space And Defense Corporation |
Three-dimensional modular assembly of integrated circuits
|
JP2606177B2
(en)
*
|
1995-04-26 |
1997-04-30 |
日本電気株式会社 |
Printed wiring board
|
US6002167A
(en)
*
|
1995-09-22 |
1999-12-14 |
Hitachi Cable, Ltd. |
Semiconductor device having lead on chip structure
|
JPH09139559A
(en)
*
|
1995-11-13 |
1997-05-27 |
Minolta Co Ltd |
Connection structure of circuit board
|
US5708287A
(en)
*
|
1995-11-29 |
1998-01-13 |
Kabushiki Kaisha Toshiba |
Power semiconductor device having an active layer
|
US5646446A
(en)
*
|
1995-12-22 |
1997-07-08 |
Fairchild Space And Defense Corporation |
Three-dimensional flexible assembly of integrated circuits
|
JP2810647B2
(en)
*
|
1996-04-30 |
1998-10-15 |
山一電機株式会社 |
IC package
|
US5778522A
(en)
*
|
1996-05-20 |
1998-07-14 |
Staktek Corporation |
Method of manufacturing a high density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain relief
|
US5754409A
(en)
*
|
1996-11-06 |
1998-05-19 |
Dynamem, Inc. |
Foldable electronic assembly module
|
JP3695893B2
(en)
*
|
1996-12-03 |
2005-09-14 |
沖電気工業株式会社 |
Semiconductor device, manufacturing method and mounting method thereof
|
JP3011233B2
(en)
*
|
1997-05-02 |
2000-02-21 |
日本電気株式会社 |
Semiconductor package and its semiconductor mounting structure
|
US5986209A
(en)
*
|
1997-07-09 |
1999-11-16 |
Micron Technology, Inc. |
Package stack via bottom leaded plastic (BLP) packaging
|
US6002589A
(en)
*
|
1997-07-21 |
1999-12-14 |
Rambus Inc. |
Integrated circuit package for coupling to a printed circuit board
|
US5949657A
(en)
*
|
1997-12-01 |
1999-09-07 |
Karabatsos; Chris |
Bottom or top jumpered foldable electronic assembly
|
US5963427A
(en)
*
|
1997-12-11 |
1999-10-05 |
Sun Microsystems, Inc. |
Multi-chip module with flexible circuit board
|
US20040236877A1
(en)
*
|
1997-12-17 |
2004-11-25 |
Lee A. Burton |
Switch/network adapter port incorporating shared memory resources selectively accessible by a direct execution logic element and one or more dense logic devices in a fully buffered dual in-line memory module format (FB-DIMM)
|
US5966287A
(en)
*
|
1997-12-17 |
1999-10-12 |
Intel Corporation |
Clip on heat exchanger for a memory module and assembly method
|
DE19758197C2
(en)
*
|
1997-12-30 |
2002-11-07 |
Infineon Technologies Ag |
Stack arrangement for two semiconductor memory chips and printed circuit board, which is equipped with a plurality of such stack arrangements
|
US6222739B1
(en)
*
|
1998-01-20 |
2001-04-24 |
Viking Components |
High-density computer module with stacked parallel-plane packaging
|
US6172874B1
(en)
*
|
1998-04-06 |
2001-01-09 |
Silicon Graphics, Inc. |
System for stacking of integrated circuit packages
|
US6357023B1
(en)
*
|
1998-04-08 |
2002-03-12 |
Kingston Technology Co. |
Connector assembly for testing memory modules from the solder-side of a PC motherboard with forced hot air
|
JP3109479B2
(en)
*
|
1998-06-12 |
2000-11-13 |
日本電気株式会社 |
Heat radiator and memory module equipped with heat radiator
|
JP2000068444A
(en)
*
|
1998-08-26 |
2000-03-03 |
Mitsubishi Electric Corp |
Semiconductor device
|
US6239485B1
(en)
*
|
1998-11-13 |
2001-05-29 |
Fujitsu Limited |
Reduced cross-talk noise high density signal interposer with power and ground wrap
|
DE69831159T2
(en)
*
|
1998-12-14 |
2006-05-24 |
Atlas Copco Airpower N.V. |
Method and apparatus for drying a gas
|
US6025992A
(en)
*
|
1999-02-11 |
2000-02-15 |
International Business Machines Corp. |
Integrated heat exchanger for memory module
|
US6351029B1
(en)
*
|
1999-05-05 |
2002-02-26 |
Harlan R. Isaak |
Stackable flex circuit chip package and method of making same
|
US6234620B1
(en)
*
|
1999-06-29 |
2001-05-22 |
Eastman Kodak Company |
Continuous ink jet printer catcher and method for making same
|
JP2001127088A
(en)
*
|
1999-10-27 |
2001-05-11 |
Mitsubishi Electric Corp |
Semiconductor device
|
US6262895B1
(en)
*
|
2000-01-13 |
2001-07-17 |
John A. Forthun |
Stackable chip package with flex carrier
|
US6489178B2
(en)
*
|
2000-01-26 |
2002-12-03 |
Texas Instruments Incorporated |
Method of fabricating a molded package for micromechanical devices
|
US6528870B2
(en)
*
|
2000-01-28 |
2003-03-04 |
Kabushiki Kaisha Toshiba |
Semiconductor device having a plurality of stacked wiring boards
|
JP2001217388A
(en)
*
|
2000-02-01 |
2001-08-10 |
Sony Corp |
Electronic device and method for manufacturing the same
|
US6444921B1
(en)
*
|
2000-02-03 |
2002-09-03 |
Fujitsu Limited |
Reduced stress and zero stress interposers for integrated-circuit chips, multichip substrates, and the like
|
JP3855594B2
(en)
*
|
2000-04-25 |
2006-12-13 |
セイコーエプソン株式会社 |
Semiconductor device
|
US6833984B1
(en)
*
|
2000-05-03 |
2004-12-21 |
Rambus, Inc. |
Semiconductor module with serial bus connection to multiple dies
|
US6449159B1
(en)
*
|
2000-05-03 |
2002-09-10 |
Rambus Inc. |
Semiconductor module with imbedded heat spreader
|
US6683377B1
(en)
*
|
2000-05-30 |
2004-01-27 |
Amkor Technology, Inc. |
Multi-stacked memory package
|
US6552910B1
(en)
*
|
2000-06-28 |
2003-04-22 |
Micron Technology, Inc. |
Stacked-die assemblies with a plurality of microelectronic devices and methods of manufacture
|
US6560117B2
(en)
*
|
2000-06-28 |
2003-05-06 |
Micron Technology, Inc. |
Packaged microelectronic die assemblies and methods of manufacture
|
JP3390412B2
(en)
*
|
2000-08-07 |
2003-03-24 |
株式会社キャットアイ |
head lamp
|
JP4397109B2
(en)
*
|
2000-08-14 |
2010-01-13 |
富士通株式会社 |
Information processing apparatus and crossbar board unit / back panel assembly manufacturing method
|
KR100340285B1
(en)
*
|
2000-10-24 |
2002-06-15 |
윤종용 |
Memory module having series-connected printed circuit boards
|
JP2002151648A
(en)
*
|
2000-11-07 |
2002-05-24 |
Mitsubishi Electric Corp |
Semiconductor module
|
US6588095B2
(en)
*
|
2001-04-27 |
2003-07-08 |
Hewlett-Packard Development Company, Lp. |
Method of processing a device by electrophoresis coating
|
US6774653B2
(en)
*
|
2001-08-22 |
2004-08-10 |
Sun Microsystems, Inc. |
Two-pin thermal sensor calibration interface
|
US6956284B2
(en)
*
|
2001-10-26 |
2005-10-18 |
Staktek Group L.P. |
Integrated circuit stacking system and method
|
US20030234443A1
(en)
*
|
2001-10-26 |
2003-12-25 |
Staktek Group, L.P. |
Low profile stacking system and method
|
US7371609B2
(en)
*
|
2001-10-26 |
2008-05-13 |
Staktek Group L.P. |
Stacked module systems and methods
|
US7053478B2
(en)
*
|
2001-10-26 |
2006-05-30 |
Staktek Group L.P. |
Pitch change and chip scale stacking system
|
US6914324B2
(en)
*
|
2001-10-26 |
2005-07-05 |
Staktek Group L.P. |
Memory expansion and chip scale stacking system and method
|
US7026708B2
(en)
*
|
2001-10-26 |
2006-04-11 |
Staktek Group L.P. |
Low profile chip scale stacking system and method
|
US6590282B1
(en)
*
|
2002-04-12 |
2003-07-08 |
Industrial Technology Research Institute |
Stacked semiconductor package formed on a substrate and method for fabrication
|
US6762942B1
(en)
*
|
2002-09-05 |
2004-07-13 |
Gary W. Smith |
Break away, high speed, folded, jumperless electronic assembly
|
US6721181B1
(en)
*
|
2002-09-27 |
2004-04-13 |
Rockwell Automation Technologies, Inc. |
Elongated heat sink for use in converter assemblies
|
JP2005123503A
(en)
*
|
2003-10-20 |
2005-05-12 |
Renesas Technology Corp |
Semiconductor device and semiconductor module
|
JP2005347353A
(en)
*
|
2004-05-31 |
2005-12-15 |
Sanyo Electric Co Ltd |
Circuit device and its manufacturing method
|
US7079396B2
(en)
*
|
2004-06-14 |
2006-07-18 |
Sun Microsystems, Inc. |
Memory module cooling
|
US7254663B2
(en)
*
|
2004-07-22 |
2007-08-07 |
International Business Machines Corporation |
Multi-node architecture with daisy chain communication link configurable to operate in unidirectional and bidirectional modes
|
US7443023B2
(en)
*
|
2004-09-03 |
2008-10-28 |
Entorian Technologies, Lp |
High capacity thin module system
|
US20060053345A1
(en)
*
|
2004-09-03 |
2006-03-09 |
Staktek Group L.P. |
Thin module system and method
|
US20060050492A1
(en)
*
|
2004-09-03 |
2006-03-09 |
Staktek Group, L.P. |
Thin module system and method
|
US7616452B2
(en)
*
|
2004-09-03 |
2009-11-10 |
Entorian Technologies, Lp |
Flex circuit constructions for high capacity circuit module systems and methods
|
US7289327B2
(en)
*
|
2006-02-27 |
2007-10-30 |
Stakick Group L.P. |
Active cooling methods and apparatus for modules
|
US7511968B2
(en)
*
|
2004-09-03 |
2009-03-31 |
Entorian Technologies, Lp |
Buffered thin module system and method
|
US7606049B2
(en)
*
|
2004-09-03 |
2009-10-20 |
Entorian Technologies, Lp |
Module thermal management system and method
|
US7324352B2
(en)
*
|
2004-09-03 |
2008-01-29 |
Staktek Group L.P. |
High capacity thin module system and method
|
US7334070B2
(en)
*
|
2004-10-29 |
2008-02-19 |
International Business Machines Corporation |
Multi-channel memory architecture for daisy chained arrangements of nodes with bridging between memory channels
|
US7099794B2
(en)
*
|
2004-11-23 |
2006-08-29 |
Intel Corporation |
Method, apparatus, and system for memory read transaction biasing in mirrored mode to provide thermal management
|