WO2006129291A3 - Led assembly and module - Google Patents

Led assembly and module Download PDF

Info

Publication number
WO2006129291A3
WO2006129291A3 PCT/IB2006/051765 IB2006051765W WO2006129291A3 WO 2006129291 A3 WO2006129291 A3 WO 2006129291A3 IB 2006051765 W IB2006051765 W IB 2006051765W WO 2006129291 A3 WO2006129291 A3 WO 2006129291A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
module
led assembly
electrically
sides
Prior art date
Application number
PCT/IB2006/051765
Other languages
French (fr)
Other versions
WO2006129291A2 (en
Inventor
Robert A Erhardt
Original Assignee
Koninkl Philips Electronics Nv
Robert A Erhardt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv, Robert A Erhardt filed Critical Koninkl Philips Electronics Nv
Priority to JP2008514290A priority Critical patent/JP2008543075A/en
Priority to KR1020087000031A priority patent/KR101256392B1/en
Priority to US11/916,128 priority patent/US7830095B2/en
Priority to BRPI0611190-4A priority patent/BRPI0611190A2/en
Priority to EP06756046.6A priority patent/EP1891685B1/en
Priority to CN2006800192927A priority patent/CN101189736B/en
Publication of WO2006129291A2 publication Critical patent/WO2006129291A2/en
Publication of WO2006129291A3 publication Critical patent/WO2006129291A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/20—Controlling the colour of the light
    • H05B45/28—Controlling the colour of the light using temperature feedback
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H05B45/42—Antiparallel configurations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48237—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Abstract

A light emitting diode (LED) assembly and module including a substrate (48) having opposing first and second sides (50, 52); a capacitor (32) having first and second electrically-conductive plates (44, 46) respectively disposed proximate the first and second sides (50, 52) of the substrate (48); and an anti-parallel LED structure (34) electrically connected to the first electrically-conductive plate (44) and thermally coupled to the substrate (48).
PCT/IB2006/051765 2005-06-02 2006-06-01 Led assembly and module WO2006129291A2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2008514290A JP2008543075A (en) 2005-06-02 2006-06-01 LED assembly and module
KR1020087000031A KR101256392B1 (en) 2005-06-02 2006-06-01 Led assembly and module
US11/916,128 US7830095B2 (en) 2005-06-02 2006-06-01 LED assembly and module
BRPI0611190-4A BRPI0611190A2 (en) 2005-06-02 2006-06-01 LED assembly, module and system
EP06756046.6A EP1891685B1 (en) 2005-06-02 2006-06-01 Led assembly and module
CN2006800192927A CN101189736B (en) 2005-06-02 2006-06-01 Led assembly and module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US68681205P 2005-06-02 2005-06-02
US60/686,812 2005-06-02

Publications (2)

Publication Number Publication Date
WO2006129291A2 WO2006129291A2 (en) 2006-12-07
WO2006129291A3 true WO2006129291A3 (en) 2007-04-26

Family

ID=37037057

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2006/051765 WO2006129291A2 (en) 2005-06-02 2006-06-01 Led assembly and module

Country Status (9)

Country Link
US (1) US7830095B2 (en)
EP (1) EP1891685B1 (en)
JP (2) JP2008543075A (en)
KR (1) KR101256392B1 (en)
CN (1) CN101189736B (en)
BR (1) BRPI0611190A2 (en)
MY (1) MY147397A (en)
TW (1) TW200702824A (en)
WO (1) WO2006129291A2 (en)

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TWI498048B (en) * 2008-10-02 2015-08-21 Koninkl Philips Electronics Nv Led circuit arrangement with improved flicker performance
CN102340904B (en) 2010-07-14 2015-06-17 通用电气公司 Light-emitting diode driving device and driving method thereof
TWI434599B (en) * 2010-07-23 2014-04-11 Advanced Connectek Inc A light-emitting element driving circuit
US9443834B2 (en) 2010-09-02 2016-09-13 Micron Technology, Inc. Back-to-back solid state lighting devices and associated methods
DE102010047450A1 (en) * 2010-10-04 2012-04-05 Osram Opto Semiconductors Gmbh lighting device
US8384294B2 (en) 2010-10-05 2013-02-26 Electronic Theatre Controls, Inc. System and method for color creation and matching
CN101969726B (en) * 2010-10-15 2013-10-30 赵熙 LED driving loop
US8723450B2 (en) 2011-01-12 2014-05-13 Electronics Theatre Controls, Inc. System and method for controlling the spectral content of an output of a light fixture
US8593074B2 (en) 2011-01-12 2013-11-26 Electronic Theater Controls, Inc. Systems and methods for controlling an output of a light fixture
US9210762B2 (en) * 2011-03-07 2015-12-08 Koninklijke Philips N.V. Electroluminescent device
JP2013225629A (en) * 2012-04-23 2013-10-31 Panasonic Corp Lighting circuit and switch
WO2014033694A1 (en) * 2012-09-03 2014-03-06 Techno Resources Hk Voltage controlled impedance synthesizer
US9386640B2 (en) 2012-10-15 2016-07-05 Koninklijke Philips N.V. LED package with capacitive couplings
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ITMI20130061A1 (en) * 2013-01-17 2014-07-18 St Microelectronics Srl CURRENT DRIVER FOR AN ARRAY OF LED DIODES.
EP2962531B1 (en) 2013-02-28 2017-08-30 Philips Lighting Holding B.V. Simple led package suitable for capacitive driving
US20140368125A1 (en) * 2013-06-09 2014-12-18 Q Technology, Inc. Lighting panel with distributed capacitance
US8957590B1 (en) * 2013-08-15 2015-02-17 Mei-Ling Peng Structure of color mixture synchronization circuit of LED light string
US20150048747A1 (en) * 2013-08-15 2015-02-19 Mei-Ling Peng Structure of color mixing circuit of led light string
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US8841856B1 (en) * 2013-10-03 2014-09-23 Robertson Transformer Co. Capacitive ladder feed for AC LED
ITBA20130071A1 (en) * 2013-10-25 2015-04-26 Matteo Console POWER SUPPLY AND DRIVER FOR TURBO LED T8 DIMENSIONS (60CM, 90CM, 120CM, 150CM) WITH VARIABLE CAPACITIVE REACTANCE.
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DE4129059A1 (en) * 1991-09-02 1993-03-04 Vdo Schindling Light emitting diode circuit including energy storage capacitor - charges capacitor during half-cycles from AC supply, and discharges through diodes of opposite polarity
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Also Published As

Publication number Publication date
TW200702824A (en) 2007-01-16
EP1891685B1 (en) 2016-11-30
US20080218095A1 (en) 2008-09-11
WO2006129291A2 (en) 2006-12-07
MY147397A (en) 2012-11-30
JP2008543075A (en) 2008-11-27
EP1891685A2 (en) 2008-02-27
CN101189736B (en) 2010-05-19
US7830095B2 (en) 2010-11-09
JP5438799B2 (en) 2014-03-12
BRPI0611190A2 (en) 2011-02-22
KR20080027322A (en) 2008-03-26
CN101189736A (en) 2008-05-28
JP2012182486A (en) 2012-09-20
KR101256392B1 (en) 2013-04-25

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