WO2006133249A3 - Integrated chemical mechanical polishing composition and process for single platen processing - Google Patents

Integrated chemical mechanical polishing composition and process for single platen processing Download PDF

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Publication number
WO2006133249A3
WO2006133249A3 PCT/US2006/022037 US2006022037W WO2006133249A3 WO 2006133249 A3 WO2006133249 A3 WO 2006133249A3 US 2006022037 W US2006022037 W US 2006022037W WO 2006133249 A3 WO2006133249 A3 WO 2006133249A3
Authority
WO
WIPO (PCT)
Prior art keywords
mechanical polishing
chemical mechanical
polishing composition
integrated chemical
single platen
Prior art date
Application number
PCT/US2006/022037
Other languages
French (fr)
Other versions
WO2006133249A2 (en
Inventor
Michael Darsillo
Peter Wrschka
James Welch
Jeffrey Giles
Michele Stawasz
Karl Boggs
Original Assignee
Advanced Tech Materials
Michael Darsillo
Peter Wrschka
James Welch
Jeffrey Giles
Michele Stawasz
Karl Boggs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Tech Materials, Michael Darsillo, Peter Wrschka, James Welch, Jeffrey Giles, Michele Stawasz, Karl Boggs filed Critical Advanced Tech Materials
Priority to US11/916,727 priority Critical patent/US20090215269A1/en
Priority to JP2008515851A priority patent/JP2008546214A/en
Priority to EP06772376A priority patent/EP1899111A2/en
Priority to KR1020087000153A priority patent/KR101332302B1/en
Publication of WO2006133249A2 publication Critical patent/WO2006133249A2/en
Priority to IL187914A priority patent/IL187914A0/en
Publication of WO2006133249A3 publication Critical patent/WO2006133249A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1472—Non-aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]

Abstract

Chemical mechanical polishing (CMP) compositions and single CMP platen process for the removal of copper and barrier layer material from a microelectronic device substrate having same thereon. The process includes the in situ transformation of a Step I slurry formulation, which is used to selectively remove and planarize copper, into a Step II slurry formulation, which is used to selectively remove barrier layer material, on a single CMP platen pad.
PCT/US2006/022037 2005-06-06 2006-06-06 Integrated chemical mechanical polishing composition and process for single platen processing WO2006133249A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US11/916,727 US20090215269A1 (en) 2005-06-06 2006-06-06 Integrated chemical mechanical polishing composition and process for single platen processing
JP2008515851A JP2008546214A (en) 2005-06-06 2006-06-06 Integrated chemical mechanical polishing composition and process for single platen processing
EP06772376A EP1899111A2 (en) 2005-06-06 2006-06-06 Integrated chemical mechanical polishing composition and process for single platen processing
KR1020087000153A KR101332302B1 (en) 2005-06-06 2006-06-06 Integrated chemical mechanical polishing composition and process for single platen processing
IL187914A IL187914A0 (en) 2005-06-06 2007-12-05 Integrated chemical mechanical polishing composition and process for single platen processing

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US68772105P 2005-06-06 2005-06-06
US60/687,721 2005-06-06

Publications (2)

Publication Number Publication Date
WO2006133249A2 WO2006133249A2 (en) 2006-12-14
WO2006133249A3 true WO2006133249A3 (en) 2009-04-16

Family

ID=37499073

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/022037 WO2006133249A2 (en) 2005-06-06 2006-06-06 Integrated chemical mechanical polishing composition and process for single platen processing

Country Status (8)

Country Link
US (1) US20090215269A1 (en)
EP (1) EP1899111A2 (en)
JP (1) JP2008546214A (en)
KR (1) KR101332302B1 (en)
CN (1) CN101511607A (en)
IL (1) IL187914A0 (en)
TW (1) TWI434957B (en)
WO (1) WO2006133249A2 (en)

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TWI434957B (en) 2014-04-21
KR101332302B1 (en) 2013-11-25
JP2008546214A (en) 2008-12-18
US20090215269A1 (en) 2009-08-27
EP1899111A2 (en) 2008-03-19
IL187914A0 (en) 2008-03-20

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